JP2007288089A5 - - Google Patents

Download PDF

Info

Publication number
JP2007288089A5
JP2007288089A5 JP2006116473A JP2006116473A JP2007288089A5 JP 2007288089 A5 JP2007288089 A5 JP 2007288089A5 JP 2006116473 A JP2006116473 A JP 2006116473A JP 2006116473 A JP2006116473 A JP 2006116473A JP 2007288089 A5 JP2007288089 A5 JP 2007288089A5
Authority
JP
Japan
Prior art keywords
optical element
semiconductor substrate
semiconductor layer
active region
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006116473A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007288089A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006116473A priority Critical patent/JP2007288089A/ja
Priority claimed from JP2006116473A external-priority patent/JP2007288089A/ja
Priority to US11/785,926 priority patent/US20070249109A1/en
Publication of JP2007288089A publication Critical patent/JP2007288089A/ja
Publication of JP2007288089A5 publication Critical patent/JP2007288089A5/ja
Pending legal-status Critical Current

Links

JP2006116473A 2006-04-20 2006-04-20 光素子および光モジュール Pending JP2007288089A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006116473A JP2007288089A (ja) 2006-04-20 2006-04-20 光素子および光モジュール
US11/785,926 US20070249109A1 (en) 2006-04-20 2007-04-20 Optical device and optical module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006116473A JP2007288089A (ja) 2006-04-20 2006-04-20 光素子および光モジュール

Publications (2)

Publication Number Publication Date
JP2007288089A JP2007288089A (ja) 2007-11-01
JP2007288089A5 true JP2007288089A5 (enExample) 2009-03-12

Family

ID=38619973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006116473A Pending JP2007288089A (ja) 2006-04-20 2006-04-20 光素子および光モジュール

Country Status (2)

Country Link
US (1) US20070249109A1 (enExample)
JP (1) JP2007288089A (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112009003719T5 (de) * 2008-12-10 2012-08-16 Furukawa Electric Co., Ltd., Halbleiterlaserelement und herstellungsverfahren dafür
US7949024B2 (en) * 2009-02-17 2011-05-24 Trilumina Corporation Multibeam arrays of optoelectronic devices for high frequency operation
JP2010267647A (ja) * 2009-05-12 2010-11-25 Opnext Japan Inc 半導体装置
JP5515767B2 (ja) * 2009-05-28 2014-06-11 株式会社リコー 面発光レーザ素子の製造方法、面発光レーザ素子、面発光レーザアレイ、光走査装置及び画像形成装置
JP2011233783A (ja) * 2010-04-28 2011-11-17 Mitsubishi Heavy Ind Ltd 半導体発光素子、半導体発光素子の保護膜及びその作製方法
JP5982711B2 (ja) * 2011-04-28 2016-08-31 住友電工デバイス・イノベーション株式会社 半導体受光装置
US10622302B2 (en) 2018-02-14 2020-04-14 Taiwan Semiconductor Manufacturing Company, Ltd. Via for semiconductor device connection and methods of forming the same
DE102018126130B4 (de) 2018-06-08 2023-08-10 Taiwan Semiconductor Manufacturing Co., Ltd. Halbleitervorrichtung und -verfahren
US10992100B2 (en) * 2018-07-06 2021-04-27 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and method
JP7434710B2 (ja) * 2019-02-07 2024-02-21 富士フイルムビジネスイノベーション株式会社 光半導体素子、光半導体装置、光伝送システム、および光半導体装置の製造方法
US11441484B2 (en) * 2019-03-20 2022-09-13 Seoul Viosys Co., Ltd. Vertical-cavity surface-emitting laser device
GB2590350B (en) * 2019-11-06 2024-08-07 Integrated Compound Semiconductors Ltd High reliability MESA photodiode
JP2022149786A (ja) * 2021-03-25 2022-10-07 聯嘉光電股▲ふん▼有限公司 テスト可能で側壁を保護する金属層を備える垂直型発光ダイオード構造
JP2024106499A (ja) * 2023-01-27 2024-08-08 ウシオ電機株式会社 赤外led素子
US20240332900A1 (en) * 2023-03-27 2024-10-03 Ii-Vi Delaware, Inc. Bottom surface emitting vertical cavity surface emitting laser

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62104178A (ja) * 1985-10-31 1987-05-14 Fujitsu Ltd Pinホトダイオ−ド
JP4220688B2 (ja) * 2001-02-26 2009-02-04 日本オプネクスト株式会社 アバランシェホトダイオード
EP2290715B1 (en) * 2002-08-01 2019-01-23 Nichia Corporation Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same
JP4109159B2 (ja) * 2003-06-13 2008-07-02 浜松ホトニクス株式会社 半導体受光素子
JP4318981B2 (ja) * 2003-07-29 2009-08-26 三菱電機株式会社 導波路型受光素子
JP2005108983A (ja) * 2003-09-29 2005-04-21 Victor Co Of Japan Ltd 面発光レーザ素子
JP4837295B2 (ja) * 2005-03-02 2011-12-14 株式会社沖データ 半導体装置、led装置、ledヘッド、及び画像形成装置

Similar Documents

Publication Publication Date Title
CN109300919B (zh) Micro LED显示基板及其制作方法、显示装置
JP6619159B2 (ja) グラフェン及び量子点を含む電子素子
US7625769B2 (en) Electroluminescent device and fabrication method thereof
EP2107653A3 (en) Surface Emitting Laser Element Array
US7411221B2 (en) Light emitting device having protection element and method of manufacturing the light emitting device
EP2081075A4 (en) OPTICAL SEMICONDUCTOR MODULATOR
WO2009044698A1 (ja) 半導体発光素子および半導体発光素子の製造方法
US20130264603A1 (en) Surface-mounting led chip
JP2009157367A5 (enExample)
US9203003B2 (en) Light-emitting diode device
KR100875128B1 (ko) 고내정전압을 갖는 발광다이오드 및 그의 제조방법
EP2343744A3 (en) Light emitting diode with patterned electrodes
WO2006098545A3 (en) Light emitting device having a plurality of light emitting cells and package mounting the same
EP2362455A3 (en) Light emitting device, method of manufacturing the same, light emitting device package, and illumination system
US9966332B2 (en) Solid-state device including a conductive bump connected to a metal pattern and method of manufacturing the same
US7740376B2 (en) Flexible light emitting module
JP2009010248A5 (enExample)
CN110797331A (zh) 微发光二极管构造体及其制造方法
JP2011018837A5 (enExample)
JP2011091139A5 (enExample)
JP2010092935A5 (enExample)
JP2008227476A5 (enExample)
KR101628029B1 (ko) 발광 다이오드를 포함하는 소자 및 그 제조방법
JP2017054942A5 (enExample)
WO2007073601A8 (en) Pixel structure for a solid state light emitting device