KR20150092692A - Display device and method of manufacturing the same - Google Patents

Abstract

A display device according to the present invention comprises a first base substrate including an active area and a first pad area adjacent to one side of the active area; a second base substrate arranged to be separated from the first base substrate, overlapped with the active area, and exposing the first pad area; a combination member arranged between the first base substrate and the second base substrate; a first support member arranged on the first pad area of the first base substrate, and defining a certain area by being separated from the combination member; and a second support member filling a certain space.

Description

TECHNICAL FIELD [0001] The present invention relates to a display device and a method of manufacturing the same,

The present invention relates to a display device and a method of manufacturing the same, and more particularly to a display device with improved reliability and a method of manufacturing the same.

The display device includes a display panel for displaying an image on the outside, a protective member for protecting the display panel, and various electronic components for driving the display device. The display device is used in a real life by being housed by combining various structures with each other.

Display devices with different configurations combined must be reliable to operate reliably from external forces or impacts.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a display device in which structures can be stably assembled and a method of manufacturing the same.

A display device according to an embodiment of the present invention includes a first base substrate including a valid region and a first pad region adjacent to one side of the effective region, a second base substrate disposed apart from the first base substrate, A second base substrate for exposing the first pad region, a coupling member disposed between the first base substrate and the second base substrate, and a second pad region disposed on the first pad region of the first base substrate, A first support member spaced apart from the member and defining a predetermined space, and a second support member filled in the predetermined space.

A display device according to an embodiment of the present invention includes a wiring portion extending in a first direction and each disposed in the effective region and a pad portion disposed in the first pad region, First signal lines, and a plurality of second signal lines extending in a second direction that intersects the first direction.

The first support member may be disposed on a pad portion of each of the first signal lines.

Wherein the first base substrate further includes a second pad region adjacent to another side of the effective region, the second signal lines are connected to the wiring portion and the wiring portion disposed in the effective region, And the first support member may be disposed in each of the first and second pad regions.

The display device according to an embodiment of the present invention further includes at least one first driving chip electrically connected to the pad portions of the first signal lines to apply a voltage to the pad portions of the first signal lines, 1 driving chip may be arranged to overlap the pad portions of the first signal lines of the first pad region, and the first supporting member may be disposed on the first driving chip.

The display device according to an embodiment of the present invention further includes a flexible circuit film connected to the pads of the second signal lines, a second driving chip mounted on the flexible circuit film, and a main circuit board connected to the flexible circuit film , The first supporting member may be disposed on the flexible circuit film.

The coupling member may be disposed along the edge of the second base substrate in a plan view.

The first support member may include a flat portion disposed in the first pad region and at least one partition wall bent from the flat portion and facing the coupling member.

The upper surface of the partition wall may define the same plane as the upper surface of the second base substrate.

The upper surface of the second support member may define the same plane as the upper surface of the partition wall portion and the upper surface of the second base substrate.

The display device according to an embodiment of the present invention may further include a first optical member disposed on the lower side of the first base substrate and a second optical member disposed on the upper side of the second base substrate, Member and the second optical member may overlap the effective region.

The second optical member may be disposed on a plane defined by an upper surface of the partition, a top surface of the second support member, and an upper surface of the second base substrate to cover the pad area.

A display device according to an embodiment of the present invention includes a side wall part covering an edge of the first base substrate and the partition wall part of the first support member and an upper part covering the first pad area by being bent from the side wall part And the upper portion may be disposed on a plane defined by the upper surface of the partition wall portion, the upper surface of the second support member, and the upper surface of the second base substrate.

The upper end of the upper part may overlap with the engaging member.

The plurality of barrier ribs may be spaced apart from one another, and the display device may further include a third support member for filling the spaces between the barrier ribs.

The second support member may include silicon, and the second support member may further include black pigment particles.

A method of manufacturing a display device according to an embodiment of the present invention includes: providing a display panel including a pad region on at least one side; disposing a driving circuit portion in the pad region of the display panel; Placing the supporting member, bonding the driving circuit portion to the display panel, and filling the space defined by the first supporting member and the display panel with the second supporting member.

The method of manufacturing a display device according to an embodiment of the present invention may further include polishing the upper surface of the second support member such that the upper surface of the second support member is flush with the upper surface of the display panel.

A method of manufacturing a display device according to an embodiment of the present invention includes the steps of providing a display panel including a pad region on at least one side thereof, attaching a first optical member to a lower surface of the display panel, A step of attaching a protective film, disposing a flexible circuit film on the pad region of the display panel, disposing a first support member on the flexible circuit film, bonding the flexible circuit film to the display panel Filling a space defined by the first support member and the display panel with a second support member; removing the protective film from the upper surface of the display panel; And attaching an optical member to cover the pad area.

According to the present invention, since the display device further includes the support member in the pad area of the display panel, even if the cover member overlaps the display panel with a small area, the display panel can be stably fixed and reliability is improved.

In addition, according to the present invention, even if the bezel area is reduced, the display device can effectively prevent moisture from penetrating into the display panel.

Further, according to the present invention, the display device manufacturing method can provide a display device having a narrow bezel area and improved reliability.

1 is an exploded perspective view of a display device according to an embodiment of the present invention.
2 is a partially exploded perspective view of a display device according to an embodiment of the present invention.
3 is an assembled perspective view of a display device according to an embodiment of the present invention.
4A is a fragmentary cross-sectional view taken along the line I-I 'in FIG.
4B is a partial cross-sectional view taken along line II-II 'in FIG.
4C is a partial cross-sectional view taken along the line III-III 'in FIG.
5 is a partial cross-sectional view of a display device according to an embodiment of the present invention.
6 is a partial cross-sectional view of a display device according to an embodiment of the present invention.
7A to 7E are cross-sectional views illustrating a method of manufacturing a display device according to an embodiment of the present invention.
8A to 8E are cross-sectional views illustrating a method of manufacturing a display device according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention and the manner of achieving them will become apparent with reference to the embodiments described in detail below with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. In addition, like reference numerals refer to like elements throughout the specification. In the accompanying drawings, the scale of some components is exaggerated or reduced in order to clearly illustrate the various layers and regions.

1 is an exploded perspective view of a display device according to an embodiment of the present invention. 2 is an assembled perspective view of the display device shown in FIG. 3 is a partial perspective view of a display module according to an embodiment of the present invention. However, in FIG. 2, a part of the configuration is omitted. Hereinafter, the configurations of the display device will be described with reference to Figs. 1 to 3. Fig.

The display device according to the present invention includes protective members 100U and 100L, a display module DM, and a backlight unit BLU. In the present embodiment, the protective members 100U and 100L include an upper protective member 100U and a lower protective member 100L. In the meantime, at least one of the protection members in the display device according to the embodiment of the present invention may be omitted. The upper protective member 100U is disposed above the display module DM. The upper protective member 100U covers the outside of the display module DM and the lower protective member 100L.

The upper protective member 100U includes openings 100U-OP. The opening 100U-OP exposes a part of the display module DM, for example, a display area DA in which an image is generated. The upper protective member 100U may have a frame shape surrounding the edge of the display module DM.

The lower protective member 100L is engaged with the upper protective member 100U. The lower protective member 100L accommodates the backlight unit BLU. The lower protective member 100L includes a bottom portion 110 and a side wall portion bent upward from the bottom portion 110. As shown in FIG.

The bottom 110 may be a rectangle that overlaps the backlight unit BLU in a plan view. The side wall portion is bent upward from each of the four sides of the bottom portion 110. The side wall part may be divided into four parts corresponding to four sides of the bottom part 110. [

Wherein the four portions have first sidewalls (121, 122) facing each other in a first direction (D1), and second sidewalls (122) facing each other in a second direction (D2) intersecting the first direction And includes sidewalls 123 and 124. The four portions surround the bottom portion 110.

The display module (DM) receives light from the backlight unit (BLU) and generates an image. The display module DM includes a display panel DP, a driving circuit connected to the display panel DP, a first support member 230 disposed on one side of the display panel DP, (240).

The display panel DP is a transmissive or semi-transmissive display panel. For example, the display panel DP may be an organic light emitting display panel, a liquid crystal display panel, an electrophoretic display panel, or an electrowetting display panel. In the present embodiment, the display panel DP will be described with reference to a liquid crystal display panel, for example.

The display panel DP includes a first base substrate 210 and a second base substrate 220 facing each other. An unshown coupling member may be disposed between the first base substrate 210 and the second base substrate 220. The coupling member is disposed along the edge of the second base substrate 220 to couple the first base substrate 210 and the second base substrate 220 together.

The first base substrate 210 includes an effective region EA and at least one pad region PAD1 and PAD2 adjacent to the effective region EA. The display module DM according to the present embodiment may include a first pad region PAD1 and a second pad region PAD2. The first pad region PAD1 and the second pad region PAD2 may be connected to each other.

Unshown pixels are arranged in the effective area EA. Each of the pixels may include at least one thin film transistor (not shown) and a pixel electrode (not shown) connected to the thin film transistor.

Signal lines connected to each of the pixels may be disposed in the effective area EA. The signal wirings may include gate lines GL and data lines DL.

The gate lines GL extend in a first direction D1 and are arranged in a second direction D2 intersecting the first direction D1. The gate lines GL transfer gate voltages to corresponding ones of the pixels.

Each of the gate lines GL includes a wiring portion disposed in the effective region EA and a pad portion GL-P disposed in the first pad region PAD1. The pad portion GL-P is provided at the ends of each of the gate lines.

The data lines DL extend in the second direction D2 and are arranged to be insulated from the gate lines GL. The data lines DL transfer data voltages to corresponding ones of the pixels.

Each of the signal lines may include a wiring portion disposed in the effective region EA and a pad portion disposed in the pad regions. The pad portion is provided at an end of the wiring portion. For example, each of the gate lines GL may include a pad portion GL-P disposed in the first pad region PAD1. Each of the data lines DL may include a pad portion (not shown) disposed in the second pad region PAD2.

The second base substrate 220 is disposed on the first base substrate 210. The second base substrate 220 is spaced apart from the first base substrate 210 in the thickness direction D3 (hereinafter referred to as a third direction). The second base substrate 220 overlaps the effective region EA of the first base substrate 210.

The second base substrate 220 exposes at least one side of the first base substrate 210 to define at least one pad region. In the present embodiment, the second base substrate 220 exposes the first pad region PAD1 and the second pad region PAD2.

The driving circuit includes a printed circuit board (PCB), a first driving chip IC-G disposed on the first base substrate 210, and a chip on film (COF). The chip on film (COF) may include a flexible circuit film FM and a second driving chip IC-D. A plurality of the first driving chips IC-G and the chip-on films COF may be provided.

The printed circuit board (PCB) is disposed adjacent to the one side of the first base substrate 210. The printed circuit board (PCB) mounts unshown elements. The printed circuit board (PCB) is connected to one side of the flexible circuit film (FM). The printed circuit board (PCB) is electrically connected to the pad portions of the data lines DL. A data driving signal output from the printed circuit board (PCB) may be transmitted to the data lines DL through the flexible circuit film FM.

The first driving chip IC-G may be a gate driver. The first driving chip IC-G provides a gate signal to the gate lines GL. The first driving chip IC-G is connected to the pad portions GL-P of the gate lines GL. The first driving chip IC-G applies a gate voltage to the pad portions GL-P of the gate lines. The first driving chip IC-G may be disposed on the first base substrate 210 and directly connected to the pad portions GL-P of the gate lines. Meanwhile, in another embodiment, the first driving chip IC-G may be mounted on the flexible film and connected to the pad portions GL-P of the gate lines.

The second driving chip IC-D may be a data driver. The second driving chip IC-D is connected to pad portions (not shown) of the data lines DL. The pad portions of the data lines DL may have the same shape as the pad portions GL-P of the gate lines GL. The second driving chip IC-D applies a data voltage to pad portions of the data lines DL.

The other side of the flexible circuit film FM is connected to the pad portions. The second driving chip IC-D is mounted on one surface of the flexible circuit film FM and disposed adjacent to one side of the first base substrate 210. [ The flexible circuit film FM has circuits mounted on one surface thereof to electrically connect the pad portion and other structures. In the present embodiment, the second driving chip IC-D is mounted on the lower surface of the flexible circuit film FM.

Meanwhile, in the display device according to an embodiment of the present invention, the second driving chip IC-D may be disposed directly on the pad portions of the data lines so as to correspond to the first driving chip IC-G . At this time, the flexible circuit film FM may be omitted.

Although not shown, the display module DM further includes a conductive adhesive member disposed between the flexible circuit film FM and the first base substrate 210. [ The conductive adhesive member connects the flexible circuit film FM and the first base substrate 210 and electrically connects them. The conductive adhesive member may be an adhesive including a conductive ball or an anisotropic conductive film.

The first support member 230 is disposed on the pad regions PAD1 and PAD2 of the first base substrate 210. [ The first support member 230 may be disposed to cover at least the pad portions, for example, pad portions GL-P of the gate lines and pad portions (not shown) of the data lines. The first support members 230 may be provided in a plurality of ways so that each of the first support members 230 may cover the pad portions and may be integrally provided to cover all the pad portions disposed in the pad region.

The first support member 230 may be disposed in each of the pad regions PAD1 and PAD2. Or the first support member 230 may have an integral shape including a first portion extending in the first direction D1 and a second portion extending in the second direction D2, The present invention is not limited to the embodiment of Figs.

The first support member 230 may be disposed on the flexible circuit film FM in the first pad region PAD1. The first support member 230 is disposed to overlap with the flexible circuit film FM and the pad portions of the data lines.

Alternatively, the first supporting member 230 may be disposed on the first driving chip IC-G in the second pad region PAD2. The first supporting member 230 is disposed to overlap the pad portions GL-P of the gate lines GL and covers the first driving IC IC-G.

The second support member 240 is disposed in the first pad region PAD1 and the second pad region PAD2 of the first base substrate 210. [ The second support member 240 is filled in a predetermined space defined by the support member 230, the first base substrate 210, and the coupling member (not shown). The second support member 240 eliminates a step formed between the first base substrate 210 and the second base substrate 220 together with the first support member 230. A detailed description thereof will be described later.

The backlight unit BLU is disposed below the display module DM. The backlight unit (BLU) provides light to the front surface of the display panel (DP). The backlight unit includes a light guide 300 and a light source 400.

The light guide 300 is disposed below the display panel DP. The light guide 300 guides the light received from the light source 400 in a direction in which the display module 200 is disposed.

The light guide 300 includes a first surface US, a second surface (not shown), and connection surfaces connecting the first surface US and the second surface. The light guide 300 includes at least one light incident surface and an exit surface.

The light incidence surface is a surface that receives light from the light source 400. The light incidence surface is provided on the surface of the light guide 300 facing the light source 400. In this embodiment, the light incidence surface may be provided on any one of the connection surfaces.

The exit surface is a surface that emits light incident from the light incidence surface toward the display panel (DP). Is provided on the first surface (US) or on a surface of the second surface facing the display panel (DP). In this embodiment, the emission surface is provided on the first surface US.

The light source 400 generates light. The light source 400 includes a light emitting device 410 and a circuit board 420. As shown in FIG. 1, the light source 400 may include light emitting devices 410.

The light emitting devices 410 may be mounted on the circuit board 420. The circuit board 420 is electrically connected to the light emitting device 410. Although not shown, the circuit board 420 may be provided with circuit boards corresponding to the light emitting elements.

In this embodiment, the circuit board 420 is disposed on the lower side of the light emitting device, but the present invention is not limited thereto. The circuit board 420 may be disposed on the side of the light emitting device 410.

Although not shown in FIGS. 1 to 3, the display device according to the present invention may further include at least one optical member. The optical member includes a polarizing film adhered to upper and lower surfaces of the display panel DP.

Alternatively, the optical member may include a reflective member that reflects light emitted to the lower side of the light guide member 300, out of the light incident on the light guide member 300. Alternatively, the optical member

Alternatively, the optical sheet may include a diffusion sheet that uniformly transmits light emitted from the first surface US of the light guide 300 to the display panel. The optical member may be disposed below the light guide member 300 and may be received in the lower protective member 100L.

4A is a cross-sectional view taken along the line I-I 'of FIG. 1, FIG. 4B is a cross-sectional view taken along line II-II' of FIG. 2, and FIG. 4C is a cross-sectional view taken along line III-III 'of FIG. Only some of the configurations are shown in Figs. 4A to 4C. Hereinafter, a display device according to the present invention will be described with reference to Figs. 4A to 4C. 1 to 3 are denoted by the same reference numerals, and a detailed description thereof will be omitted.

Although not shown, the first base substrate 210 may include insulating layers. The thin film transistor (not shown) and the signal lines (not shown) may be disposed between the insulating layers.

Some of the signal lines extend to the second pad region PAD2 and the ends of the signal lines are exposed from the insulating layers to form pad portions GL-P (see FIG. 2) of the gate lines. Further, another portion of the signal lines may extend to the first pad region PAD1 (see FIG. 2), and an end thereof may be exposed from the insulating layers to form pad portions (not shown) of the data line .

As shown in FIG. 4A, the color filter layer CF may be disposed on the lower surface of the second base substrate 220. The color filter layer CF includes a color pattern CL containing at least one color and a black matrix BM adjacent to the color pattern CL. The black matrix BM prevents light leakage at the edge of the second base substrate 220.

A liquid crystal layer LC is disposed between the first base substrate 210 and the second base substrate 220. The liquid crystal layer LC adjusts the directionality thereof according to an electric field to adjust an amount of light passing through the color pattern CL to display an image.

The coupling member SL is disposed between the first base substrate 210 and the second base substrate 220. The coupling member SL is disposed along the edge of the second base substrate 220 to seal the liquid crystal layer LC. Although not shown, a plurality of the engagement members SL may be provided.

The coupling member SL may be formed of various materials. The coupling member SL protects the liquid crystal layer LC from external moisture or contamination. For example, the engaging member SL may include a thermosetting resin or an ultraviolet ray hardening resin.

The display module DM according to the present invention can be divided into the pad areas PAD1 and PAD2 on the planar surface and the effective area EA adjacent to the pad areas PAD1 and PAD2. The effective region EA includes a coupling region AR1 overlapping the coupling member SL, a pixel region AR2 overlapping the color pattern CL, and a coupling region AR2 overlapping the coupling region AR1 and the pixel region AR2 And an intermediate region AR3 disposed between the intermediate regions AR1 and AR2.

The coupling area AR1 is a region where the coupling member SL is disposed in a region overlapping the black matrix BM. The coupling region AR1 may be defined by an end of the second base substrate 220 and an inner surface of the coupling member SL.

The pixel region AR2 is an area in which the pixels (not shown) are disposed. The pixel region AR2 overlaps with the color pattern CL. In the pixel region AR2, light is generally transmitted and an image is displayed.

The intermediate region AR3 overlaps with the black matrix BM and a part of the liquid crystal layer LC. The intermediate region AR3 is a maximum region in which a foreign substance, for example, moisture penetrating into the liquid crystal layer LC through the coupling member SL can be diffused toward the pixel region AR2.

The intermediate region AR3 may define a boundary between a bezel area and a display area of the display device according to an exemplary embodiment of the present invention. The bezel area is an edge area of the display device and is an area where no image is displayed. For example, the bezel region may overlap the pad regions PAD1 and PAD2, the coupling region AR1, and the middle region AR3.

As shown in FIG. 4A, the first support member 230 is disposed in the first pad region PAD1. The first support member 230 includes a flat portion 230P and at least one partition 230W.

The plane portion 230P defines a plane parallel to the first base substrate 210. [ The planar portion 230P is disposed on a flexible circuit film FM connected to a pad portion of a data line and an unillustrated pad portion of the data line. The flat portion 230P covers the pad portion of the data line and the flexible circuit film FM.

The partition 230W extends from the flat surface 230P in the third direction D3. The partition 230W includes a top surface 230W-US. The top surface 230W-US of the partition wall supports a structure disposed on the first support member 230. [ The top surface 230W-US of the partition wall defines the same plane as the top surface 220-US of the second base substrate 220.

As shown in FIG. 4A, the first support member 230 is disposed apart from the engagement member SL. The first support member 230, the first base substrate 210, and the engagement member SL define a predetermined space. The second support member 240 is filled in the predetermined space. The second support member 240 defines a top surface 240-US in the same plane as the top surface 220-US of the second base substrate 220.

The second support member 240 does not contact the flexible circuit film FM. The first support member 230 protects the flexible circuit film FM from the second support member 240. Therefore, even if the second support member 240 is cured by light or heat, it is possible to prevent the flexible circuit film FM from being damaged by heat or light.

The second support member 240 may include a curable material that may be provided in a liquid phase. For example, the second support member 240 may include silicon. Or the second support member 240 may further include black pigment particles. The second support member including the black pigment particles prevents light from leaking into the pad region PAD1.

Alternatively, the second support member 240 may include the same material as the material forming the engagement member SL. At this time, the second support member 240 becomes a double sealing member sealing the liquid crystal layer LC together with the engagement member SL, thereby stably sealing the liquid crystal layer LC.

The display device according to the present invention further includes the second support member 240, so that the width of the intermediate region AR3, which is the maximum movement distance of the penetrated moisture, can be reduced. The intermediate region AR3 protects the pixel region AR2 from moisture permeated through the coupling member SL. As the area of the middle area AR3 increases, the influence of the foreign matter on the pixel area AR2 may be reduced, but the bezel area may increase.

The display device according to an embodiment of the present invention further includes the second support member 240, thereby having an effect of double-sealing the liquid crystal layer LC. The second support member 240 minimizes moisture and contamination penetrating into the liquid crystal layer LC. Therefore, the display device according to the present invention can reduce the width of the middle area AR2, and the bezel area is reduced. As shown in FIG. 4B, the first supporting member 230 may be disposed on the first driving chip IC-G in the second pad region PAD2. The top surface 230W-US of the first support member 230, the top surface 240-US of the second support member 240, and the top surface 220-US of the second base substrate 220, Defines the same plane (IP).

The first support member 230 protects the first drive chip IC-G from the second support member 240. Therefore, even if the second supporting member 240 is cured by light or heat, it is possible to prevent the first driving chip IC-G from being damaged by heat or light.

4C is a cross-sectional view of the display module DM of FIG. 4B coupled with the upper protective member 100U (see FIG. 1). 4C is a cross-sectional view of the second pad region PAD2. As shown in FIG. 4C, the display module DM according to the present invention can be covered by the upper protective member 100U. The upper protective member 100U includes side wall portions 100U-W and upper portions 100U-U.

The side wall portions 100U-W cover the side surfaces of the display module DM. The side wall portions 100U-W cover the side surfaces of the first base substrate 210 and the side surfaces of the partition portion 230W of the first support member 230. [ The side wall portions 100U-W align the positions of the display modules DM.

The upper portion 100U-U is bent and extended in the second direction D2 from the side wall portion 100U-W. An end 100U-E of the upper part 100U-U defines an opening 100U-OP of the upper protective member (see FIG. 1). The upper portion 100U-U may overlap a part of the display module DM on a plane. For example, the upper portion 100U-U may overlap at least the pad regions PAD1 and PAD2.

The top surface 220-US of the second base substrate 220, the top surface 230W-US of the first support member 230, and the top surface 240-US of the second support member 240 ) Define the same plane (IP). The plane IP supports the upper portion 100U-U.

The end 100U-E of the upper portion 100U-U may overlap the coupling region AR1. In the present embodiment, in the display module DM, a region overlapping the upper portion 100-U-U may be an area for supporting the upper protective member 100U. The display device according to the present invention further includes the first supporting member 230 and the second supporting member 240 so that the area of the upper portion 100U- It supports the area that does not exist.

Accordingly, the upper portion 100U-U can be stably supported by the display module DM even if only a small area of the second base substrate 220 is used. Therefore, the upper protective member 100U can be stably coupled to the display module DM without the end 100U-E of the upper portion 100U-U extending to the middle region AR3 .

The display device according to the present invention can improve the supporting force of the upper protective member 100U in the pad area. The upper protective member 100U may be configured such that the second base substrate 220 is warped or the first base substrate 210 is bent to the upper protective member 210 even if only a portion of the first base substrate 210 is supported, The phenomenon of escaping from the main body 100U can be prevented.

5 is a partial cross-sectional view of a display device according to another embodiment of the present invention. As shown in FIG. 5, the first support member 230 may have various shapes. In this embodiment, the first supporting member 230-1 may include a flat surface portion 230P, and partition wall portions 230W1, 230W2, and 230W3.

The partition portions 230W1, 230W2, and 230W3 extend upward from the planar portion 230P. The barrier ribs 230W1, 230W2, and 230W3 may be spaced apart from each other.

Each of the barrier ribs 230W1, 230W2 and 230W3 includes support surfaces on the upper side. The barrier ribs 230W1, 230W2, and 230W3 extend so that the support surfaces reach the same plane as the upper surface of the second base substrate 220. FIG.

As shown in FIG. 5, the display module DM-1 according to the present invention further includes a third support member 250. The third support member 250 is filled in the spaced space between the partition portions 230W1, 230W2, and 230W3. The third support member 250 is filled between the partition walls 230W1, 230W2, and 230W3 to more stably support the upper protective member 100U (see FIG. 4C).

6 is a partial cross-sectional view of a display device according to an embodiment of the present invention. The embodiment shown in Fig. 6 differs from the embodiment shown in Fig. 5 in the shape of the optical members OP10-1 and OP20-1, and the remaining components are the same. Hereinafter, the same components as those shown in Figs. 1 to 5 are denoted by the same reference numerals, and a detailed description thereof will be omitted.

In the present embodiment, the first optical member OP10-1 and the second optical member OP20-1 may overlap with the first pad region PAD1. However, although not shown, the first optical member OP10-1 and the second optical member OP20-1 may be disposed so as to overlap with the second pad region PAD2 (see FIG. 2).

The second optical member OP20-1 may be disposed on a plane IP defined by the top surface of the first supporting member, the top surface of the second supporting member, and the top surface of the second base substrate . The second optical member OP20-1 may cover the first pad region PAD1.

The display module DM-2 according to an embodiment of the present invention can cover the pad areas PAD1 and PAD2 without including a separate upper protective member 100U (see FIG. 1). The display device fixes the outer surface of the display module DM-2, so that the respective components of the display device can be assembled. Therefore, according to the present invention, the thickness can be reduced, and a configuration like a chassis covering the top of the display panel can be omitted, so that the display device with reduced bezel area can be provided.

7A to 7E are cross-sectional views illustrating a method of manufacturing a display device according to an embodiment of the present invention. 7A to 7E show a manufacturing method of the display device shown in FIG. 4A. Hereinafter, the same constituent elements as those described in Figs. 1 to 6 are denoted by the same reference numerals, and redundant description is omitted.

As shown in Fig. 7A, a display panel and a driver circuit portion are provided. The display panel includes a first base substrate 210 and a second base substrate 220 facing each other and a liquid crystal layer disposed between the first base substrate 210 and the second base substrate 220 LC).

The driving circuit portion is disposed on the pad region PAD1. The driving circuit portion may include a flexible circuit film (FM) and a printed circuit board. One side of the flexible circuit film FM is connected to a pad portion (not shown) of the pad region PAD and the other side of the flexible circuit film FM is connected to the printed circuit board (not shown). A data driving chip (not shown) is disposed on the flexible circuit film FM. The data driving chip may be mounted on the lower surface of the flexible circuit film FM by a TAB (Tape Amounted Bonding) process, for example. In the figure, a portion of the flexible circuit film FM connected to the printed circuit board and a portion where the data driving chip is mounted are omitted.

As shown in FIG. 7B, the first support member 230 is disposed on the pad region PAD. The first support member 230 includes a planar portion 230P and a partition 230W connected to the planar portion 230P. The partition 230W extends upward from the flat surface 230P.

The first support member 230 may be disposed such that the planar portion 230P overlaps the one side of the flexible circuit film FM and the pad portion. In addition, the first support member 230 may be disposed such that the side surface of the partition 230W is aligned with the end of the first base substrate 210.

The top surface 230W-US of the partition 230W defines the same plane IP as the top surface 220-US of the second base substrate 220. The first support member 230 has a size capable of supporting a step D formed by the upper surface 220-US of the second base substrate 220 from the upper surface of the first base substrate 210 .

As shown in FIG. 7C, a heating and pressure (LP) process is performed on the pad region. Through the heating and pressure (LP) process, the driving circuit portion disposed on the pad region is electrically connected to the signal lines disposed on the inner surface of the first base substrate. Although not shown, a conductive adhesive member may be further included between the flexible circuit film FM and the pad portion (not shown). The conductive adhesive member improves the adhesiveness and electrical connection between the flexible circuit film FM and the first base substrate 210 and the pad portion.

As shown in FIG. 7D, a liquid second support member 240-LQ is provided by using a nozzle NZ on the pad region. The liquid second support member 240-LQ is filled in a space formed by the sides of the first support member 230, the engagement member SL, and the second base substrate 220.

As shown in FIG. 7E, the filled second liquid support member 240-LQ is cured to form a second support member 240. The second support member 240 may be cured by heat or light, or may be cured by a drying process.

The second support member 240 may comprise, for example, silicon. The second support member 240 blocks moisture and the like that can penetrate the coupling member SL. The second support member 240 can functionally reinforce the engagement member SL. The area of the intermediate region AR1 defined between the pixel region AR2 and the engagement member SL can be reduced when the second support member 240 has improved moisture barrier function. Therefore, the display device according to the present invention can reduce the bezel area.

The method of manufacturing a display module according to the present invention may further include polishing the upper surface of the second support member 240 and the upper surface 220-US of the second base substrate 220 to have the same plane IP have. The top surface 230W-US of the first support member 230, the top surface 240-US of the second support member 240, and the top surface 220-US of the second base substrate 220, Can define the same plane.

8A to 8E are cross-sectional views illustrating a method of manufacturing a display module according to another embodiment of the present invention. 8A to 8E show a manufacturing method of the display module corresponding to the embodiment shown in Fig. 7A to 7E, the same reference numerals are assigned to the same components as those described in Figs. 7A to 7E, and a detailed description thereof will be omitted.

The first base substrate 210 and the second base substrate 220 are formed on the first base substrate 210 and the first base substrate 210 and the second base substrate 220, A joining member SL is formed between the second base substrate 220 to join the first base substrate 210 and the second base substrate 220 together.

A liquid crystal layer LC is formed between the first base substrate 210 and the second base substrate 220. The liquid crystal layer LC is sealed by the engagement member SL. The coupling member SL protects the liquid crystal layer LC from the external environment.

A first polarizing member 210-1 is formed on the outer surface of the first base substrate 210. [ The first polarizing member OP10-1 covers the entire surface of the first base substrate 210. [ A protective film PF is attached on the outer surface of the second base substrate 220. The protective film PF covers the entire surface of the second base substrate 220.

Through the heating and pressing process (LP), the flexible circuit film (FM) is bonded to the pad region. Then, the second supporting member 240 is filled on the pad region. The second support member 240 is disposed in a space formed by the side surfaces of the first support member 230, the first base substrate 210, the engagement member SL and the second base substrate 220 Lt; / RTI > This will be described with reference to Figs. 7B to 7D, and redundant description will be omitted.

8D and 8E, the protective film PF is removed from the second base substrate 220 after the first support member 230 is formed. The second polarizing member OP20-1 is disposed on the second base substrate 220 from which the protective film PF is removed. The method of manufacturing a display device according to the present invention may further include a step of attaching the protective film PF to the second polarizing member OP20-1 during the bonding process and during the curing process of the second supporting member 240, Can be prevented from being damaged.

The top surface 230W-US of the first support member 230, the top surface 240-US of the second support member 240, and the top surface 220-US of the second base substrate 220, And defines the same plane (IP: see Fig. 8B). And the second polarizing member OP20-1 is disposed on the plane IP. The second polarizing member OP20-1 covers the second base substrate 220 and the first pad region PAD1.

While the present invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that various modifications and changes may be made thereto without departing from the scope of the present invention.

Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

100L: lower protective member 100U: upper protective member
DM: Display module DP: Display panel
230: first support member 240: second support member
250: third supporting member

Claims (19)

A first base substrate including a valid region and a first pad region adjacent to one side of the effective region;
A second base substrate spaced apart from the first base substrate, the second base substrate overlapping the effective region and exposing the first pad region;
An engaging member disposed between the first base substrate and the second base substrate;
A first support member disposed in the first pad region of the first base substrate and spaced apart from the coupling member to define a predetermined space; And
And a second supporting member filled in the predetermined space. The method according to claim 1,
A plurality of first signal lines extending in a first direction and each comprising a wiring portion disposed in the effective region and a pad portion disposed in the first pad region; And
Further comprising a plurality of second signal lines extending in a second direction intersecting the first direction,
Wherein the first supporting member is disposed on a pad portion of each of the first signal lines. 3. The method of claim 2,
Wherein the first base substrate further comprises a second pad region adjacent to the other side of the effective region,
The second signal lines include a wiring portion disposed in the effective region and a plurality of pad portions connected to the wiring portion and disposed in the second pad region,
And the first support member is disposed in each of the first and second pad regions. The method of claim 3,
And at least one first driving chip electrically connected to the pad portions of the first signal lines to apply a voltage to the pad portions of the first signal lines,
Wherein the first driving chip is arranged to overlap the pad portions of the first signal lines of the first pad region,
Wherein the first supporting member is disposed on the first driving chip. 5. The method of claim 4,
A flexible circuit film connected to the pad portions of the second signal lines;
A second driving chip mounted on the flexible circuit film;
And a main circuit board connected to the flexible circuit film,
Wherein the first supporting member is disposed on the flexible circuit film. The method according to claim 1,
Wherein the coupling member is disposed along an edge of the second base substrate in a plan view. The method according to claim 6,
Wherein the first support member comprises:
A planar portion disposed in the first pad region; And
And at least one partition wall portion bent from the flat portion and facing the coupling member. 8. The method of claim 7,
Wherein the upper surface of the partition wall defines a plane same as the upper surface of the second base substrate. 9. The method of claim 8,
And the upper surface of the second support member defines a plane that is the same as the upper surface of the partition wall portion and the upper surface of the second base substrate. 10. The method of claim 9,
A first optical member disposed below the first base substrate; And
And a second optical member disposed on the second base substrate
Wherein the first optical member and the second optical member overlap the effective region. 11. The method of claim 10,
Wherein the second optical member is disposed on a plane defined by the upper surface of the partition wall portion, the upper surface of the second support member, and the upper surface of the second base substrate, and covers the pad region. 10. The method of claim 9,
A side wall portion covering an edge of the first base substrate and the partition portion of the first support member; And
And a cover member folded from the side wall portion and including an upper portion covering the first pad region,
Wherein the upper portion is disposed on a plane defined by a top surface of the partition wall portion, a top surface of the second support member, and an upper surface of the second base substrate. 13. The method of claim 12,
And the upper end of the upper part overlaps with the engaging member. 8. The method of claim 7,
Wherein the barrier ribs are provided in a plurality of spaced-
And a third support member for filling between the plurality of partition portions. The method according to claim 1,
And the second supporting member comprises silicon. 16. The method of claim 15,
Wherein the second supporting member further comprises black pigment particles. Providing a display panel including a pad region on at least one side thereof;
Disposing a driving circuit portion in the pad region of the display panel;
Disposing a first support member on the drive circuit portion;
Bonding the driving circuit portion to the display panel; And
And filling a space defined by the first support member and the display panel with a second support member. 18. The method of claim 17,
Further comprising the step of polishing the upper surface of the second support member such that the upper surface of the second support member is flush with the upper surface of the display panel. Providing a display panel including a pad region on at least one side thereof;
Attaching a first optical member to the lower surface of the display panel and attaching a protective film on the upper surface of the display panel;
Disposing a flexible circuit film on the pad region of the display panel;
Disposing a first support member on the flexible circuit film;
Bonding the flexible circuit film to the display panel;
Filling the space defined by the first support member and the display panel with a second support member;
Removing the protective film from the upper surface of the display panel; And
And attaching a second optical member to the upper surface of the display panel to cover the pad area.

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