JP2007328492A - Memory card formation device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve productivity by efficiently forming the variant section and chamfered section of a memory card. <P>SOLUTION: In a first insertion hole sequence 11a of a fixing tool 1, a first side section 20a of a memory card 20 is fixed so as to be cut, and in a second insertion hole sequence 11b, a second side section 20b of the memory card 20 is fixed so as to be cut, and the first side section 20a and the second side section 20b of the memory card can be simultaneously formed by using a first cutting means 33 and a second cutting means 34 while the fixing tool 1 is held by the mobile table of the formation apparatus. Therefore, the first side section 20a and the second side section 20b are respectively cut by the first cutting means 33 and the second cutting means 34, and the both sides of the fixing tool 1 are reversed with a synchronous axis 2a in the middle of the alignment direction of the first insertion hole sequence 11a and the second insertion hole sequence 11b as a reference, and the second side section 20b and the first side section 20a are respectively cut by the second cutting means 34 and the first cutting means 33. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a molding apparatus and a molding method used for manufacturing a memory card that is used by being inserted into a card slot of an electronic device.

  A memory card such as an SD card (registered trademark) or miniSD (registered trademark) used by being inserted into a card slot of various electronic devices is formed by mounting a memory element on a wiring board and covering it with a mold resin. (For example, refer to Patent Document 1). In such a memory card, memory elements are mounted in a grid pattern on a single wiring board and the whole is covered with a mold resin to form a package board, and then the area between the memory elements on the package board is separated by cutting or the like. Is formed. Further, the shape of the memory card is standardized, and a deformed portion for specifying the front and back sides and the front-rear direction at the time of insertion is formed. In addition, chamfering is performed on the corner portion where the deformed portion is not formed.

JP 2003-44804 A

  However, at the stage where the package substrate is divided by cutting or the like, the deformed portion and the chamfered portion are not formed. Therefore, the deformed portion and the chamfered portion must be formed by laser processing, router processing, etc. for each memory card. There is a problem that productivity is low.

  Therefore, the problem to be solved by the present invention is to improve productivity by efficiently forming a deformed portion and a chamfered portion in a memory card.

  1st invention provided at least the cutting means which has a cutting grindstone which shape | molds the side part of a memory card, the fixing jig which fixes a memory card, and the movement table provided with the holding part holding a fixing jig. The present invention relates to a memory card forming apparatus, wherein the cutting means includes a first cutting means having a first cutting wheel for forming the first side portion of the memory card and a second side for forming the second side portion of the memory card. The fixing jig includes a held portion that is detachably held by the holding portion of the moving table and a plurality of insertion holes into which the memory card is inserted. A first insertion hole row formed; a second insertion hole row formed by aligning a plurality of insertion holes that are provided alongside the first insertion hole row and into which a memory card is inserted; and the first insertion hole row. Insert the memory card inserted in A first fixing portion to be fixed, and a second fixing portion for fixing the memory card inserted into the second insertion hole row, in the alignment direction of the first insertion hole row and the second insertion hole row. The holding part is formed on the front and back surfaces of the fixing jig and is inserted into the first insertion hole row and the second insertion hole row. The side portion and the second side portion are exposed from the front and back surfaces.

  The second invention relates to a memory card molding method for molding a memory card using the memory card molding apparatus, and a first cutting means and a first cutting means formed on a fixing jig by a second cutting means. The first side portion and the second side portion of the memory card fixed to the insertion hole row and the second insertion hole row are cut, and the first side portion and the second side portion are formed into a desired shape. The first forming step and the front and back surfaces of the fixing jig are reversed with respect to the symmetry axis in the middle of the alignment direction of the first insertion hole row and the second insertion hole row as a reference, Cutting the second side and the first side of the memory card fixed to the second insertion hole row and the first insertion hole row by the second cutting means; It is comprised from the 2nd shaping | molding process which shape | molds a side part to a desired shape.

  In the present invention, the first insertion hole row of the fixing jig fixes the first side portion of the memory card in a cutable state, and the second insertion hole row can cut the second side portion of the memory card. The first side and the second side of the memory card using the first cutting means and the second cutting means with the fixing jig held on the moving table of the molding apparatus. Since the first side and the second side are cut by the first cutting means and the second cutting means, respectively, the front and back of the fixing jig are reversed. Thus, by cutting the second side portion and the first side portion with the second cutting means and the first cutting means, respectively, a memory card having a desired shape can be efficiently formed.

  A fixing jig 1 shown in FIG. 1 is a jig for holding a memory card when molding a side portion of the memory card, and is formed of a jig body 2 and a hard material such as stainless steel and is accommodated in the jig body 2. A first fixing part 3 and a second fixing part 4; a buffer member 5 made of an elastic material such as hard urethane accommodated in the jig body 2; a first support member 6 attached to the jig body 2; It has a second support member 7, a screw 8 for fixing the first support member 6 and the second support member 7, and a spring 9 accommodated in the jig body 1.

  The jig body 2 is formed by aligning a front-side held portion 10a and a back-side held portion 10b that are detachably held in the molding apparatus, and a memory card insertion hole 11 into which a memory card is inserted. The first insertion hole row 11a formed parallel to the first insertion hole row 11a and the memory card insertion holes 11 into which the memory card is inserted are arranged in a line. A first fixed portion receiving hole 12 and a second fixed portion receiving hole 13 in which the first fixed portion 3 and the second fixed portion 4 are stored, and a buffer member receiving hole 14 in which the buffer member 5 is stored. And a spring accommodating portion 15 that accommodates the spring 9 and a screw hole 16 into which the screw 8 is screwed. In addition, on the front and back surfaces of the jig body 2, an opening / closing long hole 17 for sliding the first fixing portion 3 and the second fixing portion 4, and a position for fixing the fixing jig 1 to the molding apparatus. A plurality of positioning holes 18 for alignment are formed. Further, the first support member 6 and the second support member 7 are formed with a plurality of through holes 19 for allowing the screws 8 to pass therethrough. The fixing jig 1 is formed symmetrically with respect to an intermediate symmetry axis 2a in the alignment direction (longitudinal direction in the illustrated example) of the first insertion hole row 10a and the second insertion hole row 10b.

  In the first fixing portion 3 and the second fixing portion 4, elastic members 3a, 4a such as hard urethane are respectively fixed to the side surfaces facing the buffer member 5, and the engagement holes 3b penetrating the front and back surfaces, 4b is formed.

  As shown in FIG. 2, the memory card 20 before molding is inserted into each memory card insertion hole 11 constituting the first insertion hole row 11a and the second insertion hole row 11b. The memory card 20 has a first side 20a and a second side 20b.

  In the illustrated example, each memory card insertion hole 11 has a shape that allows the memory card 20 to be inserted in two directions, and is inserted between the first insertion hole row 11a and the second insertion hole row 11b. The memory card 20 has a different orientation. In the illustrated example, the memory card 20 to be inserted into the memory card insertion hole 11 constituting the first insertion hole row 11a is inserted so that the first side portion 20a is exposed upward, and the second insertion hole row is The memory card 20 inserted into the memory card insertion hole 11 constituting 11b is inserted so that the second side portion 20b is exposed upward. The memory card 20 inserted into the memory card insertion hole 11 constituting the first insertion hole row 11a is exposed at the second side portion 20b, and the second insertion hole row 11b is constituted. The memory card 20 to be inserted into the memory card insertion hole 11 may be configured such that the first side portion 20a is exposed upward.

  On the other hand, since the memory card insertion hole 11 penetrates the front and back surfaces, the memory card 20 accommodated in the first insertion hole row 11 a is exposed with the second side portion 20 b protruding from the back surface of the fixing jig 1. The first side portion 20b of the memory card 20 accommodated in the first insertion hole row 11a is exposed from the back surface of the fixing jig 1.

  The memory card 20 accommodated in the first insertion hole row 11a enters between the buffer member 5 and the first fixing portion 3, and the memory card 20 accommodated in the second insertion hole row 11b 5 and the second fixing member 4. The memory card 20 has a pin for extending the distance between the first fixing portion 3 and the second fixing portion 4 inserted into the open / close elongated hole 17 and the pins are engaged with the engagement holes 3b and 4b. Pulling the first fixing portion 3 and the second fixing portion 4 away from each other and slightly moving the first fixing portion 3 and the second fixing portion 4 away from each other against the biasing force of the spring 9. In this state, it is inserted into the memory card insertion holes 11 constituting the first insertion hole row 11a and the second insertion hole row 11b. When the pin is removed, the memory card 20 inserted into the memory card insertion hole 11 constituting the first insertion hole row 11a is held between the buffer member 5 and the first fixing portion 3 by the biasing force of the spring. Then, the memory card 20 inserted into the memory card insertion hole 11 constituting the second insertion hole row 11b is sandwiched between the buffer member 5 and the second fixing portion 4, and both are in a stable state.

  The fixing jig 1 in which a plurality of memory cards 20 are inserted as shown in FIGS. 2 and 3 is used for forming a memory card in the memory card forming apparatus 30 shown in FIG. 4, for example. The memory card molding apparatus 30 includes a cutting means 31 that molds the side portion of the memory card, and a moving table 32 that holds the fixing jig 1 and is movable in the X-axis direction.

  The moving table 32 is movable in the X-axis direction and is rotatable, and includes a detachable holding portion 320 that holds the fixing jig 1 as shown in FIG. The holding part 320 has, for example, a porous suction part 321, and the suction part 321 communicates with a suction source (not shown) provided below the moving table 32. In addition, a positioning projection 322 corresponding to the positioning hole 18 (see FIG. 1) formed in the fixing jig 1 to be placed is formed on the upper surface of the holding portion 320. The positioning hole 18 is formed in the positioning projection 322. In a state of being fitted, the fixing jig 1 is placed on the holding unit 320, and the fixing jig 1 is sucked and held by the suction unit 321. At this time, the alignment direction of the memory card 20 coincides with the X-axis direction.

  In the example of FIG. 4, the cutting means 31 includes a first cutting means 33 for forming the first side portion 20 a of the memory card 20 and a second cutting means for forming the second side portion 20 b of the memory card 20. 34.

  As shown in FIG. 4, in the first cutting means 33, the first spindle 331 is rotatably supported by the first housing 330. As shown in FIG. 6, the first cutting means 33 has a first cutting grindstone 333 formed on the outer periphery of a cylindrical first wheel 332 having a through-hole through which the first spindle 330 penetrates by electrodeposition or the like. The first wheel 332 is fitted to the first spindle 331 and is fixed by a nut 334. The first cutting grindstone 333 is configured by fixing abrasive grains such as diamond abrasive grains by nickel plating or the like, and has a side shape corresponding to a desired shape of the first side portion 20a of the memory card 20. Yes.

  As shown in FIG. 4, in the second cutting means 34, the second spindle 341 is rotatably supported by the second housing 340. As shown in FIG. 7, the second cutting means 34 has a second cutting grindstone 343 formed on the outer periphery of a cylindrical second wheel 342 having a through hole through which the second spindle 341 passes, by electrodeposition or the like. The second wheel 342 is fitted to the second spindle 341 and is fixed by a nut 344. The second cutting grindstone 343 is configured by fixing abrasive grains such as diamond abrasive grains by nickel plating or the like, and has a side shape corresponding to a desired shape of the second side portion 20b of the memory card 20. Yes.

  Since the memory card 20 is finally formed into an asymmetric shape in which the shapes of the first side portion 20a and the second side portion 20b are different, the first cutting grindstone 333 and the second cutting grindstone 343 are: Its side shape is different.

  As shown in FIG. 4, alignment means 35 is disposed above the moving path of the moving table 32. The alignment means 35 includes an imaging unit 350. By imaging the fixing jig 1 and detecting a specific area thereof, the angle adjustment of the fixing jig 1 held on the moving table 32 or the first The cutting means 33 and the second cutting means 34 are positioned in the Y-axis direction and aligned in relation to the memory card 20 fixed to the fixing jig 1.

  When the memory card 20 is formed into a desired shape, as shown in FIG. 3, the first side portion 20a is fixedly fixed to each memory card insertion hole 11 constituting the first insertion hole row 11a. The memory card 20 is inserted while being exposed from the surface side of the tool 1. At this time, the second side portion 20 b is exposed from the back side of the fixing jig 1. On the other hand, the memory card 20 is inserted into each memory card insertion hole 11 constituting the second insertion hole row 11b with the second side portion 20b exposed from the surface side of the fixing jig 1. The side portion 20a is exposed from the back side of the fixing jig 1.

  And the to-be-held part 10b side of the fixing jig 1 is hold | maintained at the holding | maintenance part 320 of the movement table 32, the movement table 32 is moved to the X-axis direction, is moved just under the alignment means 35, Fine adjustment, alignment of the memory card 20 fixed to the first insertion hole row 11a and the first cutting grindstone 333 in the Y-axis direction, and the memory card 20 fixed to the second insertion hole row 11b and the first Positioning in the Y-axis direction with the second cutting grindstone 343 is performed. That is, as shown in FIG. 8, the first cutting grindstone 333 is positioned immediately above the movement path of the memory card 20 held in the memory card insertion holes 11 constituting the first insertion hole row 11a, and the second The second cutting grindstone 343 is positioned immediately above the movement path of the memory card 20 held in the memory card insertion hole 11 constituting the insertion hole row 11b.

  Thereafter, the moving table 32 moves in the + X direction shown in FIG. 4, and the first cutting means 33 and the second cutting means 34 while the first cutting grindstone 333 and the second cutting grindstone 343 rotate at high speed. As shown in FIG. 9, the first cutting grindstone 333 comes into contact with the first side portions 20a of the plurality of memory cards 20 fixed to the first insertion hole row 11a and exposed upward, The second cutting grindstone 343 contacts the second side portion 20b of the plurality of memory cards 20 fixed to the second insertion hole row 11b and exposed upward. Then, the shape of the first cutting grindstone 333 is transferred to the first side portion 20a of the memory card 20 fixed to the first insertion hole row 11a, and the memory fixed to the first insertion hole row 11b. The shape of the second cutting grindstone 343 is transferred to the second side portion 20b of the card 20 (first molding step).

  Next, the fixing jig 1 is removed from the holding portion 320 shown in FIG. 5, and the fixing jig 1 is used with reference to the symmetrical axis 2 a in the alignment direction of the first insertion hole row 11 a and the second insertion hole row 11 b. Then, the holding part 10 a side of the fixing jig 1 is held by the holding part 320. At this time, as shown in FIG. 10, the second side portion 20b of the memory card 20 fixed to the first insertion hole row 11a is exposed upward, and the memory card 20 fixed to the second insertion hole row 11b. The card 20 is in a state where the first side portion 20a is exposed upward. In addition, the fixing jig 1 is formed symmetrically with respect to the middle of the alignment direction of the first insertion hole row 11a and the second insertion hole row 11b. The memory card 20 fixed to the second insertion hole row 11b is located below, and the memory card 20 fixed to the first insertion hole row 11a is located below the second cutting grindstone 343. Therefore, it is not necessary to change the positions of the first cutting grindstone 333 and the second cutting grindstone 343 in the Y-axis direction.

  In this state, the fine adjustment of the orientation of the holding portion 320 is performed as necessary, and the memory card 20 held in the first insertion hole row 11a is then moved to the second side as shown in FIG. The second cutting grindstone 343 is brought into contact with the portion 20b, and the first cutting grindstone 333 is brought into contact with the first side portion 20a of the memory card 20 held in the second insertion hole row 11b. Then, the shape of the second cutting grindstone 343 is transferred to the second side portion 20b of the memory card 20, and the shape of the first cutting grindstone 333 is transferred to the first side portion 20a of the memory card 20. (Second molding step). If the fixing jig 1 is precisely formed, fine adjustment of the direction of the holding portion 320 is not necessarily required.

  In this way, for all the memory cards 20a, the shapes of the first cutting grindstone 333 and the second cutting grindstone 343 are transferred to the first side portion 20a and the second side portion 20b, and the desired shape shown in FIG. The memory card 21 is shaped as follows. In this memory card 21, four corners are chamfered, and two of the chamfered portions 210 and 211 are formed by transferring the shape of the first cutting grindstone 333. On the other hand, the remaining two chamfered portions 212 and 213 are formed by transferring the shape of the second cutting grindstone 343. A deformed portion 214 is formed on the second side portion 20b, and the deformed portion 214 is formed by transferring the shape of the second cutting grindstone 343.

  As described above, the memory card 20 is held by the first insertion hole row 11a and the second insertion hole row 11b in the fixing jig 1, and the first cutting grindstone 333 and the second side are respectively held on the respective side portions. After cutting with the cutting grindstone 343, the two sides of the memory card can be efficiently formed by turning the fixing jig 1 and performing similar cutting.

It is a disassembled perspective view which shows an example of a fixing jig. It is a perspective view which shows the state which inserts the memory card before shaping | molding in a fixing jig. It is sectional drawing which shows schematically the state which inserted the memory card before shaping | molding in a fixing jig. It is a perspective view which shows an example of a memory card molding apparatus. It is a perspective view which shows the movement table and fixing jig of a memory card molding apparatus. It is sectional drawing which shows a 1st cutting means schematically. It is sectional drawing which shows a 2nd cutting means schematically. It is a front view which shows the state which aligned the 1st cutting grindstone and the 2nd cutting grindstone. It is a front view which shows a 1st shaping | molding process. It is a front view which shows a 2nd shaping | molding process. It is a front view which shows the shape | molded memory card.

Explanation of symbols

1: Fixing jig 2: Jig body 2a: Axis of symmetry 3: First fixing part 4: Second fixing part 5: Buffer member 6: First supporting member 7: Second supporting member 8: Screw 9 : Spring 10a, 10b: Held portion 11: Memory card insertion hole 11a: First insertion hole row 11b: Second insertion hole row 12: First fixing portion receiving hole 13: Second fixing portion receiving hole 14 : Buffer member accommodation hole 15: spring accommodation part 16: screw hole 17: opening / closing long hole 18: positioning hole 19: through hole 20: memory card 20a: first side part 20b: second side part 30: memory card molding Device 31: Cutting means 32: Moving table 320: Holding part 321: Suction part 322: Positioning protrusion 33: First cutting means 330: First housing 331: First spindle 332: First wheel 333: First Cutting wheel 334: Nut G: Second cutting means 340: Second housing 341: Second spindle 342: Second wheel 343: Second cutting grindstone 344: Nut 35: Alignment means 350: Imaging unit

Claims (2)

A memory card molding apparatus comprising at least a cutting means having a cutting grindstone for molding a side portion of a memory card, a fixing jig for fixing the memory card, and a moving table having a holding unit for holding the fixing jig. Because
The cutting means includes a first cutting means having a first cutting grindstone for forming the first side portion of the memory card, and a second cutting grindstone for shaping the second side portion of the memory card. Two cutting means,
The fixing jig includes a held portion that is detachably held by the holding portion of the moving table, a first insertion hole row in which a plurality of insertion holes into which a memory card is inserted are aligned, A second insertion hole array in which a plurality of insertion holes into which a memory card is inserted are arranged side by side, and a memory card inserted into the first insertion hole array is fixed. And a second fixing portion for fixing the memory card inserted into the second insertion hole row, and the middle of the alignment direction of the first insertion hole row and the second insertion hole row. Symmetric with respect to the symmetry axis of
The held portions are formed on the front surface and the back surface of the fixing jig, and the first side portion and the second side of the memory card inserted into the first insertion hole row and the second insertion hole row. Memory card molding device that exposes the front and back surfaces. A memory card molding method for molding a memory card using the memory card molding apparatus according to claim 1,
The first side of the memory card fixed to the first insertion hole row and the second insertion hole row formed in the fixing jig by the first cutting means and the second cutting means and the second side A first molding step of cutting a second side part and molding the first side part and the second side part into a desired shape;
Reversing the front and back of the fixing jig with respect to an axis of symmetry intermediate in the alignment direction of the first insertion hole row and the second insertion hole row, the first cutting means and the second cutting means To cut the second side and the first side of the memory card fixed to the second insertion hole row and the first insertion hole row, A memory card molding method comprising: a second molding step for molding the side portion into a desired shape.

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