JP2007250825A - Connection structure of substrate and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection structure of a substrate capable of surely separating conductive particles between connection terminals even if an anisotropic conductive adhesive is applied entirely to a terminal part, and to provide its manufacturing method. <P>SOLUTION: The connection structure of a substrate makes a plurality of connection terminals 11 of a first substrate 10 face a plurality of connection terminals 21 of a second substrate 20, and electrically connects the first and second substrates 10 and 20 via an adhesive 30 containing conductive particles 31. The structure is equipped with protruding insulation members 40 having peaks 40a continuously formed between the plurality of connection terminals 21 of the second substrate 20. The members 40 are placed to correspond to between the plurality of opposite connection terminals 11 of the first substrate 10. The conductive particles 31 of the adhesive 30 are separated by the peaks 40a of the member 40 between the connection terminals in the direction of substrate planes of the first and second substrates 10 and 20. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  In the present invention, when connection terminals formed on two substrates are opposed to each other and electrically connected via an adhesive containing conductive particles, a short circuit occurs between the connection terminals in the substrate surface direction of the substrate. The present invention relates to a substrate connection structure and a method for manufacturing the same.

  In general, an electro-optical device such as a liquid crystal device or an EL device forms a panel structure such as a liquid crystal panel or an EL panel by arranging an electro-optical material such as liquid crystal or EL between substrates, and further, with respect to the panel structure. Mount drive ICs and necessary electronic components. Further, after mounting a driving IC or the like, a flexible substrate for connecting an electronic component such as a power circuit component or an LED circuit component to the liquid crystal panel is also connected.

  For example, of a pair of substrates constituting a liquid crystal device, an element substrate on which a switch element is mounted has a connection terminal formed at the end of the substrate, and a polyimide film or the like is used as a base film for the connection terminal. The wiring of the substrate or the IC pad is electrically connected using an adhesive containing conductive particles such as ACF (anisotropic conductive film).

  As a conventional substrate connection structure, for example, in Patent Document 1, regarding a connection between a flexible substrate and a rigid substrate using an anisotropic conductive adhesive, a flexible substrate facing a convex insulator provided between connection terminals of a rigid substrate is provided. A printed wiring board connection structure is disclosed in which a flexible printed circuit board connection terminal and a rigid circuit board connection terminal are electrically connected by being inserted into through holes provided between the connection terminals and heated and pressurized with an anisotropic conductive adhesive. Has been.

In Patent Document 2, a convex portion thicker than the thickness of the lead is provided between the leads of a TAB type semiconductor device or a flexible tape, and the lead that is the concave portion and the pattern of the other substrate are connected by various bonding materials. After connection, leads such as TAB type semiconductor device and flexible tape are inserted into the pattern provided on the other substrate to prevent misalignment between the leads such as flexible tape and the pattern provided on the substrate Later, it is described that the conductive particles contained in the anisotropic conductive adhesive are dispersed between the leads to prevent electrical short-circuiting between the leads.
JP 2001-24300 A JP-A-5-74850

  However, Patent Document 1 discloses that the shape of the convex insulator provided between the connection terminals is a rectangular body, a truncated pyramid, a trapezoidal body, or a stepped shape thereof. Since the conductive particles in the anisotropic conductive adhesive get on and the connection terminals are not completely blocked, there is a possibility of causing a short circuit between the terminals. In addition, since the connection terminals are not completely blocked by the through holes of the flexible substrate, there is a possibility of causing a short circuit between the terminals.

  In addition, since Patent Document 2 applies an anisotropic conductive adhesive only to the concave portion of the connection terminal and limits the application of the adhesive only to the connection terminal portion, the number of operations for applying the adhesive in the manufacturing process. Increases cost.

  Therefore, in view of the above problems, the present invention provides a substrate connection structure that can reliably separate conductive particles between connection terminals even when an anisotropic conductive adhesive is applied to the entire terminal portion, and its manufacture. It is intended to provide a method.

A substrate connection structure according to the present invention is a substrate connection structure in which a plurality of connection terminals of a first substrate and a plurality of connection terminals of a second substrate are opposed to each other and electrically connected with an adhesive containing conductive particles. A convex insulating member having a continuous top is formed between the plurality of connection terminals of the second substrate, and the convex insulating member is connected to the plurality of connections of the first substrate facing each other. The conductive particles of the adhesive are arranged correspondingly between the terminals, and are separated between the connection terminals in the substrate surface direction of the first and second substrates by the tops of the convex insulating members. To do.

  According to such a configuration of the present invention, since the convex insulating member having the top continuously formed between the connection terminals in the substrate surface direction of the second substrate is provided, the adhesive containing conductive particles If a film-like adhesive such as ACF (anisotropic conductive film) is interposed, the continuously formed top of the convex insulating member functions as a so-called water divide, and the conductive of the adhesive This makes it easy to separate the conductive particles between the connection terminals in the substrate surface direction of the substrate, and is effective in preventing a short circuit between the connection terminals in the substrate surface direction.

In the present invention, the top portion of the convex insulating member is in contact with the substrate surface between the connection terminals of the first substrate.
According to such a configuration, the conductive particles of the adhesive can be more effectively separated between the connection terminals in the substrate surface direction of the first and second substrates by the top of the convex insulating member. Become.

In the present invention, the convex insulating member has a triangular prism shape, and the top portion is a ridge line portion of the triangular prism shape.
According to such a configuration, since the ridge line portion of the triangular prism shape of the convex insulating member has a sharp tip, the conductive particles of the adhesive are more effectively applied to the substrate surface direction of the first and second substrates. It is possible to separate the connection terminals.

In the present invention, the second substrate is a substrate constituting a liquid crystal device, and the convex insulating member is formed by using an insulating film material constituting the liquid crystal device. .
According to such a configuration, since the convex insulating member can be created using the resin material used when manufacturing the liquid crystal device, the manufacturing process is simplified and the convex insulating member is configured. Manufacturing cost can be reduced.

In the present invention, the convex insulating member is an insulating material having low hardness.
According to such a configuration, since the convex insulating member is formed of a material having low hardness when a force is applied to press-bond the first substrate and the second substrate, the convex insulating member It becomes possible to easily absorb the variation in the height of the top of the conductive material, and it becomes easy to crush the conductive particles contained in the adhesive between the connection terminal of the first substrate and the connection terminal of the second substrate.

In the present invention, the convex insulating member has a structure in which a plurality of insulating materials are laminated.
According to such a configuration, it is formed at the same time as the insulating resin material used when manufacturing the liquid crystal device, and when the height of the convex insulating member does not reach one layer, it is used when manufacturing other liquid crystal devices. Since the convex insulating member can be made to have a predetermined height by simultaneously laminating the resin materials to be manufactured, the manufacturing process can be simplified and the manufacturing cost for configuring the convex insulating member can be reduced.

In this invention, the front-end | tip part containing the said top part of the said convex-shaped insulating member is an insulating material with low hardness, It is characterized by the above-mentioned.
According to such a configuration, when the above-described convex insulating member is formed by laminating a plurality of insulating materials, the tip portion is made of a material and a state having a hardness as low as possible so that the conductive particles are not crushed. It becomes possible to prevent.

The substrate connection structure manufacturing method according to the present invention is a substrate in which a plurality of connection terminals of a first substrate and a plurality of connection terminals of a second substrate are opposed to each other and electrically connected with an adhesive containing conductive particles. In the manufacturing method of the connection structure, a structure having a top portion continuous in the height direction from the substrate surface provided with the connection terminals is formed between the connection terminals of the second substrate, and the connection terminals By placing and pressing the first substrate on the second substrate in a state where the adhesive containing the conductive particles is disposed and interposed in a continuous region corresponding to the structure, the structure The conductive particles of the adhesive are separated and blocked between the connection terminals in the substrate surface direction of the first and second substrates by the top portion of the first and second substrates.

  According to such a method of the present invention, since the convex insulating member having the top continuously formed between the connection terminals in the substrate surface direction of the second substrate is formed, the adhesive containing conductive particles is used. If a film-like adhesive such as ACF (anisotropic conductive film) is used, the continuously formed top of the convex insulating member functions as a so-called water basin, and the conductivity of the adhesive It becomes easy to separate the particles between the connection terminals in the substrate surface direction of the substrate, which is effective in preventing a short circuit between the connection terminals in the substrate surface direction.

Embodiments of the invention will be described with reference to the drawings.
[First Embodiment]
FIG. 1 is a side sectional view showing a substrate connection structure according to a first embodiment of the present invention.

  In FIG. 1, the substrate connection structure includes a first substrate 10 such as a flexible tape or an IC chip, a plurality of connection terminals 11 formed on a part of one surface of the first substrate 10, a glass substrate, and the like. The second substrate 20, the plurality of connection terminals 21 formed on a part of one surface of the second substrate 20, and the substrate surface direction of the plurality of connection terminals 21 of the second substrate (of the connection terminals) A convex insulating member 40 provided on the substrate surface between the connection terminals in the arrangement direction) and an anisotropic conductive adhesive 30 in which the conductive particles 31 are dispersed in the insulating adhesive 32 are provided.

  The second substrate 20 is, for example, one substrate (for example, an element substrate on which a TFT element or the like is formed) that constitutes a liquid crystal device and is opposed to each other. With respect to the plurality of connection terminals 21 led out to the end portion of the substrate 20, flexible tape wiring as a first substrate 10 and pads of a driving IC chip are formed using the anisotropic conductive adhesive 30. Conductive connection.

  The shape of the convex insulating member 40 has a prismatic shape (for example, a triangular prism) in which a top portion (in other words, a ridge line portion) 40a is formed continuously in the direction from the front of the drawing. The top 40a of the member 40 is positioned in a space (gap) provided between the connection terminals 11 in the substrate surface direction (connection terminal arrangement direction) of the first substrate 10 facing the member 40, and the anisotropic conductive adhesive 30 The conductive particles 31 are separated between the connection terminals in the substrate surface direction of the first and second substrates 10 and 20 by the top 40 a of the convex insulating member 40.

  Then, the connection terminal 11 of the first substrate 10 is opposed to the connection terminal 21 of the second substrate 20 by pressure-bonding with the anisotropic conductive adhesive 30 interposed therebetween. At this time, the conductive particles 31 of the anisotropic conductive adhesive 30 are sandwiched and bonded between the connection terminals 11 of the first substrate 10 and the connection terminals 21 of the second substrate 20. For this reason, the conductive particles 31 are electrically connected (conductive connection) between the upper and lower connection terminals 11 and 21.

  According to such a configuration, since the convex insulating member 40 in which the top portion 40a is continuously formed between the connection terminals 21 of the second substrate 20 is provided, the adhesive 30 including the conductive particles 31 is provided. If a film-like adhesive such as an anisotropic conductive film (ACF) is used for pressure connection, the continuously formed top portion 40a of the convex insulating member 40 functions as a so-called water divide. It is easy to separate the conductive particles 31 of the adhesive 30 between the connection terminals in the substrate surface direction, which is effective in preventing a short circuit between the connection terminals in the substrate surface direction.

In the present embodiment, the top portion 40 a of the convex insulating member 40 is preferably in contact (contact) with the substrate surface between the connection terminals 11 of the first substrate 10. The height of the convex insulating member (for example, triangular prism) 40 is desirably (the height of the connection terminal 11) + (the height of the connection terminal 21) + (the height of the crushed conductive particles).
With this configuration, the conductive particles 31 of the adhesive 30 are more effectively transferred between the connection terminals in the substrate surface direction of the first and second substrates 10 and 20 by the top portion 40a of the convex insulating member 40. It becomes possible to separate with.

Moreover, in this embodiment, it is preferable that the convex insulating member 40 has a triangular prism shape, and the top portion 40a is a ridge line portion of the triangular prism shape.
With such a configuration, the triangular prism-shaped ridge line portion of the convex insulating member 40 has a sharp cross-sectional shape at the tip, so that the conductive particles 31 of the adhesive 30 can be more effectively and effectively separated from each other. It is possible to separate the connection terminals in the substrate surface direction of the substrates 10 and 20.

In this embodiment, when the second substrate 20 is one substrate (element substrate or counter substrate) of the liquid crystal device, the convex insulating member 40 is created using an insulating film material formed on the substrate. It is preferable that
With such a configuration, the convex insulating member can be created using the resin material used when manufacturing the liquid crystal device.

Specifically, as the convex insulating member 40, an insulating resin material used when manufacturing a liquid crystal device, such as a color filter, a scallop-shaped spacer, an overlayer, or the like, can be used and formed simultaneously with these members. Most preferred.
The color filter is usually formed on a counter substrate in a liquid crystal device, and is useful when simultaneously forming a convex insulating member on the counter substrate side using the same material as the color filter.
In the liquid crystal device, the shell-shaped spacer is formed by using a sealing material to form a cell in which liquid crystal is sealed between an element substrate and a counter substrate disposed to face the element substrate. It is provided as a support column to prevent the space from deforming. This scallop-shaped spacer is useful when a scallop-shaped spacer is provided on the element substrate of the liquid crystal device, and at the same time, for example, the convex insulating member is formed on the element substrate side simultaneously with the same material as the scallop-shaped spacer.

The overlayer is provided in the liquid crystal device in order to obtain a high-quality display by preventing a decrease in display quality and a decrease in transmittance because the distance between the pixel electrode and each signal line on both sides thereof is narrow. It is an insulating film. In particular, it is possible to insulate the pixel electrode from the data line and the element such as TFD through an overlayer as an insulating film. This overlayer is useful when the overlay is provided on the element substrate of the liquid crystal device, and the convex insulating member is simultaneously formed on the same element substrate side with the same material as the overlayer.
In the present embodiment, the convex insulating member 40 is preferably an insulating material having low hardness.
With such a configuration, the convex insulating member 40 is made of a material having as low a hardness as possible, so that when the first substrate 10 is pressed against the second substrate 20, the top of the convex insulating member is formed. The variation in height can be easily absorbed, and the pressing force is transmitted to the adhesive 30 so that the conductive particles 31 are easily crushed between the connection terminal 11 of the first substrate 10 and the connection terminal 21 of the second substrate 20. .

Next, a method for manufacturing the substrate connection structure of FIG. 1 will be described with reference to FIGS. 2A is an exploded cross-sectional view before assembly, and FIG. 2B is a cross-sectional view after assembly.
As shown in FIG. 2A, after the plurality of connection terminals 21 provided on the second substrate 20 to be connected to a plurality of wirings (not shown) on the same substrate are formed, the substrate of the second substrate 20 is formed. A convex insulating member 40 is formed as a structure having a top portion (in other words, a ridge line portion) 40a continuously between the plurality of connection terminals 21 in the surface direction in the height direction. Thereafter, the first substrate 10 is placed on the second substrate 20 with the anisotropic conductive adhesive 30 interposed therebetween, and the first substrate 10 is heated to the second substrate 20 in a heated state. Press against. Accordingly, as shown in FIG. 2B, the anisotropic conductive adhesive 30 is formed between the connection terminals in the substrate surface direction of the first and second substrates 10 and 20 by the top 40a of the convex insulating member 40. The conductive particles 31 are separated (insulated), and the conductive (conductive) connection between the upper and lower connection terminals 11 and 21 and the adhesion between the first and second substrates 10 and 20 are performed.

  FIG. 3 illustrates the manufacturing process of FIG. 2A, in which a film-like anisotropic conductive adhesive 30 (indicated by a two-dot chain line) is disposed on the second substrate 20. A plan view is shown. A convex insulating member 40 having a triangular prism shape is provided between the plurality of connection terminals 21 formed on the second substrate 20. The triangular prism-shaped convex insulating member 40 extends long in the wiring direction, and the length of the convex insulating member 40 is longer than the length of the connection terminal 21 in the wiring direction. A plurality of connection terminals 11 (shown by dotted lines) of the first substrate 10 (not shown) are arranged corresponding to each of the plurality of connection terminals 21 of the second substrate 20.

FIG. 4 is a side view showing an example of a method for forming the convex insulating member 40 on the second substrate 20. A case where the convex insulating member 40 is formed by a method called a photolithography process will be described.
First, for example, a photosensitive resin material 40A that is sensitive to ultraviolet rays (UV) is applied on the surface of the second substrate 20 as a photoresist. Next, in order to form a triangular prism-shaped three-dimensional pattern in the thickness direction (vertical direction) of the photosensitive resin material 40A, a gray mask having different light transmittances depending on the place on the surface irradiated with ultraviolet light A so-called light quantity adjustment mask 50 is prepared, and this light quantity adjustment mask 50 is disposed above the photosensitive resin material 40 coated on the surface of the second substrate 20, and ultraviolet rays (UV) are applied to the mask 50. Irradiate evenly from above. Thus, the photosensitive resin material 40A is exposed in accordance with the light transmittance pattern of the mask 50. Next, the process proceeds to a developing step, where the photosensitive resin material 40A in the exposed area is dissolved with a solvent, and the pattern in the unexposed area is left, whereby the pattern corresponding to the mask 50 is transferred to the photosensitive resin material 40A. Thus, for example, in positive development, the higher the exposure amount of the convex insulating member 40 is, the easier it is to be removed with the solvent, and the lower exposure amount is the harder it is to be removed with the solvent. A convex insulating member 40 having a shape is formed.

  According to such a method, since the convex insulating member 40 in which the top portions 40a are continuously formed between the connection terminals 21 in the substrate surface direction of the second substrate 20 is formed, the adhesive containing conductive particles As a method of crimping and connecting with a film-like adhesive such as an anisotropic conductive film (ACF), the continuously formed top portion 40a of the convex insulating member 40 functions as a so-called water divide. Thus, it becomes easy to separate the conductive particles 31 of the adhesive 30 between the connection terminals in the substrate surface direction, which is effective in preventing a short circuit between the connection terminals in the substrate surface direction.

[Second Embodiment]
FIG. 5 is a cross-sectional view showing a substrate connection structure according to a second embodiment of the present invention.
5 differs from FIG. 1 in that the convex insulating member 40 uses one type of resin material in FIG. 1, whereas a plurality (three in the figure) of resin materials 41 in FIG. , 42, and 43, and a plurality of insulating resin materials 41, 42, and 43 are laminated. Other configurations are the same as those in FIG.

Specifically, as long as the convex insulator has a triangular prism shape, it may have a laminated structure such as a color filter, a scallop spacer, and an overlayer.
According to such a configuration, the convex insulating member 40 is formed by laminating a plurality of insulating materials. According to such a configuration, the insulating resin material used when manufacturing the liquid crystal device is simultaneously provided. If the convex insulating member is not formed in one layer, the resin material used when manufacturing the liquid crystal device can be laminated simultaneously to make the convex insulating member have a predetermined height. The manufacturing process for simplifying the manufacturing process and forming the convex insulating member can be reduced.

In this embodiment, it is preferable that the front-end | tip part containing the top part 40a of the convex-shaped insulating member 40 made into the laminated structure is an insulating material with low hardness.
With such a configuration, when the above-described convex insulating member 40 is formed by laminating a plurality of insulating film materials, the tip portion is made of a material and state having as low a hardness as possible, so that the height of the top portion varies. It is possible to prevent the conductive particles from being insufficiently crushed. By making the tip part of the convex insulating member 40 as low a hardness as possible, when the first substrate 10 is pressed against the second substrate 20, the top 40 a of the convex insulating member 40 is elastically a substrate. The pressing force is transmitted to the adhesive 30 and the conductive particles 31 are easily crushed between the connection terminals 11 of the first substrate 10 and the connection terminals 21 of the second substrate 20.

Next, a driving circuit built-in type TFT active matrix driving type liquid crystal device, which is an example of an electro-optical device to which the above-described substrate connection structure is applied, will be described. FIG. 6 is a plan view of the element substrate viewed from the side of the counter substrate together with each component formed thereon, and FIG. 7 is a cross-sectional view taken along the line HH ′ of FIG.
6 and 7, in the liquid crystal device according to the present embodiment, the element substrate 110 and the counter substrate 120 are arranged to face each other. The element substrate 110 corresponds to the second substrate 20 in FIGS. 1 to 5.
A liquid crystal layer 150 is sealed between the element substrate 110 and the counter substrate 120, and the element substrate 110 and the counter substrate 120 are mutually connected by a sealing material 152 provided in a seal region located around the image display region 110 a. It is glued to. The sealing material 152 is made of, for example, a thermosetting resin, heat and photo-curing resin, photo-curing resin, UV-curing resin, or the like to bond the two substrates together. It is cured by heating, light irradiation, light irradiation, ultraviolet irradiation or the like.

In such a sealing material 152, a gap material such as glass fiber or glass beads for mixing the distance between the substrates (inter-substrate gap) to a predetermined value is mixed. Alternatively, for example, in a large liquid crystal device, the interval between the two substrates in the cell may be set to a predetermined value by a shell-shaped spacer provided on the element substrate side.
Vertical conduction members 106 are provided at the four corners of the counter substrate 120, and electrical conduction is established between the vertical conduction terminals provided on the element substrate 110 and the counter electrode 121 provided on the counter substrate 120. .

6 and 7, a light-shielding peripheral light-shielding film 153 that defines the image display region 110a is provided on the counter substrate 120 side in parallel with the inside of the seal region where the sealant 152 is disposed. Needless to say, the peripheral light shielding film 153 may be provided on the element substrate 110 side. The data line driving circuit 101 and the external circuit connection terminal 102 are provided along one side of the element substrate 110 on the outer side of the seal area where the sealant 152 is arranged, in the peripheral area extending around the image display area. The scanning line driving circuit 104 is provided along two sides adjacent to the one side. The external circuit connection terminal 102 corresponds to the connection terminal 21 in FIGS. A terminal portion of a wiring portion of a flexible substrate (not shown) corresponding to the first substrate 10 in FIGS. 1 to 5 is connected to the external circuit connection terminal 102 with an anisotropic conductive adhesive.
Further, on the remaining side of the element substrate 110, a plurality of wirings 105 are provided for connecting between the scanning line driving circuits 104 provided on both sides of the image display region 110a.

  In FIG. 7, on the element substrate 110, an alignment film is formed on the pixel electrode 109a after the pixel switching TFT, the scanning line, the data line, and the like are formed. On the other hand, on the counter substrate 120, in addition to the counter electrode 121, an alignment film is formed in the uppermost layer portion. The liquid crystal layer 150 is made of, for example, a liquid crystal in which one or several types of nematic liquid crystals are mixed, and takes a predetermined alignment state between the pair of alignment films.

  In the present embodiment, a sampling circuit (not shown) is provided in a region on the element substrate 110 below the peripheral light shielding film 153. The sampling circuit is configured to sample the image signal on the image signal line in accordance with the sampling circuit drive signal supplied from the data line drive circuit 101 and supply the sampled signal to the data line.

  The electro-optical device according to the present invention can be similarly applied not only to an active matrix (TFT, TFD) driving type liquid crystal device but also to a passive matrix type liquid crystal device. In addition to liquid crystal devices, electroluminescence (EL) devices, organic electroluminescence devices, plasma display devices, electrophoretic display devices, devices using electron-emitting devices (Field Emission Display and Surface-Conduction Electron-Emitter Display, etc.) The present invention can be similarly applied to various electro-optical devices such as).

Note that the present invention relates to a display device for forming a circuit element on a substrate, such as an LCOS (Liquid
(Crysta1 On Silicon). In LCOS, a single crystal silicon substrate is used as an element substrate, and a transistor is formed on a single crystal silicon substrate as a switching element used for a pixel or a peripheral circuit. In addition, a reflective pixel electrode is used for the pixel, and each element of the pixel is formed under the pixel electrode.

Sectional drawing which shows the connection structure of the board | substrate of the 1st Embodiment of this invention. Sectional drawing explaining the manufacturing method of the connection structure of the board | substrate of FIG. FIG. 3 is a plan view illustrating a state in which a film-like anisotropic conductive adhesive is disposed on a second substrate, illustrating the manufacturing process of FIG. The side view which shows an example of the method of forming a convex-shaped insulation member on a 2nd board | substrate. Sectional drawing which shows the connection structure of the board | substrate of the 2nd Embodiment of this invention. The top view which looked at the element substrate in a liquid crystal device from the counter substrate side with each component formed on it. H-H 'sectional drawing of FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... 1st board | substrate, 11, 21 ... Connection terminal, 20 ... 2nd board | substrate, 30 ... Anisotropic conductive adhesive, 31 ... Conductive particle | grains, 40 ... Convex-shaped insulation member, 40a ... Top part.

Claims (8)

In the substrate connection structure in which the plurality of connection terminals of the first substrate and the plurality of connection terminals of the second substrate are opposed to each other and electrically connected with an adhesive containing conductive particles,
A convex insulating member having a continuous top is provided between the plurality of connection terminals of the second substrate, and the convex insulating member is the plurality of connection terminals of the first substrate facing each other. And the conductive particles of the adhesive are separated between the connection terminals in the substrate surface direction of the first and second substrates by the tops of the convex insulating members. Board connection structure.   The board connection structure according to claim 1, wherein the top portion of the convex insulating member is in contact with a board surface between the connection terminals of the first board.  The board connection structure according to claim 1, wherein the convex insulating member has a triangular prism shape, and the top portion is a ridge line portion of the triangular prism shape.   The said 2nd board | substrate is a board | substrate which comprises a liquid crystal device, Comprising: The said convex-shaped insulation member is produced using the insulating film material which comprises this liquid crystal device. 4. The substrate connection structure according to any one of 3 above.   The board connection structure according to claim 1, wherein the convex insulating member is an insulating material having low hardness.   The board connection structure according to claim 1, wherein the convex insulating member has a structure in which a plurality of insulating materials are laminated.   The connecting structure for a substrate according to claim 6, wherein a tip portion including the top portion of the convex insulating member is an insulating material having low hardness. In the method for manufacturing a substrate connection structure in which a plurality of connection terminals of the first substrate and a plurality of connection terminals of the second substrate are opposed to each other and electrically connected with an adhesive containing conductive particles,
A structure having a top portion continuous in the height direction from the surface of the substrate on which the connection terminal is provided is created between the connection terminals of the second substrate, and the structure corresponding to the connection terminal and the structure is continuous. By placing and pressing the first substrate on the second substrate in a state where the adhesive containing the conductive particles is disposed and interposed in the region, the top portion of the structure causes the first, A method for manufacturing a substrate connection structure, comprising separating and blocking conductive particles of the adhesive between connection terminals in a substrate surface direction of a second substrate.

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