1254999 九、發明說明： 【發明所屬之技術領域】 本發明係與半導體產品有關，特別是指一種電子元件 之封裝方法，其可直接成形為所電子元件需要的外型。 :5【先前技術】 按，一般應用於數位相機或行動電話之記憶卡(Flash Card)的製造流程為：首先製造記憶卡的電路基板，並在其 _ 上安裝主動與被動元件，接著對該電路基板進行封裝作業 (package)，最後將電路基板利用超音波或是熱熔壓等技術 10固定於一殼件中，如此即可得到一般市售之記憶卡。 市售之3己憶卡有許多格式，例如·· Compact Flash Card (CF card) > Secure Digital Card (SD card) ^ Multi Media Card (MMC)等。因此製造商必須準備不同的殼件，來製造不同 格式的記憶卡，如此會使成本相對提高。再者，以製造SD 15卡為例，記憶卡的一角呈切角狀，所以電路基板也需要被 • 製作為具有切角的形狀。在製造流程中，該電路基板必須 在封裝後進行切角的步驟，如此又會增加製程的複雜性與 增加製造成本。 20【發明内容】 本發明之主要目的在於提供一種電子元件的封裝方 法，其可直接製作出所需要形狀之電子元件。 為達成W述之發明目的，本發明所提供之電子元件之 封裝方法，包含有下列步驟： 1254999 a) 在一基板上開設若干穿槽，其中該基板上具有若干 電子單元，而該等穿槽是位於各該電子單元的旁邊； b) 將4基板裝设於―模具之模穴中，其中該模穴之壁 =上具有一表面輪廓，該表面輪廓是位於對應於該等穿槽 c) 將熔融狀之封裝膠注入該模具之模穴中； p待销裝膠固化後，打開該模具並取出該基板，此 、、，該固化後之封裝膠形成一封裝層覆蓋該等電子單元， 以及 e)切割該基板，以得到若干電子元件，每一電子元件 =有-基板’其上具有該電子單元，以及該封裝層，而在 μ封裝層上具有由該表面輪廓所形成之預定形狀。 15 依據本發明之方法所製造出之電子元件包含有一基 $其上具有-電子單元，其是由一電路與至少一主動元 2組成；—封裝層，設置於該基板上且包覆該電子單元， ^該封裝層之面積大於該基板，且該封裝層在超過該基 ，之部份形成-周緣部，且關緣部上具有直 之預 疋形狀。 20【實施方式】 ^為了詳細說明本發明之構造及特點所在，茲舉以下之 較佳實施例並配合圖式說明如后： 請參閱第-圖至第四圖所示，本發明第一較佳實施例 斤提供之電子元件之封裝方法，包含有下列步驟： 1254999 a) 請參閱第一圖所示，在一基板10上開設若干長形穿 槽12，其中該基板10上具有呈行列排列之電子單元14， 該等電子單元14由Hx及若干主動元件與被動元件 (未顯示)所組成。該等穿槽12呈平行排列，位於該等電子 單元14的各列之間以及第一列與最後一列之外側。 b) 請參閱第二圖與第三圖所示，將該基板1〇放置於 一模具16之模穴22中，其中該模具16是由一上模18以 及一下模20所組成，在該模穴22之壁面上具有預定之表 面輪廓(surface profile)，對應於該基板1〇上之各穿槽12。 對應於每-電子單it 14，該表面輪廓具有—三角形的柱體 24，由該下模20延伸至該上模18、一楔形凸條％，位於 該柱體24的旁邊，以及一半圓形凸條28。 、 c) 在該模416之模& 22中注入炼融狀之封裝膠。 15 d) 待該封裝膠冷卻後，打開該模具16,並取出該基板 10。請參閱第四圖所示，該基板1G上具有—封裝層3〇:包 覆該基板1G上之各電子單幻4之電路、主動树與被動 兀件。雜裝層3G在對應於該表面輪廓之位置且有特定之 形狀(pattern)，例如對應於每一電子單元14之頂側後方具 有-凹槽32 ’細前方具楔形部34，而該楔形部％ 的旁邊具有一三角形之穿孔36。 e) 沿第四圖所示之假想線[切割該基板1〇，可得 干電子元件38。請參_五_第六圖，各該電子元件％ 之封裝層30之面積大於該基板1〇之面積使該封裝層邓 再超過該基板10之部份形成—周緣部4G，而在該周緣部 20 1254999 1\上具有一切角部42(由該穿孔36所形成）、該_部34 从及該凹槽32。 f)研磨各該電子it件38的周邊，以去除尖銳的部分。 由以上所揭示之方法可知，本發明所提供之 77 ^習用之製造程序中的封裝步驟加以改良，直接成形^ 件所需要雜。可省去制製造程序巾之料於 :的步驟，如此可簡化製造程序，並且不需要另外製ς殼 ，以及省去殼件所帶來的成本增加。 λ 本發明第-較佳實施例所提供之方法僅能在電 U目反二滅形所需要的形狀。如果欲在電子元件的 ^成形所需要的形狀時，可在基板上再開設穿槽。★青 =圖所示，基板44上所開設的穿槽从仙包ς 15 =5〇的各列之間以及第-列與最後-列之外側之長： :槽46,以及位於電子單元％的各行之間以及 最 C行，以及相鄰之二該長形穿槽48之間。或是： =圖所示，該基板52在環繞各該電 開設一穿槽56。祕具之模物& μ目+ ± W四周各 應於各該穿_未頻干）。具有之表面輪廓可對 九圖# Γ 此_成之電子元件％，如第 哕；子不2板6〇位於中央而四侧邊均形成週緣部62，使 °亥電子凡件58的四側邊均可成形預定之形狀。 7 20 1254999 【圖式簡單說明】 顯示在該 第一圖係本發明第一較佳實施例之示意圖 基板上開設穿槽； 第二圖係本發明第—較佳實施例之示意圖，顯示基板 位於模具中但模具之上模未顯示； 第二圖係第二圖中沿3_3剖線之剖視圖；1254999 IX. Description of the Invention: [Technical Field] The present invention relates to a semiconductor product, and more particularly to a method of packaging an electronic component which can be directly formed into a desired shape of the electronic component. :5 [Prior Art] Press, the memory card (Flash Card) generally used in digital cameras or mobile phones is manufactured by first manufacturing a circuit board of a memory card, and installing active and passive components on the camera, and then The circuit board is packaged, and finally the circuit board is fixed in a case by ultrasonic wave or hot melt pressing technology 10, so that a commercially available memory card can be obtained. There are many formats available on the market, such as Compact Flash Card (CF card) > Secure Digital Card (SD card) ^ Multi Media Card (MMC). Therefore, manufacturers must prepare different shells to make memory cards in different formats, which will increase the cost. Furthermore, in the case of manufacturing an SD 15 card, a corner of the memory card has a chamfered shape, so the circuit board also needs to be formed into a chamfered shape. In the manufacturing process, the circuit substrate must be chamfered after packaging, which in turn increases the complexity of the process and increases manufacturing costs. 20] SUMMARY OF THE INVENTION A primary object of the present invention is to provide an electronic component packaging method which can directly produce an electronic component of a desired shape. In order to achieve the object of the invention, the method for packaging an electronic component provided by the present invention comprises the following steps: 1254999 a) opening a plurality of slots in a substrate, wherein the substrate has a plurality of electronic units, and the through slots Is located next to each of the electronic units; b) mounting the 4 substrate in the mold cavity of the mold, wherein the wall of the cavity has a surface contour, and the surface contour is located corresponding to the through grooves c) Injecting the molten encapsulant into the cavity of the mold; p, after the glue is solidified, opening the mold and taking out the substrate, wherein the cured encapsulant forms an encapsulation layer covering the electronic units, And e) cutting the substrate to obtain a plurality of electronic components, each electronic component=with-substrate having the electronic unit thereon, and the encapsulation layer having a predetermined shape formed by the surface profile on the μ encapsulation layer . 15 The electronic component produced by the method of the present invention comprises a base having an electronic unit thereon, which is composed of a circuit and at least one active element 2; an encapsulation layer disposed on the substrate and covering the electron The unit, the area of the encapsulation layer is larger than the substrate, and the encapsulation layer forms a peripheral portion at a portion beyond the base, and has a straight pre-cut shape on the edge portion. 20 [Embodiment] In order to explain the structure and features of the present invention in detail, the following preferred embodiments are described with reference to the following figures: Please refer to the first to fourth figures, the first comparison of the present invention The method for packaging the electronic component provided by the embodiment includes the following steps: 1254999 a) Referring to the first figure, a plurality of elongated slots 12 are formed in a substrate 10, wherein the substrate 10 has rows and columns arranged thereon. The electronic unit 14 is composed of Hx and a plurality of active components and passive components (not shown). The through slots 12 are arranged in parallel, between the columns of the electronic units 14 and on the outside of the first and last columns. b) Referring to the second and third figures, the substrate 1 is placed in a cavity 22 of a mold 16, wherein the mold 16 is composed of an upper mold 18 and a lower mold 20, in the mold The wall surface of the pocket 22 has a predetermined surface profile corresponding to each of the slots 12 in the substrate 1 . Corresponding to each-electronic single it 14, the surface profile has a triangular-shaped cylinder 24 extending from the lower mold 20 to the upper mold 18, a wedge-shaped ridge %, located beside the cylinder 24, and a semi-circular shape Ribs 28. And c) injecting a molten encapsulant into the mold & 22 of the mold 416. 15 d) After the encapsulant is cooled, the mold 16 is opened and the substrate 10 is taken out. Referring to the fourth figure, the substrate 1G has an encapsulation layer 3: a circuit for covering each electronic single magic 4 on the substrate 1G, an active tree and a passive element. The miscellaneous layer 3G has a specific pattern at a position corresponding to the surface contour, for example, corresponding to the top side of each electronic unit 14 has a groove 32', a thin front portion having a wedge portion 34, and the wedge portion The side of % has a triangular perforation 36. e) along the imaginary line shown in the fourth figure [cutting the substrate 1 〇, the dry electronic component 38 is obtained. Referring to FIG. 5, the area of the encapsulation layer 30 of each of the electronic components is larger than the area of the substrate 1 such that the encapsulation layer is further formed over the portion of the substrate 10, and the peripheral portion 4G is formed at the periphery. The portion 20 1254999 1\ has all corners 42 (formed by the perforations 36), the _ portion 34 and the recess 32. f) Grinding the perimeter of each of the electronic components 38 to remove sharp portions. It can be seen from the above-discussed methods that the packaging steps in the manufacturing process provided by the present invention are improved, and the necessary molding is required. The step of manufacturing the procedural towel can be omitted, which simplifies the manufacturing process and eliminates the need for additional clamshells and the cost of the casing. λ The method provided by the first preferred embodiment of the present invention can only be used in the shape required for the electric purpose. If it is desired to shape the electronic component, a groove can be formed in the substrate. ★ Cyan = as shown in the figure, the groove formed in the substrate 44 is from the columns of the fairy bag 15 = 5 之间 and the length of the outer side of the first column and the last column: : groove 46, and located in the electronic unit% Between the rows and the most C rows, and between the adjacent two elongated slots 48. Or: = As shown in the figure, the substrate 52 defines a through-groove 56 around each of the electrodes. The mold of the secret tool & μ mesh + ± W around each should be worn _ not frequency dry. The surface profile can be on the nine figure # Γ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The predetermined shape can be formed on both sides. 7 20 1254999 [Brief Description of the Drawings] The first figure shows a through-groove on the schematic substrate of the first preferred embodiment of the present invention; the second figure is a schematic view of the first preferred embodiment of the present invention, showing that the substrate is located The mold is not shown in the mold but the mold is not shown; the second figure is a cross-sectional view along the line 3_3 in the second figure;
10 第四圖本發明第一較佳實施例之示意圖，顯示灌膠步 驟後，該基板之頂視圖； 第五圖與第六圖係本發明第一較佳實施例之切割後之 電子元件之頂視圖與底視圖； 第七圖係本發明第二較佳實施例之示意圖，顯示在該 基板上開設穿槽； 第八圖係本發明第三較佳實施例之示意圖，顯示在該 基板上開設穿槽，以及 第九圖係本發明第二與第三較佳實施例所成形之電子 元件之示意圖。 1254999 【主要元件符號說明】 10基板 12穿槽 14電子單元 16模具 18上模 20下模 22模穴 24,26,28表面輪廓（凸條、柱體) 5 30封裝層 32凹槽 34楔形部 36穿孔 42切角部 38電子元件 40周緣部 44基板 46, 48穿槽 50電子單元 52基板 54電子單元 56穿槽 10 58電子元件 60基板 62週緣部10 is a schematic view showing a first preferred embodiment of the present invention, showing a top view of the substrate after the step of filling; 5 and 6 are the electronic components after cutting according to the first preferred embodiment of the present invention. The top view and the bottom view; the seventh figure is a schematic view of the second preferred embodiment of the present invention, showing a through-groove on the substrate; the eighth figure is a schematic view of the third preferred embodiment of the present invention, shown on the substrate A slot is provided, and a ninth drawing is a schematic view of an electronic component formed by the second and third preferred embodiments of the present invention. 1254999 [Description of main component symbols] 10 substrate 12 through slot 14 electronic unit 16 mold 18 upper mold 20 lower mold 22 mold cavity 24, 26, 28 surface contour (spigot, cylinder) 5 30 encapsulation layer 32 groove 34 wedge portion 36 perforation 42 chamfered portion 38 electronic component 40 peripheral portion 44 substrate 46, 48 through slot 50 electronic unit 52 substrate 54 electronic unit 56 through slot 10 58 electronic component 60 substrate 62 peripheral portion