KR101186278B1 - Chuck table apparatus used in laser processing apparatus, laser processing apparatus adopting the same, and chucking method thereof - Google Patents

Abstract

The disclosed chuck table apparatus includes a table, an adsorption bed disposed on the table, and provided with a plurality of vacuum adsorption units, a plurality of gratings supporting the object to be processed, and the plurality of vacuum adsorption units are provided to be located in the plurality of gratings. The bed includes a bed, a first magnet disposed inside the plurality of gratings, and a second magnet positioned to face the first magnet with the object to be processed therebetween. Thereby, the processing object of various forms can be supported, and the curvature of the processing object can be correct | amended and can be supported flatly.

Description

Chuck table apparatus used in laser processing apparatus, laser processing apparatus adopting the same, and chucking method

The present invention relates to a chuck table device of a laser processing apparatus, a laser processing apparatus employing the same, and a chucking method for irradiating a laser beam to a processing object to perform industrially useful processing. The present invention relates to a chuck table device that can be easily supported, a laser processing device employing the same, and a chucking method.

In a laser processing apparatus that irradiates a laser beam onto a processing object such as a semiconductor package, a printed circuit board, a plastic, or a ceramic, the processing object is mounted on a chuck table.

The chuck table device is to securely fix the object to a fixed position. The laser processing apparatus can process a workpiece having various sizes and shapes. In this case, in order to fix a workpiece having a shape of various sizes, a fixing jig is required in accordance with each workpiece.

In addition, the wide plate-like object needs to be supported flat. For example, a thin object to be processed, such as a wafer used in a semiconductor process, may cause so-called 'warpage', in which an unsupported portion sags downward to warp the entire wafer. This warpage of the object to be processed is a problem because it can increase the defective rate by inhibiting the precision of the machining performed on the object. In order to solve such a problem, the jig which can support the whole surface of a process object can be employ | adopted. However, in this case, since the structure for supporting it varies depending on the size and shape of the object to be processed, a jig should be manufactured separately when the object is changed. Therefore, each time the object to be processed changes the jig, and the additional process and cost of replacing and mounting it on the laser processing machine takes.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a chuck table apparatus of a laser processing apparatus, a laser processing apparatus employing the same, and a chucking method capable of supporting a processing object of various sizes and shapes. do. Moreover, an object of this invention is to provide the chuck table apparatus of the laser processing apparatus which can support a process target flatly, the laser processing apparatus employing the same, and the chucking method.

The chuck table apparatus of the laser processing apparatus of the present invention for achieving the above object includes a table; An adsorption bed disposed on the table and provided with a plurality of vacuum adsorption parts for adsorbing a workpiece by vacuum pressure; A grating bed having a plurality of gratings for supporting the object to be processed, the grating beds being provided such that the plurality of vacuum adsorption portions are located in the plurality of gratings; A first magnet disposed in the plurality of gratings; And a second magnet placed on the workpiece so as to face the first magnet and pressing the workpiece by a magnetic force acting between the first magnet.

The first magnet may be detachably disposed in the plurality of gratings.

The first magnet may be provided with an insertion hole into which the vacuum suction unit is inserted.

The first and second magnets may be alico magnets.

The grating bed may be formed of aluminum.

Laser processing apparatus of the present invention for achieving the above object, a laser oscillator; A scan lens for irradiating a laser beam irradiated from the laser oscillator onto an object to be processed; And the chuck table apparatus described above.

The chucking method of the present invention for achieving the above object comprises the steps of: arranging a plurality of vacuum adsorption portion and the first magnet in one or more of the plurality of gratings of the grating bed; Depositing an object to be processed on the lattice bed and applying a vacuum pressure through the plurality of vacuum adsorption units to vacuum-adsorb the object to be processed; And arranging a second magnet on the object to be opposed to the first magnet to magnetically adsorb the object to be processed by a magnetic force.

The first and second magnets may be disposed in the warped portion of the workpiece to correct the warpage by magnetic force.

According to the chuck table device, the laser processing device employing the same, and the chucking method according to the present invention, the object can be fixed by vacuum pressure and magnetic force even if the size and outline of the object are changed. There is no need to make a fixed jig separately. In addition, by using the vacuum pressure and the magnetic force, it is possible to smoothly support the object to be warped, thereby reducing processing defects caused by the warpage of the object. Moreover, by attaching a 1st, 2nd magnet to the fin part of a process target object, it can support flatly according to the bending position and a direction of a process target object.

1 is a configuration diagram schematically showing a laser processing apparatus according to an embodiment of the present invention.
Figure 2 is an exploded perspective view of the chuck table device according to an embodiment of the present invention.
3 is a cross-sectional view showing in detail the vacuum adsorption unit.
Figure 4 is an exploded perspective view showing an example of the coupling structure of the first magnet and the lattice.
5 is a cross-sectional view taken along line AA ′ of FIG. 4.
6 is a plan view illustrating an example of an arrangement of a vacuum suction unit and a first magnet;
7 is a perspective view showing a modification of the first magnet;
Fig. 8 is a side view showing a state in which a warped object is placed in a chuck table device.
9 is a side view illustrating a state in which the warpage of the object to be processed is corrected using the first and second magnets.

Hereinafter, with reference to the accompanying drawings will be described embodiments of the chuck table device of the laser processing apparatus, the laser processing apparatus employing the same, and the chucking method according to an embodiment of the present invention.

1 is a configuration diagram of an embodiment of a laser processing apparatus according to an embodiment of the present invention. Referring to FIG. 1, the laser processing apparatus may include a laser oscillator 10, a reflection mirror 20, a scanner 30, and a scan lens 40. The laser beam emitted from the laser oscillator 10 is reflected by the reflection mirror 20 and is incident to the scanner 30. The scanner 30 moves the laser beam to a predetermined position in the plane by the processing data, and may be, for example, a galvano mirror device. The laser beam whose position is controlled by the scanner 30 is focused on a desired position of the object 50 to be processed via the scanning lens 40, thereby processing the object 50. By such a process, the laser processing apparatus performs a machining process such as marking, etching, cutting, exposing and drilling of the object 50 by irradiating a laser beam.

The object to be processed 50 is mounted on the chuck table apparatus 100. The chuck table apparatus 100 may be movable in the transverse and / or longitudinal direction by a conveying means (not shown). The chuck table apparatus 100 is for supporting the object to be processed 50. Referring to FIGS. 2 and 3, the table 110, the adsorption bed 120, the grid bed 130, and the first magnet 150 are provided. ), May include a second magnet 160. Adsorption bed 120 may be coupled to the table 110 by a fastening means (not shown). The grid bed 130 may be coupled to the table 110 or the adsorption bed 120 by fastening means (not shown).

The grid bed 130 is provided with a plurality of grids 131 separated by a plurality of partitions 132. The grating bed 130 of the grating structure is to minimize the reflection by the grating bed 130 in the laser beam during the laser processing. For this purpose, the partition wall 132 is preferably as thin as possible. The grating bed 130 may be made of a material that is less damaged by the laser beam. For example, the grating bed 130 may be formed of aluminum. 2 illustrates a grating bed 130 having a rectangular grating 131, but this is only an example. For example, the grid 131 may have various shapes such as a pentagon, a hexagon, and a circle. In addition, the gratings 131 need not all have the same shape.

Adsorption bed 120 is located above table 110. The adsorption bed 120 is provided with a plurality of vacuum adsorption units 140 for adsorbing the object 50 by vacuum pressure. The vacuum suction unit 140 is located in the grating 131. The vacuum suction unit 140 may include a vacuum needle 121 extending upward from the suction bed 120. The hollow part 122 inside the vacuum needle 121 is connected to the vacuum passage 123 formed inside the adsorption bed 120. The vacuum passage 123 is connected to a vacuum pump (not shown) through the vacuum connection 129. The vacuum pressure provided from the vacuum pump may be applied to the front end portion 124 of the vacuum needle 121 through the vacuum passage 123, the hollow portion 122. The vacuum adsorption unit 140 may include a tip 125 having elasticity. For example, a rubber tip 125 may be provided at the tip 124 of the vacuum needle 121. The peak portion 125 supports the lower surface of the object to be processed 50 and is in contact with the lower surface of the object to be processed 50 so that vacuum pressure does not leak. Although not shown in the drawings, a vacuum passage 123 may be provided in the table 110, and the vacuum needle 121 may be connected to the vacuum passage 123 when the suction bed 120 is mounted on the table 110. In addition, the vacuum pressure may be supplied to the vacuum needle 121 by various methods.

The first magnet 150 is located in the grating 131. The first magnet 150 may be inserted into the grid 131 by an interference fit method. In addition, the first magnet 150 may be detachably coupled to the grating 131. For example, referring to FIG. 4, a hook groove 151 is provided in the first magnet 150, and a hook 133 coupled to the hook groove 151 is provided in the partition wall 132 constituting the grid 131. Can be. When the first magnet 150 is inserted into the grating 131 above the grating 131, the arm 134 of the hook 133 is retracted. When the locking groove 151 reaches the same height as the hook 133, the first magnet 150 is moved forward by the arm 134 and the hook 133 is caught by the locking groove 151 as shown in FIG. Are coupled within the grating 131. When the first magnet 150 is to be removed, the arm 134 may be retracted to detach the hook 133 from the locking groove 151 and the first magnet 150 may be removed from the grating 131.

It is not necessary for the vacuum suction unit 140 to be located in all the grids 131. In addition, it is not necessary to be located in the first magnet 150 in all the grids 131. As an example of the arrangement of the vacuum adsorption unit 140 and the first magnet 150, a structure in which the vacuum adsorption unit 140 and the first magnet 150 are alternately arranged in the grating 131 is disclosed. . However, the scope of the present invention is not limited thereto, and various arrangements of the vacuum adsorption unit 140 and the first magnet 150 may be applied as necessary. In addition, one vacuum suction unit 140 does not necessarily need to be disposed in the grating 131, and two or more vacuum suction units 140 may be disposed. In addition, the first and second magnets 150 and 160 may be disposed at the warped portion of the object to be processed 50.

As a variant, as shown in FIG. 7, an insertion hole 153 into which the vacuum suction unit 140 may be inserted may be provided in the first magnet 150a. Such a configuration is useful when the arrangement positions of the first magnet 150a and the vacuum suction unit 140 need to overlap.

Hereinafter, the effect by the structure mentioned above is demonstrated. As shown in FIG. 8, the adsorptive bed 120 is positioned above the table 110. The grating bed 130 is positioned above the adsorption bed 120 such that the vacuum adsorption unit 140 is located in the grating 131. The object to be processed 50 is positioned above the grating bed 130. As shown in FIG. 8, when both ends of the object 50 are turned upward by warpage, the object to be processed is not acted upon by the vacuum pressure of the vacuum adsorption part 140 in the region and its vicinity. 50 cannot be supported flat. For example, even if the back surface of the object 50 is pressed against the vacuum suction unit 140 by hand, it may be spaced apart from the vacuum suction unit 140 by elasticity. When the object 50 is not flatly supported as described above, processing defects may occur because the object 50 is not focused on the surface of the object 50 to be precisely focused on the laser beam to be irradiated.

In order to support the object 50 flatly, the first magnet 150 is disposed in the lattice 131 corresponding to both ends of the object 50. Then, the second magnet 160 is disposed on the object 50 to face the first magnet 150. When the first and second magnets 150 and 160 are disposed to face different polarities with each other, the magnetic force is applied in a direction in which the first and second magnets 150 and 160 are coupled to each other. Therefore, the bending of the object 50 is corrected by pressing the object 50 while the second magnet 160 is pulled in the direction of the first magnet 150. Furthermore, the vacuum suction part 140 near the curved part of the to-be-processed object 50 contacts the back surface of the to-be-processed object 50, and pulls out the to-be-processed object 50 by a vacuum pressure. By this process, the object to be processed 50 may be supported on the grating bed 130 flatly and firmly.

In FIG. 8 and FIG. 9, the case in which both ends of the object to be processed are lifted upwards as an example, but the scope of the present invention is not limited thereto. An appropriate number of first magnets 150 and second magnets 160 may be disposed at an appropriate position in accordance with the shape or position of the warpage of the object 50 to be processed.

According to the chuck table apparatus described above, even if the size and the outer shape of the object 50 is changed, the object 50 can be fixed by vacuum pressure and magnetic force. Therefore, it is not necessary to separately manufacture the fixing jig in accordance with the object to be processed 50. In addition, by using the vacuum pressure and the magnetic force, the warped object 50 can be smoothly supported, and machining defects caused by the warp of the object 50 can be reduced. Moreover, by attaching a 1st, 2nd magnet to the fin part of the to-be-processed object 50, it can support flatly according to the bending position or direction of the to-be-processed object 50. FIG.

As shown in FIG. 6, when the first magnet 150a having the insertion hole 153 is employed, the vacuum pressure of the vacuum suction unit 140 and the magnetic force of the first and second magnets 150a and 160 are measured. It can concentrate on the part with the curvature of the to-be-processed object 50, and can correct | amend the warpage of the to-be-processed object 50 effectively, and can support it flatly. That is, the first magnet 150a having the first magnet 150 and the insertion hole 153 may be used together as necessary. 6 illustrates a first magnet 150a provided with one insertion hole 153, two or more insertion holes 153 may be provided as necessary.

Various magnets may be used as the first and second magnets 150 and 160. For example, as the first and second magnets 150 and 160, an alico magnet having high stability to temperature may be employed. Alico magnet can be easily manufactured in a desired shape by a method such as sintering, casting, etc., it is easy to apply to the grating bed 130 of various forms.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the scope of the present invention. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.

10 ... laser oscillator 20 ... reflective mirror
30 ... scanner 40 ... scan lens
50 ... workpiece 100 ... chuck table device
110 table 120 adsorption bed
121 Vacuum needle 123 Vacuum passage
125 ... peak 130 ... lattice bed
131 ... Grid 132 ... Bulk
133 Hook ... 134 Arm
140 ... vacuum adsorption part 150, 150a ... 1st magnet
151.Gripping groove 153 ... Inserting hole
160 ... Second magnet

Claims (8)

table;
An adsorption bed disposed on the table and provided with a plurality of vacuum adsorption parts for adsorbing a workpiece by vacuum pressure;
A grating bed having a plurality of gratings for supporting the object to be processed, the grating beds being provided such that the plurality of vacuum adsorption portions are located in the plurality of gratings;
A first magnet disposed in the plurality of gratings;
And a second magnet placed on the object to be opposed to the first magnet and pressing the object by a magnetic force acting between the first magnet. 2. . The method of claim 1,
The first magnet is detachably arranged in the plurality of gratings, characterized in that the chuck table device. The method of claim 1,
The first magnet is a chuck table device, characterized in that the insertion hole is inserted into the vacuum suction unit is provided. The method of claim 1,
And the first and second magnets are alico magnets. The method of claim 1,
The lattice bed is a chuck table device of a laser processing apparatus, characterized in that formed of aluminum. A chuck table device according to any one of claims 1 to 5, wherein the object to be processed is mounted;
Laser oscillator;
And a scan lens for irradiating a laser beam irradiated from the laser oscillator onto a processing object. Disposing a plurality of vacuum adsorption portions and a first magnet on at least one of the plurality of grids of the grid bed;
Depositing an object to be processed on the lattice bed and applying a vacuum pressure through the plurality of vacuum adsorption units to vacuum-adsorb the object to be processed;
And arranging a second magnet on the object to be opposed to the first magnet to magnetically adsorb the object by magnetic force. The method of claim 7, wherein
And the first and second magnets are arranged in the warped portion of the workpiece to correct the warpage by a magnetic force.

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