JP2007313628A - Die for processing of mother board, manufacturing method for working plate, and manufacturing method for product plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To perform processing of a mother board in dividing into a plurality of processing regions along the mother board transported direction, in which it is possible to extend the degree of freedom in selecting the processing method in each region without complication of a processing die or its enlargement in the size. <P>SOLUTION: A first region 12 and a second region 14 are provided in the downstream and upstream, respectively, about the mother board transported direction, and a mother board cutting means to cut the mother board in the direction crossing the mother board transported direction is installed between the first 12 and second regions 14. The mother board cutting means includes a female die 60 with the undersurface of the upper die 50 secured to the first region 12 and an upper die stripper 70 for cutting the mother board arranged movably in the vertical direction along the side face in the upstream of the female die 60 and energized downward, and on the second region 14 of a lower die 20, a punch 38 for cutting the mother board is installed in such an arrangement that its side face in the downstream slides along the side face in the upstream of the female die 60. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a mold for processing a mother board, a method for manufacturing a processed board, and a method for manufacturing a product board. More specifically, a product board (for example, a printed circuit board) is temporarily fixed to a frame portion by a pushback method. A processing die (for example, a mounting substrate) or a base plate processing mold for manufacturing a processing plate temporarily fixed to a frame portion through a long hole connecting portion in which product plates are discretely formed, The present invention relates to a method for manufacturing a processed plate using such a base plate processing mold, and a method for manufacturing a product plate obtained by breaking a frame portion provided in such a processed plate.

  In recent years, with the miniaturization of electronic devices, there has been an increasing demand for miniaturization and modification of printed circuit boards used in electronic devices. On the other hand, an electronic component automatic mounting machine (hereinafter referred to as “self-mounting machine”) such as a chip mounter or an automatic insertion machine for mounting electronic components on a printed circuit board is referred to as the size of a workpiece because of its conveyance. Have upper and lower limits. Moreover, the external shape of the workpiece | work used for a self-machine is required to be substantially rectangular, ie, at least one side is a straight line, and at least one of the orthogonal sides is a straight line.

  Therefore, when mounting electronic components on a small and irregular printed circuit board using a self-mounting machine, first, a plurality of printed circuit boards are formed on the printed wiring board, and the V-cut method and pushback method are used. Using a perforation method, etc., the printed circuit board is temporarily fixed to the original printed wiring board, and then the printed wiring board has a size and shape that can be conveyed by the self-equipment. A method of cutting a substrate (mounting substrate) is used.

Of these, the V-cut method inserts V-shaped, U-shaped and other concave grooves (V-cut) along the printed circuit boundary printed on the printed wiring board, and mounts electronic components on the printed circuit. And then breaking along the V-cut. Therefore, the V-cut method can be applied only to a printed circuit board whose outer shape is linear.
The perforation method is a method in which a large number of small holes are formed along the boundary line of the printed circuit board and the holes are broken along the small holes. The perforation method is applicable only to a printed circuit board that does not require dimensional accuracy of the outer shape, because unevenness remains on the boundary line after fracture.

  On the other hand, in the pushback method, the printed circuit board is punched out using a blade having a predetermined shape while holding the printed wiring board between the upper mold and the lower mold, and then the punched printed circuit board is removed from the original hole. It is a method of fitting. The pushback method has a high dimensional accuracy of the outer shape and there is no restriction on the shape of the printed circuit board, and is therefore an effective method particularly when electronic components are automatically mounted on a deformed printed circuit board.

The processing of printed wiring board using the pushback method is generally
(1) Form a reference hole for pushback on the printed wiring board on which the electric circuit is printed,
(2) Push-back processing of the printed circuit board using the push-back mold, and drilling of component holes as necessary,
(3) Cutting the outer shape of the printed wiring board using an outer cutting die and cutting out a mounting board including a predetermined number of printed circuit boards from the mother board.
Has been done.

  However, the pushback process generally tends to warp because a strong shearing force acts on the printed wiring board. Conventionally, pushback processing and outline cutting have been generally performed using separate molds. However, if only pushback processing is performed continuously on the base plate, large warpage will occur in the base plate. There is a problem that it becomes difficult to cut the outer shape. In addition, a pushback mold and an outer cutting mold are required, which increases the cost. Further, when the manufactured mounting board is warped or has a relatively large residual stress, it is difficult to remove the printed circuit board from the frame.

Therefore, in order to solve this problem, Patent Document 1 discloses that the printed circuit board is disposed on the upstream side with respect to the conveyance direction of the printed wiring board, and the printed circuit board is punched out from the printed wiring board. A mounting board including one or two or more of the printed circuit boards that are arranged on the downstream side with respect to the transport direction of the printed wiring board and pushed back. There is disclosed a printed wiring board processing die having an outer shape cutting means for cutting out from a printed wiring board.
In this document, since the area pushed back by the pushback means is sequentially separated by the outline cutting means, the outline cutting can be easily performed without being greatly affected by the warp of the printed wiring board, and one metal It describes that the die cost can be reduced because push back processing and external cutting processing can be performed with the mold.

  Further, Patent Document 2 is arranged on the upstream side with respect to the conveyance direction of the mother board, punches the punching board from the mother board, and pushback means for fitting the punched punching board into the original hole; For processing a mother board provided with an external cutting means for cutting out from the mother board a processing board including one or more punched plates that are disposed downstream of the mother board in the conveying direction and pushed back In the mold, a mother board further comprising flat punching means for pressing the mother board in which the punching plate is fitted between the pushback means and the outer shape cutting means to flatten the surface of the mother board. A processing die is disclosed. By adopting such a configuration in this document, it is possible to manufacture a flat processed plate that does not have deformation or damage around the through hole, etc., regardless of the material of the base plate, the shape of the punched plate, etc. In addition, it describes that it is possible to reduce mold costs and man-hours.

  Further, Patent Document 3 is based on the first pushback plate that is arranged upstream of the conveyance direction of the mother plate, punches out one or more first pushback plates from the mother plate, and is punched out. A first pushback means for fitting into the hole, and a downstream side of the first pushback means with respect to the conveying direction of the mother board, and one or more second pushback boards from the mother board. A second pushback means for fitting the punched and punched second pushback plate into the original hole; and a pushback disposed downstream of the second pushback means with respect to the conveying direction of the mother plate. Disclosed is a mother board machining die provided with one or two or more of the first pushback board and the outer shape cutting means for cutting out a machining board including the second pushback board from the mother board. There. According to this document, by adopting such a configuration, even if the shape of the pushback plate is complicated, pushback processing is easy, the consumption of the mold is small, and the material yield is improved. Are listed.

  Further, Patent Document 4 includes a first means disposed on the upstream side with respect to the conveyance direction of the mother board, and a second means disposed on the downstream side with respect to the conveyance direction of the mother board, The first means is formed in the region at the same time as the pushback means for punching out the region that is the same as or larger than the processed plate from the mother plate and fitting the punched region into the original hole. First elongated hole forming means for discretely forming first elongated holes in a part of the outer periphery of the finished product plate, and the second means punches the processed plate including the product plate from the mother plate. At the same time as the punching means and the punching of the processed plate, at least one end thereof is close to one end of the first elongated hole, and is the outer periphery of the product plate, and the second elongated hole between the first elongated holes. Gold for processing a mother board provided with second slot forming means for forming a hole There has been disclosed. In the same document, by adopting such a configuration, in the case where a processed plate in which a product plate is temporarily fixed to a frame portion by a discontinuous long hole from a base plate is manufactured using a die press method, It describes that the die cost and man-hours can be reduced, the mold is complicated and the strength is suppressed, and the mother board can be prevented from being lifted.

JP 2002-233996 A JP 2004-247499 A Japanese Patent Laid-Open No. 2004-2731992 Japanese Patent No. 3396835

As disclosed in Patent Document 1, when the pushback means and the outer shape cutting means are arranged in this order along the conveyance direction of the mother board, and the pushback processing and the outer shape cutting processing are sequentially performed, the outer shape cutting is extremely easy. Can be done. Further, as disclosed in Patent Document 3, the first pushback means, the second pushback means, and the outer shape cutting means are arranged in this order along the conveying direction of the mother board, and pushback processing and outer shape cutting processing are performed. Are sequentially performed, it is possible to easily perform push-back processing and outer shape cutting processing even for a printed circuit board having a complicated shape.
However, in recent years, there has been a demand for further efficiency in the automatic mounting process, and the number of printed circuit boards (that is, the total area of the mounting board) formed on one mounting board is steadily increasing. . Therefore, the conventional mold in which the pushback process and the outer shape cutting process are performed in two or three stages has a problem that the mold becomes large.

  Moreover, as disclosed in Patent Documents 1 to 4, when the mold is divided into a plurality of regions along the conveyance direction of the mother board, and a processing means for processing the mother board is arranged in each area, Complex machining can be continuously performed on the mother board. However, all of the conventional molds basically have a structure in which either the upper mold or the lower mold is a female mold and the other is a punch (male mold), and the entire base plate is pressed in one direction. It has become. Therefore, the processing methods that can be selected in each region are limited by the pressing direction of the mother board, and there is a problem that the degree of freedom in selecting the processing method in each region is small. Even if the processing method can be selected, there is a problem that the mold becomes complicated in order to perform the desired processing.

  Further, as disclosed in Patent Documents 1 to 4, in the case of a mold that presses the entire mother board downward, usually, a lower mold stripper for placing the mother board and a lower mold stripper are supported. An elastic member for restoring the pressed base plate and the lower mold stripper to the original position is inserted between the lower mold base plate and the lower mold base plate. At the time of pressing, the lower stripper is pressed downward against the urging force of the elastic member. However, as the number of parts to be urged using elastic members increases, it is necessary to press the lower mold stripper against the urging force of these elastic members, so a large press machine with a large load is required. . In addition, since a relatively large load is repeatedly applied to the mold, there is a problem that the elastic member deteriorates early and the frequency of replacement work increases.

The problem to be solved by the present invention is divided into a plurality of processing regions along the conveying direction of the mother board, and the selection of the processing method in each region without complicating / enlarging the mold. An object of the present invention is to provide a mold for processing a mother board having a high degree of freedom.
Further, another problem to be solved by the present invention is a mold for processing a base plate that can easily perform a plurality of processing along the transport direction of the base plate even when a small press machine is used. Is to provide.
Another problem to be solved by the present invention is to provide a mold for processing a base plate with a low replacement frequency of an elastic member for restoring each component provided in the mold to its original position.
Furthermore, another problem to be solved by the present invention is to provide a method for manufacturing a processed plate using such a base plate processing mold and a method for manufacturing a product plate.

In order to solve the above problems, a mother board machining die according to the present invention is:
A first region for cutting a processed plate, which is disposed downstream of the mother plate in the conveyance direction and the product plate is supported by a frame portion from the mother plate;
A second region that is disposed upstream of the transport direction of the base plate, has an area corresponding to at least one of the processing plates, and for processing the base plate;
Provided with a mother board cutting means provided between the first area and the second area for cutting the mother board in a direction intersecting the conveying direction of the mother board;
The mother board cutting means is
A lower surface of the upper mold (a) a female mold fixed on the first region of the upper mold;
(B) Dividing into an upper stripper for cutting a mother plate that can move up and down along the upstream side surface of the female mold and is biased downward;
On the second region of the lower mold, the downstream side surface is arranged so as to slide along the upstream side surface of the female mold, and the base in the direction perpendicular to the conveying direction of the base plate is arranged. Fixing a punch for cutting a mother board having a width wider than the length of the board;
In the first region and the second region, processing is performed on the mother plate, respectively, and at the same time, using the upstream side surface of the female mold and the downstream side surface of the mother plate cutting punch, It consists of what shears the said mother board along the direction which cross | intersects with respect to a conveyance direction.

Moreover, the manufacturing method of the processed plate according to the present invention includes:
A first pressing step of performing a first press on the mother board in the second region using the mother board machining die according to the present invention;
The mother board is transported so that the area pressed in the second area in the immediately preceding press is on the first area, and at the same time as the new pressing of the mother board is performed in the second area, In a region, a second pressing step of cutting the processed plate from the mother plate;
Simultaneously with the second pressing step, there is provided a mother board cutting step of shearing the mother board along a direction intersecting the conveying direction of the mother board using the mother board cutting means.
Furthermore, the gist of the method for producing a product plate according to the present invention is to break the frame portion provided in the processed plate obtained by the method according to the present invention and to separate the product plate.

When the lower surface of the upper die is divided into the female die on the first region and the upper die stripper for cutting the mother plate on the second region, the mother plate is cut between the first region and the second region simultaneously with pressing. At this time, the mother board on the second area side does not move downward, and only the mother board on the first area side moves downward, so that separate operations are performed in the first area and the second area, respectively. To make it easier. Therefore, the degree of freedom in selecting the processing method in the first region and the second region is increased as compared with a conventional mold that moves the entire base plate downward. Moreover, different processing can be easily performed in the first region and the second region without making the mold complicated and large.
Furthermore, by dividing the upper die into the female die and the upper die stripper for cutting the base plate, the amount of the elastic member to be used can be greatly reduced depending on the type of processing. Therefore, even if a small press machine is used, it can be processed easily. Moreover, since only a relatively small force is applied to the elastic member, the replacement frequency of the elastic member is also reduced.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the following description, a mother board processing mold for manufacturing a mounting board in which a printed circuit board is supported by a frame portion from a printed wiring board, a manufacturing method of the mounting board, and a printed circuit board However, the present invention is also applicable to “mother boards” other than printed wiring board, “processed boards” other than mounting boards, and “product boards” other than printed circuit boards. Can do.

First, a mother board machining die according to a first embodiment of the present invention will be described.
1 and 2 show a mother board machining die according to a first embodiment of the present invention. In FIG. 1 and FIG. 2, the dimensions of each part are appropriately enlarged and reduced from the actual dimensions for easy viewing. In FIG. 1 and FIG. 2, the mother board machining mold 10 includes a lower mold 20 and an upper mold 50.

The base plate processing mold 10 has a first region 12 on the downstream side and a second region 14 on the upstream side with respect to the conveyance direction of the printed wiring mother plate.
The first area 12 is an area for cutting out a mounting substrate in which a printed circuit board is supported by a frame portion from a printed wiring board. In the present embodiment, the first region 12 includes a first pushback means for punching out a printed circuit board from the printed wiring board, and fitting the punched printed circuit board into the original hole, and printing from the printed wiring board. A second pushback means is provided for punching the frame portion in the opposite direction to the circuit board and fitting the punched frame portion into the original hole.
The second region 14 has an area corresponding to at least one mounting substrate and is a region for processing the mother board. The printed wiring board is sequentially pressed in the second region 14 and the first region 12 while being stepped from the second region 14 toward the first region 12.

  As shown in FIG. 1, the lower mold 20 includes a lower mold base plate 22, a frame punch (second pushback means) 24, a first lower mold stripper (first pushback means) 26, 2 A lower mold stripper 28 and a mother board cutting punch 38 are provided.

  Two guide posts 30, 30 that are used for positioning the upper die 50 at the time of pressing are erected at the corner on the downstream side of the lower die base plate 22. The second lower mold stripper 28 is movable up and down along the peripheral wall surfaces of the guide posts 30, 30. On the other hand, on the upstream side of the lower mold base plate 22, two guide post guide holes 30 a and 30 a for guiding a guide post standing on the upper mold 50 are provided.

  The frame punching punch 24 is a punch (male die) for punching upward the frame portion for supporting the printed circuit board from the printed wiring mother board placed on the lower die 20, and at the same time This is a female die for punching the circuit board downward, and is fixed to the approximate center of the first region 12 of the lower die base plate 22. In FIG. 1, the outer shape of the frame punching punch 24 is rectangular, but the shape is not limited to this, and at least one side is a straight line and at least one side is orthogonal to this. Just do it. Each side may have unevenness for partially forming a slit for stress relaxation, a semicircular or rectangular cutout, and the like.

On the upper surface of the frame punching punch 24, positioning pins 32a and 32a used for positioning when the printed wiring board is pressed are provided upright. In FIG. 1, two positioning pins 32a and 32a are provided on the diagonal of the frame punching punch 24, but this is merely an example, and the positions and number of the positioning pins 32a and 32a are as follows. , Can be arbitrarily selected according to the purpose.
The frame punching punch 24 is provided with lift pin insertion holes (lifting / dispensing means) 24a and 24a for inserting lift pins, which will be described later. Further, the lower mold base plate 22 is provided with through holes 22a, 22a at positions corresponding to the lift pin insertion holes 24a, 24a for dropping the punched residue generated by the lift pins downward. In FIG. 1, two lift pin insertion holes 24ba and 24a are provided on the left and right sides of the frame punching punch 24. However, this is merely an example, and the positions of the lift pin insertion holes 24a and 24a As for the number, the optimum position and number may be selected so that the mounting substrate after the press working is smoothly lifted and removed.

The first lower mold stripper 26 is used for fitting a printed circuit board punched downward from a printed wiring board placed on the lower mold 20 (that is, in a direction opposite to the frame portion) into the original hole. It is supported by the lower mold 20 and urged upward so as to be movable up and down along the inner peripheral surface of the frame punching punch 24.
A pressing plate 26 a is provided on the back surface of the lower mold base plate 22 and below the first lower mold stripper 26. A through hole is provided in the pressing plate 26a, and support bolts 26b, 26b... Are loosely inserted in the through hole. The washers 26c, 26c, and elastic members 26d, 26d, and so on are inserted between the tops of the support bolts 26b, 26b, and the lower surface of the pressing plate 26a. The material of the elastic members 26d, 26d... Is not particularly limited, but urethane rubber or the like is suitable.
Further, the lower mold base plate 22 is provided with a through hole below the first lower mold stripper 26, and pressing pins 26e, 26e... Are loosely inserted into the through holes. The upper ends of the pressing pins 26e, 26e ... are in contact with or fixed to the lower surface of the first lower mold stripper 26, and the lower ends of the pressing pins 26e, 26e ... are in contact with or fixed to the upper surface of the pressing plate 26a. That is, the first lower mold stripper 26 is supported by the pressing pin 26e and is urged upward by the elastic members 26d, 26d.

  In FIG. 1, one first lower mold stripper 26 having a circular cross section is arranged in the frame punching punch 24, but the shape and arrangement of the first lower mold stripper 26 are particularly limited. Is not to be done. That is, the first lower mold stripper 26 may have a shape such as a quadrangle, a triangle, or an ellipse. Further, two or more first lower mold strippers 26 may be disposed in the frame punching punch 24 so as to be movable up and down.

The second lower mold stripper 28 is for placing a printed wiring mother board during processing, and can move up and down along the peripheral wall surfaces of the frame punching punch 24 and the mother board cutting punch 38. It is supported by the lower mold 20 and biased upward. Support bolts 34, 34... Loosely inserted from the lower surface of the lower mold base plate 22 are fixed to the lower surface of the second lower mold stripper 28. The support bolts 34, 34... Can move up and down in the lower mold base plate 22. Further, elastic members 36, 36... Are inserted between the lower surface of the second lower mold stripper 28 and the upper surface of the lower mold base plate 22. That is, the second lower mold stripper 28 is restricted from moving upward by the support bolts 34, 34... And urged upward by the elastic members 36, 36.
The number and arrangement of the support bolts 34, 34... And the elastic members 36, 36... Are not particularly limited, and an optimal number and arrangement are appropriately selected so that the printed wiring board can be processed smoothly. . Further, the material of the elastic members 36, 36... Is not particularly limited, but urethane rubber or the like is preferable.

  The mother board cutting punch 38 is fixed to the lower mold base plate 22 on the second region 14. The mother board cutting punch 38 includes a region serving as a mounting substrate on the first region 12 (a region surrounded by the outer periphery of the frame cutting punch 24) and a region serving as a mounting substrate on the second region 14. This is for cutting the printed wiring board in a direction intersecting with the conveyance direction of the printed wiring board (mother board cutting means). Therefore, the lateral width of the mother board cutting punch 38 is wider than the lateral width of the printed wiring mother board. In the present embodiment, the mother board cutting punch 38 is perpendicular to the conveyance direction of the printed wiring mother board along the downstream side of the area to be the mounting board on the second area 14. The shape is determined so that the printed wiring board is cut.

In the present embodiment, the mother board cutting punch 38 is not only a mother board cutting means, but also a means for forming various through holes such as component holes in the printed circuit board (through hole forming means). , Through-hole forming holes 38a, 38a... For guiding pins for forming the through-holes are provided. The lower mold base plate 22 is provided with through holes 22b, 22b,... For dropping the punched residue downward at positions corresponding to the through hole formations 38a, 38a,. The shape, arrangement, number, and the like of the through-hole forming holes 38a, 38a... Are not particularly limited, and can be arbitrarily set according to the purpose.
Further, positioning pins 32b and 32b are provided on the upper surface of the mother board cutting punch 38 at positions corresponding to the positioning pins 32a and 32a.

Outer frame cutting pin guide holes 38b, 38b are provided on the upper surface of the base plate cutting punch 38. Further, the lower mold base plate 22 is provided with through holes 22c, 22c for dropping the punched residue downward at positions corresponding to the outer frame cutting pin guide holes 38b, 38b.
The outer frame cutting pin guide holes 38b, 38b... And an outer frame cutting pin to be described later are mounted including a printed circuit board supported by the frame part by cutting between the outer periphery of the printed wiring board and the outer periphery of the frame part. This is for separating the circuit board from the printed wiring board (outer frame cutting means). The outer frame cutting pin guide holes 38b, 38b... Have an elongated rectangular shape, and are provided one by one on the left and right so that the longitudinal direction thereof is perpendicular to the transport direction of the printed wiring board. One end of each of the outer frame cutting pin guide holes 38b and 38b is in contact with the side surface of the region serving as the mounting substrate on the second region 14. The length of the left end of the outer frame cutting pin guide hole 28a arranged on the left side and the right end of the outer frame cutting pin 38b arranged on the right side are longer than the entire width of the printed wiring board used for processing. Yes. Further, the outer frame cutting pin guide holes 38b, 38b... Are provided at the corners on the upstream side of the region to be the mounting substrate, and cut on the extension lines of the corners of the mounting substrate. ing.

The outer frame cutting pin guide holes 38b, 38b,... May be provided on the side of the side surface of the region serving as the mounting substrate on the second region 14. However, if the outer frame cutting pin guide holes 38b, 38b... Are provided on the side of the side of the region to be the mounting substrate, the outer frame of the printed wiring board after the press processing becomes a “U” shape and is cut. Since the outer frame may be caught on the mounting substrate, the outer frame cutting pin guide holes 38b, 38b... Are preferably provided at the corners of the region to be the mounting substrate.
Further, the end portions of the outer frame cutting pin guide holes 38b, 38b... Are preferably in contact with the side surface of the region to be the mounting substrate, but there may be a slight gap between them. Even if there is a slight gap between the two, the outer frame naturally dissociates due to strain introduced during processing of the printed wiring board, so that there is almost no hindrance to the separation of the mounting board. Since the allowable gap interval depends on the material and thickness of the printed wiring board, the optimum interval is selected according to these.
Further, when the outer frame cutting pin guide holes 38b, 38b,... Are provided on the side of the region to be the mounting substrate, the end portions of the outer frame cutting pin guide holes 38b, 38b,. You may bite into. When the end portions of the outer frame cutting pin guide holes 28a, 28a... Are bitten into the region to be the mounting substrate, a slit is formed on the outer periphery of the mounting substrate by the outer frame cutting pin. Can be further reduced.

Further, in FIG. 1, the downstream side of the mother board cutting punch 38 and the downstream side of the area serving as the mounting substrate on the second region 14 coincide with each other. The downstream side of 38 may be between the upstream side of the frame punching punch 24 and the downstream side of the region to be the mounting substrate on the second region 14. In this case, in order to facilitate separation of the mounting board from the printed wiring board, the outer frame cutting pin guide hole (outside It is preferable to provide a frame cutting means.
In the present embodiment, the outer frame cutting means is provided in the second area 14, but all or part of the outer frame cutting means may be provided in the first area 12. Further, in the present embodiment, the outer frame cutting means is provided on the extension line of the corner portion of the region to be the frame portion, but may be provided on the side of the region to be the frame portion.

The upper die 50 includes a top plate 52, a pressing plate holder 54, a pin holder 56, a punch plate 58, a female die 60, and an upper die stripper 70 for cutting a mother plate. That is, in the present invention, the lower surface of the upper mold 50 is divided into a female mold 60 and an upper mold stripper 70 for cutting a mother board. The top plate 52, the pressing plate holder 54, the pin holder 56, the punch plate 58, and the female die 60 are stacked via knock pins 52a, 52a, and fixed by fastening bolts 52b, 52b, and so on.
The female die 60 is for punching out the printed circuit board and the frame portion, and is fixed on the first region 12 of the upper die 50. The female die 60 is disposed on the first region 12 such that the upstream side surface slides along the downstream side surface of the upper die stripper 70 for cutting the mother plate. Further, the lateral width of the female mold 60 is wider than the width of the printed wiring board. Further, guide post guide holes 60 a, 60 a... Are formed in the female mold 60 at positions corresponding to the guide posts 30, 30.

In addition, a slide space is provided at a position substantially in the center of the female die 60 and corresponding to the frame punching punch 24, and the frame portion punched from the printed wiring board is used as the original hole in the slide space. A first upper mold stripper (second pushback means) 62 for insertion is loosely inserted.
The first upper mold stripper 62 is supported by support bolts 62a, 62a... Loosely inserted from above the punch plate 58, and is restricted from moving downward. The upper ends of the support bolts 62 a, 62 a... Can be moved up and down along the through holes formed in the pin holder 56. The first upper mold stripper 62 is supported by support bolts 62a, 62a... So that the lower end of the first upper mold stripper 62 slightly protrudes from the lower surface of the female mold 60.
As shown in FIG. 2 (d), the punch plate 58 is provided with a through hole above the first upper mold stripper 62, and a lower surface of cap bolts 58a, 58a,. Elastic members 58b, 58b,... For biasing the first upper mold stripper 62 downward are inserted between the upper surfaces of the first upper mold strippers 62. The material of the elastic members 58b, 58b... Is not particularly limited, but urethane rubber or the like is suitable.
Further, the first upper mold stripper 62 is provided with positioning pin guiding holes 62b and 62b at positions corresponding to the positioning pins 32a and 32a.

  In the first upper mold stripper 62, a printed circuit board punch for punching a printed circuit board downward from the printed wiring board at a position corresponding to the first lower mold stripper 26 (first pushback means) 64 is provided. The printed circuit board punching punch 64 is fixed to the punch plate 58.

In the first upper mold stripper 62, lift pins (lifting / dispensing means) 66a are provided at positions corresponding to the lift pin insertion holes 24a, 24a. The lift pin 66 a is inserted into a through hole provided in the punch plate 58, and its upper end is fixed by a pin holder 56. The tip of the lift pin 66a protrudes from the lower surface of the first upper mold stripper 62 in a no-load state.
The lift pins 66a are for punching out any part of the mounting board thereby lifting the mounting board together with the upper mold 50 by the frictional force between the lift pins 66a and the mounting board. Accordingly, it is preferable that the length of the lift pins 66a is set so that the mounting substrate can be easily lifted. Specifically, the length from the lower surface of the first upper mold stripper 62 to the tip of the lift pin 66a in the no-load state is preferably 0.8 to 2 times the thickness of the printed wiring board.

A slide space is provided in the first upper mold stripper 62 and around the lift pin 66a, and a second upper mold stripper (lifting / dispensing means) 66b is loosely inserted in the slide space. A through hole is provided in the second upper mold stripper 66b, and a lift pin 66a is loosely inserted in the through hole.
The second upper mold stripper 66b is supported by a support bolt (not shown) that is loosely inserted from above the punch plate 58. The upper end of the support bolt that supports the second upper mold stripper 66 b can move up and down along a through-hole provided in the pin holder 56.
Further, the second upper mold stripper 66b is configured such that the lower surface of the second upper mold stripper 66b and the tip surface of the lift pin 66a are on the same plane or the lift pin 66a when the upper mold 50 reaches the top dead center. It is supported by a support bolt (not shown) so that the lower surface of the second upper mold stripper 66b is lower than the front end surface of the second upper mold stripper 66b.

In the through hole that penetrates the pin holder 56 and the punch plate 58, pressing pins 66c, 66c,. The lower ends of the pressing pins 66c, 66c ... are in contact with the upper surface of the second upper mold stripper 66b, and the upper ends of the pressing pins 66c, 66c ... are the lower surfaces of the pressing plates 66d provided in the slide space of the pressing plate holder 54. Touching.
Further, the top plate 52 is provided with a through hole at a position corresponding to the pressing plate 66d, and knockout bushes 66e, 66e,... Are inserted into the through hole. The knockout bushes 66e, 66e,... Are set so that their tips slightly protrude from the upper surface of the top plate 52 in an unloaded state.

In the example shown in FIGS. 1 and 2, the lift pin 66a is provided in the first upper mold stripper 62 (that is, any part of the frame portion), but as long as the printed circuit is not damaged. The printed circuit board punching punch 64 (that is, any portion of the printed circuit board) may be provided.
Further, in order to facilitate transport of the mounting substrate after processing to the next process, it is provided with a lift pin 66a, a second upper mold stripper 66b, and a mechanism (lifting / dispensing means) related thereto. However, when it is not necessary to lift the mounting substrate after processing, the lifting / wiping off means can be omitted.

  The upper die stripper 70 for cutting the mother plate is movable up and down along the upstream side surface of the female die 60. The boundary line between the mother board cutting upper mold stripper 70 and the female mold 60 is on the downstream side of the mother board cutting punch 38. The upper stripper 70 for cutting the mother board is supported by support bolts 70a, 70a, ..., and its downward movement is restricted. The support bolts 70 a, 70 a... Are loosely inserted from above the punch plate 58, and their upper ends can be moved up and down along the through holes formed in the pin holder 56.

  The punch plate 58 has a through hole provided above the upper stripper 70 for cutting the base plate. The lower surface of the cap bolts 58c, 58c... Fitted into the upper portion of the through hole and the upper stripper 70 for cutting the base plate. Elastic members 58d, 58d,... For urging the upper die stripper 70 for cutting the base plate downward are inserted between the upper surface and the upper surface. The material of the elastic members 58d, 58d... Is not particularly limited, but urethane rubber or the like is suitable.

Further, the upper stripper 70 for cutting the mother board is provided with a through hole at a predetermined position, and through-hole forming pins 72, 72... And outer frame cutting pins 68, 68 are loosely inserted in the through-hole. . The through-hole forming pins 72, 72... And the outer frame cutting pins 68, 68 are inserted from above the punch plate 58 and fixed by a pin holder 56. Therefore, as the upper stripper 70 for cutting the mother board moves upward, the tips of the through-hole forming pins 72, 72. It has become.
The upper stripper 70 for cutting the mother board is provided with positioning pin guide holes 70b and 70b at positions corresponding to the positioning pins 32b and 32b.

  Further, guide posts 74 and 74 are erected on the punch plate 58 at positions corresponding to the guide post guide holes 30 a and 30 a provided in the lower mold 20. The upper die stripper 70 for cutting the base plate is movable up and down along the peripheral wall surfaces of the guide posts 74 and 74. The guide posts 74, 74 may be erected on the lower mold 20, but when provided on the upper mold 50, it is possible to suppress lateral displacement when the upper mold stripper 70 for cutting the mother board moves up and down. There are advantages.

As described above, the outer frame cutting pins 68, 68... And the related mechanism (outer frame cutting means) are formed between the outer periphery of the printed wiring board and the outer periphery of the frame portion or the outer periphery of the region to be the frame portion. The mounting board including the printed circuit board supported by the frame portion is separated from the printed wiring board. Therefore, the outer frame cutting means can be omitted when a cut is formed in advance between the outer periphery of the printed wiring board and the outer periphery of the region to be the frame portion by pressing, NC processing, or the like.
In addition, the outer frame cutting pins 68, 68... Are erected on the lower die 20 instead of being erected on the upper die 50, and as the second lower die stripper 28 moves downward, the tip thereof becomes the second. You may make it protrude from the upper surface of the lower mold | type stripper 28. FIG. However, in this case, since the structure of the upper mold 50 is complicated, it is preferable that the outer frame cutting pins 68, 68. Further, in FIGS. 1 and 2, outer frame cutting pins 68, 68... Are provided on the second region 14, but all or part of the outer frame cutting pins 68, 68. May be provided.

  Next, a method for manufacturing a mounting board using the mother board processing mold shown in FIGS. 1 and 2 and a method for manufacturing a printed circuit board will be described. FIG. 3 shows a process chart of a printed wiring board processing process viewed from a direction perpendicular to the transport direction. FIG. 4 shows a process diagram of a printed wiring board processing step viewed from a direction parallel to the transport direction.

  First, as shown in FIGS. 3A and 4A, the printed wiring mother board 100 is placed on the lower mold 20. The printed wiring board 100 is previously provided with a pushback reference hole, and positioning is performed by inserting the pushback reference hole into the positioning pins 32a and 32a and the positioning pins 32b and 32b. In addition, the printed wiring mother board 100 illustrated in FIG. 3A is obtained by forming notches for cutting through holes and outer frames in the second region 14 in the immediately preceding press. After pressing in the second area 14, the printed wiring board 100 is transported to the right, and the portion pressed in the second area 14 is placed on the first area 12.

When the upper die 50 is lowered from this state, as shown in FIG. 4B, in the first region 12, the second upper die stripper 66b and the first upper die stripper 62 come into contact with the printed wiring board 100, Move upward. Along with this, the lift pins 66a protrude from the lower surface of the second upper mold stripper 66b, and the printed wiring board 100 is punched out. Further, as the second upper mold stripper 66b moves upward, the pressing pins 66c, 66c,... Push the pressing plate 66d upward. As a result, knockout bushes 66e, 66e,... Protrude from the top surface of the top plate 52.
On the other hand, in the second region 14, the through hole forming punch 38 pushes up the upper die stripper 70 for cutting the base plate against the urging force of the elastic members 58d, 58d. As a result, the through hole forming pins 72, 72... And the outer frame cutting pins 68, 68 protrude from the tip of the upper stripper 70 for cutting the mother board, and the printed wiring mother board 100 is punched out.

When the upper die 50 is further lowered, as shown in FIGS. 3B and 4C, in the first region 12, the printed circuit board punching punch 64 and the female die 60 are elastic members 36, 36. The second lower mold stripper 28, the first lower mold stripper 26, and the printed wiring board 100 are pushed downward against the urging force of the elastic members 26d, 26d. As a result, the printed circuit board 102 is punched from the printed wiring board 100.
The frame cutting punch 24 pushes up the first upper mold stripper 62 against the urging force of the elastic members 58b, 58b. As a result, the frame portion 104 is punched from the printed wiring board 100 in the direction opposite to the printed circuit board 102 (upward). Further, as the first upper mold stripper 62 moves upward, the second upper mold stripper 66b also moves upward, and the pressing pins 66c, 66c,... Push the pressing plate 66d and the knockout bush 66e further upward.

  On the other hand, in the second region 14, the downward movement of the printed wiring mother board 100 is restricted by the mother board cutting punch 38. Therefore, when the upper die 50 is further lowered, the downstream area of the mother board cutting punch 38 is reduced. The printed wiring board 100 is sheared in the direction perpendicular to the conveying direction by the side surface and the upstream side surface of the female die 60.

  When the upper die 50 is raised after the press is finished, the elastic members 36, 36... And the elastic members 26d, 26d... Become the second lower die stripper 28, the first lower die stripper 26, and the printed wiring board 100, respectively. And the printed circuit board 102 is pushed upward. At the same time, the elastic members 58b, 58b... Push down the first upper mold stripper 62 and the frame portion 104 downward. As a result, as shown in FIG. 4D, in the first region 12, the printed circuit board 102 and the frame portion 104 are respectively fitted into the original holes. Further, the upper die stripper 70 for cutting the mother board is pushed downward by the urging force of the elastic members 58d, 58d.

At this time, since the outer frame of the printed wiring board is cut by the outer frame cutting pins 68, 68..., The holes of the printed wiring board remaining after punching out the frame portion 104 are not closed holes. In the present application, this is also referred to as “original hole” for convenience. Further, the frame portion 104 is simply pushed back in the direction opposite to the punching direction, and strictly speaking, it is not returned to the “closed hole” remaining after the printed wiring board is punched. In this application, for the sake of convenience, this is also referred to as “pushback”. ,
At this time, since the downward urging force does not act on the second upper mold stripper 66b, the second upper mold stripper 66b remains moved upward.

Further, at this time, the outer frame of the printed wiring board 100 is divided into pieces by outer frame cutting pins 68, 68... And the lift pins 66 a and 66 a remain stuck into the frame portion 104. ing. Therefore, when the upper die 50 is further raised from this state, the mounting substrate 106 in which the printed circuit board 102 is supported by the frame portion 104 is lifted upward together with the upper die 50 by the lift pins 66a and 66a.
Thereafter, when the upper die 50 is further raised and the upper die 50 approaches the top dead center, a pressing means (not shown) presses the knockout bushes 66e, 66e. As a result, the pressing plate 66d pushes down the second upper mold stripper 66b downward via the pressing pin 66c, and the mounting substrate 106 is removed from the upper mold 50.
The obtained mounting board 106 is sent to an automatic mounting process, and electronic components are automatically mounted on the printed circuit board 102. After the automatic mounting is completed, the printed circuit board 102 can be separated by breaking the frame portion 104.

  FIG. 5 shows a plan view of the lower mold 20 and the printed wiring mother board 100 of the mother board processing mold 10. As shown in FIG. 5 (a), pushback reference holes 100a, 100a... Formed in the printed wiring board 100 are inserted into the positioning pins 32b, 32b, and the first press is performed in the second region 14 (first). 1 press step), through holes 100b, 100b,... Are formed in the approximate center of the printed wiring board 100, and cuts 100c, 100c are formed in the outer frame. Further, the printed wiring mother board 100 is sheared along the downstream side of the mother board cutting punch 38, and a strip-like cut residue 100d is cut off.

Next, the printed wiring mother board 100 is transported and placed on the lower mold 20 so that the portion processed in the second region 14 in the immediately preceding press comes on the first region 12. The printed wiring board 100 is positioned using the positioning pins 32a and 32a and the positioning pins 32b and 32b. When the second pressing is performed from this state (second pressing step), as shown in FIG. 5B, through holes 100b, 100b... And notches 100c, 100c are newly formed in the second region 14. . Further, the printed wiring board 100 is sheared along the downstream side of the board cutting punch 38.
On the other hand, on the first region 12, the printed circuit board 102 and the frame portion 104 are punched in opposite directions and fitted into the original holes. Further, by performing the push back of the frame portion 104, the strip-shaped cut scraps 100e and 100e on the side of the printed wiring mother board 100 and the strip-shaped cut scraps 100d in front of the punch 38 for cutting the base plate are performed. 'Is cut off. As a result, the mounting substrate 106 can be lifted and removed very easily by the lift pins 66a and 66a and the second upper mold strippers 66b and 66b.

  In the mother board processing mold 10 according to the present embodiment, the lower surface of the upper mold 50 is divided into the female mold 60 and the upper mold stripper 70 for cutting the mother board. It is easy to perform separate operations. In addition, this allows a large degree of freedom in processing selection that can be performed in the first region 12 and the second region 14.

  Further, in the case where the through hole is formed in the second region 14, the die structure becomes simpler if the through hole is punched downward. In this case, in a mold having no punch for cutting a base plate, a through hole forming pin is erected on the upper mold 50, a through hole forming pin guide hole is provided on the lower mold stripper 28, and the entire lower mold stripper 28 is made of an elastic member. The through hole can be punched downward with a through hole forming pin while urging upward and supporting the lower mold stripper 28 with an elastic member. However, for that purpose, an elastic member having such a strength that the position of the lower mold stripper 28 does not move is inserted between the lower mold stripper 28 and the lower mold base plate 22 until the through hole is formed. There is a need. Therefore, in order to continue the processing after forming the through hole, it is necessary to push down the lower mold stripper 28 against the urging force of the elastic member, so that a large press machine with a large load is required. Moreover, since a large repeated load is applied to the elastic member, the deterioration of the elastic member is accelerated, and the replacement frequency of the elastic member is increased.

  On the other hand, when the base plate cutting punch 38 is fixed to the lower mold 20 of the second region 14 and the through hole forming hole is formed in the base plate cutting punch 38, the lower mold stripper 28 is formed when the through hole is formed. No downward force is applied. Therefore, the amount of the elastic member inserted between the lower mold stripper 28 and the lower mold base plate 22 can be reduced. As a result, the load required for further lowering the upper mold 50 after forming the through hole is reduced. Therefore, even if a small press machine is used, processing can be easily performed. In addition, since the load applied to the elastic member is relatively small, the replacement frequency of the elastic member is also reduced.

Furthermore, the mother board processing mold 10 according to the present embodiment includes a first pushback means for pushing back the printed circuit board 102 in the first region 12 and a frame portion for supporting the printed circuit board 102. Since the second pushback means for performing the pushback of 104 and the pushback of the printed circuit board 102 and the pushback of the frame portion 104 are simultaneously performed, the printed circuit is within one area (first area). It is possible to perform the push-back and the outer shape cutting of the plate 102 at the same time. Therefore, the mold can be reduced in size as compared with the conventional mold in which pushback and outer shape cutting are performed in separate areas.
Further, if an outer frame cutting means for cutting the outer frame of the printed wiring board is provided in the first region 12 and / or the second region 14, the outer frame is separated when the push back of the frame portion 104 is completed. become. Therefore, the mounting substrate 106 can be separated from the printed wiring board 100 very easily.
Furthermore, since the outer frame of the printed wiring board 100 is disjoint at the end of pressing, the mounting substrate 106 after the press processing can be easily raised together with the upper mold. For this reason, it is very easy to transport the mounting substrate 106 to the next process, and the working efficiency is dramatically improved.

Next, a mother board machining die according to a second embodiment of the present invention will be described.
6 and 7 show a mother board machining die according to the present embodiment. 6 and 7, the dimensions of each part are appropriately enlarged or reduced from the actual dimensions for easy viewing. Moreover, in the following description and in FIG. 6 and FIG. 7, the reference numerals of the respective parts, which correspond to the base plate processing mold 10 shown in FIG. 1 and FIG. The same symbols were used.
6 and 7, the mother board machining mold 10 'includes a lower mold 20' and an upper mold 50 '.

The base plate processing mold 10 ′ has a first region 12 on the downstream side and a second region 14 on the upstream side with respect to the conveyance direction of the printed wiring mother plate.
In the first region 12, the first long holes are discretely formed along at least a part of the boundary line of the printed circuit board (first long hole forming means), and at the same time, the mounting board is cut out from the printed wiring board. This is a region for (outer shape cutting means).
The second region 14 is a region having an area corresponding to at least one mounting substrate, and the second long holes are discretely formed along at least a part of the boundary line of the printed circuit board (the second region 14). This is a region for a long hole forming means. The printed wiring board is sequentially pressed in the second region 14 and the first region 12 while being stepped from the second region 14 toward the first region 12. In addition, the mounting board obtained by the mother board processing mold according to the present embodiment is a printed circuit board via connecting portions between elongated holes discretely formed along the boundary line of the printed circuit board. Is supported by the frame.

  As shown in FIG. 6, the lower mold 20 ′ includes a lower mold base plate 22, a frame punching punch (outline cutting means) 24 ′, a second lower mold stripper 28, and a mother board cutting punch 38. I have.

  Two guide posts 30, 30 that are used for positioning the upper die 50 ′ at the time of pressing are erected at the corner on the downstream side of the lower die base plate 22. On the other hand, on the upstream side of the lower mold base plate 22, two guide post guide holes 30 a and 30 a for guiding the guide post erected on the upper mold 50 ′ are provided.

  The frame punching punch 24 ′ is provided in the first region 12. The punch 24 ′ for punching the frame part is not for performing pushback, but holds the cut mounting substrate in the slide space of the upper mold 50 ′ so that the upper mold 50 ′ reaches near the top dead center. It is intended to be removed from the slide space. This point is different from the first embodiment.

Further, first long hole forming holes 24b, 24b,... For discretely forming the first long holes are formed in the frame punching punch 24 ′. In addition, the lower mold base plate 22 is provided with through holes 22d, 22d,... For dropping the punched residue downward at positions corresponding to the first long hole forming holes 24b, 24b,.
In the present embodiment, the first elongated hole forming holes 24b, 24b... Are formed along a part of the boundary line of the printed circuit board. Further, the first long hole forming holes 24b, 24b,... Are arranged so that one end of the first long hole formed thereby is close to one end of the second long hole described later. That is, the first elongated hole and the second elongated hole are alternately formed in the boundary line of the printed circuit board.
Note that “discrete” means that the first elongated hole and / or the second elongated hole are formed so as not to communicate with each other. Moreover, when forming a 1st elongate hole and a 2nd elongate hole alternately, the space | interval between each elongate hole can be arbitrarily selected according to the objective. For example, when the connecting portions between the long holes are broken manually, it is preferable to shorten the interval between the connecting portions. On the other hand, when the connecting portions between the long holes are broken by a press or the like, the interval between the connecting portions may be relatively long.

  The second lower mold stripper 28 is supported by the lower mold 20 'and urged upward so as to be movable up and down along the peripheral wall surfaces of the frame punching punch 24' and the base plate cutting punch 38. Has been. The other points regarding the second lower mold stripper 28 are the same as those of the first embodiment, and thus the description thereof is omitted.

The mother board cutting punch 38 is fixed to the lower mold base plate 22 on the second region 14. In the present embodiment, the mother board cutting punch 38 is for cutting the printed wiring mother board in a direction intersecting the conveyance direction of the printed wiring mother board (mother board cutting means), and at the same time, It is also for forming the second elongated holes discretely (second elongated hole forming means) along at least a part of the boundary line of the circuit board.
In the present embodiment, the mother board cutting punch 38 has second elongated hole forming holes 38c, 38c,... For discretely forming second elongated holes along a part of the boundary line of the printed circuit board. Is provided. The lower mold base plate 22 is provided with through holes 22f, 22f,... For dropping the punched residue downward at positions corresponding to the second long hole forming holes 38c, 38c,.

In addition, when the long holes are formed at a relatively narrow interval along the boundary line of the printed circuit board, the long holes formed along the boundary line are alternately formed in the second region as shown in FIG. 14 and the first region 12 are desirable, but when the interval between the long holes is relatively wide, all the long holes arranged on the boundary line in the second region 14 may be punched out.
Alternatively, all the long holes arranged on the boundary line in the second region 14 may be punched, and the same portion as the punched long hole may be punched again in the first region 12. For example, when a printed wiring board reinforced with glass fiber or the like is processed, the processed surface may become fluffy. On the other hand, when the same long hole is punched twice, the inner peripheral surface of the long hole (that is, the outer peripheral surface of the printed circuit board) is shaved, and fluffing can be suppressed.
Further, with respect to other points related to the mother board cutting punch 38, the first embodiment is performed except that the outer frame cutting pin guide hole is not provided in the corner of the area to be the mounting substrate on the second area 14. Since this is the same as the embodiment, the description is omitted.

The upper die 50 ′ includes a top plate 52, a pressing plate holder 54, a pin holder 56, a punch plate 58, a female die 60, and a mother plate cutting upper die stripper 70. That is, in the present embodiment, the lower surface of the upper mold 50 ′ is divided into a female mold 60 and an upper mold stripper 70 for cutting a mother board.
The female die 60 is used for forming the first elongated hole and cutting the outer shape, and is fixed on the first region 12 of the upper die 50. The female die 60 is disposed on the first region 12 such that the upstream side surface slides along the downstream side surface of the upper die stripper 70 for cutting the mother plate.

A slide space is provided at a position substantially in the center of the female die 60 and corresponding to the frame punching punch 24 ', and a first upper die stripper for punching the frame portion from the printed wiring board in the slide space. (Outline cutting means) 62 'is loosely inserted.
The first upper mold stripper 62 ′ is supported by support bolts 62 a, 62 a... Loosely inserted from above the punch plate 58 and is restricted from moving downward. The upper ends of the support bolts 62 a, 62 a... Can be moved up and down along the through holes formed in the pin holder 56. The first upper mold stripper 62 ′ is supported by support bolts 62 a, 62 a... So that the lower end of the first upper mold stripper 62 ′ protrudes slightly from the lower surface of the female mold 60.

The first upper mold stripper 62 'is not biased downward. This point is different from the first embodiment.
.. Are inserted into the through holes penetrating the pin holder 56 and the punch plate 58. The lower ends of the pressing pins 63a, 63a ... are in contact with the upper surface of the first upper mold stripper 62 ', and the upper ends of the pressing pins 63a, 63a ... are of the pressing plate 63b provided in the slide space of the pressing plate holder 54. It is in contact with the bottom surface.
Further, the top plate 52 is provided with a through hole at a position corresponding to the pressing plate 63b, and knockout bushes 63c, 63c,... Are inserted into the through holes. The lengths of the knockout bushes 63c, 63c,... Are determined such that the tip ends slightly protrude from the upper surface of the top plate 52 in an unloaded state.

  Further, the first upper mold stripper 62 ′ is provided with through holes at positions corresponding to the first long hole forming holes 24b and 24b, and the first long hole forming pins 65 and 65 are loosely inserted into the through holes. . The first long hole forming pins 65, 65 are inserted from above the punch plate 58, and the upper ends thereof are fixed by a pin holder 56. Therefore, as the first upper mold stripper 62 'moves upward along the slide space of the female mold 60, the tip of the first upper mold stripper 62' protrudes from the lower surface of the first upper mold stripper 62 '.

The upper die stripper 70 for cutting the mother plate is movable up and down along the upstream side surface of the female die 60. The upper stripper 70 for cutting the base plate is provided with through holes at positions corresponding to the second long hole forming holes 38c, 38c, and second long hole forming pins 73, 73 are provided upright in the through holes. ing. The second long hole forming pins 73 and 73 are inserted from above the punch plate 58, and the upper ends thereof are fixed by the pin holder 56. Therefore, as the upper stripper 70 for cutting the mother board moves upward, the tip of the upper stripper 70 protrudes from the lower surface of the upper stripper 70 for cutting the mother board.
Other points regarding the upper mold 50 'are the same as those in the first embodiment, and thus the description thereof is omitted.

Next, the manufacturing method of the mounting board | substrate using the metal mold | die 10 'for mother board processing concerning this Embodiment is demonstrated.
First, a printed wiring board is placed on the lower mold 20 ′. The printed wiring board is provided with a pushback reference hole in advance, and positioning is performed by inserting the pushback reference hole into the positioning pins 32a and 32a and the positioning pins 32b and 32b.

When the upper mold 50 ′ is lowered from this state, in the first region 12, the first upper mold stripper 62 ′ contacts the printed wiring board and moves upward. Along with this, the first elongated hole forming pins 65 and 65 protrude from the lower surface of the first upper mold stripper 62 ′, and the printed wiring board is punched out. Further, as the first upper mold stripper 62 ′ moves upward, the pressing pins 63a, 63a... Push the pressing plate 63b upward. As a result, the knockout bushes 63 c, 63 c... Protrude from the top surface of the top plate 52.
On the other hand, in the second region 14, the mother board cutting punch 38 pushes up the mother board cutting upper mold stripper 70 against the urging force of the elastic members 58d, 58d. As a result, the second elongated hole forming pins 73 and 73 protrude from the tip of the upper die stripper 70 for cutting the mother board, and the printed wiring board is punched out.

  When the upper die 50 'is further lowered, in the first region 12, the female die 60 pushes down the second lower die stripper 28 and the printed wiring board 100 against the urging force of the elastic members 36, 36. . On the other hand, the frame cutting punch 24 'pushes the first upper mold stripper 62' upward. As a result, the frame part is punched from the printed wiring board. Further, as the first upper mold stripper 62 'moves upward, the pressing pins 63a, 63a,... Push the pressing plate 63b and the knockout bushes 63c, 63c,.

  On the other hand, in the second region 14, the downward movement of the printed wiring mother board is restricted by the mother board cutting punch 38. Therefore, when the upper die 50 ′ is further lowered, the downstream area of the mother board cutting punch 38 is reduced. The printed wiring board is sheared in the direction perpendicular to the conveying direction by the side surface and the upstream side surface of the female die 60.

When the upper die 50 ′ is raised after the press is finished, the elastic members 36, 36... Push up the second lower die stripper 28 and the printed wiring board. At the same time, the elastic members 58d, 58d,... Push down the upper die stripper 70 for cutting the mother board.
At this time, since the downward urging force does not act on the first upper mold stripper 62 ′, the first upper mold stripper 62 ′ remains in the state of moving upward. Further, the punched frame portion remains in the state of being held in the slide space of the female die 60.

Thereafter, when the upper mold 50 ′ is further raised and the upper mold 50 ′ approaches the top dead center, a pressing means (not shown) presses the knockout bushes 63c, 63c. As a result, the pressing plate 63 b pushes down the first upper mold stripper 62 ′ via the pressing pins 63 a, 63 a..., And the mounting substrate 106 is removed from the slide space of the female mold 60.
The obtained mounting board is sent to an automatic mounting process, and electronic components are automatically mounted on the printed circuit board. After the automatic mounting, the printed circuit board can be separated by breaking the connecting portion between the long holes.

  FIG. 8 shows a plan view of the lower mold 20 ′ of the mother board processing mold 10 ′ and the printed wiring mother board 100. As shown in FIG. 8A, pushback reference holes 100a, 100a... Formed in the printed wiring board 100 are inserted into the positioning pins 32b, 32b, and the first press is performed in the second region 14 (first). 1 press step), the second elongated holes 100f and 100f are discretely formed in the printed wiring board 100 along a part of the boundary line of the printed circuit board 102. Further, the printed wiring mother board 100 is sheared along the downstream side of the mother board cutting punch 38, and a strip-like cut residue 100d is cut off.

  Next, the printed wiring mother board 100 is transported and placed on the lower mold 20 ′ so that the portion processed in the second region 14 in the immediately preceding press comes on the first region 12. The printed wiring board 100 is positioned using the positioning pins 32a and 32a and the positioning pins 32b and 32b. When the second pressing is performed from this state (second pressing step), the second long holes 100f, 100f,... Are newly formed in the second region. Further, the printed wiring board 100 is sheared along the downstream side of the board cutting punch 38.

  On the other hand, on the first region 12, the first elongated holes 100g and 100g are formed between the second elongated holes 100f and 100f so that the distal end thereof is close to the distal end of the second elongated hole 100f. At the same time, the mounting substrate 106 in which the printed circuit board 102 is supported by the frame portion 104 is punched and temporarily held by the upper mold 50 '. As a result, a U-shaped cut residue 100d 'remains on the lower mold 20'.

When long holes are formed discretely along the boundary line of the printed circuit board, if the long holes arranged at extremely narrow intervals are pressed at the same time, the printed wiring board may be damaged or the strength of the mold may be reduced. May decrease.
On the other hand, when forming the long holes discretely along the boundary line of the printed circuit board, the mother board machining die 10 ′ according to the present embodiment is configured in the second area 14 and the first area 12. Since the second elongated holes 100f and the first elongated holes 100g are alternately formed, even if the elongated holes are arranged at an extremely narrow interval, damage to the printed wiring board and a decrease in the strength of the mold are suppressed. can do. Further, since the upper die 50 'is divided into the female die 60 and the upper die stripper 70 for cutting the mother board, such complicated processing can be easily performed without making the die complicated and large. it can.

Furthermore, when pressing is performed using a mold having many parts urged by an elastic member such as a pushback means, it is necessary to apply pressure against the urging force of all the elastic members to the mold. Therefore, a large press machine with a large load is required for processing. In addition, since the pressure applied to the elastic member increases, the replacement frequency of the elastic member also increases.
On the other hand, when the upper mold 50 ′ is divided into the female mold 60 and the upper mold stripper 70 for cutting the mother board, the amount of the elastic member to be used can be reduced as compared with the conventional mold. Therefore, even if it is a case where a small press machine is used, it can process easily. In addition, since the pressure applied to the elastic member is relatively small, the deterioration of the elastic member is suppressed, and the replacement frequency of the elastic member can be greatly suppressed.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present invention.
For example, in the mother board machining die 10 shown in FIGS. 1 and 2, component holes are formed in the second region, and the printed circuit board and the frame portion are pushed back in the first region. 6, the second long hole is formed in the second region, the second long hole is formed in the first region, and the outer shape of the frame portion is cut. The type of processing performed in the second region and the combination thereof are not limited to this, and can be arbitrarily selected according to the purpose.

  Further, in the mother board machining mold 10 shown in FIGS. 1 and 2, when a through hole forming pin is erected on the upper mold 50 or the lower mold 20 also in the first area 12, the through hole is also formed in the first area 12. Can be formed. In particular, in the case where the through holes are arranged at extremely narrow intervals, if the through holes are formed at once in the same region, the mother board may be damaged or the mold strength may be reduced. On the other hand, when the approaching through hole is divided and formed in the first region 12 and the second region 14, the through hole can be formed without causing damage to the mother board or lowering the mold strength. .

  Further, in the mother board processing mold 10 ′ shown in FIGS. 5 and 6, in the first region, the punched frame portion is temporarily held in the slide space of the female mold 60. You may substitute with the pushback means similar to the metal mold | die 10 for mother board processing shown in FIG.1 and FIG.2.

A mold for processing a mother board according to the present invention is a mounting board in which a printed circuit board is supported by a frame part by a pushback method, or a frame part by a connecting part of elongated holes in which printed circuit boards are discretely formed. It can be used as a mold for manufacturing a mounting substrate supported by the substrate.
The processed board manufacturing method according to the present invention includes a mounting board in which a printed circuit board is supported by a frame portion by a pushback method, or a long hole connecting portion in which printed circuit boards are discretely formed. It can be used as a method for manufacturing a mounting substrate supported by a portion.
Further, the manufacturing method of the product board according to the present invention includes a mounting board in which the printed circuit board is supported by the frame part by a pushback method, or a long hole connecting part in which the printed circuit board is discretely formed. It can be used as a method for producing a printed circuit board from a mounting substrate supported by a part.

1 (a), 1 (b), and 1 (c) are plan views of a lower die for a mother board machining die according to the first embodiment of the present invention, respectively, BB ′. It is a line sectional view and its CC 'line sectional view. 2 (a), 2 (b), and 2 (c) are bottom views of the upper die of the mother board machining die according to the first embodiment of the present invention, respectively, BB ′. It is a line sectional view and its CC 'line sectional view. FIG. 2D is a partial cross-sectional view in the vicinity of the first upper mold stripper. It is process drawing which shows the manufacturing method of the mounting board | substrate using the metal mold | die for mother board processing shown in FIG.1 and FIG.2, Comprising: It is sectional drawing seen from the orthogonal | vertical direction with respect to the conveyance direction of a printed wiring mother board. It is process drawing which shows the manufacturing method of the mounting board | substrate using the metal mold | die for mother board processing shown in FIG.1 and FIG.2, Comprising: It is sectional drawing seen from the parallel direction with respect to the conveyance direction of a printed wiring mother board. It is process drawing which shows the manufacturing method of the mounting board | substrate using the metal mold | die for mother board processing shown in FIG.1 and FIG.2, Comprising: It is the figure seen from the normal line direction of the printed wiring mother board. FIGS. 6 (a), 6 (b) and 6 (c) are plan views of the lower die of the mother board machining die according to the second embodiment of the present invention, respectively, BB ′. It is a line sectional view and its CC 'line sectional view. 7 (a), 7 (b) and 7 (c) are bottom views of the upper die of the mother board machining die according to the second embodiment of the present invention, respectively, BB ′. It is a line sectional view and its CC 'line sectional view. It is process drawing which shows the manufacturing method of the mounting board | substrate using the metal mold | die for mother board processing shown in FIG.6 and FIG.7, Comprising: It is the figure seen from the normal line direction of the printed wiring mother board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Base plate processing metal mold | die 12 1st area | region 14 2nd area | region 20 Lower mold | type 24 Punch for frame part punching (2nd pushback means)
24a Lift pin guide hole (lifting / wiping off means)
26 First lower mold stripper (first pushback means)
38b Outer frame cutting pin guide hole (outer frame cutting means)
38 Punch for cutting a mother board (Mother board cutting means)
50 Upper mold 62 Upper mold first stripper (second pushback means)
64 Punch for printed circuit board punching (first pushback means)
66a Lift pin (lifting / wiping off means)
66b 2nd upper mold stripper (lifting / dispensing means)
68 Outer frame cutting pin (outer frame cutting means)
70 Upper die stripper for cutting mother board (Member cutting means)
10 'Base plate processing die 24' Punch for frame punching (outline cutting means)
24b 1st slot formation hole (1st slot formation means)
38c 2nd long hole formation hole (2nd long hole formation means)
65 1st slot forming pin (first slot forming means)
73 Second long hole forming pin (second long hole forming means)

Claims (12)

A first region for cutting a processed plate, which is disposed downstream of the mother plate in the conveyance direction and the product plate is supported by a frame portion from the mother plate;
A second region that is disposed upstream of the transport direction of the base plate, has an area corresponding to at least one of the processing plates, and for processing the base plate;
Provided with a mother board cutting means provided between the first area and the second area for cutting the mother board in a direction intersecting the conveying direction of the mother board;
The mother board cutting means is
A lower surface of the upper mold (a) a female mold fixed on the first region of the upper mold;
(B) Dividing into an upper stripper for cutting a mother plate that can move up and down along the upstream side surface of the female mold and is biased downward;
On the second region of the lower mold, the downstream side surface is arranged so as to slide along the upstream side surface of the female mold, and the base in the direction perpendicular to the conveying direction of the base plate is arranged. Fixing a punch for cutting a mother board having a width wider than the length of the board;
In the first region and the second region, processing is performed on the mother plate, respectively, and at the same time, using the upstream side surface of the female mold and the downstream side surface of the mother plate cutting punch, A mold for processing a mother board, which shears the mother board along a direction intersecting with a conveying direction.   2. The mother board machining gold according to claim 1, wherein the mother board cutting means is configured to cut the mother board along a downstream side of an area to be the processed board on the second area. Type. The first region is
A first pushback means for punching out the product plate from the mother plate and fitting the punched product plate into the original hole;
The second pushback means for punching the frame portion in the direction opposite to the product plate from the base plate and fitting the punched frame portion into the original hole is provided. Mold for processing base plate. The first region is
At the same time that the product plate is pushed back and the frame portion is pushed back, a lift pin provided on the upper die is used to punch out any part of the processed plate, and between the lift pin and the processed plate. The working plate is lifted upward together with the upper die by the friction force of the upper die, and when the upper die reaches near the top dead center, the working plate is pressed downward against the friction force, and the working plate is lowered 4. The mold for processing a mother board according to claim 3, further comprising a lifting / dispensing means for displacing. The first region and / or the second region are:
And further comprising an outer frame cutting means for making a cut between an outer periphery of the base plate and an outer periphery of the frame portion or an outer region of the frame portion to separate the processed plate from the base plate. Item 5. A mold for processing a mother board according to Item 3 or 4.   The outer frame cutting means is between the outer periphery of the base plate and the outer periphery of the frame portion or the outer periphery of the region to be the frame portion, and is a corner portion of the processed plate or a corner portion of the region to be the processed plate The mother board machining die according to claim 5, wherein the mold is cut along an extension line of the board.   The base plate machining die according to any one of claims 3 to 6, wherein the second region further includes a through hole forming means for forming a through hole in any of the regions to be the product plate. The second region further includes second elongated hole forming means for discretely forming second elongated holes along at least a part of a boundary line of the product plate,
The first region includes first elongated hole forming means for discretely forming first elongated holes along at least a part of a boundary line of the product plate, and outer shape cutting means for cutting the processed plate from the mother plate. The mother board machining die according to claim 1 or 2, further comprising: The second long hole forming means discretely forms the second long holes along a part of a boundary line of the product plate,
The first long hole forming means forms the first long hole between the second long holes so that at least one end thereof is close to one end of the second long hole. Mold for processing the mother board. The second long hole forming means discretely forms the second long holes over the entire circumference of the boundary line of the product plate,
9. The mother board processing according to claim 8, wherein the first long hole forming means forms the first long hole at the same location as the second long hole formed by the second long hole forming means. Mold. A first pressing step of performing a first press on the mother board in the second region using the mother board machining die according to any one of claims 1 to 10,
The mother board is transported so that the area pressed in the second area in the immediately preceding press is on the first area, and at the same time as the new pressing of the mother board is performed in the second area, In a region, a second pressing step of cutting the processed plate from the mother plate;
Simultaneously with the second pressing step, using the mother board cutting means, a mother board cutting step comprising shearing the mother board along a direction intersecting the conveying direction of the mother board. Method. The manufacturing method of the product board which fractures | ruptures the said frame part with which the said processed board obtained by the method of Claim 11 is equipped, and isolate | separates the said product board.

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