TW200634937A - Method of packaging electronic components and electronic component made thereby - Google Patents

Method of packaging electronic components and electronic component made thereby

Info

Publication number
TW200634937A
TW200634937A TW094108678A TW94108678A TW200634937A TW 200634937 A TW200634937 A TW 200634937A TW 094108678 A TW094108678 A TW 094108678A TW 94108678 A TW94108678 A TW 94108678A TW 200634937 A TW200634937 A TW 200634937A
Authority
TW
Taiwan
Prior art keywords
packaging
substrate
electronic component
electronic
component made
Prior art date
Application number
TW094108678A
Other languages
Chinese (zh)
Other versions
TWI254999B (en
Inventor
Chi-Pang Huang
Original Assignee
Chi-Pang Huang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chi-Pang Huang filed Critical Chi-Pang Huang
Priority to TW94108678A priority Critical patent/TWI254999B/en
Application granted granted Critical
Publication of TWI254999B publication Critical patent/TWI254999B/en
Publication of TW200634937A publication Critical patent/TW200634937A/en

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

A method of packaging an electronic component comprises: forming a slot in a substrate at a location adjacent to an electronic unit; positioning the substrate in a cavity of a mold where a wall of the mold cavity has a surface contour corresponding to the slot of the substrate; injecting packaging resin; and taking out and cutting the substrate to get a plurality of electronic components wherein each electronic component has a substrate on which the electronic unit is arranged and a packaging layer formed by curing of the packaging resin which has a predetermined shape defined by the surface contour.
TW94108678A 2005-03-21 2005-03-21 Method of packaging electronic components and electronic component made thereby TWI254999B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94108678A TWI254999B (en) 2005-03-21 2005-03-21 Method of packaging electronic components and electronic component made thereby

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94108678A TWI254999B (en) 2005-03-21 2005-03-21 Method of packaging electronic components and electronic component made thereby

Publications (2)

Publication Number Publication Date
TWI254999B TWI254999B (en) 2006-05-11
TW200634937A true TW200634937A (en) 2006-10-01

Family

ID=37607572

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94108678A TWI254999B (en) 2005-03-21 2005-03-21 Method of packaging electronic components and electronic component made thereby

Country Status (1)

Country Link
TW (1) TWI254999B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451535B (en) * 2012-02-22 2014-09-01 Advanced Semiconductor Eng Irregular-shaped semiconductor package and method for making the same
CN112233986A (en) * 2019-07-15 2021-01-15 矽磐微电子(重庆)有限公司 Manufacturing method of chip packaging structure and plastic packaging mold

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4861751B2 (en) * 2006-06-07 2012-01-25 株式会社ディスコ Memory card molding apparatus and molding method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451535B (en) * 2012-02-22 2014-09-01 Advanced Semiconductor Eng Irregular-shaped semiconductor package and method for making the same
CN112233986A (en) * 2019-07-15 2021-01-15 矽磐微电子(重庆)有限公司 Manufacturing method of chip packaging structure and plastic packaging mold

Also Published As

Publication number Publication date
TWI254999B (en) 2006-05-11

Similar Documents

Publication Publication Date Title
TW200742519A (en) Substrate embedded with passive device
WO2007130451A3 (en) Laminated electronic components and method for insert molding
MX2016007899A (en) Plastic moulded part and method for the production thereof.
WO2007020417A3 (en) Orthopaedic surgical instrument
TW200746467A (en) Light emitting unit, apparatus and method for manufacturing the same, apparatus for molding lens thereof, and light emitting device package thereof
EP1634686A4 (en) Method of forming film on molded body, method of producing molded body with film formed thereon, mold for producing molded body with film formed thereon
HK1108140A1 (en) Method of forming a hardened skin on a surface of a molded article
ATE462545T1 (en) METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCED THEREFROM
WO2006050230A3 (en) System, device, and method for producing thin plastic lenses
WO2008149544A1 (en) Form, microprocessed article, and their manufacturing methods
WO2006113758A3 (en) Method of two shot mold metallizing of polymer components
TW200944093A (en) Case of an electronic device and method of fabricating the same
TW200713473A (en) Method of resin-seal-molding electronic component and apparatus therefor
JP2009220569A (en) Injection mold and method for making housing using the injection mold
TW200634937A (en) Method of packaging electronic components and electronic component made thereby
TW200801806A (en) Method of fabricating a mold
WO2007019009A3 (en) Process for 360 degree soft touch molding on an object core and product made therewith
SG131057A1 (en) Method of resin-seal-molding electronic component and apparatus therefor
TW200630003A (en) Wiring pattern formation method, manufacturing method for multi layer wiring substrate, and electronic device
WO2010107212A3 (en) Method of manufacturing case-integrated film type antenna
WO2008153336A3 (en) Case for electronic apparatus and method of manufacturing case for electronic apparatus
CN103140066A (en) Decorative shell and production method thereof
MY154273A (en) A film for sliced veneer insert, a method of manufacturing same, and a method of manufacturing a sliced veneer insert molded article
TW200633830A (en) In mold decoration fabrication of injection molding
DE602006009293D1 (en) LAMINATE MANUFACTURE THROUGH RESIN INJECTION

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees