JP2007294910A5 - - Google Patents

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Publication number
JP2007294910A5
JP2007294910A5 JP2007073788A JP2007073788A JP2007294910A5 JP 2007294910 A5 JP2007294910 A5 JP 2007294910A5 JP 2007073788 A JP2007073788 A JP 2007073788A JP 2007073788 A JP2007073788 A JP 2007073788A JP 2007294910 A5 JP2007294910 A5 JP 2007294910A5
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JP
Japan
Prior art keywords
layer
insulating layer
semiconductor
floating gate
formation region
Prior art date
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Application number
JP2007073788A
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English (en)
Japanese (ja)
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JP5483659B2 (ja
JP2007294910A (ja
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Publication date
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Priority to JP2007073788A priority Critical patent/JP5483659B2/ja
Priority claimed from JP2007073788A external-priority patent/JP5483659B2/ja
Publication of JP2007294910A publication Critical patent/JP2007294910A/ja
Publication of JP2007294910A5 publication Critical patent/JP2007294910A5/ja
Application granted granted Critical
Publication of JP5483659B2 publication Critical patent/JP5483659B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007073788A 2006-03-31 2007-03-21 半導体装置 Expired - Fee Related JP5483659B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007073788A JP5483659B2 (ja) 2006-03-31 2007-03-21 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006100367 2006-03-31
JP2006100367 2006-03-31
JP2007073788A JP5483659B2 (ja) 2006-03-31 2007-03-21 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013156967A Division JP2014013901A (ja) 2006-03-31 2013-07-29 半導体装置

Publications (3)

Publication Number Publication Date
JP2007294910A JP2007294910A (ja) 2007-11-08
JP2007294910A5 true JP2007294910A5 (https=) 2010-04-22
JP5483659B2 JP5483659B2 (ja) 2014-05-07

Family

ID=38765163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007073788A Expired - Fee Related JP5483659B2 (ja) 2006-03-31 2007-03-21 半導体装置

Country Status (1)

Country Link
JP (1) JP5483659B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020150227A (ja) 2019-03-15 2020-09-17 キオクシア株式会社 半導体装置およびその製造方法
CN115910798A (zh) * 2022-12-09 2023-04-04 华中科技大学 一种边缘接触的高速浮栅存储器及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2656986B2 (ja) * 1989-10-02 1997-09-24 松下電子工業株式会社 不揮発性半導体記憶装置の製造方法
JPH03153085A (ja) * 1989-11-10 1991-07-01 Fujitsu Ltd 半導体記憶装置及びその製造方法
JP3737276B2 (ja) * 1997-04-25 2006-01-18 富士通株式会社 半導体記憶装置
JP2001101368A (ja) * 1999-10-01 2001-04-13 Tokin Corp 集積半導体装置
JP4530464B2 (ja) * 2000-03-09 2010-08-25 ルネサスエレクトロニクス株式会社 半導体集積回路
JP3984020B2 (ja) * 2000-10-30 2007-09-26 株式会社東芝 不揮発性半導体記憶装置
JP3594550B2 (ja) * 2000-11-27 2004-12-02 シャープ株式会社 半導体装置の製造方法
JP2002198446A (ja) * 2000-12-27 2002-07-12 Fujitsu Ltd 半導体記憶装置とその製造方法
JP4472934B2 (ja) * 2002-03-27 2010-06-02 イノテック株式会社 半導体装置および半導体メモリ
US20050095786A1 (en) * 2003-11-03 2005-05-05 Ting-Chang Chang Non-volatile memory and method of manufacturing floating gate
JP4896416B2 (ja) * 2004-03-08 2012-03-14 株式会社半導体エネルギー研究所 半導体装置の作製方法

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