CN101071157A - Method and equipment for inspecting display substrate - Google Patents

Method and equipment for inspecting display substrate Download PDF

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Publication number
CN101071157A
CN101071157A CNA2007100077338A CN200710007733A CN101071157A CN 101071157 A CN101071157 A CN 101071157A CN A2007100077338 A CNA2007100077338 A CN A2007100077338A CN 200710007733 A CN200710007733 A CN 200710007733A CN 101071157 A CN101071157 A CN 101071157A
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China
Prior art keywords
signal
pad
short circuit
wire
defective
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CNA2007100077338A
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Chinese (zh)
Inventor
任灿享
金奎泰
宋寅喆
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Publication of CN101071157A publication Critical patent/CN101071157A/en
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/006Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/0895Maintenance systems or processes, e.g. indicating need for maintenance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)

Abstract

Provided is a checking method and a checking device of the display cardinal plate. The display cardinal plate include a plurality of test wires, a plurality of signal-exerting solder pads which are electrically connected to the test wires and a plurality of signal lines which are connected to the signal-exerting solder pads. In this method, exert a plurality of first test signals to the test wires, to check whether the first signal defect is produced. When the first signal defect is produced, make the signal-exerting solder pad mutually short-circuit. Exert a plurality of second test signals to the test wires, to check whether the second signal defect is produced. Therefore, it can increase the checking reliability of the display cardinal plate.

Description

Check the method and apparatus of display base plate
Technical field
The present invention relates to check the method and apparatus of display base plate.More specifically, the present invention relates to improve the inspection method and the equipment of the display base plate of checking reliability.
Background technology
Usually, liquid crystal display (LCD) device comprises the LCD screen board of the transmittance display image that utilizes liquid crystal molecule and the backlight assembly of light is provided for the LCD screen board.Backlight assembly is arranged under the LCD screen board.
The LCD screen board comprise array base palte, filter substrate and be inserted in described array base palte and described filter substrate between liquid crystal layer.
Described array base palte can also comprise that many signal line, a plurality of signal apply pad, many p-wires and a plurality of testing weld pad.Every signal line is electrically connected to each thin film transistor (TFT) (TFT) respectively.Each signal applies pad and is electrically connected to every signal line respectively.Each testing weld pad is electrically connected to each signal respectively and applies pad.After the inspection that executes array base palte, remove described p-wire and testing weld pad from described array base palte.After removing described p-wire and described testing weld pad, apply on the pad at signal the extra chip for driving that is used for drive TFT is installed from described array base palte.
In the middle of the inspection of LCD screen board, apply test signal to testing weld pad, thereby on the LCD screen board, show test pattern, afterwards described test pattern is analyzed to find the display defect of LCD screen board.
But, judging whether to have produced display defect by applying test signal, when obtaining as a result thus, and when on the LCD screen board, having produced display defect, can't accurately judge the exact position of the part of the LCD screen board that produces defective.Particularly, can't judge that described defective is to be caused by the p-wire that applies pad with respect to signal and the defective of testing weld pad, still cause by the defective of signal wire.Therefore, can't judge the reason that causes the display defective exactly, thereby reduce the reliability of checking by the display base plate inspection method of routine.
Summary of the invention
The invention provides a kind of inspection method that can improve the display base plate of checking reliability.
The present invention also provides a kind of and has been used to adopt said method to check the equipment of display base plate.
A kind of inspection method of display base plate is provided in one aspect of the invention.Described display base plate comprises that many p-wires, a plurality of signal that is electrically connected to every described p-wire apply pad and many and be electrically connected to the signal wire that described signal applies pad.In described method, apply a plurality of first test signals to described p-wire, whether produced first signal defect to check.When producing first signal defect, make described signal apply the mutual electric short circuit of pad.Apply a plurality of second test signals to described p-wire, whether produced the secondary signal defective to check.
In one aspect of the invention, described first signal defect may be the defective of p-wire or the defective of signal wire, or the defective of the defective of p-wire and signal wire, and described secondary signal defective may be the defective of signal wire.For example, when determining not produce the secondary signal defective, the defective that can determine described display base plate is the defective of p-wire.On the other hand, when determining to have produced the secondary signal defective, the defective of determining described display base plate is the defective of signal wire.
In another aspect of this invention, a kind of checkout facility of display base plate comprises base body part, test signal applying portion and pad short circuit part.
Described test signal applying portion is engaged to described base body part, and contacts with the testing weld pad of described display base plate.Described test signal applying portion applies a plurality of test signals to each described testing weld pad.Described pad short circuit partly is engaged to described base body part and applies pad with the signal of described display base plate and contacts.Described pad short circuit partly makes described signal apply the mutual electric short circuit of pad.
In another aspect of this invention, the checkout facility of described display base plate can also comprise that a plurality of edges are basically parallel to the test signal applying portion that the first direction of the end of described display base plate is provided with.Here, described pad short circuit partly is arranged between each described test signal applying portion.
For example, the checkout facility of described display base plate can comprise the translator unit that is arranged on the described base body part selectively.Described translator unit transmits described pad short circuit part by being engaged to described pad short circuit part along described first direction.
As mentioned above, after checking first signal defect, signal is applied the mutual electric short circuit of pad, check the secondary signal defective afterwards, thereby might determine the position that in the signal wire of the p-wire of described display base plate or described display base plate, produces defective.Therefore, can improve the inspection reliability of display base plate.In addition, can omit the extra inspection step of the reason of the defective that detection produces on display base plate, check cost thereby reduce.
Description of drawings
When considering in conjunction with the accompanying drawings, by with reference to hereinafter embodiment, above-mentioned and other advantages of the present invention will become apparent, wherein:
Fig. 1 shows the process flow diagram according to the inspection method of the display base plate of one exemplary embodiment of the present invention;
Fig. 2 is the planimetric map that shows display base plate and utilize the equipment of the display base plate inspection method inspection display base plate Fig. 1 from conceptive;
Fig. 3 shows the planimetric map of the part " A " of display base plate checkout facility shown in Figure 2;
Fig. 4 shows the planimetric map of the part " B " of display base plate checkout facility shown in Figure 2;
Fig. 5 shows the process flow diagram according to the inspection method of the display base plate of another one exemplary embodiment of the present invention;
Fig. 6 shows the skeleton view according to the checkout facility of the display base plate of one exemplary embodiment of the present invention;
Fig. 7 shows the enlarged drawing of the part " C " of the display base plate checkout facility among Fig. 6;
Fig. 8 shows the skeleton view according to the checkout facility of the display base plate of another one exemplary embodiment of the present invention;
Fig. 9 shows the skeleton view according to the checkout facility of the display base plate of another one exemplary embodiment of the present invention; And
Figure 10 is the sectional view that the I-I ' line along Fig. 9 obtains.
Embodiment
Hereinafter will describe the present invention more fully with reference to the accompanying drawings, show embodiments of the invention in the accompanying drawing.But, the present invention can implement with many different forms, should not be considered limited to one exemplary embodiment described herein.On the contrary, it is in order to make the disclosure thorough and fully that these embodiment are provided, and will convey to those skilled in the art to scope of the present invention fully.In the accompanying drawings, can exaggerate for clarity the layer and the zone size and relative size.
Be to be understood that, when claim an element or layer another element or layer " on ", perhaps " be connected to ", when " being coupled to " another element or layer, it may be directly on another element or layer, or directly connect, be coupled to another element or layer, also may there be intermediary element or layer.Otherwise, when claim an element " be located immediately at " another element or layer " on ", when " being directly connected to " or " directly being couple to " another element or layer are gone up, do not have intermediary element or layer.All the time with similar numeral indication similar elements.Terminology used here " and/or " comprise any of one or more relevant Listed Items and all make up.
Though should be appreciated that and to use term here first, second waits and describes multiple element, assembly, zone, layer and/or part that these elements, assembly, zone, layer and/or part should not be considered limited to these terms.These terms only are used for a certain element, parts, zone, layer or part and other zones, layer or part are distinguished.So, under situation without departing the teaching of the invention, first element discussed below, assembly, zone, layer or part can be called as second element, assembly, zone, layer or part.
For convenience of description, for example may use here " ... down ", " under ", space relative terms such as D score, " on ", " on " describe as shown in the figure element or the relation of feature and another or a plurality of element or feature.Should be appreciated that the space relative terms be intended to comprise except that direction as shown in use or the different directions of device at work.For example, if with the device reverse turn among the figure, be described as be in other elements or functional part D score or " under " element will be positioned at other elements or functional part " on ".So, exemplary term " ... down " can comprise on and under two kinds of directions.Device can be taked other orientations (revolve turn 90 degrees or in other directions), and used here spatial relationship is described language explain accordingly.
Terminology used here only is in order to describe certain embodiments, and is not intended to restriction the present invention.As used herein, singulative " " and " being somebody's turn to do " are intended to comprise simultaneously plural form, unless context spells out separately.What it is also understood that is, term used in this instructions " comprises " existence that indicates described feature, integer, step, operation, element and/or assembly, but does not get rid of the existence or the increase of one or more other features, integer, step, operation, element, assembly and/or its combination.
Here describe embodiments of the invention with reference to sectional view, described sectional view is the synoptic diagram of idealized embodiment of the present invention (and intermediate structure).Like this, can predict because for example manufacturing technology and/or tolerance limit can cause the variation of shape shown.So, embodiments of the invention should not be construed as limited to illustrated specific region shape here, but comprise the change of shape that produces because of (for example) manufacturing.For example, the injection region that is illustrated as rectangle has circular or crooked functional part usually and/or has the gradient of implantation concentration in its edge, rather than has binary from the injection region to non-injection region and change.Similarly, may cause injecting at some by injecting the burial layer that forms at described burial layer with by the region memory between the surface of its generation injection.So, illustrated zone is schematically in essence, and their shape is not intended to the true form of showing device area, and is not intended to and limits the scope of the invention.
Unless otherwise defined, otherwise all terms that adopted in the literary composition have (comprising scientific and technical terminology) implication of one skilled in the art's common sense of the present invention.What it is also understood that is, should be interpreted as and its corresponding to implication of implication in correlation technique and context of the present disclosure such as defined those terms in universaling dictionary, unless clear and definite the definition, otherwise should not be interpreted as the meaning of Utopian or excessive form here.
Describe the present invention in detail below with reference to accompanying drawing.
Embodiment 1 (inspection method of display base plate)
Fig. 1 is the process flow diagram according to the inspection method of the display base plate of one exemplary embodiment of the present invention.Fig. 2 is the planimetric map that shows display base plate and utilize the equipment of the display base plate inspection method inspection display base plate Fig. 1 from conceptive.
At first, the display base plate of checking according to the display base plate inspection method of this one exemplary embodiment will be adopted, described display base plate inspection method will be described afterwards in detail describing.
With reference to figure 2, display base plate 100 comprises that a plurality of pixel electrode (not shown), a plurality of thin film transistor (TFT) (TFT) (not shown), a plurality of signal apply pad 120, many p-wires 130 and a plurality of testing weld pad 140.Display base plate 100 can be the array base palte of LCD (LCD) screen board (not shown).The LCD screen board can also comprise filter substrate and be inserted in described array base palte and described filter substrate between liquid crystal layer.
Pixel electrode comprises migration (transference) conductive material.Pixel electrode is arranged on the array base palte with matrix shape.
Each TFT is electrically connected to each pixel electrode, and the pixel voltage that is filled in the control pixel electrode.
Every signal line 110 is electrically connected to each TFT, and controls described TFT.Particularly, signal wire 110 comprises the gate line 114 that many data lines 112 that form along first direction and many edges form perpendicular to the second direction of first direction.
Each signal applies pad 120 and is electrically connected to every signal line 110.The chip for driving (not shown) can be arranged at signal applies on the pad 120.Chip for driving being electrically connected to signal applying pad 120, is that signal applies the drive signal that pad 120 is provided for display image thereby make chip for driving.For example, signal applies pad 120 and can comprise a plurality of data pads 122 and a plurality of gate pads 124 that are electrically connected to gate line 114 that are electrically connected to data line 112.
Every p-wire 130 is electrically connected to each signal and applies pad 120.For example, p-wire 130 can comprise a plurality of data test line 132 and many grid p-wires 134 that are electrically connected to gate pads 124 that are electrically connected to each data pads 122.
Each testing weld pad 140 is electrically connected to every p-wire 130.Can make a plurality of signals apply the pin (not shown) contacts with testing weld pad 140.It is the test image signal that testing weld pad 140 is provided for testing the image that shows on the LCD screen board that signal applies pin.For example, testing weld pad 140 can comprise a plurality of data test pad 142 and a plurality of grid testing weld pads 144 that are electrically connected to grid p-wire 134 that are electrically connected to data test line 132.
Fig. 3 shows the planimetric map of the part " A " of display base plate checkout facility shown in Figure 2.
With reference to figure 3, the data pads 122 of predetermined quantity is defined as a group.Be provided with a plurality of described group along second direction.For example, six data pads 122 can be defined as a group.Each data pads 122 in the group is electrically connected to every corresponding data line 112 one to one.
Data test line 132 comprises many first data test line 132a and many second data test line 132b.
The first data test line 132a forms along first direction.The first data test line 132a is electrically connected to each corresponding data pads 122 one to one, and the quantity that is defined as one group the first data test line 132a equates substantially with the quantity of data pads 122.
The second data test line 132b forms along second direction, thereby intersects with the first data test line 132a.The second data test line 132b is electrically connected to the first data test line 132a of every correspondence one to one by each first contact hole 50, and the quantity that is defined as one group the second data test line 132b equates substantially with the quantity of the first data test line 132a.
The quantity that is defined as one group data test pad 142 equates substantially with the quantity of the second data test line 132b.Each data test pad 142 is electrically connected to every second data test line 132b.For example, every second data test line 132b can comprise first end and the second end.First end is electrically connected to the data test pad 142 in being arranged at first group.The second end be electrically connected to be arranged at described first group adjacent second group in data test pad 142.Therefore, the data test pad 142 of all groups has all obtained the electrical connection one to one of mutual correspondence.
Perhaps, can make one group of interior data pads 122 by the first short circuit part, 10 mutual electric short circuits.And, can cut display base plates 100 along first line of cut 30 by after checking display base plate 100 according to the display base plate inspection method of this one exemplary embodiment.Therefore, can remove data test line 132 and data test pad 142 from display base plate 100.Between the data pads 122 and the second p-wire 132b, first line of cut 30 is set, makes it to intersect with the first data test line 132a.
Fig. 4 shows the planimetric map of the part " B " of display base plate checkout facility shown in Figure 2.With reference to figure 4, the gate pads 124 of predetermined quantity is defined as a group.Be provided with a plurality of described group along first direction.For example, four gate pads 124 can be defined as one group.Each gate pads 124 is electrically connected to the gate line 114 of every correspondence one to one.
Grid p-wire 134 comprises many first grid p-wire 134a and many second grid p-wire 134b.
First grid p-wire 134a forms along first direction.The quantity that is defined as one group the quantity of first grid p-wire 134a and gate pads 124 is basic identical.Every first grid p-wire 134a is electrically connected to each corresponding gate pads 124 one to one.
Second grid p-wire 134b edge forms with the second direction that first grid p-wire 134a intersects.Second contact hole 60 of second grid p-wire 134b by each correspondence is electrically connected to every first grid p-wire 134a one to one, and the quantity that is defined as one group second grid p-wire 134b equates substantially with the quantity of first grid p-wire 134a.
The quantity that is defined as one group grid testing weld pad 144 equates substantially with the quantity of second grid p-wire 134b.Each grid testing weld pad 144 is electrically connected to each second grid p-wire 134b.
Perhaps, can make one group of interior gate pads 124 by the second short circuit part, 20 mutual electric short circuits.And, can cut display base plates 100 along second line of cut 40 by after checking display base plate 100 according to the display base plate inspection method of this one exemplary embodiment.Therefore, can remove grid p-wire 134 and grid testing weld pad 144 from display base plate 100.Second line of cut 40 is arranged between gate pads 124 and the second grid p-wire 134b, makes it to intersect with first grid p-wire 134a.
Hereinafter, will describe the inspection method of aforesaid display base plate 100 referring to figs. 1 to Fig. 4 in detail.
Apply a plurality of first test signals (step S10) to p-wire 130 respectively.Respectively when p-wire 130 applies first test signal, in the pixel electrode of display base plate 100, charge into voltage, thereby show first test pattern corresponding to first test signal.First test signal comprises a plurality of first data test signals and a plurality of grid test signal.
Particularly, apply the first data test signal to data test pad 142 respectively.The first data test signal that will be applied on the data test pad 142 by the first and second data test line 132a and 132b is applied on the data pads 122 respectively.The first data test signal that will be applied on the data pads 122 by data line 112 is applied on the TFT respectively, controls described TFT thus.
Perhaps, the first grid test signal can be applied to respectively on the grid testing weld pad 144.The first grid test signal that will be applied to grid testing weld pad 144 by first grid p-wire 134a, second grid p-wire 134b, gate pads 124 and gate line 114 is applied to TFT respectively, controls described TFT thus.
TFT by the first data test signal and the control of first grid test signal is charged to certain voltage with pixel electrode, shows first test pattern thus.First test pattern is used to determine whether correctly shown the expection image, promptly has the image of prospective quality with regard to tone, brightness etc.
Afterwards, carry out and check, thereby determine whether to have produced first signal defect (step S20) by observing first test pattern.For example, described first signal defect may be to be caused by the defective of p-wire 130 or the defective of signal wire 110.
The defective of p-wire 130 is meant in the electrical connection between the first and second data test line 132a and 132b and has defective, and has defective in the electrical connection between first grid p- wire 134a and 134b.
Particularly, the first and second data test line 132a and 132b are electrically connected mutually accordingly one to one by first contact hole 50; But, in described electrical connection, may have problems.For example, one of first data test line 132a may be electrically connected to two or more second data test line 132b.Again for example, may one of first data test line 132a be electrically connected at least one among the second data test line 132b.
Adopt essentially identical mode, the first and second grid p- wire 134a and 134b are electrically connected mutually accordingly one to one by second contact hole 60; But, in described electrical connection, may have problems.
The defective of signal wire 110 is meant every data line 112 disconnected or mutual electric short circuit of TURP each other, and every gate line 114 disconnected or mutual electric short circuit of TURP each other.
After in step S20, determining not produce first signal defect, determine on display base plate 100, not produce defective (step S70a).
On the other hand, in step S20, determine to have produced after first signal defect, determine in p-wire 130 or signal wire 110, to have produced defective (step S70a).But, can not determine that first signal defect is to cause by the defective of p-wire 130 or by the defective of signal wire 110.
Therefore, in order accurately to judge the reason of first signal defect, also to carry out following inspection step.
Employing comprises that the extra short circuit body of conductive material makes signal apply pad 120 mutual electric short circuits (step S30).For example, can adopt the short circuit body to make and apply the mutual electric short circuit of group that pad 120 constitutes by signal corresponding to first signal defect.
Particularly, when the part along data line 112 produces first signal defect, make the mutual electric short circuit of group that constitutes by data pads 122 corresponding to the part of data line 112 by the first short circuit part 10.
Perhaps, when the part along gate line 114 produces first signal defect, make the mutual electric short circuit of group that constitutes by gate pads 124 corresponding to the part of gate line 114 by the second short circuit part 20.
So, after employing short circuit body applies signal pad 120 mutual electric short circuits, apply second test signal (step S40) to p-wire 130.For example, when second test signal comprises the second data test signal and second grid test signal, the second data test signal can be applied on the data test pad 142, the second grid test signal can be applied on the grid testing weld pad 144.
For example, each second test signal can be mutually the same substantially.For example, each second data test signal can be basic identical, and each second grid test signal can be basic identical.
Correspondingly, when p-wire 130 applies second test signal, on the LCD screen board, show second test pattern.
Afterwards, carry out and check, thereby determine whether to have produced secondary signal defective (step S50) by observing second test pattern.For example, the secondary signal defective may be that defective by signal wire 110 causes.
After determining not produce the secondary signal defective in step S50, the defective of determining display base plate 100 is (the step S70b) that is caused by the defective that produces in the p-wire 130.For example, first signal defect may be the defective of p-wire 130 or signal wire 110, and the secondary signal defective may be the defective of signal wire 110.Therefore,, but do not produce second defective, determine that so the defective that produces is the defective that is caused by p-wire 130 on display base plate 100 if produced first signal defect.
On the other hand, in step S50, determine to have produced the secondary signal defective after, the defective of determining display base plate 100 is not the defective of p-wire 1 30, but the defective of signal wire 110 (step S70c).
According to inspection method according to the display base plate 100 of this one exemplary embodiment, might determine that the defective that produces on the display base plate 100 produces p-wire 130 in, still be generation in signal wire 110.Therefore, can improve the reliability of inspection.In addition, can omit the extra inspection step that the defective that detects display base plate 100 produces reason, check cost thereby reduce.
In addition, display base plate 100 is being checked comprehensively back removal p-wire 130.Therefore, after the defective of determining display base plate 100 only is defective p-wire 130 in, can be along with p-wire 130 is removed and the defective of elimination display base plate 100 from display base plate 100.Therefore, can reduce the inspection cost and the supervision time of LCD screen board, thereby further improve the manufacturing throughput rate of LCD screen board.
In above-mentioned display panel inspection method shown in Figure 1, think that first signal defect is one of the defective of p-wire 130 and defective of signal wire 110.
But, when first signal defect be the defective of signal wire 110 and p-wire 130 defective at least one of them the time, can in above-mentioned display panel inspection method shown in Figure 1, comprise the contrast step between first signal defect and the secondary signal defective.
Fig. 5 is the process flow diagram according to the inspection method of the display base plate of another one exemplary embodiment of the present invention.Except step S60 and step S70d, according to the step S10 of this one exemplary embodiment to step S70c and shown in Figure 1 basic identical.Therefore, will adopt same reference numerals to represent and identical step shown in Figure 1, and will omit any additional description relevant with above-mentioned steps.
Hereinafter, will describe new additional step in detail with reference to figure 5.
After in step S50, determining to have produced the secondary signal defective, first signal defect and secondary signal defective are compared (step S60).For example, the contrast step of first and second defectives can comprise by shown image first and second defectives are carried out visual comparison.Again for example, the contrast step between first and second defectives can comprise by the extra means such as current detection device first and second defectives are compared mutually.
Determine that in step S50 first signal defect is equal to after the secondary signal defective substantially, the defective that can determine display base plate 100 is the defective (step S70c) of signal wire 110.First and second signal defects to be equal to the generation position and the secondary signal generation of defects position that are meant first signal defect basic identical.
Determine that in step S50 first signal defect is different from after the secondary signal defective, the defective that can determine display base plate 100 is the defective (step S70d) of p-wire 130 and signal wire 110.For example, in the part of the p-wire 130 of display base plate 100, produce defective, in the part of the signal wire 110 of display base plate 100, also produced another defective.
Correspondingly, increase the step of contrast first and second signal defects to the inspection method of display base plate shown in Figure 1, thereby can judge exactly that the defective that produces in the display base plate 100 only is the defective of p-wire 130, only be the defective of signal wire 110, or be the two defective of p-wire 130 and signal wire 110.
Embodiment 2 (checkout facility of display base plate)
Fig. 6 shows the skeleton view according to the display base plate checkout facility of one exemplary embodiment of the present invention.Fig. 7 shows the enlarged drawing of the part " C " of the display base plate checkout facility among Fig. 6.
With reference to figure 6 and Fig. 7, comprise base body part 210, test signal applying portion 220 and pad short circuit part 230 according to the checkout facility 200 of one exemplary embodiment of the present invention.For example, two checkout facilities 200 can be arranged at the data side and the gate electrode side of array base palte 100, thereby provide test signal to the data line and the gate line of the array base palte 100 of LCD screen board.
Base body part (base body section) 210 is engaged to test signal applying portion 220 and pad short circuit part 230.For example, vertical movable base body portion 210, thus test signal applying portion 220 and pad short circuit part 230 are vertically moved.
Test signal applying portion 220 is engaged to base body part 210.Test signal applying portion 220 contacts with the testing weld pad 140 of array base palte 100, thereby makes test signal applying portion 220 provide a plurality of test signals for each testing weld pad 140.
Particularly, test signal applying portion 220 comprises that signal applies body 222 and signal applies pin 224.Signal applies body 222 and is engaged to base body part 210.Signal applies pin 224 and is engaged to signal and applies body 222.Signal applies pin 224 to have from signal and applies the outstanding shape of body 222, with in the face of testing weld pad 140.The quantity that signal applies pin 224 can equate substantially with the quantity of testing weld pad 140.Signal applies pin 224 vertical motion by base body part 210 and contacts with testing weld pad 140, provides test signal thereby make signal apply pin 224 for each testing weld pad 140.
A plurality of test signal applying portions 220 can be set along the first direction of the end that is basically parallel to array base palte 100.The quantity of the group that the number of test signal applying portion 220 can constitute with testing weld pad 140 equates substantially.Pad short circuit part 230 is engaged to base body part 210, and applies pad 220 with signal and contact, thereby makes each signal apply pad 220 by pad short circuit part 230 mutual electric short circuits.Can pad short circuit part 230 be set along between the test signal applying portion 220 of first direction setting.The quantity of pad short circuit part 230 can equate substantially with the quantity that signal applies the group that pad 220 constitutes.
Particularly, pad short circuit part 230 comprises main body 232 and pad short unit 234.Main body 232 is engaged to base body part 210.Pad short unit 234 is engaged to main body 232, and applies pad 220 with signal and contact, thereby pad short unit 234 makes signal apply pad 220 mutual electric short circuits.
Pad short unit 234 can comprise, for example, and short circuit body 234a, connecting link 234b, pressing body 234c and spring 234d.
Short circuit body 234a is arranged under the main body 232, in the face of signal applies pad 220, makes short circuit body 234a and signal apply pad 220 and contacts, thereby make signal apply pad 220 electric short circuits.For example, short circuit body 234a can wholely be made of conductive material.Again for example, can constitute by conductive material with the end that signal applies the short circuit body 234a that pad 220 contacts.
Connecting link 234b is connected to short circuit body 234a, and passes main body 232, and is outstanding from the top of main body 232.Preferably, can be with a plurality of connecting link 234b, for example two connecting link 234b are connected to short circuit body 234a.
Pressing body 234c is connected to connecting link 234b, and pressing body 234c is arranged on the top of main body 232, to face short circuit body 234a.When pressing body 234c was moved up, pressing body 234c applies pad 220 with short circuit body 234a with signal to be separated.Perhaps, when pressing body 234c was moved down, pressing body 234c applied pad 220 with short circuit body 234a with signal and contacts.
The spring 234d that is engaged to connecting link 234b is set between pressing body 234c and main body 232.The quantity of spring 234d equates substantially with the quantity of connecting link 234b.Spring 234d provides dynamic stability for pressing body 234c, thereby makes pressing body 234c turn back to reference position.For example,, can reduce the size of spring 234d, contact thereby make short circuit body 234a and signal apply pad 220 when pressing body 234c provides external force.So, with external force after pressing body 234c removes, the size restoration of spring 234d separates thereby make short circuit body 234a and signal apply pad 220 to original state.
Whether the checkout facility 200 according to being used for checking according to this one exemplary embodiment display base plate might obtain normal demonstration by test signal applying portion 220 check image on the LCD screen board, with the reason of the defective of determining to cause the LCD screen board.
Therefore, check adopting to carry out when determining whether in the array base palte 100 of LCD screen board, to have produced defective, might check whether on array base palte 100, produced defective according to the checkout facility 200 of this one exemplary embodiment.In addition, the reason of defective might be checked, thereby the inspection reliability of array base palte can be improved.
Embodiment 3 (checkout facility of display base plate)
Fig. 8 shows the skeleton view according to the checkout facility of the display base plate of another one exemplary embodiment of the present invention.Except translator unit (transfer section), the display base plate checkout facility of present embodiment and embodiment's 2 is basic identical.Therefore, with use the same reference numerals to represent with embodiment 2 in the same or analogous part described, and will omit any further duplicate explanation relevant with said elements.
With reference to figure 8, comprise base body part 210, test signal applying portion 220, pad short circuit part 230 and first translator unit 240 according to the checkout facility 200 of another one exemplary embodiment.
First translator unit 240 comprises makes pad short circuit part 230 driven rod 242 that is moved and the supporter 244 that supports driven rod 242.
Driven rod 242 forms along the first direction of the end that is basically parallel to array base palte 100, and it passes pad short circuit part 230.Particularly, form through hole on the main body 232 of pad short circuit part 230, driven rod 242 passes pad short circuit part by through hole 232a.
Correspondingly, because driven rod 242 passes the main body 232 of pad short circuit part 230, therefore can move along first direction by driven rod 242 guiding pad short circuit parts 230.
On base body part 210, form a pair of supporter 244, and it is engaged to two ends of driven rod 242 respectively, to support driven rod 242.
Perhaps, a plurality of driven rods 242 can be set to be parallel to each other substantially.For example, the quantity of driven rod 242 can be two or more.The length of each driven rod 242 preferably is no more than about 300mm.For example, the driven rod 242 that a pair of length is no more than 300mm is set, and when making it support pad short circuit part 230, this intensive quantity that driven rod 242 is had can make pad short circuit part 230 not bend substantially parallel.
Owing to pad short circuit part 230 is moved, therefore can make quantity according to the pad short circuit part 230 of this one exemplary embodiment be less than quantity according to the pad short circuit part 230 of embodiment 2 by first translator unit 240.Particularly, pad short circuit part 230 is set between the test signal applying portion 220 in embodiment 2.But,, therefore further reduced the quantity of pad short circuit part 230 owing to, pad short circuit part 230 is moved by first translator unit 240 at the checkout facility 200 that is used for checking display base plate according to this one exemplary embodiment.For example, pad short circuit part 230 can be moved to the defect part of array base palte 100, thereby check array base palte 100 once more, further reduce the quantity of pad short circuit part 230 thus.
Embodiment 4 (checkout facility of display base plate)
Fig. 9 shows the skeleton view according to the checkout facility of the display base plate of another one exemplary embodiment of the present invention.Figure 10 is the sectional view that the I-I ' line along Fig. 9 obtains.Except translator unit, basic identical according to the display base plate checkout facility of this one exemplary embodiment and embodiment 2.Therefore, with use the same reference numerals to represent with embodiment 2 in the same or analogous part described, and will omit any further duplicate explanation relevant with said elements.
With reference to figure 9 and Figure 10, the display base plate checkout facility of another one exemplary embodiment comprises base body part 210, test signal applying portion 220, pad short circuit part 230 and second translator unit 250 according to the present invention
Second translator unit 250 comprises the transmission rail (transfer rail) 252 of the transfer path that guides pad short circuit part 230 and reduces the transmission ball 254 of the friction force of pad short circuit part 230.
Transmitting rail 252 is arranged on the base body part 210.Transmit rail and have elongate shape, promptly the first direction along the end that is basically parallel to array base palte 100 forms.Transmit rail 252 and be engaged to pad short circuit part 230, and guiding pad short circuit part 230 moves along first direction.
Particularly, on the main body 232 of pad short circuit part 230, form the engaging groove 232b that is engaged to transmission rail 252.Owing to transmit the engaging groove 232b that rail 252 is engaged to main body 232, therefore be moved along transmitting rail 252 guiding pad short circuit parts 230.Perhaps, can on transmission rail 252, form guide groove 252a to increase binding force to pad short circuit part 230.
At the engaging groove 232b of main body 232 with transmit to be provided with between the rail 252 and transmit ball 254.Transmission ball 254 has reduced the friction force between pad short circuit part 230 and the transmission rail 252.For example, when moving pad short circuit part 230, between pad short circuit part 230 and transmission rail 252, will produce friction force along transmission rail 252.Friction force hinders the position that pad short circuit part 230 accurately moves between the test signal applying portion 220.Therefore, transmission ball 254 has reduced the friction force between pad short circuit part 230 and the transmission rail 252, thereby pad short circuit part 230 is moved to more accurate position.
Perhaps, a plurality of transmission balls 254 can be divided into a plurality of groups.The group of the transmission ball 254 divided can be arranged on a plurality of positions.For example, can be set in the face of transmitting two side surfaces of rail 252 transmitting ball 254.Again for example, can be set in the face of transmitting the upper surface of rail 252 transmitting ball 254.Transmit group that ball 254 constitutes between the inside part of the inside part of main body 232 and engaging groove 232b, (for example) according to the desired trajectory motion such as elliptical orbit, thereby further reduces pad short circuit part 230 and transmit friction force between the rail 252.
According to the present invention, after checking first signal defect, signal is applied the mutual electric short circuit of pad, check the secondary signal defective afterwards, thereby might determine whether in the p-wire of display base plate, to have produced defective, in the signal wire of display base plate, produce defective, perhaps within both, produced defective.Therefore, can improve the inspection reliability of display base plate.In addition, can omit the extra inspection step of the reason of the defective that detection produces on display base plate, check cost thereby reduce.
In addition, after the defective of determining display base plate only is the defective of p-wire, can be along with p-wire is removed and the defective of elimination display base plate from display base plate.Therefore, can reduce the inspection cost and the supervision time of LCD screen board, thereby further improve the manufacturing throughput rate of LCD screen board.
Although described one exemplary embodiment of the present invention, but those of ordinary skills are to be understood that, the invention is not restricted to these one exemplary embodiment, in the spirit and scope of the present invention that are defined by the claims, can make various modifications and variations it.

Claims (20)

1. the inspection method of a display base plate, described display base plate comprise that many p-wires, a plurality of signal that is electrically connected to every described p-wire apply pad and many and be electrically connected to the signal wire that described signal applies pad, and described method comprises:
Apply a plurality of first test signals to described p-wire, whether produced first signal defect to check;
When producing described first signal defect, described signal is applied the mutual electric short circuit of pad; And
Apply a plurality of second test signals to described p-wire, whether produced the secondary signal defective to check.
2. method according to claim 1, wherein, described second test signal is basic identical each other.
3. method according to claim 1, wherein, one of the defective that described first signal defect is a p-wire and defective of signal wire, described secondary signal defective are the defectives of signal wire.
4. method according to claim 3, wherein, when not producing described secondary signal defective, the defective that produces in the described display base plate is the defective of described p-wire, when having produced described secondary signal defective, the defective that produces in the described display base plate is the defective of described signal wire.
5. method according to claim 3, wherein, described p-wire comprises:
Many are electrically connected to first p-wire that each described signal applies pad; And
Many are set to second p-wire that intersects with described first p-wire, and described second p-wire is electrically connected to every described first signal wire.
6. method according to claim 5, wherein, described display base plate also comprises a plurality of testing weld pads that are electrically connected to every described second p-wire, described testing weld pad applies described test signal to every described second p-wire.
7. method according to claim 1, wherein, described signal wire comprises:
Along many data lines of first direction formation and many gate lines that form along the second direction that is basically perpendicular to described first direction; And
Described signal applies pad and comprises a plurality of data pads and a plurality of gate pads that are electrically connected to every described gate line that are electrically connected to every described data line,
Wherein, described signal being applied the mutual electric short circuit of pad comprises:
Described data pads is divided into six one group, and with each mutual electric short circuit of described integrated data pad through grouping; And
Described gate pads is divided into tetrad, and with each mutual electric short circuit of described gate pads through grouping.
8. the checkout facility of a display base plate comprises:
The base body part;
The test signal applying portion that is engaged to described base body part and contacts with the testing weld pad of display base plate, described test signal applying portion applies a plurality of test signals to each described testing weld pad; And
Be engaged to described base body part and apply the pad short circuit part that pad contacts with the signal of described display base plate, described pad short circuit partly makes described signal apply the mutual electric short circuit of pad.
9. equipment according to claim 8, wherein, described pad short circuit partly comprises:
Be engaged to the main body of described base body part; And
Be engaged to the pad short unit of described main body, described pad short unit contacts and makes described signal apply the mutual electric short circuit of pad by applying pad with described signal.
10. equipment according to claim 9, wherein, described pad short unit comprises:
Be arranged under the described main body, in the face of described signal applies the short circuit body of pad, described short circuit body contacts and makes described signal apply the mutual electric short circuit of pad by applying pad with described signal;
Be connected to the connecting link of described short circuit body, described connecting link passes described main body from described short circuit body and gives prominence to towards the top of described main body; And
Be connected to the pressing body of described connecting link, described pressing body is arranged at the top of described main body, and in the face of described short circuit body, described pressing body makes described short circuit body and described signal apply pad in response to external force to separate or contact.
11. equipment according to claim 10, wherein, described pad short unit also comprises spring, described spring is engaged to the described connecting link that is arranged between described pressing body and the described main body, described spring provides dynamic stability for described pressing body, thereby allows described pressing body to turn back to reference position.
12. equipment according to claim 8, wherein, described test signal applying portion comprises:
The signal that is engaged to described base body part applies body; And
Be engaged to the signal that described signal applies body and apply pin, it is outstanding from the bottom that described signal applies body, and with in the face of described testing weld pad, described signal applies pin and provides test signal by contacting with described testing weld pad to each described testing weld pad.
13. equipment according to claim 8 comprises that also a plurality of edges are basically parallel to the test signal applying portion that the first direction of the end of described display base plate is provided with.
14. equipment according to claim 13 wherein, partly is arranged at described pad short circuit between each described test signal applying portion.
15. equipment according to claim 13 also comprises:
Be arranged at the translator unit on the described base body part, described translator unit transmits described pad short circuit part by being engaged to described pad short circuit part along first direction.
16. equipment according to claim 15, wherein, described translator unit comprises:
Along the driven rod that passes described pad short circuit part that described first direction forms, described driven rod guides described pad short circuit part to move along described first direction; And
Be engaged to the supporter of two ends of described driven rod, the described driven rod of described support body supports.
17. equipment according to claim 16, wherein, the quantity of described driven rod is two or more, and described driven rod is arranged in parallel substantially.
18. equipment according to claim 17, wherein, the length of each described driven rod is no more than about 300mm.
19. equipment according to claim 15, wherein, described translator unit comprises:
Along the transmission rail that described first direction forms with elongate shape, it is engaged to described pad short circuit part, and described transmission rail guides described pad short circuit part to move along described first direction; And
Be formed at the engaging groove that is adapted to couple to described transmission rail on the described pad short circuit part.
20. equipment according to claim 19, wherein, described translator unit also comprises the engaging groove that is arranged at described pad short circuit part and the transmission ball between the described transmission rail, and described transmission ball has reduced the friction force between described pad short circuit part and the described transmission rail.
CNA2007100077338A 2006-05-08 2007-01-29 Method and equipment for inspecting display substrate Pending CN101071157A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR40827/06 2006-05-08
KR1020060040827A KR20070108589A (en) 2006-05-08 2006-05-08 Method of display substrate inspection and apparatus of display substrate inspection using the method

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Publication number Priority date Publication date Assignee Title
CN110473469A (en) * 2018-05-09 2019-11-19 三星显示有限公司 Show equipment

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KR102296768B1 (en) * 2014-12-03 2021-09-01 엘지디스플레이 주식회사 Display panel and method for testing of display panel
CN109459653A (en) * 2018-12-29 2019-03-12 北方奥钛纳米技术有限公司 A kind of battery core short circuit testing tool

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110473469A (en) * 2018-05-09 2019-11-19 三星显示有限公司 Show equipment

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