JP2007299950A - Device and method for inspecting semiconductor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and a method for inspecting a semiconductor capable of decreasing a damage as much as possible on the surface of a bonding pad. <P>SOLUTION: The semiconductor inspecting device of a semiconductor element 40 having a plurality of bonding pads 45 comprises a probe card 10 having a measurement terminal 12 for electrically connecting with the pads 45, a conductive material liquid supply nozzle 14 for supplying the conductive material liquid 50 on the pads 45 or to an end part of the terminal 12, and a measurement controller 20 for electrically connecting the end part of the terminal 12 to the pads 45 through the liquid 50 to inspect the characteristic of the semiconductor element 40. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a semiconductor inspection apparatus and a semiconductor inspection method.

  Conventionally, a method for inspecting a semiconductor device is a temporary electrical connection between an external test device and a semiconductor device by directly pressing the tip of the probe of the inspection device against a bonding pad of the semiconductor device formed on the semiconductor wafer. The electrical characteristic test has been carried out.

  However, since the material of the probe is generally harder than the material of the bonding pad, in the conventional electrical connection method, the surface of the bonding pad is damaged by the pressure applied to the probe. This damage to the bonding pad causes an increase in contact resistance, making it difficult to perform accurate measurements with conventional semiconductor device inspection methods that perform multiple electrical characteristic tests. I was in trouble.

As this type of related technology, an example of an inspection method of a semiconductor device is disclosed (for example, refer to Patent Document 1).
JP 2003-68807 A

  An object of the present invention is to provide a semiconductor inspection apparatus and a semiconductor inspection method capable of reducing damage to the surface of a bonding pad as much as possible.

  A semiconductor inspection apparatus according to one embodiment of the present invention is a semiconductor inspection apparatus for a semiconductor element having a plurality of electrodes, and includes a probe card having a measurement terminal that is electrically connected to the electrode, and the measurement terminal end on the electrode Conductor liquid supply means for supplying a conductor liquid to the part, and electrically connecting the measurement terminal end to the electrode via the conductor liquid, and controlling the measurement terminal, thereby performing a characteristic inspection of the semiconductor element. And a semiconductor inspection means for performing.

  According to another aspect of the present invention, there is provided a semiconductor inspection method comprising: supplying a conductive liquid on an electrode of a semiconductor element or to a measurement terminal end; and electrically connecting the electrode to the measurement terminal end via the conductive liquid. A step of connecting, a step of inspecting characteristics of the semiconductor element in a state in which the end portion of the measurement terminal is in contact with the conductor liquid, and a step of removing the conductor liquid from the electrode. Yes.

  According to the present invention, damage to the surface of the bonding pad can be reduced as much as possible.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a sectional view schematically showing a semiconductor inspection apparatus according to Embodiment 1 of the present invention. FIG. 2 is a perspective view schematically showing the semiconductor inspection apparatus according to the first embodiment of the present invention.

  As shown in FIG. 1, the semiconductor inspection apparatus according to the first embodiment of the present invention includes a probe card 10, a measurement controller 20, and a conductor liquid supply apparatus 30.

  The probe card 10 is connected to the measurement controller 20 and the conductor liquid supply device 30, respectively, and is electrically connected to the bonding pad 45 of the semiconductor element 40. Here, the bonding pads 45 of the semiconductor element 40 of FIG. 1 have a plurality of bonding pads 45 in one semiconductor element 40, and a plurality of semiconductor elements 40 are formed in a semiconductor wafer. The semiconductor element 40 and the bonding pad 45 in FIG. 1 represent a part of the semiconductor wafer.

  The measurement controller 20 supplies the probe card 10 electrically connected to the bonding pad 45 of the semiconductor element 40 to supply current and voltage necessary for the electrical characteristic test, and performs the electrical characteristic test of the semiconductor element 40.

  The conductor supply device 30 supplies the conductor liquid 50 to the probe card 10, and supplies the conductor liquid 50 from the probe card 10 onto the bonding pad 45 of the semiconductor element 40. Therefore, the probe card 10 and the semiconductor element 40 can be electrically connected via the conductor liquid 50 without directly contacting the bonding pad 45 with a probe needle or the like used conventionally.

  The probe card 10 also includes a measurement terminal 12 connected to the measurement controller 20 and a conductor liquid supply nozzle 14 connected to the conductor liquid supply device 30. The measurement terminal 12 and the conductor liquid supply nozzle 14 are provided at positions adjacent to each other, and are provided at positions corresponding to the bonding pads 45 of the semiconductor element 40 as shown in FIG. The measurement terminal 12 is supplied with a control signal such as a current / voltage for performing an electrical characteristic test of the semiconductor element 40 from the measurement controller 20 to the bonding pad 45 of the semiconductor element 40. The conductor liquid supply nozzle 14 is supplied with the conductor liquid 50 from the conductor liquid supply device 30 and supplies the conductor liquid 50 onto the bonding pads 45 of the semiconductor element 40. Therefore, the probe card 10 and the semiconductor element 40 can be electrically connected via the conductor liquid 50 without directly contacting the bonding pad 45 with a probe needle or the like conventionally used.

  Here, in FIG. 1, the measurement terminal 12 has a flat surface to be brought into contact with the conductor liquid 50, but in order to improve electrical contact with the conductor liquid 50, from the device surface side of the probe card 10. It may be a protruding shape. As the conductor liquid supply nozzle 14, for example, a spoid type or ink jet type nozzle can be used to supply the conductor liquid 50 onto the bonding pad 45 of the semiconductor element 40 at a predetermined timing. Further, the supply of the conductive liquid 50 may be controlled by the conductive liquid supply apparatus 30 or may be controlled by the conductive liquid supply nozzle 14. Further, the conductor liquid 50 is preferably one having a small electric resistance and a small change in electric resistance due to a temperature change. Moreover, the measurement terminal 12 and the conductor liquid supply nozzle 14 may be integrated. That is, the measurement terminal 12 may be provided in the conductor liquid nozzle 14, or the conductor liquid noise 14 may be provided in the measurement terminal 12. Furthermore, you may use the pipe | tube itself of the conductor liquid nozzle 14 for a measurement terminal.

  Next, a semiconductor element inspection method using the semiconductor inspection apparatus constructed as described above will be described with reference to FIG. FIG. 3 is a flowchart showing a semiconductor element inspection method using the semiconductor inspection apparatus according to the first embodiment of the present invention.

  As shown in FIG. 3, the probe card 10 is moved onto a predetermined semiconductor element 40 (S101). At this time, the probe card 10 is moved so that the bonding pad 45 of the semiconductor element 40 faces the measurement terminal 12 of the probe card 10 and the conductor liquid supply nozzle 14. When the conductive liquid 50 is supplied from the conductive liquid supply nozzle 14, the conductive liquid 50 is brought close to the bonding pad 45 and the measurement terminal 12.

  Next, the conductor liquid 50 is supplied from the conductor liquid supply device 30 to the conductor liquid supply nozzle 14 of the probe card 10, and the conductor liquid 50 is supplied onto the bonding pad 45 (S102). Thereby, the measurement terminal 12 of the probe card 10 is electrically connected to the bonding pad 45 through the conductor liquid 50. That is, the measurement terminal 12 is electrically connected without contacting the bonding pad 45.

  Next, an electrical measurement test of the semiconductor element 40 is performed using the measurement controller 20 (S103). At this time, the electrical measurement test can be performed under various temperature conditions while cooling or heating the semiconductor wafer by using a cooling device or a heater.

  Next, when the electrical characteristic test of the predetermined semiconductor element 40 is completed, it is confirmed whether or not the electrical characteristic test of the semiconductor element 40 on the semiconductor wafer is completed (S104).

  At this time, if there is a semiconductor element 40 on the semiconductor wafer that has not yet been subjected to the electrical characteristic test, the electrical characteristic test of the semiconductor element 40 is performed, and the steps from step S101 to step S104 are repeated.

  When the electrical characteristic test of the semiconductor elements 40 on all the semiconductor wafers is completed, the conductor liquid 50 supplied onto the bonding pads 45 of all the semiconductor elements 40 is removed (S105).

  Thus, the inspection of the semiconductor element 40 of the series of semiconductor inspection apparatuses is completed.

  Here, as a method for inspecting the semiconductor element 40 of the semiconductor inspection apparatus according to the first embodiment of the present invention, the measurement terminal 12 of the probe card 10 is brought close to the bonding pad 45 of the semiconductor element 40 and placed on the bonding pad 45 of the semiconductor element 40. The conductor liquid 50 is supplied and the semiconductor element 40 and the probe card 10 are electrically connected. In addition, after supplying the conductor liquid 50 to the tip of the measurement terminal 12, the probe card 10 is connected to the semiconductor element 40. Alternatively, the semiconductor element 40 and the probe card 10 may be electrically connected via the conductor liquid 50.

  As described above, since the semiconductor inspection apparatus according to the present invention can perform an electrical characteristic test without bringing the measurement terminal of the probe card into contact with the bonding pad, damage to the surface of the bonding pad can be reduced as much as possible. And since the rise in measurement resistance accompanying damage to the bonding pad surface can be reduced, the restriction on the number of times of electrical characteristic test can be eliminated.

  FIG. 4 is a sectional view schematically showing a semiconductor inspection apparatus according to Embodiment 2 of the present invention. FIG. 5 is a perspective view showing a part of a semiconductor inspection apparatus according to Embodiment 2 of the present invention.

  The difference between the present embodiment and the first embodiment is that in the first embodiment, as shown in FIG. 1, a conductor liquid supply nozzle 14 is provided at a position adjacent to the measurement terminal 12 of the probe card 10. Although the conductor liquid supply nozzle 14 is provided for each terminal 12, in this embodiment, as shown in FIG. 4, as shown in FIG. A body fluid supply nozzle 14 is provided. In addition, about the structure same as the other Example 1, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  Further, as shown in FIG. 5, the conductor liquid supply nozzle 14 is arranged at the end of the probe card 10 or in an independent form so as to correspond to the position where the measurement terminal 12 of the probe card 10 is provided. It is arranged in a row in the depth direction. Here, the conductor liquid supply nozzles 14 are not limited to one row, and may have a plurality of rows. Further, the measurement terminal 12 of the probe card 10 is provided so as to correspond to a place where the bonding pad 45 of the semiconductor element 40 is present.

  The difference from the first embodiment of the method for inspecting the semiconductor element 40 is that after performing Step S101, the conductor liquid 50 is supplied to the bonding pads 45 of the semiconductor element 40 one by one or plural columns in Step S102. At this time, the conductor liquid 50 is not supplied to a place where the bonding pad 45 is not present, such as the central portion of the semiconductor element 40, and the conductor liquid 50 is selectively supplied to the place where the bonding pad 45 is located. The supply device 30 or the conductor liquid supply nozzle 14 is controlled.

  Subsequent steps S103 to S105 are the same as those in the first embodiment, and a description thereof will be omitted.

  Since the semiconductor inspection apparatus of the present embodiment configured as described above can perform an electrical characteristic test without bringing the measurement terminal of the probe card into contact with the bonding pad, similarly to the first embodiment, the surface of the bonding pad can be damaged. Can be reduced as much as possible. And since the rise in measurement resistance accompanying damage to the bonding pad surface can be reduced, the restriction on the number of times of electrical characteristic test can be eliminated.

  Further, in the semiconductor inspection apparatus of this embodiment, the conductor liquid supply nozzle is provided at the end of the probe card that is not adjacent to the measurement terminal of the probe card or so as to be independent, so the number of conductor liquid supply nozzles is reduced. The manufacturing cost of the semiconductor inspection apparatus can be reduced. Further, by providing the conductor liquid supply nozzle independently from the probe card, it is possible to easily realize the semiconductor inspection apparatus of this embodiment simply by adding the conductor liquid supply mechanism to the current probe card.

  FIG. 6 is a perspective view schematically showing a semiconductor inspection apparatus according to Embodiment 3 of the present invention.

  The difference between the present embodiment and the first embodiment is that, in the first embodiment, the positions of the measurement terminals 12 and the conductor liquid supply nozzles 14 of the probe card 10 correspond to the positions of the bonding pads of the semiconductor element 40 as shown in FIG. In this embodiment, as shown in FIG. 6, a large number of measurement terminals 12 and conductor liquid supply nozzles 14 of the probe card 10 are provided in a grid pattern at a predetermined pitch, for example. . In addition, about the structure same as the other Example 1, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  Specifically, in this embodiment, as shown in FIG. 6, the measurement terminals 12 and the conductor liquid supply nozzles 14 of the probe card 10 are arranged in a grid pattern at the same interval as the pitch of the bonding pads 45 of the semiconductor element, The number of measurement terminals 12 and conductor liquid supply nozzles 14 is larger than the number of bonding pads 45 of the semiconductor element 40.

  Therefore, in the method for inspecting the semiconductor element 40 shown in FIG. 3, the supply of the conductor liquid 50 onto the bonding pad 45 of the semiconductor element 40 (S102) is such that the conductor liquid 50 is supplied only to the position where the bonding pad 45 is located. In addition, the conductor liquid supply device 30 or the conductor liquid supply nozzle 14 is controlled.

  Further, as described above, since the measurement terminals 12 and the conductor liquid supply nozzles 14 are arranged in a grid pattern at a predetermined pitch, for example, bonding that is twice as wide as the pits of the measurement terminals 12 and the conductor liquid supply nozzles 14 is performed. When the semiconductor element 40 having the pitch of the pad 45 is inspected, the inspection can be performed using the semiconductor inspection apparatus of this embodiment as it is. In other words, the conductive liquid 50 is supplied from the conductive liquid supply nozzle 14 corresponding to the position of the bonding pad 45 and is electrically connected to the measurement terminal 12, so that the electrical characteristic test is performed even on the semiconductor element 40 having a wide pitch. Can do.

  Here, although the pitch of the measurement terminal 12 and the conductor liquid supply nozzle 14 is described as the same pitch as the bonding pad 45 of the semiconductor element 40, the pitch width of the measurement terminal 12 and the conductor liquid supply nozzle 14 should be as narrow as possible. It is also possible to have a pitch width that is 1 / n times (n: integer) the pitch width of the bonding pads 45 of a certain semiconductor element 40. Further, the positions of the measurement terminal 12 and the conductor liquid supply nozzle 14 are not necessarily limited to a lattice shape.

  As described above, since the semiconductor inspection apparatus shown in the present embodiment can perform the electrical characteristic test without bringing the measurement terminal of the probe card into contact with the bonding pad, as in the first embodiment, the surface damage of the bonding pad can be reduced as much as possible. Can do. And since the rise in measurement resistance accompanying damage to the bonding pad surface can be reduced, the restriction on the number of times of electrical characteristic test can be eliminated.

  In addition, by arranging a large number of measurement terminals and conductor liquid supply nozzles of the probe card in a grid pattern at predetermined intervals, it is possible to test electrical characteristics of semiconductor elements having various pitches. Therefore, it is not necessary to prepare a probe card that has been necessary for each semiconductor element so far, and the inspection cost of the semiconductor element can be reduced.

  FIG. 7 is a perspective view schematically showing a semiconductor inspection apparatus according to Embodiment 4 of the present invention.

  The difference between the present embodiment and the second embodiment is that, in the second embodiment, the positions of the measurement terminals 12 and the conductor liquid supply nozzles 14 of the probe card 10 correspond to the positions of the bonding pads of the semiconductor element 40 as shown in FIG. In this embodiment, as shown in FIG. 7, a number of measurement terminals 12 of the probe card 10 are provided in a grid pattern at a predetermined pitch, for example, and the conductor liquid supply nozzle 14 is measured. One or more rows are provided in the depth direction in the figure at the same pitch as the terminals 12. In addition, about the structure same as another Example, the same code | symbol is attached | subjected and description is abbreviate | omitted.

  The arrangement of the measurement terminal 12 and the conductor liquid supply nozzle 14 of the probe card 10 and the semiconductor inspection method of the present embodiment are the same as those in the above embodiments, and thus the description thereof is omitted.

  As described above, since the semiconductor inspection apparatus shown in the present embodiment can perform the electrical characteristic test without bringing the measurement terminal of the probe card into contact with the bonding pad, as in the first embodiment, the surface damage of the bonding pad can be reduced as much as possible. Can do. And since the rise in measurement resistance accompanying damage to the bonding pad surface can be reduced, the restriction on the number of times of electrical characteristic test can be eliminated.

  Further, in the semiconductor inspection apparatus of this embodiment, the conductor liquid supply nozzle is provided at the end of the probe card that is not adjacent to the measurement terminal of the probe card or so as to be independent, so the number of conductor liquid supply nozzles is reduced. The manufacturing cost of the semiconductor inspection apparatus can be reduced. Further, by providing the conductor liquid supply nozzle in a form independent of the probe card, the semiconductor inspection apparatus of this embodiment can be easily realized simply by adding the conductor liquid supply mechanism to the current probe card.

  In addition, by arranging a large number of measurement terminals and conductor liquid supply nozzles of the probe card in a grid pattern at predetermined intervals, it is possible to test electrical characteristics of semiconductor elements having various pitches. Therefore, it is not necessary to prepare a probe card that has been necessary for each semiconductor element so far, and the inspection cost of the semiconductor element can be reduced.

  Note that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

1 is a cross-sectional view schematically showing a semiconductor inspection apparatus according to Embodiment 1 of the present invention. 1 is a perspective view schematically showing a semiconductor inspection apparatus according to Embodiment 1 of the present invention. 1 is a flowchart showing a semiconductor element inspection method using the semiconductor inspection apparatus according to Embodiment 1 of the present invention. Sectional drawing which showed roughly the semiconductor inspection apparatus which concerns on Example 2 of this invention. The perspective view which showed roughly the semiconductor inspection apparatus which concerns on Example 2 of this invention. The perspective view which showed roughly the semiconductor inspection apparatus which concerns on Example 3 of this invention. The perspective view which showed roughly the semiconductor inspection apparatus which concerns on Example 4 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Probe card 12 Measurement terminal 14 Conductor liquid supply nozzle 20 Measurement controller 30 Conductor liquid supply apparatus 40 Semiconductor element 45 Bonding pad 50 Conductor liquid

Claims (5)

A semiconductor inspection apparatus for a semiconductor element having a plurality of electrodes,
A probe card having a measurement terminal for electrical connection with the electrode;
A conductor liquid supply means for supplying a conductor liquid on the electrode or the measurement terminal end;
Semiconductor inspection means for electrically connecting the end of the measurement terminal to the electrode via the conductor liquid, and performing characteristic inspection of the semiconductor element using the measurement terminal;
A semiconductor inspection apparatus comprising: The conductor liquid supply means has a conductor supply nozzle for supplying the conductor liquid on the electrode or the measurement terminal end,
The semiconductor inspection apparatus according to claim 1, wherein the conductor supply nozzle is provided adjacent to the measurement terminal. The pitch width of the measurement terminals is 1 / n times (n: integer) the pitch width between the electrodes, and the measurement terminals are arranged in a lattice pattern, which is larger than the number of electrodes. The semiconductor inspection apparatus according to claim 1 or 2. The conductor liquid supply means supplies the conductor liquid to the measurement terminal end disposed on the electrode or at a position corresponding to the electrode, and the semiconductor inspection means is the measurement electrically connected to the electrode. 4. The semiconductor inspection apparatus according to claim 3, wherein a characteristic inspection of the semiconductor element is performed using a terminal. Supplying a conductive liquid on the electrode of the semiconductor element or the measurement terminal end; and
Electrically connecting the electrode to the end of the measurement terminal via the conductor liquid;
Inspecting the characteristics of the semiconductor element in a state where the end of the measurement terminal is in contact with the conductor liquid;
Removing the conductive liquid from the electrode;
A semiconductor inspection method comprising:

Images