JP2007304083A - Inspection method for display substrate, and inspection device for display substrate using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection method for a display substrate improved in reliability of inspection, and an inspection device for the display substrate using the same. <P>SOLUTION: The method for inspecting a display substrate including test wires, a signal application pad electrically connected with each of test wires, and a signal line electrically connected with the signal application pad comprises: inspecting whether a first signal failure occurs or not by applying a first test signal to the test wires; mutually short-circuiting the signal application pads in the occurrence of the first signal failure; and inspecting whether a second signal failure occurs or not by applying a second test signal to the test wires. The signal application pads are mutually short-circuited after the inspection for the first signal failure, and the inspection for the second signal failure is further performed, whereby in which part of a display panel a failure has occurred is acquired. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a display substrate inspection method and a display substrate inspection apparatus using the same, and more particularly to a display substrate inspection method with improved inspection reliability and a display substrate inspection apparatus using the same. .

  2. Description of the Related Art Generally, a liquid crystal display device includes a liquid crystal display panel that displays an image using light transmittance of liquid crystal, and a backlight assembly that is disposed below the liquid crystal display panel and provides light to the liquid crystal display panel.

  The liquid crystal display panel includes an array substrate having a thin film transistor and a pixel electrode, a color filter substrate having a color filter and a common electrode, and a liquid crystal layer interposed between the array substrate and the color filter substrate.

  The array substrate includes a signal line electrically connected to each of the thin film transistors, a signal application pad electrically connected to each of the signal lines, a test wiring electrically connected to each of the signal application pads, and a test wiring And a test pad electrically connected to each of the test pads. At this time, the test wiring and the test pad are generally removed from the array substrate after inspecting whether the liquid crystal display panel sufficiently realizes a desired image. After the test wiring and the test pad are removed, another driving chip for driving the thin film transistor is mounted on the signal application pad.

  A method for inspecting a liquid crystal display panel will be briefly described. A test signal is applied to a test pad to display a test image on the liquid crystal display panel, and the test image is analyzed to determine whether a display defect of the liquid crystal display panel is possible.

  However, as a result of applying the test signal to determine whether or not the display defect is possible, when a display defect occurs in the liquid crystal display panel, it is not accurately known where the defect occurred in the liquid crystal display panel and the display defect occurred. . In particular, it is not known whether a display defect has occurred due to a defect in the test wiring and the test pad with reference to the signal application pad or a display defect has occurred due to a defect in the signal line. Thus, the conventional inspection method has a problem that the cause of the display failure cannot be accurately grasped and the reliability of the inspection is low.

  Accordingly, the technical problem of the present invention is to solve such a conventional problem, and the object of the present invention is to inspect the display substrate in which the cause of the display defect is detected and the reliability of the inspection is improved. It is to provide a method.

  Another object of the present invention is to provide a display substrate inspection apparatus using the inspection method described above.

  A display substrate inspection method according to an embodiment for achieving the object of the present invention includes a test wiring, a signal application pad electrically connected to each of the test wirings, and a signal electrically connected to the signal application pad. In a method for inspecting a display substrate having a line, a first test signal is applied to a test wiring to inspect whether or not a first signal failure occurs, and when a first signal failure occurs, the signal application pads are connected to each other. It is characterized by short-circuiting and applying a second test signal to the test wiring to inspect whether or not the second signal is defective.

  On the other hand, it can be said that the failure of the first signal is at least one of the test wiring and the signal line, and the failure of the second signal is the failure of the signal line. For example, when the second signal defect does not occur, the defect generated on the display substrate is a test wiring defect, and when the second signal defect occurs, the defect generated on the display substrate is a signal line defect.

  According to another embodiment of the present invention, a display substrate manufacturing method includes a base body, a test signal applying unit, and a pad short-circuit unit.

  The test signal application unit is coupled to the base body unit, and contacts the test pads of the display substrate to apply a test signal to each of the test pads. The pad short-circuit unit is coupled to the base main body unit and contacts the signal application pad of the display panel to short-circuit the signal application pads.

  Meanwhile, a plurality of test signal applying units may be arranged in one direction parallel to the end of the display substrate. At this time, the pad short-circuit portion may be disposed between the test signal application portions.

  Optionally, the display substrate inspection apparatus may further include a transfer unit disposed on the base main body unit and coupled to the pad short-circuit unit to transfer the pad short-circuit unit in the one direction.

  According to the present invention, after the first signal failure is inspected, the signal application pads are short-circuited to each other, and further, the second signal failure is inspected to determine where the failure has occurred among the test wiring and the signal line of the display substrate. Thus, not only can the reliability of the inspection be improved, but another inspection for detecting the cause of the defect of the display substrate can be omitted to reduce the inspection cost.

  Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a flow chart showing a display substrate inspection method according to an embodiment of the present invention, and FIG. 2 is a plan view conceptually showing a display substrate to be inspected in the display substrate inspection method of FIG. .

  First, before explaining the display substrate inspection method according to this embodiment, the display substrate to be inspected by the inspection method will be described, and then the display substrate inspection method will be described in detail.

  Referring to FIG. 2, the display substrate 100 includes pixel electrodes (not shown), thin film transistors (not shown), signal lines 110, signal application pads 120, test wirings 130, and test pads 140. At this time, the display substrate 100 is an array substrate which is one of the components of a liquid crystal display panel (not shown). That is, the liquid crystal display panel includes an array substrate, an array substrate, a color filter substrate disposed opposite to the array substrate, and a liquid crystal layer interposed between the array substrate and the color filter substrate. Among the components, it is an array substrate.

  The pixel electrode is made of a transparent conductive material and arranged in a matrix shape.

  The thin film transistor is electrically connected to the pixel electrode and controls a pixel voltage charged in the pixel electrode.

  The signal line 110 is electrically connected to the thin film transistor and controls the thin film transistor. Specifically, the signal line 110 includes a data line 112 formed in a first direction and a gate line 114 formed in a second direction perpendicular to the first direction.

  The signal application pad 120 is electrically connected to each of the signal lines 110. Another driving chip (not shown) is disposed on the signal application pad 120. Here, the driving chip is electrically connected to the signal applying pad 120 and applies a driving signal for realizing an image to the signal applying pad 120. Specifically, the signal application pad 120 includes a data pad 122 electrically connected to each of the data lines 112 and a gate pad 124 electrically connected to each of the gate lines 114.

  The test wiring 130 is electrically connected to each of the signal application pads 120. Specifically, the test wiring 130 includes a data test wiring 132 that is electrically connected to each of the data pads 122 and a gate test wiring 134 that is electrically connected to the gate pad 124.

  The test pad 140 is electrically connected to each of the test wirings 130. A signal application pin (not shown) is brought into contact with the test pad 140. The signal application pin applies a test image signal to the test pad 140 to test an image on the liquid crystal display panel. Specifically, the test pad 140 includes a data test pad 142 electrically connected to each of the test wirings 132 and a gate test pad 144 electrically connected to each of the gate test wirings 134.

  3 is an enlarged plan view showing a portion A of FIG.

  Referring to FIG. 3, a predetermined number of data pads 122 form one group, and a plurality of such groups are arranged along the second direction. As an example, six data pads 122 are grouped. One group of data pads 122 is electrically connected to the data wiring 112 so as to have a one-to-one correspondence.

  The data test wiring 132 includes a first data test line 132a and a second data test line 132b.

  The first data test line 132a is formed in the first direction. The first data test lines 132a are grouped into the same number as the data pads 122 and are electrically connected to the data pads 122 so as to have a one-to-one correspondence.

  The second data test line 132b is formed in the second direction so as to intersect the first data test line 132a. The second data test lines 132b are grouped in the same number as the first data test lines 132a, and are electrically connected through the first contact holes 50 so as to have a one-to-one correspondence with the first data test lines 132a.

  The data test pads 142 are grouped in the same number as the second data test lines 132b, and are electrically connected so as to have a one-to-one correspondence with the second data test lines 132b. Preferably, both ends of the second data test line 132b are electrically connected to two different groups of data test pads 142. As a result, all groups of the data test pads 142 are electrically connected so as to have a one-to-one correspondence.

  Meanwhile, the group of data pads 122 may be electrically short-circuited through the first short-circuit unit 10. In addition, after the display substrate 100 is inspected by using the inspection method according to the present embodiment, the data test wiring 132 and the data test pad 142 are removed from the display substrate 100 by cutting along the first cut line 30 of the temporary image. Also good. Here, the first cut line 30 is formed between the data pad 122 and the second data test line 132b so as to intersect the first data test line 132a.

  4 is an enlarged plan view showing a portion B of FIG.

  Referring to FIG. 4, a predetermined number of gate pads 124 are collected to form one group, and the plurality of groups are arranged along the first direction. As an example, four gate pads 124 are grouped. One group of the gate pads 124 is electrically connected to the gate wiring 114 in a one-to-one correspondence.

  The gate test wiring 134 includes a first gate test line 134a and a second gate test line 134b.

  The first gate test line 134a is formed in the second direction. The first gate test lines 134a are grouped into the same number as the gate pads 124, and are electrically connected to the gate pads 124 so as to have a one-to-one correspondence.

  The second gate test line 134b is formed in the first direction so as to intersect the first gate test line 134a. The second gate test lines 134b are grouped in the same number as the first gate test lines 134a, and are electrically connected through the second contact holes 60 so as to have a one-to-one correspondence with the first gate test lines 134a.

  The gate test pads 144 are grouped in the same number as the second gate test lines 134b, and are electrically connected to the second gate test lines 134b in a one-to-one correspondence.

  Meanwhile, one group of gate pads 124 may be electrically short-circuited through the second short-circuit unit 20. In addition, after the display substrate 100 is inspected using the inspection method according to this embodiment, the gate test wiring 134 and the gate test pad 144 are removed from the display substrate 100 by cutting along the second cut line 40 of the temporary image. Also good. Here, the second cut line 40 is formed between the gate pad 124 and the second gate test line 134b so as to intersect the first gate test line 134a.

  Hereinafter, a method for inspecting the above-described display substrate 100 will be described with reference to FIG.

  First, a first test signal is applied to the test wiring 130 (S10). At this time, when the first test signal is applied to the test wiring 130, the voltage is charged in the pixel electrode of the display substrate 100 to display the first test image. The first test signal includes a first data test signal and a first gate test signal.

  More specifically, the first data test signal is applied to the data test pad 142, and the first data test signal applied in this way passes through the first and second data test lines 132a and 132b. Further applied to the data pad 122. The first data test signal applied to the data pad 122 is applied to the thin film transistor via the data line 112 to control the thin film transistor.

  The first gate test signal is applied to the gate test pad 144, and the first gate test signal applied in this way is the first gate test line 134a, the second gate test line 134b, the gate pad 124, and the gate wiring 114. Is applied to the thin film transistor to control the thin film transistor.

  As described above, the thin film transistor controlled by the first data test signal and the first gate test signal charges the pixel electrode with a voltage and displays the first test image. The first test image is an image for determining whether a desired image is sufficiently displayed, that is, whether an image is displayed with a desired display quality in terms of hue, luminance, and the like.

  Thereafter, the first test image is observed to check whether or not the first signal failure has occurred (S20). Here, the first signal failure may be caused by a failure of the test wiring 130 or may be caused by a failure of the signal line 110.

  First, the failure of the test wiring 130 is due to the failure in the electrical connection relationship between the first and second data test lines 132a and 132b and the failure in the electrical connection relationship between the first and second gate test lines 134a and 134b. Means bad.

  More specifically, the first and second data test lines 132a and 132b are electrically connected so as to correspond one-to-one through the first contact hole 50. However, there is a problem with such an electrical connection relationship. Can occur. For example, one first data test line 132a is electrically connected to two or more second data test lines 132b, or any one of the second data test lines 132b is electrically connected. Failure to be connected may occur.

  Similarly, the first and second gate test lines 134a and 134b are electrically connected so as to correspond one-to-one through the second contact hole 60. However, a problem may occur even in such a connection relationship. sell.

  On the other hand, the defect of the signal line 110 means a defect in which the data wiring and the gate wiring are disconnected or short-circuited.

  Thus, as a result of examining whether or not the first signal failure occurs, it is found that when the first signal failure does not occur, the display substrate 100 does not fail (S70a).

  On the other hand, as a result of inspecting whether or not the first signal failure occurs, it can be seen that if one of the test wires 130 and the signal line 110 occurs, a failure has occurred. However, it cannot be accurately determined whether the first signal failure is caused by a failure in the test wiring 130 or a failure in the signal line 110.

  Therefore, in order to accurately grasp the cause of the first signal failure, the inspection described later is further performed.

  First, the signal application pads 120 are short-circuited by using another short-circuit body made of a conductive material (S30). Preferably, the group of the signal application pads 120 corresponding to the portion where the first signal failure is generated is short-circuited using the short-circuit body.

  Specifically, when the first signal defect is formed along a part of the data wiring 112, a group of the data pads 122 corresponding to a part of the data wiring 112 is changed to the first. 1 Short-circuit each other by the short-circuit portion 10.

  When the first signal failure is formed along a part of the gate wiring 114, the group of the gate pads 124 corresponding to a part of the gate wiring 114 is short-circuited by the second short-circuit portion 20.

  After the signal applying pads 120 are short-circuited using the short-circuit body, the second test signal is applied to the test wiring 130 (S40). That is, when it is assumed that the second test signal includes the second data test signal and the second gate test signal, the second data test signal is applied to the data test pad 142, and the second gate test signal is applied to the gate test pad 144. Apply.

  The second test signals are preferably the same signal. That is, the second data test signal and the second gate test signal are preferably the same signal.

  As described above, when the second test signal is applied to the test wiring 130, the second test image is displayed on the liquid crystal display panel.

  Thereafter, the second test image is observed to check whether or not a second signal failure has occurred (S50). Here, the second signal failure is caused by a failure of the signal line 110.

  As a result of checking whether or not the second signal failure has occurred, if the second signal failure does not occur, it is found that the failure that has occurred in the display substrate 100 is the failure that has occurred in the test wiring 130 (S70b). That is, the first signal failure is one of the test wiring 130 and the signal line 110, and the second signal failure is a failure of the signal line 110. Therefore, the first signal failure occurs, but the second signal When no defect occurs, it can be seen that the defect generated in the display substrate 100 is a defect caused by the test wiring 130.

  As a result of inspecting whether or not the second signal failure occurs, if the second signal failure occurs, it can be seen that the failure generated on the display substrate 100 is not the failure of the test wiring 130 but the failure of the signal line 110 (S70c). ).

  As described above, according to the method for inspecting the display substrate 100 according to the present embodiment, it is possible to grasp at which position of the test wiring 130 and the signal line 110 the defect has occurred in the display substrate 100, Thus, the reliability of inspection can be further improved. Further, the inspection cost can be reduced by omitting another inspection for detecting the cause of the defect of the display substrate 100.

  Further, since the test wiring 130 is generally removed from the display substrate 100 after the display substrate 100 is inspected, if it is determined that the defect occurring in the display substrate 100 is only the test wiring 130, the test wiring 130 When 130 is removed from the display substrate, any defects in the display substrate 100 can also be removed. As a result, the cost and time required for the liquid crystal display panel can be reduced, and the productivity of the liquid crystal display panel can be further improved.

  The display panel inspection method described with reference to FIG. 1 is described assuming that the first signal failure is one of the test wiring 130 and the signal line 110.

  However, when the first signal failure is at least one of the test wiring 130 and the signal line 110, that is, the first signal failure is the test wiring 130 failure or the signal line 110 failure. Alternatively, when the test wiring 130 and the signal line 110 are defective, it is preferable to compare the first and second signal defects with the inspection method of FIG.

  FIG. 5 is a flow chart showing a display substrate inspection method different from FIG.

  Hereinafter, the new addition will be described in detail with reference to FIG.

  As a result of checking whether or not the second signal failure occurs (S50), when the second signal failure occurs, the first signal failure and the second signal failure are further compared with each other (S60). At this time, comparing the first and second signal defects with each other may be visually compared with the displayed image, but unlike with this, it may be compared with another device such as a current measuring device. Good.

  As a result of comparing the first and second signal defects with each other, if the first and second signal defects are the same, it can be seen that the defect generated on the display substrate 100 is only the signal line 110 (S70c). Here, the fact that the first and second signal failures are the same means that the position where the first signal failure occurs and the position where the second signal failure occurs are the same.

  On the other hand, if the first and second signal defects are different from each other as a result of comparing the first and second signal defects, the defect generated in the display substrate 100 is a defect generated in both the test wiring 130 and the signal line 110. It can be seen that there is (S70d). That is, it can be seen that a defect has occurred in a part of the test wiring 130 and a defect has occurred in a part of the signal line 110 in the display substrate 100.

  In this way, by further adding the comparison of the first and second signal defects to the inspection method of FIG. 1, the defect generated in the display substrate 100 is a defect of only the test wiring 130 or only the signal line 110. It is possible to more accurately determine whether the test wiring 130 and the signal line 110 are defective.

  FIG. 6 is a perspective view showing the display substrate inspection apparatus according to the first embodiment of the present invention, and FIG. 7 is an enlarged plan view showing a portion C of FIG.

  Referring to FIGS. 6 and 7, the display substrate inspection apparatus 200 according to the present embodiment includes a base body 210, a test signal application unit 220, and a pad short-circuit unit 230. At this time, in the display substrate inspection apparatus 200, a pair is preferably arranged on each of the data side and the gate side in order to apply a test signal to the data line and the gate line in the array substrate 100 of the liquid crystal display panel. .

  The base body unit 210 is coupled to the test signal application unit 220 and the pad short-circuit unit 230. The base body 210 preferably moves up and down to move the test signal application unit 220 and the pad short-circuit unit 230 up and down.

  The test signal application unit 220 is coupled to the base body unit 210 and contacts the test pads 140 of the array substrate 100 to apply a test signal to each of the test pads 140.

  Specifically, the test signal application unit 220 includes a signal application body 222 and a signal application pin 224. The signal applying body 222 is coupled to the base body portion 210. The signal application pin 224 is coupled to the signal application body 222 and has a shape protruding below the signal application body 222 so as to face the test pad 140. At this time, it is preferable that the signal application pins 224 have the same number as the test pads 140. The signal application pin 224 contacts the test pad 140 by the vertical movement of the base main body 210 and applies a test signal to each of the test pads 140.

  On the other hand, a plurality of test signal application units 220 are arranged along one direction parallel to the end of the array substrate 100. At this time, the number of test signal application units 220 is preferably the same as the number of groups of test pads 140.

  The pad short-circuit unit 230 is coupled to the base body unit 210 and contacts the signal application pads 120 of the array substrate 100 to short-circuit the signal application pads 120 to each other. Here, the pad short-circuit unit 230 is preferably disposed between the test signal application units 220 disposed along one direction, and the number of the pad short-circuit units 230 is the same as the number of groups of the signal application pads 120. Preferably there is.

  Specifically, the pad short-circuit unit 230 includes a main body 232 and a pad short-circuit unit 234. The main body 232 is coupled to the base body portion 210. The pad short-circuit unit 234 is coupled to the main body 232 and contacts the signal application pad 120 to electrically short-circuit the signal application pads 120 to each other.

  As an example, the pad short-circuit unit 234 includes a short-circuit main body 234a, a connecting column 234b, a presser main body 234c, and a spring 234d.

  The short-circuit body 234a is disposed below the main body 232 so as to face the signal application pad 120, and contacts the signal application pad 120 to short-circuit the signal application pads 120 to each other. At this time, the entire short-circuit body 234a may be made of a conductive material, or only a portion in contact with the signal application pad 120 may be made of a conductive material.

  The connection pillar 234 b is connected to the short-circuit body 234 a and penetrates the main body 232 and protrudes from the upper portion of the main body 232. It is preferable to configure a plurality of the connecting pillars 234b, and as an example, two.

  The presser body 234c is connected to the connecting column 234b and is disposed above the main body 232 so as to face the short-circuit body 234a. The presser body 234c moves up and down by an external force, thereby bringing the short-circuit body 234a into contact with and separating from the signal application pad 120.

  The spring 234 d is coupled to the connecting column 234 b and is disposed between the presser main body 234 c and the main main body 232. The number of springs 234d is preferably the same as the number of connecting columns 234b. The spring 234d provides a restoring force so that the presser body 234c can recover the original position. That is, when the external force is removed after applying an external force to the presser body 234c by bringing the spring 234d into contact with the signal applying pad 120, the spring 234d provides a restoring force to the presser body 234c and applies the signal to the shorted body 234a. Separate from pad 120.

  As described above, according to the display substrate inspection apparatus 200 according to the present embodiment, whether or not an image is sufficiently displayed on the liquid crystal display panel through the test signal application unit 220 is inspected, and the liquid crystal display panel is defective through the pad short-circuit unit 230. The cause of can be inspected.

  Therefore, when inspecting whether or not a defect has occurred in the array substrate 100 in the liquid crystal display panel using the inspection apparatus 200 according to the present embodiment, not only whether the array substrate 100 has a defect but also the cause of the defect. Can be grasped, and the reliability of the inspection can be further improved.

  FIG. 8 is a perspective view showing a part of a display substrate inspection apparatus according to a second embodiment of the present invention. The display substrate inspection apparatus according to the present embodiment has the same configuration as that of the above-described inspection apparatus of the first embodiment except that it further includes a transfer unit. The same reference numerals and names are given.

  Referring to FIG. 8, the display substrate inspection apparatus 200 according to the present embodiment includes a base body 210, a test signal application unit 220, a pad short-circuit unit 230, and a transfer unit 240.

  The transfer unit 240 includes a transfer bar 242 that transfers the pad short-circuit unit 230 and a support body 244 that supports both ends of the transfer bar 242.

  The transfer rod 242 is formed long in one direction parallel to the end portion of the array substrate 100 and penetrates the pad short-circuit portion 230. Specifically, a through hole 232a is formed in the main body 232 of the pad short-circuit portion 230, and the transfer rod 242 penetrates the main body 232 through such a through hole 232a.

  As the transfer rod 242 passes through the main body 232 of the pad short-circuit portion 230 in this manner, the pad short-circuit portion 230 is guided by the transfer rod 242 so as to move in one direction.

  A pair of support main bodies 244 are formed on the base main body 210 and are coupled to both ends of the transfer rod 242 to support the transfer rod 242.

  On the other hand, it is preferable that a plurality of transfer rods 242 are configured in parallel with each other, and two transfer rods 242 are configured as an example. At this time, the length of the transfer rod 242 is preferably 300 mm or less. As an example, when the two transfer rods 242 guide the pad short-circuit portion 230 in parallel with each other and have a length of 300 mm, the pair of transfer rods 242 have such strength that the pad short-circuit portion 230 does not bend. Also good.

  Thus, the number of the pad short-circuiting portions 230 can be reduced by transferring the pad short-circuiting portions 230 by the transfer portion 240 from the display substrate inspection apparatus 200 according to the first embodiment. More specifically, in the display substrate inspection apparatus 200 according to the first embodiment, the pad short-circuit unit 230 is disposed between the test signal application units 220. In the display substrate inspection apparatus 200 according to the present embodiment, When the pad short-circuit part 230 is transferred by the transfer part 240, the number of the pad short-circuit parts 230 can be further reduced. That is, the number of the pad short-circuiting portions 230 can be further reduced by moving the pad short-circuiting portion 230 to the portion of the array substrate 100 where the defect has occurred and re-inspecting the array substrate 100.

  FIG. 9 is a perspective view illustrating a part of a display substrate inspection apparatus according to a third embodiment of the present invention, and FIG. 10 is a cross-sectional view taken along line I-I 'of FIG. The display substrate inspection apparatus according to the present embodiment has the same configuration as that of the above-described inspection apparatus of the first embodiment except that it further includes a transfer unit. Are given the same reference numerals and names.

  Referring to FIGS. 9 and 10, the display substrate inspection apparatus 200 according to the present embodiment includes a base body part 210, a test signal application part 220, a pad short-circuit part 230, and a transfer part 250.

  The transfer unit 250 includes a transfer rail 252 that guides the transfer path of the pad short-circuit unit 230 and a transfer ball 254 that reduces the frictional force of the pad short-circuit unit 230.

  The transfer rail 252 is disposed on the base body 210 and has a shape that is long in one direction parallel to the end of the array substrate 100. The transfer rail 252 is coupled to the pad short-circuit part 230 and guides the pad short-circuit part 230 to move in one direction.

  Specifically, a coupling groove 232 b for coupling to the transfer rail 252 is formed in the main body 232 of the pad short-circuit unit 230. By coupling the transfer rail 252 to the coupling groove 232 b of the main body 232, the pad short-circuit part 230 is guided to move along the transfer rail 252. At this time, the transfer rail 252 may further be formed with a guide groove 252 a for improving the coupling force with the pad short-circuit portion 230.

  The transfer ball 254 is disposed between the coupling groove 232 b of the main body 232 and the transfer rail 252, and reduces the frictional force between the pad short-circuit part 230 and the transfer rail 252. That is, when the pad short-circuit part 230 moves along the transfer rail 252, a certain amount of friction force is generated between the pad short-circuit part 230 and the transfer rail 252. Such a frictional force prevents the pad short-circuit unit 230 from moving to an accurate position between the test signal application units 220. Therefore, the transfer ball 254 can reduce the frictional force between the pad short-circuit portion 230 and the transfer rail 252 and move the pad short-circuit portion 230 to a more accurate position.

  Meanwhile, the transfer balls 254 may be arranged in various positions by forming a predetermined number of groups. As an example, the transfer ball 254 may be disposed so as to face both side surfaces of the transfer rail 252, or may be disposed so as to face the upper surface of the transfer rail 252. At this time, the transfer balls 252 formed with a predetermined number of groups move between the inner side of the main body 232 and the inner surface of the coupling groove 232b as an example by forming an elliptical locus, The frictional force between 252 can be further reduced.

  According to the present invention, after the first signal failure is inspected, the signal application pads are short-circuited to each other, and the second signal failure is reinspected. The reliability of the inspection can be improved, and the inspection cost can be reduced by omitting another inspection to detect the cause of the display board failure. Can be made.

  In addition, when it is determined that the defect generated in the display substrate is only the test wiring, when the test wiring is removed from the display substrate, the defect in the display substrate is also removed, so that the liquid crystal display panel Productivity is further improved.

  The present invention has been described in detail with reference to the embodiments. However, the present invention is not limited to this example, and any technical knowledge to which the present invention belongs can be used without departing from the spirit and spirit of the present invention. The present invention can be modified or changed.

FIG. 5 is a flow chart illustrating a display substrate inspection method according to an embodiment of the present invention. FIG. 2 is a plan view conceptually showing a display substrate to be inspected in the display substrate inspection method of FIG. 1. It is a top view which expands and shows the A section of FIG. It is a top view which expands and shows the B section of FIG. FIG. 2 is a flow chart showing a display substrate inspection method different from FIG. 1. 1 is a perspective view illustrating a display substrate inspection apparatus according to a first embodiment of the present invention. It is a top view which expands and shows the C section of FIG. FIG. 6 is a perspective view illustrating a part of a display substrate inspection apparatus according to a second embodiment of the present invention. It is a perspective view which shows a part among the test | inspection apparatuses of the display board by 3rd Example of this invention. FIG. 10 is a cross-sectional view taken along the line I-I ′ of FIG. 9.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Display board | substrate 110 Signal line 120 Signal application pad 130 Test wiring 140 Test pad 200 Inspection apparatus 210 of display board Base main-body part 220 Test signal application part 230 Pad short circuit part 240, 250 Transfer part

Claims (20)

In a method for inspecting a display substrate including a test wiring, a signal application pad electrically connected to each of the test wirings, and a signal line electrically connected to the signal application pad,
Applying a first test signal to the test wiring to inspect whether or not a first signal failure occurs;
When the first signal failure occurs, the signal application pads are short-circuited with each other,
A test method for a display substrate, comprising: applying a second test signal to the test wiring to inspect whether or not a second signal failure occurs.   The display substrate inspection method according to claim 1, wherein the second test signals are the same. The first signal failure is at least one failure of the test wiring and the signal line,
The display substrate inspection method according to claim 1, wherein the second signal defect is a defect of the signal line. When the second signal failure does not occur, the failure generated on the display substrate is a failure of the test wiring,
4. The display substrate inspection method according to claim 3, wherein when the second signal defect occurs, the defect generated on the display substrate is a defect of the signal line. The test wiring is
A first test line electrically connected to each of the signal application pads;
4. The display substrate inspection according to claim 3, further comprising: a second test line that is arranged to intersect the second test line and is electrically connected to each of the first test lines. 5. Method.   The display substrate inspection method according to claim 5, further comprising a test pad that is electrically connected to each of the second test lines and applies the test signal. The signal line includes a data line formed along a first direction and a gate line formed along a second direction perpendicular to the first direction,
The signal application pad includes a data pad electrically connected to each of the data lines and a gate pad electrically connected to each of the gate lines,
Shorting the signal applying pads to each other,
2. The method for inspecting a display substrate according to claim 1, wherein six data pads are grouped and short-circuited with each other, and four gate pads are grouped and short-circuited with each other. A base body,
A test signal applying unit that is coupled to the base body unit and applies a test signal to each of the test pads in contact with a test pad of a display substrate;
An inspection apparatus for a display substrate, comprising: a pad short-circuit unit that is coupled to the base main body unit and contacts the signal application pad of the display substrate to short-circuit the signal application pads. The pad short-circuit part is
A main body coupled to the base body,
9. The display substrate inspection apparatus according to claim 8, further comprising: a pad short-circuit unit that is coupled to the main body and contacts the signal application pad to short-circuit the signal application pads. The pad short-circuit unit is
A short-circuit body disposed below the main body so as to face the signal application pad, and short-circuiting the signal application pads with each other in contact with the signal application pad;
Connected to the short-circuit body, and a connecting column that protrudes through the main body and protrudes from the main body;
And a presser body that is connected to the connecting column and disposed above the main body so as to face the shorting body, and that causes the shorting body to contact and separate from the signal application pad by an external force. Item 10. A display substrate inspection apparatus according to Item 9.   The pad short-circuit unit may further include a spring disposed between the presser main body and the main main body coupled to the connection column, and providing a restoring force so that the presser main body can be restored to the original position. The display substrate inspection apparatus according to claim 10. The test signal application unit includes:
A signal applying body coupled to the base body,
A signal application pin that is coupled to the signal application body, protrudes below the signal application body so as to face the test pad, and contacts the test pad to apply the test signal to each of the test pads. 9. A display substrate inspection apparatus according to claim 8, wherein   9. The display substrate inspection apparatus according to claim 8, wherein a plurality of the test signal application units are arranged in one direction parallel to an end portion of the display substrate.   14. The display substrate inspection apparatus according to claim 13, wherein the pad short-circuit unit is disposed between the test signal application units.   The display substrate inspection apparatus according to claim 13, further comprising a transfer unit disposed on the base main body unit and coupled to the pad short-circuit unit to transfer the pad short-circuit unit in the one direction. The transfer unit is
A transfer rod which is formed long in one direction so as to penetrate the pad short-circuit portion and guides the pad short-circuit portion to move in the one direction;
The display substrate inspection apparatus according to claim 15, further comprising a support body coupled to both ends of the transfer rod and supporting the transfer rod.   The display substrate inspection apparatus according to claim 16, wherein the transfer rod includes at least two transfer bars parallel to each other.   18. The display substrate inspection apparatus according to claim 17, wherein the length of the transfer rod is 300 mm or less. The transfer unit includes a transfer rail that is formed long in the one direction, is coupled to the pad short-circuit unit, and guides the pad short-circuit unit to move in the one direction.
The display substrate inspection apparatus according to claim 15, wherein the pad short-circuit portion is formed with a coupling groove for coupling with the transfer rail.   The transfer unit may further include a transfer ball disposed between the coupling groove of the pad short-circuit unit and the transfer rail and reducing a frictional force between the pad short-circuit unit and the transfer rail. Item 20. A display substrate inspection apparatus according to Item 19.

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