200818413 九、發明說明 【發明所屬之技術領域】 本發明係關於製造插入於電子機器之卡插槽使用之記 憶卡時所使用之成形裝置及成形方法。 【先前技術】 插入各種電子機器之卡插槽使用之 SD卡（登錄商 φ 標）、miniSD(登錄商標）等之記憶卡，係將記憶體元件安 裝於配線基板，並利用成形樹脂覆蓋而形成（例如，參照 日本特開2003-44804號公報）。該記憶卡係將記憶體元件 以格子狀安裝於1片之配線基板之整體並以成形樹脂進行 覆蓋來形成封裝基板後，再針對封裝基板之記憶體元件間 之區域進行切割等使其分離而形成。此外，記憶卡之形狀 已規格化，而形成以特定插入時之表背及前後方向爲目的 之異形部。此外，對未形成異形部之角部實施倒角加工。 【發明內容】 然而，以封裝基板之切割等實施分割之階段時，因爲 未形成異形部及倒角部，故必須利用雷射加工、起槽加工 等於各記憶卡形成異形部及倒角部，因而有生產性較低之 問題。 因此，本發明要解決之課題，係在以良好效率形成記 憶卡之異形部及倒角部來提高生產性。 第一發明之記憶卡成形裝置，係關於至少具備有移動 200818413 工作台，該移動工作台具備：具有用以成形sB憶卡之 之切割磨石之切割手段、用以固定該記憶卡之固定夾 以及用以保持該固定夾具之保持部；其特徵爲：該切 段係由：具有用以成形記憶卡之第一側部之第一切割 之第一切割手段、及具有用以成形該記憶卡之第二側 第二切割磨石之第二切割手段，所構成；該固定夾 有：裝卸自如地保持於該移動工作台之保持部之被 P 部、由配列著複數之用以插入記憶卡之插入孔所形成 一插入孔列、與該第一插入孔列並設之由配列著複數 以插入記憶卡之插入孔所形成之第二插入孔列、用以 被插入於該第一插入孔列之記憶卡之第一固定部、以 以固定被插入於該第二插入孔列之記憶卡之第二固定 且係以該第一插入孔列及該第二插入孔列之配列方向 間之對稱軸爲基準而形成對稱；該被保持部係形成於 定夾具之轰面及背面，使插入於該第一插入孔列及該 φ 插入孔列之記憶卡之第一側部及第二側部及從表背 出。 第二發明之記憶卡之成形方法，係利用上述記憶 形裝置來成形記憶卡；其特徵爲由：利用前述第一切 段及前述第二切割手段，切割被固定於形成於前述固 具之第一插入孔列及第二插入孔列之記憶卡之第一側 第二側部，使該第一側部及該第二側部成形成期望之 之第一成形製程；及將該固定夾具之表背，以該第一 孔列及該第二插入孔列之配列方向之中間之對稱軸爲 側部 具、 割手 磨石 部之 具含 保持 之第 之用 固定 及用 部； 之中 該固 第二 面露 卡成 割手 定夾 部及 形狀 插入 基準 -5- 200818413 進行翻轉，利用該第一切割手段及該第二切割手段，切割 被固定於該第二插入孔列及該第一插入孔列之記憶卡之第 二側部及第一側部，使該第二側部及該第一側部成形成期 望之形狀之第二成形製程；所構成。 依據本發明，於固定夾具之第一插入孔列以可切割第 一側部之狀態固定著記憶卡，於第二插入孔列以可切割第 二側部之狀態固定著記憶卡，於該固定夾具保持於成形裝 φ 置之移動工作台之狀態下，利用第一切割手段及第二切割 手段同時成形記憶卡之第一側部及第二側部，故分別利用 第一切割手段及第二切割手段切割第一側部及第二側部 後，翻轉固定夾具之表背，再分別利用第二切割手段及第 一切割手段切割第二側部及第一側部，可有效率地成形期 望形狀之記憶卡。 【實施方式】 φ 第1圖所示之固定夾具1，係於成形記憶卡之側部 時，用以保持記憶卡之夾具，具有：夾具本體2 ;收容於 由不鏽鋼等之硬質材料所形成之夾具本體2之第一固定部 3及第二固定部4 ;收容於夾具本體2之由硬質胺甲酸乙 酯等之彈性材料所構成之緩衝構件5 ;裝設於夾具本體2 之第一支持構件6及第二支持構件7 ;用以固定第一支持 構件6及第二支持構件7之螺絲8 ;以及收容於夾具本體 1之彈簧9。 夾具本體2具備：可裝卸自如地保持於成形裝置之表 -6 - 200818413 面側之被保持部l〇a及背面側之被保持部1 〇b;配列成一 列之供記憶卡插入之記憶卡插入孔1 1所形成之第一插入 孔列1 1 a ;配列成一列之與第一插入孔列1 1 a平行並設之 供記憶卡插入之記憶卡插入孔1 1所形成之第二插入孔列 1 1 b ;用以收容第一固定部3及第二固定部4之第一固定 部收容孔1 2及第二固定部收容孔1 3 ;用以收容緩衝構件 5之緩衝構件收容孔14 ;用以收容彈簧9之彈簧收容部 1 5 ;以及用以螺合螺絲8之螺絲孔1 6。此外，於夾具本 體2之表面及背面，形成複數之：供第一固定部3及第二 固定部4滑動之開閉長孔17 ;及將固定夾具1固定於成 形裝置時之定位用之定位孔.1 8。此外，於第一支持構件6 及第二支持構件7，形成複數供螺絲8貫通之貫通孔1 9。 固定夾具1係以第一插入孔列1 〇a及第二插入孔列1 〇b之 配列方向（圖示之例係長度方向）之中間之對稱軸2a爲基 準而形成對稱。 第一固定部3及第二固定部4，於朝向緩衝構件5之 方向之側面，分別固設著硬質胺甲酸乙酯等之彈性構件 3a、4a，且分別形成貫通表背之卡合孔3b、4b。 如第2圖所示，於構成第一插入孔列1 1 a及第二插入 孔列1 1 b之各記憶卡插入孔1 1，插入著成形前之記憶卡 20。記憶卡20，具有第一側部20a及第二側部20b。 圖示之例時，各記憶卡插入孔1 1，係可以2個方向 插入記憶卡20之形狀，被插入第一插入孔列1 1 a及第二 插入孔列1 1 b之記憶卡20之方向不同。圖示之例時，被 200818413 插入構成第一插入孔列1 1 a之記憶卡插入孔1 1之記憶卡 20，係以第一側部20a朝上方露出之方式被插入，被插入 構成第二插入孔列1 1 b之記憶卡插入孔1 1之記憶卡2 〇， 係以第二側部2Ob朝上方露出之方式被插入。此外，被插 入構成第一插入孔列1 1 a之記憶卡插入孔1 1之記憶卡 20，以第二側部20b朝上方露出，而且，被插入構成第二 插入孔列1 1 b之記憶卡插入孔1 1之記憶卡2 0，以第一側 B 部20a朝上方露出之方式亦可。 另一方面，因爲記憶卡插入孔11貫通表背面，收容 於第一插入孔列1 1 a之記憶卡2 0，第二側部2 Ob從固定 夾具1之背面突出而露出，收容於第一插入孔列1 1 a之記 憶卡20，第一側部20b從固定夾具1之背面露出。 收容於第一插入孔列1 1 a之記億卡20，係插入於緩 衝構件5及第一固定部3之間，收容於第二插入孔列1 1 b 之記憶卡20，係插入於緩衝構件5及第二固定構件4之 # 間。記憶卡20係於用以擴大第一固定部3及第二固定部 4之互相距離之銷插入於開閉長孔1 7，使該銷卡合於卡合 孔3b、4b而使第一固定部3及第二固定部4朝相離之方 向張開，在對抗彈簧9之彈推力下，第一固定部3及第二 固定部4處於朝互相離離之方向移動若千之狀態，被插入 於構成第一插入孔列1 1 a及第二插入孔列1 lb之記憶卡插 入孔1 1。其次，若拆除該銷，藉由彈簧之彈推力，插入 於構成第一插入孔列1 1 a之記憶卡插入孔1 1之記憶卡20 被緩衝構件5及第一固定部3所夾持，插入於構成第二插 -8- 200818413 入孔列1 1 b之記憶卡插入孔n之記憶卡20則被緩衝構件 5及第二固定部4所夾持，皆處於安定狀態。 如第2圖及第3圖所示，用以供複數記憶卡20插入 之固定夾具1 ’例如，係使用於第4圖所示之記憶卡成形 裝置30之記憶卡之成形。該記憶卡成形裝置30，具備： 成形記憶卡之側部之切割手段3 1 ;及以可於X軸方向移 動之方式保持固定夾具1之移動工作台32。 ϋ 移動工作台32可於X軸方向移動且可旋轉，如第5 圖所示’具備裝卸自如地固保持著定夾具1之保持部 320。保持部320，例如，具有多孔質之吸引部321，吸引 部321與配設於移動工作台32之下方之圖上未標示之吸 引源進行連通。此外，於保持部320之上面，形成對應形 成於被載置之固定夾具1之定位孔18(參照第1圖）之定位 突起322，於定位突起322嵌合於定位孔18之狀態下， 固定夾具1被載置於保持部3 20，於吸引部321，固定夾 φ 具1被吸引並被保持。此時，記憶卡20之配列方向一致 於X軸方向。 第4圖之例時，切割手段3 1係由用以成形記憶卡20 之第一側部20a之第一切割手段33、及用以成形記憶卡 20之第二側部20b之第二切割手段34所構成。 如第4圖所示，第一切割手段33利用第一殻體330 以可旋轉之方式支持著第一轉軸3 3 1。如第6圖所示，第 一切割手段3 3，係於具有用以供第一轉軸3 3 0貫通之貫 通孔之圓筒狀之第一輪3 32之外周以電附著等附著著第一 -9- 200818413 切割磨石33 3而構成，第一輪332係嵌合於第一轉軸 331，並利用螺帽3 34固定而構成。第一切割磨石3 3 3係 例如以鍍鎳等固定鑽石磨粒等之磨粒而構成，具有對應於 記憶卡20之第一側部20a之期望形狀之側面形狀。 如第4圖所示，第二切割手段34利用第二殼體340 以可旋轉之方式支持著第二轉軸341。如第7圖所示，第 二切割手段34，係於具有用以供第二轉軸341貫通之貫 通孔之圓筒狀之第二輪3 42之外周以電附著等附著著第二 切割磨石343而構成，第二輪342係嵌合於第二轉軸 341，並利用螺帽344固定而構成。第二切割磨石343係 例如以鍍鎳等固定鑽石磨粒等之磨粒而構成，具有對應於 記憶卡20之第二側部20b之期望形狀之側面形狀。 因爲記憶卡20之最終之第一側部20a及第二側部 2〇b之形狀不同而成形爲非對稱，故第一切割磨石3 3 3及 第二切割磨石343之側面形狀不同。 如第4圖所示，於移動工作台32之移動路徑之上 方，配設著校準手段35。校準手段35具備攝影部3 5 0， 藉由固定夾具1之攝影來檢測其特定區域，實施移動工作 台32所保持之固定夾具1之角度調整、及第一切割手段 3 3及第二切割手段3 4之Y軸方向之定位，進行與固定於 固定夾具1之記憶卡20之關係之定位。 將記憶卡20成形成期望形狀時，如第3圖所示，將 記憶卡20以第一側部20a從固定夾具1之表面側露出之 狀態插入構成第一插入孔列1 1 a之各記憶卡插入孔1 1。 -10 - 200818413 此時，第二側部2 Ob從固定夾具1之背面側露出。另一方 面，將記憶卡20以第二側部20b從固定夾具1之表面側 露出之狀態插入構成第二插入孔列1 1 b之各記憶卡插入孔 1 1，第一側部20a從固定夾具1之背面側露出。 其次，固定夾具1之被保持部1 〇b側保持於移動工作 台32之保持部320，可使移動工作台32在X軸方向移 動，並於校準手段35之正下方移動，實施保持部320之 φ 角度之微調整、及固定於第一插入孔列1 1 a之記憶卡20 與第一切割磨石333之Y軸方向之定位、以及固定於第 二插入孔列1 lb之記憶卡20與第二切割磨石343之Y軸 方向之定位。亦即，如第8圖所示，使第一切割磨石3 3 3 位於保持於構成第一插入孔列1 1 a之記憶卡插入孔1 1之 記憶卡20之移動路徑之正上方，而且，使第二切割磨石 343位於保持於構成第二插入孔列iib之記憶卡插入孔η 之記憶卡20之移動路徑之正上方。 φ 其後，移動工作台32朝第4圖所示之+Χ方向移動， 而且，使第一切割磨石3 3 3及第二切割磨石343進行高速 旋轉，同時使第一切割手段33及第二切割手段34下降， 如第9圖所示，第一切割磨石3 3 3接觸固定於第一插入孔 列1 1 a而從上方露出之複數記憶卡2〇之第一側部2〇a， 第二切割磨石3 4 3則接觸固定於第二插入孔列n b而從上 方露出之複數記憶卡2 0之第二側部20b。如此，可將第 一切割磨石3 3 3之形狀轉錄至固定於第一插入孔列lla之 記憶卡20之第一側部20a，並將第二切割磨石343之形 -11 - 200818413 狀轉錄至固定於第一插入孔列lib之記憶卡20之第二側 部20b(第一成形製程）。 其次，從第5圖所示之保持部320拆除固定夾具1， 以第一插入孔列1 1 a及第二插入孔列1 1 b之配列方向之中 間之對稱軸2a爲基準，翻轉固定夾具1之表背後，使固 定夾具1之被保持部l〇a側保持於保持部320。此時，如 第1 〇圖所示，處於固定於第一插入孔列1 1 a之記憶卡 • 2〇 ’第二側部20b從上方露出，且固定於第二插入孔列 1 1 b之記憶卡20，第一側部20a從上方露出之狀態。此 外，固定夾具1，因爲以第一插入孔列11a及第二插入孔 列1 1 b之配列方向之中間爲基準而形成對稱，藉由翻轉， 固定於第二插入孔列11b之記憶卡20位於第一切割磨石 3 3 3之下方。固定於第一插入孔列lla之記憶卡20位於 第二切割磨石343之下方。然而，無需變更第一切割磨石 3 3 3及第二切割磨石343之Y軸方向之位置。 • 其次，於該狀態下，必要時，實施保持部320之方向 之微調整等後，如第10圖所示，保持於第一插入孔列 1 1 a之記憶卡20，第二側部20b會接觸第二切割磨石 343，保持於第二插入孔列〗lb之記憶卡20，第一側部 2 〇 a會接觸第一切割磨石3 3 3。如此，第二切割磨石3 4 3 之形狀會轉錄至記憶卡20之第二側部20b，第一切割磨 石3 3 3之形狀會轉錄至記憶卡20之第一側部20a(第二成 形製程）。此外，固定夾具1若爲精密形成，則不一定需 要實施保持部320之方向之微調整。 -12- 200818413 藉由此方式，可針對所有之記憶卡20a，將第一切割 磨石3 3 3及第二切割磨石343之形狀轉錄至第一側部20a 及第二側部2Gb，而成爲如第1 1圖所示之期望形狀之記 憶卡21。針對該記憶卡21實施4個角之倒角，其中之2 個倒角部2 1 0、2 1 1係轉錄著第一切割磨石3 3 3之形狀而 形成者。另一方面，其餘之2個倒角部212、213係轉錄 著第二切割磨石3 43之形狀而形成者。此外，於第二側部 φ 20b形成異形部214，該異形部214係轉錄第二切割磨石 3 43之形狀而形成者。 如以上所示，以固定夾具1之第一插入孔列1 1 a及第 二插入孔列lib保持記憶卡20，分別以第一切割磨石333 及第二切割磨石343切割側部後，藉由翻轉固定夾具1並 實施相同之切割，可以有效率地形成記憶卡之2個側部。 【圖式簡單說明】 • 第1圖係固定夾具之一例之分解立體圖。 第2圖係將成形前之記憶卡插入固定夾具之狀態之立 體圖。 第3圖係將成形前之記憶卡插入固定夾具之狀態之槪 略剖面圖。 第4圖係記憶卡成形裝置之一例之立體圖。 第5圖係記憶卡成形裝置之移動工作台及固定夾具之 立體圖。 第6圖係第一切割手段之槪略剖面圖。 -13- 200818413 第7圖係第二切割手段之槪略剖面圖。 第8圖係第一切割磨石及第二切割磨石之定位狀態之 正面圖。 第9圖係第一成形製程之正面圖。 第1 0圖係第二成形製程之正面圖。 第1 1圖係成形之記憶卡之正面圖。 【主要元件符號說明】 1 :固定夾具 2 :夾具本體 2a :對稱軸 3 :第一固定部 3 a :彈性構件 3b :卡合孔 4 :第二固定部 4a :彈性構件 4b :卡合孔 5 :緩衝構件 6 :第一支持構件 7 :第二支持構件 8 :螺絲 9 :彈簧 1 〇 :被保持部 l〇a :表面側之被保持部 -14- 200818413 I Ob :背面側之被保持部 II :記憶卡插入孔 1 1 a :第一插入孔列 1 1 b :第二插入孔列 1 2 :第一固定部收容孔 1 3 :第二固定部收容孔 1 4 «·緩衝構件收容孔 1 5 :彈簧收容部 1 6 :螺絲孔 1 7 :開閉長孔 1 8 :定位孔 1 9 :貫通孔 20 :記憶卡 20a :第一側部 2 0b :第二側部 21 :記憶卡 3 〇 _·記憶卡成形裝置 3 1 :切割手段 32 :移動工作台 3 3 :第一切割手段 34 :第二切割手段 3 5 :校準手段 2 1 〇 :倒角部 2 1 1 :倒角部 -15 200818413 212 :倒角部 2 1 3 :倒角部 214 :異形部 320 :保持部 321 :吸引部 322 :定位突起 3 3 0 :第一殼體 3 3 1 :第一轉軸 3 3 2 :第一輪 3 3 3 :第一切割磨石 3 3 4 :螺帽 340 :第二殼體 3 4 1 :第二轉軸 342 :第二輪 343 :第二切割磨石 3 4 4 :螺帽 3 50 :攝影部BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a forming apparatus and a forming method used for manufacturing a memory card used in a card slot of an electronic device. [Prior Art] A memory card such as an SD card (registered trademark φ mark) or a miniSD (registered trademark) that is inserted into a card slot of various electronic devices is a memory card that is mounted on a wiring board and covered with a molding resin. (For example, refer to Japanese Laid-Open Patent Publication No. 2003-44804). In the memory card, the memory element is mounted on the entire wiring board in a lattice shape and covered with a molding resin to form a package substrate, and then the region between the memory elements of the package substrate is diced or separated. form. Further, the shape of the memory card is normalized, and a profiled portion for the purpose of the front and the front and rear directions at the time of insertion is formed. Further, chamfering is performed on the corner portion where the deformed portion is not formed. SUMMARY OF THE INVENTION However, when the division of the package substrate or the like is performed, since the deformed portion and the chamfered portion are not formed, it is necessary to use the laser processing and the groove forming process to form the deformed portion and the chamfered portion of each of the memory cards. Therefore, there is a problem of low productivity. Therefore, the problem to be solved by the present invention is to improve the productivity by forming the deformed portion and the chamfered portion of the memory card with good efficiency. The memory card forming apparatus of the first invention relates to at least a mobile 200818413 workbench, which has a cutting means for cutting a grinding stone for forming an sB memory card, and a fixing clip for fixing the memory card And a holding portion for holding the fixing jig; the segment is: a first cutting means having a first cut for forming a first side portion of the memory card, and having a memory card for forming a second cutting means for the second cutting stone on the second side; the fixing clip is detachably held by the P portion of the holding portion of the moving table, and is arranged to insert a plurality of memory cards An insertion hole row formed by the insertion hole, and a second insertion hole row formed by the insertion hole of the plurality of insertion holes inserted in the first insertion hole row for inserting into the first insertion hole a first fixing portion of the memory card, wherein the second fixing of the memory card inserted in the second insertion hole row is fixed between the first insertion hole row and the second insertion hole column Symmetry axis Forming a symmetry for the reference; the held portion is formed on the firing surface and the back surface of the fixed jig, and the first side portion and the second side portion of the memory card inserted into the first insertion hole row and the φ insertion hole row and From the back of the table. A method of forming a memory card according to a second aspect of the present invention, wherein the memory card is formed by using the memory device; wherein the cutting is fixed to the first fixing member by the first cutting portion and the second cutting means a first side second side portion of the memory card inserted into the row of holes and the second row of the insertion holes, such that the first side portion and the second side portion are formed into a desired first forming process; and the fixing jig is The back of the watch, the axis of symmetry in the middle of the arrangement direction of the first hole row and the second insertion hole row is a side portion and a hand-fixing portion for holding and retaining the first portion; The second surface is formed into a cutting inserting portion and a shape insertion reference -5 - 1 184 413. The first cutting means and the second cutting means are used, and the cutting is fixed to the second insertion hole row and the first insertion The second side portion and the first side portion of the memory card of the hole array are configured to form the second side portion and the first side portion into a second forming process of a desired shape. According to the present invention, the memory card is fixed to the first insertion hole row of the fixing jig in a state in which the first side portion can be cut, and the memory card is fixed in the second insertion hole row in a state in which the second side portion can be cut. The first cutting portion and the second side portion of the memory card are simultaneously formed by the first cutting means and the second cutting means while the clamp is held in the moving table of the forming device, so that the first cutting means and the second side are respectively used After the cutting means cuts the first side portion and the second side portion, the front and back of the fixing fixture are turned over, and the second side portion and the first side portion are respectively cut by the second cutting means and the first cutting means, so that the desired shape can be efficiently formed Shape memory card. [Embodiment] φ The fixing jig 1 shown in Fig. 1 is a jig for holding a memory card when the side portion of the memory card is formed, and has a jig body 2; and is housed in a hard material made of stainless steel or the like. a first fixing portion 3 and a second fixing portion 4 of the jig body 2; a cushioning member 5 formed of an elastic material such as urethane or the like contained in the jig body 2; and a first supporting member mounted on the jig body 2 6 and a second supporting member 7; a screw 8 for fixing the first supporting member 6 and the second supporting member 7; and a spring 9 housed in the jig body 1. The jig main body 2 includes a held portion l〇a that is detachably held on the surface side of the surface of the molding apparatus -6 - 200818413, and a held portion 1 〇b on the back side; and a memory card in which the memory card is inserted in a row a first insertion hole array 1 1 a formed by the insertion hole 1 1 ; a second insertion formed by a memory card insertion hole 1 1 for the insertion of the memory card in parallel with the first insertion hole array 1 1 a The first fixing portion receiving hole 1 2 and the second fixing portion receiving hole 13 for receiving the first fixing portion 3 and the second fixing portion 4; and the buffer member receiving hole for receiving the cushioning member 5; 14; a spring receiving portion 1 5 for receiving the spring 9; and a screw hole 16 for screwing the screw 8. Further, on the front and back surfaces of the jig body 2, a plurality of opening and closing long holes 17 for sliding the first fixing portion 3 and the second fixing portion 4, and positioning holes for fixing the fixing jig 1 to the forming device are formed. .1 8. Further, in the first support member 6 and the second support member 7, a plurality of through holes 1 through which the screws 8 pass are formed. The fixing jig 1 is symmetrical with respect to the symmetry axis 2a in the middle of the arrangement direction of the first insertion hole row 1 〇a and the second insertion hole row 1 〇b (the longitudinal direction of the drawing). The first fixing portion 3 and the second fixing portion 4 are respectively fixed with elastic members 3a and 4a such as hard urethane in the side surface facing the buffer member 5, and respectively form engaging holes 3b penetrating the front and back sides. 4b. As shown in Fig. 2, the memory card 20 before molding is inserted into each of the memory card insertion holes 1 1 constituting the first insertion hole array 1 1 a and the second insertion hole array 1 1 b. The memory card 20 has a first side portion 20a and a second side portion 20b. In the illustrated example, each of the memory card insertion holes 1 1 can be inserted into the shape of the memory card 20 in two directions, and inserted into the memory card 20 of the first insertion hole array 1 1 a and the second insertion hole array 1 1 b. The direction is different. In the example shown in the figure, the memory card 20 inserted into the memory card insertion hole 1 1 of the first insertion hole array 1 1 a by 200818413 is inserted so that the first side portion 20a is exposed upward, and is inserted into the second form. The memory card 2 of the memory card insertion hole 1 1 inserted into the hole array 1 1 b is inserted so that the second side portion 2Ob is exposed upward. Further, the memory card 20 inserted into the memory card insertion hole 1 1 constituting the first insertion hole array 1 1 a is exposed upward with the second side portion 20b, and is inserted into the memory constituting the second insertion hole array 1 1 b The memory card 20 of the card insertion hole 1 1 may be exposed such that the first side B portion 20a is exposed upward. On the other hand, since the memory card insertion hole 11 penetrates the front and back surfaces, the memory card 20 is accommodated in the first insertion hole array 1 1 a, and the second side portion 2 Ob protrudes from the back surface of the fixing jig 1 and is exposed to the first. The memory card 20 inserted into the hole array 11a has the first side portion 20b exposed from the back surface of the fixing jig 1. The card 100 received in the first insertion hole row 1 1 a is inserted between the buffer member 5 and the first fixing portion 3, and the memory card 20 housed in the second insertion hole row 1 1 b is inserted into the buffer. # between the member 5 and the second fixing member 4. The memory card 20 is inserted into the opening and closing long hole 17 by a pin for expanding the mutual distance between the first fixing portion 3 and the second fixing portion 4, and the pin is engaged with the engaging holes 3b and 4b to make the first fixing portion. 3 and the second fixing portion 4 is opened in the direction of separation, and under the elastic thrust of the anti-spring 9, the first fixing portion 3 and the second fixing portion 4 are in a state of being moved away from each other by a thousand, and are inserted. The memory card insertion hole 11 is formed in the first insertion hole array 11a and the second insertion hole array 11b. Then, when the pin is removed, the memory card 20 inserted into the memory card insertion hole 1 1 constituting the first insertion hole array 11 a is held by the buffer member 5 and the first fixing portion 3 by the spring bias. The memory card 20 inserted into the memory card insertion hole n constituting the second insertion -8-200818413 entrance hole array 1 1 b is held by the buffer member 5 and the second fixing portion 4, and is in a stable state. As shown in Figs. 2 and 3, the fixing jig 1 for inserting the plurality of memory cards 20 is formed, for example, by the memory card of the memory card forming device 30 shown in Fig. 4. The memory card forming apparatus 30 includes a cutting means 3 1 for forming a side portion of the memory card, and a moving table 32 for holding the fixing jig 1 so as to be movable in the X-axis direction. ϋ The moving table 32 is movable in the X-axis direction and is rotatable, and as shown in Fig. 5, the holding portion 320 for holding the fixed jig 1 is detachably attached. The holding portion 320 has, for example, a porous suction portion 321 that communicates with an unillustrated suction source disposed on the lower side of the moving table 32. Further, on the upper surface of the holding portion 320, positioning projections 322 corresponding to the positioning holes 18 (see FIG. 1) formed on the fixing jig 1 to be placed are formed, and the positioning projections 322 are fitted to the positioning holes 18, and are fixed. The jig 1 is placed on the holding portion 315, and at the suction portion 321, the fixed clip φ 1 is sucked and held. At this time, the arrangement direction of the memory card 20 coincides with the X-axis direction. In the case of Fig. 4, the cutting means 31 is a first cutting means 33 for forming the first side portion 20a of the memory card 20, and a second cutting means for forming the second side portion 20b of the memory card 20. 34 constitutes. As shown in Fig. 4, the first cutting means 33 rotatably supports the first rotating shaft 3 31 by the first housing 330. As shown in Fig. 6, the first cutting means 3 3 is attached to the outer circumference of the cylindrical first wheel 3 32 having a through hole through which the first rotating shaft 340 passes. -9- 200818413 The grinding stone 33 3 is cut, and the first wheel 332 is fitted to the first rotating shaft 331 and is fixed by a nut 341. The first cutting stone 3 3 3 is formed, for example, by grinding abrasive grains such as nickel-plated fixed diamond abrasive grains, and has a side shape corresponding to a desired shape of the first side portion 20a of the memory card 20. As shown in FIG. 4, the second cutting means 34 rotatably supports the second rotating shaft 341 by the second housing 340. As shown in Fig. 7, the second cutting means 34 is attached to the second cutting grindstone by electric attachment or the like on the outer circumference of the cylindrical second wheel 3 42 having the through hole through which the second rotating shaft 341 passes. The second wheel 342 is fitted to the second rotating shaft 341 and fixed by a nut 344. The second cutting grindstone 343 is formed by, for example, fixing abrasive grains such as diamond abrasive grains such as nickel plating, and has a side shape corresponding to a desired shape of the second side portion 20b of the memory card 20. Since the shape of the first side portion 20a and the second side portion 2b of the memory card 20 are different from each other, the shape of the side surfaces of the first cutting stone 333 and the second cutting stone 343 are different. As shown in Fig. 4, a calibration means 35 is disposed above the moving path of the moving table 32. The calibration means 35 includes an imaging unit 350, detects a specific region by the imaging of the fixing jig 1, performs angle adjustment of the fixing jig 1 held by the moving table 32, and the first cutting means 3 3 and the second cutting means Positioning in the Y-axis direction of 3 4 is performed in relation to the relationship between the memory card 20 fixed to the fixed jig 1. When the memory card 20 is formed into a desired shape, as shown in FIG. 3, the memory card 20 is inserted into the memory constituting the first insertion hole array 11a in a state where the first side portion 20a is exposed from the surface side of the fixing jig 1 as shown in FIG. The card is inserted into the hole 1 1. -10 - 200818413 At this time, the second side portion 2 Ob is exposed from the back side of the fixing jig 1. On the other hand, the memory card 20 is inserted into each of the memory card insertion holes 1 1 constituting the second insertion hole array 1 1 b in a state where the second side portion 20b is exposed from the surface side of the fixing jig 1 , and the first side portion 20 a is fixed. The back side of the jig 1 is exposed. Then, the held portion 1 of the fixed jig 1 is held by the holding portion 320 of the moving table 32, and the moving table 32 is moved in the X-axis direction and moved directly under the calibration means 35, and the holding portion 320 is implemented. The φ angle is finely adjusted, and the memory card 20 fixed to the first insertion hole array 1 1 a is positioned in the Y-axis direction of the first cutting grindstone 333, and the memory card 20 fixed to the second insertion hole array 1 lb Positioning with the Y-axis direction of the second cutting grindstone 343. That is, as shown in Fig. 8, the first cutting grindstone 3 3 3 is positioned directly above the moving path of the memory card 20 held by the memory card insertion hole 1 1 constituting the first insertion hole array 11a, and The second cutting grindstone 343 is positioned directly above the moving path of the memory card 20 held by the memory card insertion hole η constituting the second insertion hole array iib. φ thereafter, the moving table 32 is moved in the +Χ direction shown in FIG. 4, and the first cutting stone 333 and the second cutting stone 343 are rotated at a high speed, and the first cutting means 33 and The second cutting means 34 is lowered. As shown in FIG. 9, the first cutting grindstone 3 3 3 contacts the first side portion 2 of the plurality of memory cards 2 固定 which are fixed to the first insertion hole array 11 a and are exposed from above. a, the second cutting grindstone 3 4 3 contacts the second side portion 20b of the plurality of memory cards 20 that are fixed to the second insertion hole row nb and exposed from above. Thus, the shape of the first cutting grindstone 3 3 3 can be transcribed to the first side portion 20a of the memory card 20 fixed to the first insertion hole row 11a, and the shape of the second cutting grindstone 343 is -11 - 200818413 The second side portion 20b of the memory card 20 fixed to the first insertion hole column lib is transcribed (first forming process). Next, the fixing jig 1 is removed from the holding portion 320 shown in Fig. 5, and the fixing jig is turned over based on the axis of symmetry 2a in the middle of the arrangement direction of the first insertion hole row 1 1 a and the second insertion hole row 1 1 b. Behind the watch of Fig. 1, the holding portion l〇a side of the fixing jig 1 is held by the holding portion 320. At this time, as shown in FIG. 1 , the memory card 2 ′′ second side portion 20 b fixed to the first insertion hole array 11 a is exposed from above and is fixed to the second insertion hole array 1 1 b. The memory card 20 is in a state in which the first side portion 20a is exposed from above. Further, the fixing jig 1 is formed symmetrically with respect to the middle of the arrangement direction of the first insertion hole array 11a and the second insertion hole array 11b, and is fixed to the memory card 20 of the second insertion hole array 11b by inversion. Located below the first cutting stone 3 3 3 . The memory card 20 fixed to the first insertion hole array 11a is located below the second cutting grindstone 343. However, it is not necessary to change the position of the first cutting grindstone 3 3 3 and the second cutting grindstone 343 in the Y-axis direction. • Next, in this state, if necessary, fine adjustment of the direction of the holding unit 320, etc., as shown in Fig. 10, the memory card 20 held in the first insertion hole row 1 1 a, the second side portion 20b The second cutting stone 343 is contacted, and is held in the memory card 20 of the second insertion hole array lb, and the first side portion 2 〇a contacts the first cutting stone 3 3 3 . Thus, the shape of the second cutting grindstone 3 4 3 is transcribed to the second side portion 20b of the memory card 20, and the shape of the first cutting grindstone 3 3 3 is transcribed to the first side portion 20a of the memory card 20 (second Forming process). Further, if the fixing jig 1 is precisely formed, it is not necessary to perform fine adjustment of the direction of the holding portion 320. -12- 200818413 In this way, the shapes of the first cutting grindstone 3 3 3 and the second cutting grindstone 343 can be transcribed to the first side portion 20a and the second side portion 2Gb for all the memory cards 20a, and The memory card 21 has a desired shape as shown in Fig. 11. The memory card 21 is chamfered by four corners, and the two chamfered portions 2 1 0 and 2 1 1 are formed by transcribed the shape of the first cutting grindstone 3 3 3 . On the other hand, the other two chamfered portions 212, 213 are formed by transcribed the shape of the second cutting stone 433. Further, a deformed portion 214 is formed on the second side portion φ 20b, and the deformed portion 214 is formed by transcribed the shape of the second cutting stone 433. As described above, the memory card 20 is held by the first insertion hole array 11a and the second insertion hole array lib of the fixing jig 1, and the side portions are cut by the first cutting stone 333 and the second cutting stone 343, respectively. By flipping the fixing jig 1 and performing the same cutting, the two side portions of the memory card can be efficiently formed. [Simple description of the drawings] • Fig. 1 is an exploded perspective view of an example of a fixing jig. Fig. 2 is a perspective view showing a state in which a memory card before forming is inserted into a fixing jig. Fig. 3 is a schematic cross-sectional view showing a state in which a memory card before forming is inserted into a fixing jig. Fig. 4 is a perspective view showing an example of a memory card forming apparatus. Fig. 5 is a perspective view showing a moving table and a fixing jig of the memory card forming apparatus. Figure 6 is a schematic cross-sectional view of the first cutting means. -13- 200818413 Figure 7 is a schematic cross-sectional view of the second cutting means. Fig. 8 is a front elevational view showing the positioning state of the first cutting stone and the second cutting stone. Figure 9 is a front view of the first forming process. Figure 10 is a front view of the second forming process. Figure 11 is a front view of a formed memory card. [Main component symbol description] 1 : Fixing jig 2 : Clamp body 2a : Symmetry axis 3 : First fixing portion 3 a : Elastic member 3 b : Engagement hole 4 : Second fixing portion 4 a : Elastic member 4 b : Engagement hole 5 : cushioning member 6 : first support member 7 : second support member 8 : screw 9 : spring 1 〇 : held portion l 〇 a : surface-side held portion 14 - 200818413 I Ob : held portion on the back side II: Memory card insertion hole 1 1 a : First insertion hole array 1 1 b : Second insertion hole array 1 2 : First fixing portion accommodation hole 1 3 : Second fixing portion accommodation hole 1 4 «·Actuator member accommodation hole 1 5 : Spring housing portion 1 6 : Screw hole 1 7 : Opening and closing long hole 1 8 : Positioning hole 1 9 : Through hole 20 : Memory card 20a : First side portion 2 0b : Second side portion 21 : Memory card 3 〇 _· Memory card forming device 3 1 : Cutting means 32 : Moving table 3 3 : First cutting means 34 : Second cutting means 3 5 : Calibration means 2 1 〇: Chamfering part 2 1 1 : Chamfering section -15 200818413 212 : chamfered portion 2 1 3 : chamfered portion 214 : deformed portion 320 : holding portion 321 : suction portion 322 : positioning projection 3 3 0 : first housing 3 3 1 : first rotating shaft 3 3 2 : Wheel 3 3 3 : first cutting stone 3 3 4 : nut 340 : second housing 3 4 1 : second shaft 342 : second wheel 343 : second cutting stone 3 4 4 : nut 3 50 : Department of Photography