JP2007280983A - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP2007280983A
JP2007280983A JP2006101527A JP2006101527A JP2007280983A JP 2007280983 A JP2007280983 A JP 2007280983A JP 2006101527 A JP2006101527 A JP 2006101527A JP 2006101527 A JP2006101527 A JP 2006101527A JP 2007280983 A JP2007280983 A JP 2007280983A
Authority
JP
Japan
Prior art keywords
light emitting
package
light
emitting element
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006101527A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007280983A5 (enrdf_load_stackoverflow
Inventor
Naofumi Sumiya
直文 炭谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Chemical Industries Ltd
Original Assignee
Nichia Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Chemical Industries Ltd filed Critical Nichia Chemical Industries Ltd
Priority to JP2006101527A priority Critical patent/JP2007280983A/ja
Publication of JP2007280983A publication Critical patent/JP2007280983A/ja
Publication of JP2007280983A5 publication Critical patent/JP2007280983A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2006101527A 2006-04-03 2006-04-03 発光装置 Pending JP2007280983A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006101527A JP2007280983A (ja) 2006-04-03 2006-04-03 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006101527A JP2007280983A (ja) 2006-04-03 2006-04-03 発光装置

Publications (2)

Publication Number Publication Date
JP2007280983A true JP2007280983A (ja) 2007-10-25
JP2007280983A5 JP2007280983A5 (enrdf_load_stackoverflow) 2009-04-30

Family

ID=38682166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006101527A Pending JP2007280983A (ja) 2006-04-03 2006-04-03 発光装置

Country Status (1)

Country Link
JP (1) JP2007280983A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129883A (ja) * 2008-11-28 2010-06-10 Sharp Corp 発光装置
WO2011136250A1 (ja) * 2010-04-27 2011-11-03 ローム株式会社 Ｌｅｄモジュール
WO2012169717A1 (en) * 2011-06-08 2012-12-13 Seoul Semiconductor Co., Ltd. Light emitting diode package
US8399902B2 (en) 2009-08-05 2013-03-19 Sharp Kabushiki Kaisha Light emitting device and method of manufacturing light emitting device
US8431952B2 (en) 2010-08-27 2013-04-30 Sharp Kabushiki Kaisha Light emitting device
US8803182B2 (en) 2009-02-24 2014-08-12 Nichia Corporation Light emitting device comprising protective element and base
KR101861230B1 (ko) 2011-08-05 2018-05-28 서울반도체 주식회사 발광 다이오드 패키지 및 이를 포함하는 백라이트 유닛

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0259399A (ja) * 1988-08-25 1990-02-28 Hitachi Maxell Ltd Ｉｃカード用の半導体装置
JPH10144965A (ja) * 1996-11-11 1998-05-29 Hamamatsu Photonics Kk 光半導体装置及びその製造方法
JPH11298041A (ja) * 1998-04-15 1999-10-29 Toyoda Gosei Co Ltd ３族窒化物半導体発光素子及び光源装置
JP2001223305A (ja) * 2000-02-10 2001-08-17 Matsushita Electric Ind Co Ltd 樹脂封止半導体装置
JP2002314146A (ja) * 2001-04-12 2002-10-25 Toyoda Gosei Co Ltd Ｌｅｄランプ
JP2005183882A (ja) * 2003-12-24 2005-07-07 Sharp Corp 光結合器およびそれを用いた電子機器
JP2005294736A (ja) * 2004-04-05 2005-10-20 Stanley Electric Co Ltd 半導体発光装置の製造方法
JP2006332618A (ja) * 2005-04-25 2006-12-07 Naoya Yanase 電子部品実装基板、及びその電子部品実装基板の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0259399A (ja) * 1988-08-25 1990-02-28 Hitachi Maxell Ltd Ｉｃカード用の半導体装置
JPH10144965A (ja) * 1996-11-11 1998-05-29 Hamamatsu Photonics Kk 光半導体装置及びその製造方法
JPH11298041A (ja) * 1998-04-15 1999-10-29 Toyoda Gosei Co Ltd ３族窒化物半導体発光素子及び光源装置
JP2001223305A (ja) * 2000-02-10 2001-08-17 Matsushita Electric Ind Co Ltd 樹脂封止半導体装置
JP2002314146A (ja) * 2001-04-12 2002-10-25 Toyoda Gosei Co Ltd Ｌｅｄランプ
JP2005183882A (ja) * 2003-12-24 2005-07-07 Sharp Corp 光結合器およびそれを用いた電子機器
JP2005294736A (ja) * 2004-04-05 2005-10-20 Stanley Electric Co Ltd 半導体発光装置の製造方法
JP2006332618A (ja) * 2005-04-25 2006-12-07 Naoya Yanase 電子部品実装基板、及びその電子部品実装基板の製造方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010129883A (ja) * 2008-11-28 2010-06-10 Sharp Corp 発光装置
US8476657B2 (en) 2008-11-28 2013-07-02 Sharp Kabushiki Kaisha Light-emitting device
US8803182B2 (en) 2009-02-24 2014-08-12 Nichia Corporation Light emitting device comprising protective element and base
US8399902B2 (en) 2009-08-05 2013-03-19 Sharp Kabushiki Kaisha Light emitting device and method of manufacturing light emitting device
US9613937B2 (en) 2010-04-27 2017-04-04 Rohm Co., Ltd. LED module
WO2011136250A1 (ja) * 2010-04-27 2011-11-03 ローム株式会社 Ｌｅｄモジュール
JP2011233671A (ja) * 2010-04-27 2011-11-17 Rohm Co Ltd Ｌｅｄモジュール
US10586906B2 (en) 2010-04-27 2020-03-10 Rohm Co., Ltd. LED module
CN102859730A (zh) * 2010-04-27 2013-01-02 罗姆股份有限公司 Led模块
US9093294B2 (en) 2010-04-27 2015-07-28 Rohm Co., Ltd. LED module
US10333040B2 (en) 2010-04-27 2019-06-25 Rohm Co., Ltd. LED module
US8431952B2 (en) 2010-08-27 2013-04-30 Sharp Kabushiki Kaisha Light emitting device
US9287477B2 (en) 2011-06-08 2016-03-15 Seoul Semiconductor Co., Ltd. Light emitting diode package
WO2012169717A1 (en) * 2011-06-08 2012-12-13 Seoul Semiconductor Co., Ltd. Light emitting diode package
KR101861230B1 (ko) 2011-08-05 2018-05-28 서울반도체 주식회사 발광 다이오드 패키지 및 이를 포함하는 백라이트 유닛

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