JP2007300107A - 差込サブアセンブリを収容するためのハウジングを備えるサブアセンブリ支持体 - Google Patents

差込サブアセンブリを収容するためのハウジングを備えるサブアセンブリ支持体 Download PDF

Info

Publication number
JP2007300107A
JP2007300107A JP2007116979A JP2007116979A JP2007300107A JP 2007300107 A JP2007300107 A JP 2007300107A JP 2007116979 A JP2007116979 A JP 2007116979A JP 2007116979 A JP2007116979 A JP 2007116979A JP 2007300107 A JP2007300107 A JP 2007300107A
Authority
JP
Japan
Prior art keywords
subassembly
support
plug
liquid
liquid distributor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007116979A
Other languages
English (en)
Japanese (ja)
Inventor
Ralf Herrmann
ヘルマン ラルフ
Michael Joist
ミヒャエル　ヨイスト
Heinz Kempf
ケンプ ヘインツ
Adam Pawlowski
パウロウスキ アダム
Liane Rheinschmitt
ラインシュミット リアネ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schroff GmbH
Original Assignee
Schroff GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schroff GmbH filed Critical Schroff GmbH
Publication of JP2007300107A publication Critical patent/JP2007300107A/ja
Pending legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45B—WALKING STICKS; UMBRELLAS; LADIES' OR LIKE FANS
    • A45B9/00—Details
    • A45B9/02—Handles or heads
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45B—WALKING STICKS; UMBRELLAS; LADIES' OR LIKE FANS
    • A45B25/00—Details of umbrellas
    • A45B25/12—Devices for holding umbrellas closed, e.g. magnetic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20627—Liquid coolant without phase change
    • H05K7/20645—Liquid coolant without phase change within cabinets for removing heat from sub-racks

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2007116979A 2006-05-06 2007-04-26 差込サブアセンブリを収容するためのハウジングを備えるサブアセンブリ支持体 Pending JP2007300107A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202006007275U DE202006007275U1 (de) 2006-05-06 2006-05-06 Baugruppenträger mit einem Gehäuse zur Aufnahme von Steckbaugruppen

Publications (1)

Publication Number Publication Date
JP2007300107A true JP2007300107A (ja) 2007-11-15

Family

ID=37026749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007116979A Pending JP2007300107A (ja) 2006-05-06 2007-04-26 差込サブアセンブリを収容するためのハウジングを備えるサブアセンブリ支持体

Country Status (5)

Country Link
US (1) US20070256957A1 (de)
EP (1) EP1853101B1 (de)
JP (1) JP2007300107A (de)
DE (2) DE202006007275U1 (de)
RU (1) RU2364058C2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020162367A1 (ja) 2019-02-05 2020-08-13 Ｎｅｃプラットフォームズ株式会社 配管保護装置および冷却装置

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1967938B1 (de) * 2007-01-23 2009-07-29 Schroff GmbH Schaltschrank zur Aufnahme elektronischer Steckbaugruppen mit einem Wärmetauscher
DE102007048640A1 (de) 2007-03-14 2008-09-25 SCHäFER WERKE GMBH Schaltschrank zur Aufnahme elektronischer Systemkomponenten
US9943014B2 (en) 2013-03-15 2018-04-10 Coolit Systems, Inc. Manifolded heat exchangers and related systems
US9496200B2 (en) * 2011-07-27 2016-11-15 Coolit Systems, Inc. Modular heat-transfer systems
DE102009006924B3 (de) * 2009-02-02 2010-08-05 Knürr AG Betriebsverfahren und Anordnung zum Kühlen von elektrischen und elektronischen Bauelementen und Moduleinheiten in Geräteschränken
CN101873781B (zh) * 2010-06-28 2012-01-04 华为技术有限公司 插拔机构、具有该插拔机构的成品板和插框
US10365667B2 (en) 2011-08-11 2019-07-30 Coolit Systems, Inc. Flow-path controllers and related systems
WO2014141162A1 (en) 2013-03-15 2014-09-18 Coolit Systems, Inc. Sensors, multiplexed communication techniques, and related systems
US9107293B2 (en) * 2012-05-11 2015-08-11 Raytheon Company Electronics enclosures with high thermal performance and related system
US9451726B2 (en) * 2012-09-25 2016-09-20 Liquidcool Solutions, Inc. Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices
US9468131B2 (en) 2014-04-16 2016-10-11 Raytheon Company Monolithic multi-module electronics chassis with multi-planar embedded fluid cooling channels
JP6034465B1 (ja) * 2015-10-15 2016-11-30 Ｎｅｃプラットフォームズ株式会社 冷却装置及び冷却システム
WO2017074513A1 (en) 2015-10-30 2017-05-04 Vapor IO Inc. Adapters for rack-mounted computing equipment
EP3312879A1 (de) * 2016-10-20 2018-04-25 Siemens Aktiengesellschaft Kühlvorrichtung zum kühlen von im innern eines geschlossenen gehäuses angeordneten elektrischen und/oder elektronischen betriebsmitteln
US11452243B2 (en) 2017-10-12 2022-09-20 Coolit Systems, Inc. Cooling system, controllers and methods
US11662037B2 (en) 2019-01-18 2023-05-30 Coolit Systems, Inc. Fluid flow control valve for fluid flow systems, and methods
US11473860B2 (en) 2019-04-25 2022-10-18 Coolit Systems, Inc. Cooling module with leak detector and related systems
EP4150216A4 (de) 2020-05-11 2023-11-01 Coolit Systems, Inc. Flüssigkeitspumpeinheiten sowie zugehörige systeme und verfahren
CN212906119U (zh) * 2020-08-10 2021-04-06 北京硅基远航科技有限公司 服务器
US11877428B2 (en) * 2021-04-20 2024-01-16 Dell Products L.P. Modular horizontal rack manifold for liquid cooling

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5091765A (de) * 1973-12-20 1975-07-22
JPS5580399A (en) * 1978-12-13 1980-06-17 Fujitsu Ltd Electronic device cooling structure
DE202004010204U1 (de) * 2004-06-30 2004-09-16 Schroff Gmbh Gehäuse mit modularen elektronischen Baugruppen

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3481393A (en) * 1968-01-15 1969-12-02 Ibm Modular cooling system
US5285347A (en) * 1990-07-02 1994-02-08 Digital Equipment Corporation Hybird cooling system for electronic components
GB9215442D0 (en) * 1992-07-21 1992-09-02 British Aerospace Cooling of electronic components
US5343358A (en) * 1993-04-26 1994-08-30 Ncr Corporation Apparatus for cooling electronic devices
DE4327444A1 (de) * 1993-08-14 1995-02-16 Indramat Gmbh Kühleinrichtung für einen Schaltschrank
US5740018A (en) * 1996-02-29 1998-04-14 The United States Of America As Represented By The Secretary Of The Navy Environmentally controlled circuit pack and cabinet
US5731954A (en) * 1996-08-22 1998-03-24 Cheon; Kioan Cooling system for computer
JP2874684B2 (ja) * 1997-03-27 1999-03-24 日本電気株式会社 プラグインユニットの放熱構造
JPH11163565A (ja) * 1997-11-27 1999-06-18 Ando Electric Co Ltd プリント基板の冷却構造
RU2218591C2 (ru) * 1999-06-02 2003-12-10 Гуангжи ДОНГ Система теплоотвода компьютера
US6234240B1 (en) * 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
US6196003B1 (en) * 1999-11-04 2001-03-06 Pc/Ac, Inc. Computer enclosure cooling unit
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6313990B1 (en) * 2000-05-25 2001-11-06 Kioan Cheon Cooling apparatus for electronic devices
US6407916B1 (en) * 2000-06-12 2002-06-18 Intel Corporation Computer assembly for cooling high powered microprocessors
JP2002098454A (ja) * 2000-07-21 2002-04-05 Mitsubishi Materials Corp 液冷ヒートシンク及びその製造方法
US6506111B2 (en) * 2001-05-16 2003-01-14 Sanmina-Sci Corporation Cooling airflow distribution device
US6657121B2 (en) * 2001-06-27 2003-12-02 Thermal Corp. Thermal management system and method for electronics system
US6536510B2 (en) * 2001-07-10 2003-03-25 Thermal Corp. Thermal bus for cabinets housing high power electronics equipment
US6828675B2 (en) * 2001-09-26 2004-12-07 Modine Manufacturing Company Modular cooling system and thermal bus for high power electronics cabinets
US7024573B2 (en) * 2002-02-05 2006-04-04 Hewlett-Packard Development Company, L.P. Method and apparatus for cooling heat generating components
DE10210480B4 (de) * 2002-03-11 2005-07-21 Rittal Gmbh & Co. Kg Kühlanordnung
US20040008483A1 (en) * 2002-07-13 2004-01-15 Kioan Cheon Water cooling type cooling system for electronic device
US6804117B2 (en) * 2002-08-14 2004-10-12 Thermal Corp. Thermal bus for electronics systems
US6807056B2 (en) * 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
US6798660B2 (en) * 2003-02-13 2004-09-28 Dell Products L.P. Liquid cooling module
JP4199018B2 (ja) * 2003-02-14 2008-12-17 株式会社日立製作所 ラックマウントサーバシステム
US6763880B1 (en) * 2003-06-26 2004-07-20 Evserv Tech Corporation Liquid cooled radiation module for servers
US7013955B2 (en) * 2003-07-28 2006-03-21 Thermal Corp. Flexible loop thermosyphon
US7097047B2 (en) * 2003-09-30 2006-08-29 Dell Products L.P. Cable management flip tray assembly
US7012807B2 (en) * 2003-09-30 2006-03-14 International Business Machines Corporation Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
US7457118B1 (en) * 2003-12-19 2008-11-25 Emc Corporation Method and apparatus for dispersing heat from high-power electronic devices
US7484552B2 (en) * 2003-12-19 2009-02-03 Amphenol Corporation Modular rackmount chiller
DE102004008461A1 (de) * 2004-02-17 2005-10-06 Rittal Gmbh & Co. Kg Gehäuseanordnung
US7011143B2 (en) * 2004-05-04 2006-03-14 International Business Machines Corporation Method and apparatus for cooling electronic components
US7355852B2 (en) * 2004-09-30 2008-04-08 Amphenol Corporation Modular liquid cooling of electronic assemblies
DE102004054337B4 (de) * 2004-11-09 2007-01-11 Rittal Res Electronic Systems Gmbh & Co. Kg Kühlanordnung
US7295436B2 (en) * 2005-12-10 2007-11-13 Kioan Cheon Cooling system for computer components
US7701714B2 (en) * 2006-05-26 2010-04-20 Flextronics Ap, Llc Liquid-air hybrid cooling in electronics equipment
WO2008027931A2 (en) * 2006-08-29 2008-03-06 Isothermal Systems Research, Inc. Manifold for a two-phase cooling system
EP1967938B1 (de) * 2007-01-23 2009-07-29 Schroff GmbH Schaltschrank zur Aufnahme elektronischer Steckbaugruppen mit einem Wärmetauscher
US7450385B1 (en) * 2007-06-15 2008-11-11 International Business Machines Corporation Liquid-based cooling apparatus for an electronics rack

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5091765A (de) * 1973-12-20 1975-07-22
JPS5580399A (en) * 1978-12-13 1980-06-17 Fujitsu Ltd Electronic device cooling structure
DE202004010204U1 (de) * 2004-06-30 2004-09-16 Schroff Gmbh Gehäuse mit modularen elektronischen Baugruppen

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020162367A1 (ja) 2019-02-05 2020-08-13 Ｎｅｃプラットフォームズ株式会社 配管保護装置および冷却装置

Also Published As

Publication number Publication date
US20070256957A1 (en) 2007-11-08
DE502007000198D1 (de) 2008-12-11
EP1853101A1 (de) 2007-11-07
DE202006007275U1 (de) 2006-09-07
RU2364058C2 (ru) 2009-08-10
RU2007116855A (ru) 2008-11-20
EP1853101B1 (de) 2008-10-29

Similar Documents

Publication Publication Date Title
JP2007300107A (ja) 差込サブアセンブリを収容するためのハウジングを備えるサブアセンブリ支持体
US7428151B2 (en) Cooling arrangement
EP2785166B1 (de) Serverrack und seine Servervorrichtung
JP4315946B2 (ja) 冷却アッセンブリ
ES2576479T3 (es) Sistema de ventilador conectable en caliente y aparato de conexión
JP7036416B2 (ja) 装置
US20030026074A1 (en) Externally mounted on-line replaceable fan module
US8879258B1 (en) Liquid cooling system for modular electronic systems
JP5269205B2 (ja) 通信用サブラックモジュール及び通信用サブラック
JP4734299B2 (ja) インバータ装置
JP2011065638A (ja) サーバーキャビネット
JP2012243304A (ja) サーバシャーシ
US9904329B2 (en) Power supply and circuit module for data processing system
CN116113211A (zh) 监护仪
CN112394782A (zh) 服务器和具有其的数据中心
EP2645836A1 (de) Montageanordnung zur rechtwinkligen Montage von Einsteckkarten
KR101018670B1 (ko) 배선 정리를 위한 측면 플레이트가 구비된 컴퓨터 케이스
JP3697442B2 (ja) フェイズドアレイアンテナ装置
JP3944888B2 (ja) 電子機器及びマザーボード
JP2019079851A (ja) 冷却システム、モジュール、装置
JP7048146B2 (ja) 電子機器、電子機器におけるファンユニットの交換方法
JP5347638B2 (ja) サブラック構造体及びラック構造体
KR100594986B1 (ko) 팬 셀프의 케이블 안내장치
JP5294153B2 (ja) 電子機器
KR100699259B1 (ko) 디스플레이 장치

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20091216

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110630

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110713

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111006

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20111206