JP4577375B2 - Electro-optical device and electronic apparatus - Google Patents

Description

  The present invention relates to an electronic apparatus such as a personal computer or a mobile phone, and an electro-optical device used in the electronic apparatus.

  2. Description of the Related Art Conventionally, electro-optical devices such as liquid crystal devices have been used as display devices for electronic devices such as personal computers and mobile phones. This liquid crystal device includes, for example, a liquid crystal panel in which liquid crystal is sealed between two substrates, and a liquid crystal panel heater that warms the liquid crystal panel in order to improve the response speed of the liquid crystal at a low temperature. The liquid crystal panel heater includes, for example, a transparent conductive film disposed on a substrate of the liquid crystal panel and a pair of electrode terminals formed on the transparent conductive film. The pair of electrode terminals are electrodes for applying a voltage to the transparent conductive film, for example, and are arranged in a strip shape.

  And in order to prevent the curvature of the board | substrate of a liquid crystal panel, the technique which provides a some hole in the electrode terminal of a liquid crystal panel heater is disclosed (for example, refer patent document 1).

JP 2001-242439 A (paragraph [0020], FIG. 1)

  However, in the above-described technique, since the electrode is exposed, the electrode may be corroded, and there is a problem that the electrical reliability of the connection between the transparent conductive film and the electrode is lowered.

  The present invention has been made in view of the above-described problems, and provides an electro-optical device excellent in adhesion and electrical reliability in connection between a transparent conductive film and an electrode, and an electronic apparatus including the electro-optical device. For the purpose.

In order to achieve the above object, an electro-optical device according to a main aspect of the present invention includes a first substrate and a second substrate disposed opposite to each other, and the first substrate and the second substrate. An electro-optical panel in which an electro-optical material is sealed with a sealing material provided therebetween; a transparent conductive film disposed on an outer surface of the first substrate or the second substrate; and A substrate having a heater electrode that is connected in an electrically connected manner , the transparent conductive film and the heater electrode, and an adhesive that bonds the transparent conductive film and the substrate, and the heater electrode includes the sealing material It is arrange | positioned in the position which overlaps with a plane .

In the present invention, the heater electrode formed on the substrate is electrically connected to the transparent conductive film. Moreover, the adhesive which adhere | attaches a transparent conductive film and a heater electrode, and a transparent conductive film and a base material is arrange | positioned. Thus, since the heater electrode is covered with the base material, the heater electrode is exposed, and the possibility of corrosion of the heater electrode is reduced. Moreover, the adhesiveness of a transparent conductive film and a heater electrode can be improved by adhere | attaching a transparent conductive film and a base material with an adhesive material.

In addition, the heater electrode is disposed at a position overlapping the sealing material provided between the first substrate and the second substrate. That is, since the heater electrode is disposed at a position close to the electro-optical material, the electro-optical material can be efficiently warmed while preventing the display area of the electro-optical panel from being disturbed and affecting the visual recognition.

According to an aspect of the present invention, the heater electrode has a concave portion formed on an outer edge of the heater electrode, and the adhesive is filled in the concave portion of the heater electrode. To do. Here, the “concave portion” means, for example, a concave portion that is recessed in a direction parallel to a plane on which the electro-optic panel and the transparent conductive film overlap, and a direction perpendicular to the plane from the transparent conductive film side to the substrate side. And a recessed portion that is recessed. Thereby, since a heater electrode has a concave-shaped part into which an adhesive material flows into an outer edge, the contact area of a heater electrode and an adhesive material can be increased. As a result, the adhesive force of the heater electrode to the transparent conductive film can be improved by the adhesive material flowing into the concave portion. For example, when the heater electrode is pressure-bonded to the transparent conductive film via an adhesive, the pressing area is reduced, and for example, the conductive particles in the adhesive can be reliably crushed with a larger force. As a result, the heater electrode and the transparent conductive film can be reliably electrically connected via the conductive particles.
According to another aspect of the invention, the concave portion of the heater electrode includes a first concave portion formed on an outer edge of the side of the heater electrode located on the center side of the electro-optic panel, and the electric electrode. A second concave portion formed on an outer edge of the side of the heater electrode located on the side opposite to the center side of the optical panel, wherein the second concave portion is longer than the first concave portion. It is characterized by being formed long . As a result, more adhesive can be allowed to flow into the second concave portion formed at the outer edge of the side of the heater electrode located on the opposite side of the center side of the electro-optical panel .
Moreover, according to one form of this invention, the said base material is provided with the part which overlaps with the said heater electrode planarly, and the part which does not overlap with the said heater electrode planarly, The said base material is provided with the said heater electrode. And a through hole is formed outside the outer edge of the concave portion of the heater electrode, and the adhesive material is also filled in the through hole. To do.

According to one form of this invention, the side surface of the said heater electrode is coat | covered with the said adhesive material.

According to an embodiment of the present invention, the substrate, the heater electrode and the portion overlapping in a plan view, and includes a portion that does not overlap the heater electrode in plan view, to the substrate, the heater electrode and the plane A through-hole is formed in a portion that does not overlap, and the adhesive is filled in the through-hole . Thereby, since the through-hole is provided at a position that does not overlap with the heater electrode, for example, when the heater electrode is pressure-bonded to the transparent conductive film via an adhesive, the through-hole is provided between the transparent conductive film and the heater electrode. The adhesive can be caused to flow into the through hole. As a result, the electric heater electrode and the base material can be more reliably prevented from floating.

According to one form of this invention, the said recessed part of the said heater electrode and the said recessed part of the said base material are overlapped and provided in the plane. Thereby, since the concave part of the heater electrode and the concave part of the base material are provided so as to overlap in a plane, for example, compared to the case where the concave shape of the heater electrode and the concave part of the base material are different. Thus, for example, the concave portion of the heater electrode and the concave portion of the base material can be collectively formed by punching, so that the cost can be reduced.

According to an aspect of the present invention, the adhesive is an anisotropic conductive film. Thereby, since the adhesive is an anisotropic conductive film, the conductive particles in the anisotropic conductive film are crushed by pressing the heater electrode against the transparent conductive film via the anisotropic conductive film. There is a need. For this reason, it is necessary to press a heater electrode and a base material with a predetermined pressure. At this time, the adhesive is pushed out into the concave portion of the heater electrode. As a result, the adhesive extruded into a concave portion of the heater electrode, the adhesive area is increased, thereby improving the adhesion of the heater electrode. Moreover, the base material can be reliably adhered to the transparent conductive film by the pressure-sensitive adhesive that is pushed out to at least the outer edge of the heater electrode. Furthermore, since the pressing area of the heater electrode is smaller than when the heater electrode is solid, the pressure applied to the conductive particles increases, and the conductive particles are reliably crushed and the conductive particles between the heater electrode and the transparent conductive film are interposed. The reliability of the electrical connection made can be improved.

  An electronic component according to another aspect of the present invention includes the above-described electro-optical device.

In the present invention, since the electro-optical device having excellent adhesion and electrical reliability in connection between the transparent conductive film and the heater electrode is provided, for example, the transparent conductive film is surely provided via the first and second heater electrodes. By supplying electricity to the liquid crystal panel, the liquid crystal panel is heated to improve the response speed of the liquid crystal, and an electronic device with excellent display quality can be obtained.
Moreover, according to one form of this invention, a base material has the recessed part or the through-hole formed along the edge | side of this base material, and the adhesive material is also filled also into the recessed part or the through-hole. For this reason, for example, when the heater electrode is pressure-bonded to the transparent conductive film via an adhesive, the adhesive flows into the concave portion or the through hole of the base material. As a result, the contact area between the base material and the adhesive material is increased by the adhesive material flowing into the concave portion or the through-hole, and the adhesive force of the base material can be improved. Here, the “concave portion” means, for example, a concave portion that is recessed in a direction parallel to a plane in which the electro-optical panel and the transparent conductive film overlap, and a direction perpendicular to the plane from the transparent conductive film side to the substrate side. And a recessed portion that is recessed.
Further, according to one embodiment of the present invention, the heater electrode is formed in a range where the planar shape is the same as or narrower than that of the base material, and the transparent conductive film is electrically connected via the adhesive. A transparent conductive film and a base material can be reliably adhere | attached with a material. Thereby, the adhesiveness of a transparent conductive film and a heater electrode can be improved. In addition, since the heater electrode is formed in the same or narrow range as the planar shape of the substrate, the substrate has a planar shape larger than the heater electrode, and the substrate covers the heater electrode. The heater electrode is sealed by the base material and the adhesive. For this reason, it can prevent that a heater electrode corrodes under the influence from the outside, and can improve the electrical reliability of the connection of a heater electrode and a transparent conductive film.

  Embodiments according to the present invention will be described below with reference to the drawings. In the following description of the embodiments, a liquid crystal device as an electro-optical device, specifically a reflective transflective TFT (Thin Film Transistor) active matrix liquid crystal device, and an electronic device using the liquid crystal device The device will be described but is not limited to this. Moreover, in the following drawings, in order to make each structure easy to understand, the actual structure and the scale and number of each structure are different.

  (First embodiment)

  1 is a schematic perspective view of a liquid crystal device according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA of the liquid crystal device in FIG. 1, FIG. 3 is a bottom view of the liquid crystal device in FIG. FIG. 4 is a plan view of a region E (first heater electrode) of the liquid crystal device of FIG. 3.

  (Configuration of liquid crystal device)

  The liquid crystal device 1 includes a liquid crystal panel 2, a circuit board 3 connected to the liquid crystal panel 2, and a liquid crystal panel heater 4 for heating the liquid crystal panel 2. The liquid crystal device 1 is provided with other auxiliary mechanisms such as a frame, a polarizing plate, etc. (not shown) that support the liquid crystal panel 2 as necessary.

  The liquid crystal panel 2 includes a substrate 5, a substrate 6 provided so as to face the substrate 5, a sealing material 7 provided between the substrates 5 and 6, and a liquid crystal (not shown) sealed by the substrates 5 and 6. It has. For example, TN (Twisted Nematic) is used for the liquid crystal.

  The substrate 5 and the substrate 6 are plate-like members made of a light-transmitting material such as glass or synthetic resin. A gate electrode 8, a source electrode 9, a thin film transistor element T and a pixel electrode 10 are formed on the liquid crystal side of the substrate 5, and a common electrode 6 a is formed on the liquid crystal side of the substrate 6.

  The gate electrode 8 is formed in the X direction, and the source electrode 9 is formed in the Y direction, for example, by a metal material such as aluminum. The source electrode 9 is formed, for example, as shown in FIG. 1, with the upper half routed to the left side and the lower half routed to the right side. Note that the numbers of the gate electrode 8 and the source electrode 9 can be appropriately changed according to the resolution of the liquid crystal device 1 and the size of the display area.

  The thin film transistor element T includes three terminals connected to the gate electrode 8, the source electrode 9, and the pixel electrode 10, respectively. The thin film transistor element T is connected to the pixel electrode 10, the gate electrode 8, and the source electrode 9. Thereby, when a voltage is applied to the gate electrode 8, a current flows from the source electrode 9 to the pixel electrode 10 or vice versa.

  The substrate 5 includes a region (hereinafter referred to as “projected portion”) 5 a that projects from the outer edge of the substrate 6. On the surface of the projecting portion 5a, input wirings 11 to 13 and output wirings 14 to 16 are attached, and for example, driver ICs 17, 18, and 19 for driving liquid crystal are mounted.

  As shown in FIG. 2, the substrate-side input terminal 11 a, which is one end of the input wiring 11, is connected to a driver-side input terminal 23 of a driver IC 17 to be described later via conductive particles 28. The other end 11 b of the input wiring 11 is connected to a wiring 36 attached to the flexible base 31 of the circuit board 3 via an ACF (not shown). The input wirings 12 and 13 have input terminals (not shown) at one end respectively connected to driver side input terminals (not shown) of the driver ICs 18 and 19.

  As shown in FIG. 2, the output wiring 14 has a substrate-side output terminal 14 a, which is one end thereof, connected to the driver-side output terminal 24 of the driver IC 17 through conductive particles 28. The other end of the output wiring 14 is connected to the gate electrode 8. The output wirings 15 and 16 have output terminals (not shown) at one ends thereof connected to driver output terminals (not shown) of the driver ICs 18 and 19, respectively.

  As shown in FIG. 2, the driver IC 17 is bonded to the substrate 5 by, for example, an ACF 25 provided between the driver IC 17 and the substrate 5.

  As shown in FIG. 2, the driver IC 17 includes, for example, aluminum electrode pads 21 and 22 provided on the side of the mounting surface 20 a facing the substrate 5 of the base material 20, and electrode pads 21 and 22. A plurality of driver-side input terminals 23 and a plurality of driver-side output terminals 24 that are respectively connected and projecting from the mounting surface 20a side of the driver IC 17 are provided.

  The electrode pads 21 are arranged in the arrangement direction (Y direction) of the gate electrodes 8 on the mounting surface 20a side of the substrate 20. The electrode pads 22 are provided so as to be separated from the electrode pads 22 and arranged in the arrangement direction (Y direction) of the gate electrodes 8 on the mounting surface 20 a side of the base material 20.

  The driver side input terminal 23 and the driver side output terminal 24 are connected to the electrode pads 21 and 22 shown in FIG. 2, respectively, and are arranged in the arrangement direction (Y direction) of the gate electrodes 8, respectively.

  The ACF 25 is configured such that conductive particles 28 in which, for example, resin-made elastic particles are covered with a metal film are included in an adhesive 29 of the ACF 25.

  As shown in FIG. 1, the circuit board 3 is connected to the projecting portion 5a via an adhesive such as ACF. The circuit board 3 is mounted on the flexible base material 31 in order to control the flexible base material 31, the output wiring 32 provided on the flexible base material 31, the input wiring 33, and the driver IC 17, for example. And a semiconductor IC 34.

  As shown in FIG. 1, the output wiring 32 is routed in the X direction, for example, and one end of the output wiring 32 is provided in the through hole shown in FIG. 2 formed in the flexible base 31. Is connected to the end of the wiring 36 attached to the flexible base 31. The other end of the output wiring 32 is connected to an output terminal (not shown) of the semiconductor IC 34 via an ACF or the like.

  As shown in FIG. 1, the input wiring 33 is routed, for example, in the X direction. As shown in FIG. 1, one end of the input wiring 33 is connected to, for example, an input terminal (not shown) of the semiconductor IC 34 via an ACF or the like. The other end of the input wiring 33 is connected to an external device (not shown), for example.

  As shown in FIGS. 1 to 3, the liquid crystal panel heater 4 is electrically connected to the transparent conductive film 41 (see FIG. 1) disposed so as to overlap the substrate 5 in a planar manner. The first heater electrode 42 and the second heater electrode 43 (see FIG. 3), and the first heater flexible substrate 44 disposed so as to cover the first heater electrode 42 and the second heater electrode 43. The second heater flexible substrate 45 (see FIG. 3) and at least the first heater flexible substrate 44, the second heater flexible substrate 45, and the transparent conductive film 41 are disposed. The ACF 46, the first heater electrode 42, the second heater electrode 43, the first heater wire 47, the second heater wire 48, and a power source (not shown) are provided. As this power source, for example, a DC power source is used.

  As shown in FIG. 2, for example, the transparent conductive film 41 is disposed on substantially the entire surface 5 </ b> A (outer surface) of the substrate 5 opposite to the substrate 6 side. As a constituent material of the transparent conductive film 41, for example, ITO (Indium Tin Oxide) which is a transparent material is used.

  As shown in FIG. 3, the first heater electrode 42 is disposed over a direction (Y direction in FIG. 3) perpendicular to the longitudinal direction of the liquid crystal panel 2 (X direction in FIG. 3). As shown in FIG. 5, the transparent conductive film 41 is electrically connected through the ACF 46 (conductive particles 46A). As shown in FIG. 3, the first heater electrode 42 is electrically connected at the end of one side (the projecting portion 5 a side) of the liquid crystal panel 2 in the longitudinal direction (X direction in FIG. 3).

  As shown in FIG. 4, the first heater electrode 42 is formed in a narrower range (or the same range) in plan than the first heater flexible substrate 44. Note that the first heater electrode 42 may be formed in the same range as the first heater flexible substrate 44 in a plane. As shown in FIG. 4, the first heater electrode 42 has a concave shape. For example, as shown in FIG. 4, the first heater electrode 42 has a rectangular shape whose width in the longitudinal direction (X direction in FIG. 3) of the liquid crystal panel 2 is the first width w <b> 1. A plurality of first concave portions 42A arranged in the width direction (Y direction in FIG. 3) on the center side, and arranged in the width direction (Y direction in FIG. 3) on the side opposite to the center side of the liquid crystal panel 2. And a plurality of second concave portions 42B. The first heater electrode 42 is gold plated.

  As shown in FIG. 4, the first concave portion 42 </ b> A is formed on the outer edge of the first heater electrode 42, and is recessed in the longitudinal direction (X direction in FIG. 3) so as to be away from the center of the liquid crystal panel 2. Yes. The second concave portion 42 </ b> B is formed on the outer edge of the first heater electrode 42, and is recessed in the longitudinal direction (X direction in FIG. 3) so as to approach the center of the liquid crystal panel 2. The length d2 that the second concave portion 42B is recessed is longer than the length d1 that the first concave portion 42A is recessed.

  The second heater electrode 43 is different from the first heater electrode 42 in the position where it is electrically connected to the transparent conductive film 41 via the ACF 56 as shown in FIG. As shown in FIG. 3, the second heater electrode 43 is formed on the transparent conductive film 41 at the end opposite to the projecting portion 5a, which is the other side of the liquid crystal panel 2 in the longitudinal direction (X direction in FIG. 3). They are electrically connected via ACF 56 (conductive particles not shown).

  The first heater flexible substrate 44 is formed of a resin material such as polyimide, for example. As shown in FIGS. 2 to 4, the first heater flexible substrate 44 is disposed so as to cover the first heater electrode 42. The first heater flexible substrate 44 has a larger planar shape than the first heater electrode 42. The second width w2, which is the width of the first heater flexible substrate 44, is larger than the first width w1 of the first heater electrode 42 as shown in FIG. As shown in FIGS. 2 to 4, the first heater flexible substrate 44 has a plurality of through holes 44 a. As shown in FIG. 4, the through hole 44 a is formed at a position that does not overlap the first heater electrode 42 in a plan view. As shown in FIG. 4, the through hole 44 a is disposed outside the outer edge of the first heater electrode 42 along each side of the pair of sides of the first heater flexible substrate 44. Yes. The ACF 46 flows into the through-hole 44a as shown in FIGS.

  As shown in FIG. 3, the second heater flexible substrate 45 is different from the first heater flexible substrate 44 in that the second heater flexible substrate 45 is disposed so as to cover the second heater electrode 43. . As shown in FIG. 3, the second heater flexible substrate 45 has a plurality of through-holes 45 a in which ACFs 56 are arranged.

  As shown in FIG. 4, the ACF 46 includes a first concave portion 42 </ b> A and a second concave portion 42 </ b> B of the first heater electrode 42 between the first heater flexible substrate 44 and the transparent conductive film 41. Is flowing into. As shown in FIGS. 2 and 4, the ACF 46 flows into the through hole 44 a of the first heater flexible substrate 44. Furthermore, as shown in FIG. 2, the ACF 46 has a second width that is at least larger than the first width w1 of the first heater electrode 42 between the transparent conductive film 41 and the first flexible substrate 44 for heater. It is arranged at w2. The ACF 46 overlaps at least the first heater electrode 42 in a plane between the first heater flexible substrate 44 and the transparent conductive film 41 and exists outside the outer edge 42 </ b> H of the first heater electrode 42. is doing.

  The first heater wiring 47 includes a first wiring 49 drawn out from the first heater electrode 42 and a first heater wiring board 50 extended from the first heater flexible board 44. I have. The first wiring 49 is connected to, for example, a positive terminal of a power source (not shown).

  The second heater wiring 48 includes a second wiring 51 drawn out from the second heater electrode 43 and a second heater wiring board 52 extended from the second heater flexible board 45. I have. The second wiring 51 is connected to, for example, a ground electrode of a power source (not shown).

  (Manufacturing method of the liquid crystal device 1)

  Next, a method for manufacturing the liquid crystal device 1 will be described with reference to the drawings.

  FIG. 5 is a flowchart showing manufacturing steps of the liquid crystal device 1 according to the first embodiment. In the present embodiment, the process of connecting the liquid crystal panel heater 4 to the liquid crystal panel and the like (steps S2 to S3) will be mainly described.

  First, for example, the liquid crystal panel 2 is manufactured (step S1).

  Next, a transparent conductive film 41 is formed on one surface 5A of the substrate 5 of the liquid crystal panel 2 so as to cover substantially the entire surface, for example (step S2). Note that a polarizing plate or the like is not disposed on one surface 5A of the substrate 5.

  Next, for example, the first heater flexible substrate 44 in which the first heater electrode 42 is patterned is subjected to, for example, etching or laser processing to form a through hole 44a. 44 is manufactured.

  Next, the ACF 46 including the conductive particles 46 </ b> A is pasted on the transparent conductive film 41 disposed at the end of the liquid crystal panel 2 on the protruding portion 5 a side. Then, the first heater electrode 42 formed on the first heater flexible substrate 44 is positioned so as to overlap the ACF 46 in a planar manner, and the first heater flexible substrate is formed by a pressure bonding head (not shown). 44 together with the first heater electrode 42 (step S3).

  At this time, as shown in FIG. 4, the ACF 46 disposed between the first heater flexible substrate 44 and the transparent conductive film 41 has, for example, the first concave portion 42A and the first concave portion 42A in the arrow P direction. 2 is pushed out into the concave portion 42B. As a result, the ACF 46 flows into the first concave portion 42A and the second concave portion 42B. Further, the ACF 46 is pushed out into a through-hole 44 a formed in the first heater flexible substrate 44. As a result, the ACF 46 flows into the through hole 44a. Furthermore, the ACF 46 is disposed between the transparent conductive film 41 and the first heater flexible substrate 44 with at least the second width w2. As a result, the amount of ACF 46 protruding outside the first concave portion 42A is smaller than the amount of ACF 46 protruding outside the second concave portion 42B.

  Then, the liquid crystal panel 2 and the circuit board 3 manufactured in step S4 are electrically connected via a conductive adhesive (not shown) or the like (step S5), and a backlight, a polarizing plate, a reflective sheet, etc. are connected. The liquid crystal device 1 is manufactured by providing the liquid crystal device 1 (step S6).

  This is the end of the description of the method for manufacturing the liquid crystal device 1.

  Thus, according to the present embodiment, the liquid crystal panel 2 having the substrates 5 and 6 sandwiching the liquid crystal, the transparent conductive film 41 disposed on the outer surface side of the substrate 5, the transparent conductive film 41 and the ACF 46 are interposed. A first heater flexible substrate 44 having a first heater electrode 42 that is electrically connected, and the first heater electrode 42 is more planar than the first heater flexible substrate 44. The first heater flexible substrate 44 has a through hole 44a formed on the side surface of the first heater flexible substrate 44, and the ACF 46 also fills the through hole 44a. Has been. Therefore, the transparent conductive film 41 and the first heater flexible substrate 44 can be reliably bonded by the ACF 46 flowing into the through-hole 44a. Thereby, for example, the outer edge side of the first heater flexible substrate 44 where the first heater flexible substrate 44 is most easily peeled can be reliably bonded by the ACF 46. As a result, the adhesion between the transparent conductive film 41 and the first heater electrode 42 can be improved.

  The first heater electrode 42 is formed in a range where the planar shape is narrower than that of the first heater flexible substrate 44, and the first heater electrode 42 is disposed so as to cover the first heater electrode 42. Since the flexible substrate 44 is provided, the first heater electrode 42 is hermetically sealed by the first heater flexible substrate 44 and the ACF 46. For this reason, it is possible to prevent the first heater electrode 42 from corroding due to the influence from the outside, and to improve the electrical reliability of the connection between the first heater electrode 42 and the transparent conductive film 41.

  Further, the first heater electrode 42 includes a first concave portion 42A and a second concave portion 42B into which the ACF 46 has flowed. For this reason, it is possible to increase the adhesion area between the first heater electrode 42 having the first concave portion 42A and the second concave portion 42B and the ACF 46. As a result, the adhesive force of the first heater electrode 42 to the transparent conductive film 41 can be improved by the ACF 46 flowing into the first concave portion 42A and the second concave portion 42B. For example, when the first heater electrode 42 is pressure-bonded to the transparent conductive film 41 via the ACF 46, the pressing area is reduced, and for example, the conductive particles 46A in the ACF 46 can be reliably crushed with a larger force. . As a result, the transparent conductive film 41 and the first heater electrode 42 can be reliably electrically connected via the conductive particles 46A of the ACF 46.

  The ACF 46 flows into the through hole 44 a of the first heater flexible substrate 44 when the first heater electrode 42 is pressure-bonded to the transparent conductive film 41. As a result, the contact area between the ACF 46 and the first heater flexible substrate 44 is increased by the ACF 46 flowing into the through-hole 44a, and the adhesive force of the first heater flexible substrate 44 can be improved. .

  Further, since the through hole 44a is provided outside the outer edge of the first heater electrode 42 along each side of the pair of sides of the first heater flexible substrate 44, for example, the ACF 46 is provided. When the first heater electrode 42 is pressure-bonded to the transparent conductive film 41, the ACF 46 between the transparent conductive film 41 and the first heater electrode 42 can immediately flow into the through hole 44a. Thereby, the floating of the first heater electrode 42 and the first heater flexible substrate 44 can be prevented more reliably.

  The first heater electrode 42 includes a plurality of first concave portions 42 </ b> A formed on the center side of the liquid crystal panel 2, and a plurality of second concave portions 42 </ b> B on the side opposite to the center side of the liquid crystal panel 2. It has. In addition, the length d2 that the second concave portion 42B is recessed is longer than the length d1 that the first concave portion 42A is recessed. Therefore, for example, when the first heater electrode 42 is pressure-bonded to the transparent conductive film 41 via the ACF 46, more ACFs 46 are provided between the plurality of first concave portions 42A than between the plurality of second concave portions 42B. Can be introduced. Therefore, it is possible to secure a region where the ACF 46 is not disposed on the center side of the liquid crystal panel 2 and securely dispose a polarizing plate (not shown) or the like in this region.

  Further, the first heater electrode 42 is connected to the first wiring 49 at the first corner K1 of the liquid crystal panel 2, and the second heater electrode 43 is a liquid crystal facing the first corner K1. The panel 2 is connected to the second wiring 51 at the second corner K2 (second corner K2 on the diagonal L of the liquid crystal panel 2 passing through the first corner K1). As a result, for example, the liquid crystal panel 2 is heated from the position near the first corner K1 of the liquid crystal panel 2 via the first wiring 49, and the second of the liquid crystal panel 2 via the second wiring 51. The liquid crystal panel 2 can be heated starting from a position near the corner K2. Therefore, the planar deviation of the heat supplied when the liquid crystal panel 2 is heated can be reduced, and the liquid crystal panel 2 can be heated without planar deviation.

  In addition, since the transparent conductive film 41 is formed on the one surface 5A of the substrate 5, the liquid crystal device 1 can be thinned and an increase in manufacturing steps can be suppressed.

  The first heater electrode 42 is disposed not at a position where the first heater electrode 42 is planarly overlapped with the driver ICs 17 to 19 but at a position where the first heater electrode 42 is planarly overlapped with the sealing material 7 provided between the substrates 5 and 6. Thereby, when the first heater electrode 42 is pressure-bonded to the substrate 5, the flatness can be easily maintained and the pressure can be reliably bonded. In addition, since the first heater electrode 42 is disposed at a position close to the liquid crystal (a position overlapping the sealing material 7 in a plane), the liquid crystal can be efficiently heated.

  In addition, when there is a possibility that static electricity is charged on the surface of the liquid crystal panel of the liquid crystal device, the transparent conductive film 41 may also be used to release the charged electricity (FFS (Fring Field Switching)).

  FIG. 6 is a partial plan view of a heater electrode (solid electrode) of another liquid crystal device, and FIG. 7 is a cross-sectional view taken along the line BB of the liquid crystal device of FIG.

  As shown in FIGS. 6 and 7, the liquid crystal device includes a rectangular first heater electrode 70 as shown in FIG. 6 instead of the concave first heater electrode 42 of the first embodiment. ing.

  As shown in FIGS. 6 and 7, the first heater electrode 70 has a rectangular shape having a first width w <b> 1 that is smaller than the second width w <b> 2 of the first heater flexible substrate 44. . As shown in FIG. 6, the first heater electrode 70 is disposed at a position separated from the through hole 44 a formed in the first heater flexible substrate 44 in the width direction (X direction in FIG. 6). Yes.

  As shown in FIGS. 6 and 7, the first heater flexible substrate 44 has a plurality of through holes 44a. As shown in FIGS. 6 and 7, in addition to the transparent conductive film 41 and the first flexible heater substrate 44, the ACF 71 flows into the through hole 44a.

  As described above, since the ACF 71 flows into the through-hole 44a in addition to the gap between the transparent conductive film 41 and the first heater flexible substrate 44, the ACF 71 and the first heater flow into the through-hole 44a. It is possible to increase the bonding area with the one heater flexible substrate 44. As a result, the adhesion between the first heater electrode 70 via the ACF 71 and the transparent conductive film 41 can be improved. In addition, when the first heater electrode 70 is formed on the first heater flexible substrate 44, it is not necessary to form an electrode pattern, so that the cost can be reduced.

  (First modification)

  Next, a liquid crystal device according to a first modification of the present invention and a method for manufacturing the liquid crystal device will be described. In addition, after this modification, the same code | symbol is attached | subjected to the same component as the said embodiment, the description is abbreviate | omitted, and it demonstrates centering on a different location.

  8 is a schematic perspective view of the liquid crystal device of the first modification, FIG. 9 is a cross-sectional view taken along the line C-C of the liquid crystal device of FIG. 8, and FIG. It is a top view.

  A liquid crystal device 1 ′ according to this modification includes a liquid crystal panel 2 ′, a circuit board 3 connected to the liquid crystal panel 2 ′, and a liquid crystal panel heater 4 ′. Note that the configuration and the like of the circuit board 3 are substantially the same as those in the first embodiment, and thus description thereof is omitted.

  In the liquid crystal panel 2 ′, for example, a polarizing plate 55 or the like is disposed outside the substrate 5 as compared with the liquid crystal panel 2 of the first embodiment.

  As shown in FIGS. 8 and 9, the liquid crystal panel heater 4 ′ includes a transparent substrate 60, a transparent conductive film 41 ′ disposed on the substrate 60, and a first electrically connected to the transparent conductive film 41 ′. Heater electrode 42 ′, second heater electrode 43 ′, first heater electrode 42 ′, first heater flexible substrate 44 ′ disposed so as to cover the second heater electrode 43 ′, Two heater flexible substrates 45 ′ and at least the first heater flexible substrate 44 ′, the second heater flexible substrate 45 ′, and the ACF 46 ′ disposed between the transparent conductive film 41 ′. And a first heater wire 47 ′ and a second heater wire 48 ′ drawn from the first heater electrode 42 ′, the second heater electrode 43 ′, etc., and a power source (not shown). As this power source, for example, a DC power source is used.

  The substrate 60 is a plate-like member made of a light-transmitting material such as glass or synthetic resin.

  As shown in FIG. 9, the transparent conductive film 41 'is disposed, for example, on substantially the entire surface 60A of the substrate 60 on the substrate 5 side (see FIG. 8). For example, ITO, which is a transparent material, is used as a constituent material of the transparent conductive film 41 '.

  As shown in FIG. 8, the first heater electrode 42 ′ is arranged over a direction (Y direction in FIG. 8) perpendicular to the longitudinal direction (X direction in FIG. 8) of the liquid crystal panel 2. 9, it is electrically connected to the transparent conductive film 41 ′ via the ACF 46 ′ (conductive particles 46 A ′). As shown in FIG. 8, the first heater electrode 42 ′ is connected to the transparent conductive film 41 ′ at the end portion on the protruding portion 5 a side that is one side of the liquid crystal panel 2 in the longitudinal direction (X direction in FIG. 8). ing.

  As shown in FIG. 10, the first heater electrode 42 'has a concave shape. For example, as shown in FIG. 10, the first heater electrode 42 ′ has a width in the longitudinal direction (X direction in FIG. 10) of the liquid crystal panel 2 that is the first width w1, and the center side of the liquid crystal panel 2 ′. The plurality of first concave portions 42A ′ arranged in the width direction (Y direction in FIG. 10) and the width direction (Y direction in FIG. 10) on the side opposite to the center side of the liquid crystal panel 2. And a plurality of second concave portions 42B ′.

  As shown in FIG. 10, the first concave portion 42 </ b> A ′ is recessed in the longitudinal direction (X direction in FIG. 8) so as to be away from the center of the liquid crystal panel 2 on the side surface of the first heater electrode 42 ′. The second recessed portion 42B 'is recessed in the longitudinal direction (X direction in FIG. 10) so as to approach the center of the liquid crystal panel 2 on the side surface of the first heater electrode 42'. The length d2 'in which the second concave portion 42B' is recessed is longer than the length d1 'in which the first concave portion 42A' is recessed.

  As shown in FIG. 9, the second heater electrode 43 ′ differs from the first heater electrode 42 ′ in the position where it is electrically connected to the transparent conductive film 41 ′ via the ACF 56 ′. As shown in FIG. 9, the second heater electrode 43 ′ has a transparent conductive film 41 at the end opposite to the protruding portion 5a side, which is the other side of the liquid crystal panel 2 in the longitudinal direction (X direction in FIG. 9). As shown in FIG. 9, it is electrically connected to 'through ACF 56' (conductive particles 56A ').

  The first heater flexible substrate 44 ′ is formed of a resin material such as polyimide, for example. As shown in FIGS. 8 to 10, the first heater flexible substrate 44 ′ is disposed so as to cover the first heater electrode 42 ′. The second width w2, which is the width of the first heater flexible substrate 44 ', is substantially the same as the first width w1 of the first heater electrode 42', as shown in FIG. A concave portion is formed along each side of the pair of sides of the first heater flexible substrate 44 ′. For example, as shown in FIG. 10, a plurality of third concave portions 44A 'and fourth concave portions 44B' are formed. The third concave portion 44A 'is disposed so as to overlap the first concave portion 42A' of the first heater electrode 42 'in a plane. The fourth concave portion 44B 'is disposed so as to overlap the second concave portion 43B' of the second heater electrode 43 'in a plane.

  As shown in FIG. 9, the second heater flexible substrate 45 ′ overlaps and covers the second heater electrode 43 ′ as compared with the first heater flexible substrate 44 ′. It is different in that it is arranged in.

  The ACF 46 ′ is formed between the first flexible heater substrate 44 ′ and the transparent conductive film 41 ′ as shown in FIG. 9, and the first concave portion of the first heater electrode 42 ′ as shown in FIG. 42A ′ is flowing into the second concave portion 42B ′. Further, as shown in FIGS. 9 and 10, the ACF 46 ′ has at least a first width of the first heater electrode 42 ′ between the transparent conductive film 41 ′ and the first heater flexible substrate 44 ′. The first heater flexible substrate 44 'is arranged with the second width w2 substantially the same as w1. The same applies to the ACF 56 '.

  As shown in FIG. 8, the first heater wiring 47 ′ is extended from the first wiring 49 ′ drawn from the first heater electrode 42 ′ and the first heater flexible substrate 44 ′. And a first heater wiring board 50 '. The first wiring 49 'is connected to, for example, a positive terminal of a power source (not shown).

  As shown in FIG. 8, the second heater wiring 48 ′ is extended from the second wiring 51 ′ drawn from the second heater electrode 43 ′ and the second heater flexible substrate 45 ′. And a second heater wiring board 52 '. The second wiring 51 'is connected to, for example, a ground electrode of a power source (not shown).

  (Manufacturing method of liquid crystal device 1 ')

  Next, a method for manufacturing the liquid crystal device 1 ′ will be described with reference to the drawings.

  In this modified example, the manufacturing process of the circuit board 3 is the same as that of the known technique, so that the description thereof is omitted, and the process of connecting the liquid crystal panel heater 4 ′ to the liquid crystal panel 2 ′ will be mainly described.

  First, for example, a liquid crystal panel 2 'is manufactured. At this time, the polarizing plate 55 and the like are disposed outside the substrate 5.

  Next, a transparent conductive film 41 ′ is formed so as to cover substantially the entire surface 60 </ b> A of the substrate 60.

  Next, for example, punching is performed on the wiring substrate in which the metal film to be the first heater electrode 42 ′ is formed on the flexible substrate to be the first heater flexible substrate 44 ′. 1st heater electrode 42 'in which the concave part 42A' and 2nd concave part 42B 'were formed is manufactured.

  Next, ACF 46 ′ including conductive particles 46 </ b> A ′ is pasted on the transparent conductive film 41 ′ on one end side of the substrate 60, and ACF 56 ′ is pasted on the other end side. Then, the first heater electrode 42 ′ formed on the first heater flexible substrate 44 ′ is positioned so as to overlap the ACF 46 ′ in a plan view, and the first heater can be used by a pressure bonding head (not shown). The flexible substrate 44 'and the first heater electrode 42' are heat-bonded (the same applies to the second heater electrode 43 'side).

  At this time, the ACF 46 ′ disposed between the first flexible heater substrate 44 ′ and the transparent conductive film 41 ′ has, for example, a first concave portion in the direction of arrow P as shown in FIG. 42A ′ and the second concave portion 42B ′ are pushed out. As a result, the ACF 46 ′ flows into the first concave portion 42 </ b> A ′ and the second concave portion 42 </ b> B ′. Further, ACF 46 ′ flows at least in the second width w 2 between the transparent conductive film 41 ′ and the first heater flexible substrate 44 ′.

  Then, the liquid crystal panel 2 and the circuit board 3 are electrically connected via a conductive adhesive or the like (not shown), and a liquid crystal device 1 ′ is manufactured by providing a backlight or the like.

  This is the end of the description of the manufacturing method of the liquid crystal device 1 '.

  According to such a configuration, the first heater electrode 42 ′ has the first concave shape into which the ACF 46 ′ flows when the first heater electrode 42 ′ is pressure-bonded to the transparent conductive film 41 ′ via the ACF 46 ′. A portion 42A ′ and a second concave portion 42B ′ are provided. For this reason, the contact area between the ACF 46 ′, the first concave portion 42 </ b> A ′, and the second concave portion 42 </ b> B ′ can be increased. As a result, the adhesive force between the first heater electrode 42 'and the first heater flexible substrate 44' is improved by the ACF 46 'flowing into the first concave portion 42A' and the second concave portion 42B '. Can do. For example, when the first heater electrode 42 ′ is pressure-bonded to the transparent conductive film 41 ′, the pressing area is reduced, and the conductive particles 46 A ′ in the ACF 46 ′ can be reliably crushed with a larger force. As a result, the transparent conductive film 41 ′ and the first heater electrode 42 ′ can be reliably electrically connected via the conductive particles 46 </ b> A ′ of the ACF 46 ′.

  The third concave portion 44A ′ and the fourth concave portion 44B ′ of the first heater flexible substrate 44 ′ are the first concave portion 42A ′ and the second concave shape of the first heater electrode 42 ′. The portion 42B ′ is provided so as to overlap with the plane. For this reason, for example, the first concave portion 42A ′ and the second concave portion 42B ′ of the first heater electrode 42 ′, the third concave portion 44A ′ of the first flexible substrate 44 ′ for the heater, Compared to the case where the shape of the fourth concave portion 44B ′ is different, the first concave portion 42A ′ and the third concave portion 44A ′ (the second concave portion 42B ′ and the fourth concave portion 44B ′). Can be collectively formed by punching, so that the cost can be reduced. Further, for example, when the first heater electrode 42 ′ is pressure-bonded to the transparent conductive film 41 ′ via the ACF 46 ′, the third concave portion 44A ′ of the first heater flexible substrate 44 ′, The ACF 46 ′ is extruded into the four concave portions 44B ′. As a result, the ACF 46 'is more easily pushed out between the transparent conductive film 41' and the first heater flexible substrate 44 ', and the first heater electrode is more easily pressed against the transparent conductive film 41'. 42 'can be crimped. Therefore, the transparent conductive film 41 ′ and the first heater electrode 42 ′ can be more reliably electrically connected via the ACF 46 ′.

  Further, the third concave portion 44A ′ and the fourth concave portion 44B ′ of the first heater flexible substrate 44 ′ are respectively provided on the sides of the pair of the first heater flexible substrate 44 ′. Are provided on the outer side of the outer edge of the first heater electrode 42 ′. For this reason, for example, when the first heater electrode 42 ′ is pressure-bonded to the transparent conductive film 41 ′ via the ACF 46 ′, the ACF 46 ′ between the transparent conductive film 41 ′ and the first heater electrode 42 ′ is It can immediately flow into the first concave portion 42A ′ and the second concave portion 42B ′. Therefore, the ACF 46 ′ is directly introduced into the first concave portion 42A ′ and the second concave portion 42B ′ near the first heater electrode 42 ′, so that the first heater electrode 42 ′ and the first heater electrode 42 ′ It is possible to more reliably prevent the heater flexible substrate 44 'from floating.

  Further, since it is not necessary to crimp the first heater electrode 42 ′ on one surface 5 </ b> A of the substrate 5, the polarizing plate 55 can be easily disposed on the wide one surface 5 </ b> A on the substrate 5.

  Then, after manufacturing the liquid crystal panel 2 ′ and forming the transparent conductive film 41 ′ on the substrate 60, the liquid crystal device 1 ′ can be manufactured by combining them. Therefore, the liquid crystal device 1 'can be easily manufactured.

  In this modification, an example in which the transparent conductive film 41 ′ is formed on the surface of the substrate 60 on the substrate 5 side is shown. However, the transparent conductive film 41 ′ may be formed on the surface of the substrate 60 opposite to the surface on the substrate 5 side.

  (Second modification)

  Next, a liquid crystal device of a second modification according to the present invention will be described.

  FIG. 11 is a partial plan view of the heater electrode of the liquid crystal device of the second modification.

  This modified example differs from the example shown in FIG. 6 in the position of the through hole 44a formed in the first heater flexible substrate 44. The same applies to the position of the through-hole 45a formed in the second heater flexible substrate 45, and the description thereof is omitted.

  In this modification, as shown in FIG. 11, instead of the first heater flexible substrate 44 in which the through-hole 44a is formed, the first heater flexible substrate 144 in which the through-hole 144a is formed. It has.

  As shown in FIG. 11, the first heater flexible substrate 144 has a plurality of through holes 144a. As shown in FIG. 11, the through hole 144 a is disposed so as to be adjacent to the outside of the outer edge of the first heater electrode 70 in a plan view. The ACF 71 flows into the through-hole 144a as shown in FIG.

  As described above, according to the present modification, the through hole 144 a is provided so as to be adjacent to the outside of the outer edge of the first heater electrode 70 in a planar manner. Therefore, for example, when the first heater electrode 70 is pressure-bonded to the transparent conductive film 41 via the ACF 71, the ACF 71 between the transparent conductive film 41 and the first heater electrode 70 is indicated by an arrow P as shown in FIG. It can immediately flow into the through-hole 144a. Therefore, the first heater electrode 70 and the first heater flexible substrate 144 can be more reliably prevented from floating by causing the ACF 71 to immediately flow into the through-hole 144a near the first heater electrode 70. Can do.

  (Third Modification)

  Next, a liquid crystal device of a third modification according to the present invention will be described.

  FIG. 12 is a partial plan view of the heater electrode of the liquid crystal device of the third modification.

  This modification is different from the liquid crystal device 1 ′ of the first modification in the shape of the first concave part 42 </ b> A ′ and the second concave part 42 </ b> B ′ formed on the first heater electrode 42 ′. The shapes of the third concave portion 44A ′ and the fourth concave portion 44B ′ formed on the heater flexible substrate 44 ′ are different.

  In this modification, a first heater electrode 75 is provided instead of the first heater electrode 42 ', and a first heater flexible substrate 76 is provided instead of the first heater flexible substrate 44'. ing.

  As shown in FIG. 12, the first heater electrode 75 has, for example, a substantially rectangular shape in which the longitudinal direction of the liquid crystal panel 2 (the X direction in FIG. 12) is the first width w1, and the width of the liquid crystal panel 2 A plurality of first concave portions 75A arranged in the direction (Y direction in FIG. 12), and a plurality of second concave portions 75B arranged in the width direction of the liquid crystal panel 2 (Y direction in FIG. 12) have.

  As shown in FIG. 12, the first concave portion 75A is recessed in a semicircular arc shape in the longitudinal direction (X direction in FIG. 12) so as to be away from the center of the liquid crystal panel 2. As shown in FIG. 12, the second concave portion 75 </ b> B is recessed in a semicircular arc shape in the longitudinal direction (X direction in FIG. 12) so as to approach the center of the liquid crystal panel 2.

  The first heater flexible substrate 76 is disposed so as to overlap the first heater electrode 75 in a planar manner, for example. For example, the first heater flexible substrate 76 has substantially the same shape as the first heater electrode 75 and a plurality of third heaters arranged in the width direction of the liquid crystal panel 2 (Y direction in FIG. 12). The concave portion 76A has a plurality of fourth concave portions 76B arranged in the width direction of the liquid crystal panel 2 (Y direction in FIG. 12).

  As shown in FIG. 12, the third recessed portion 76 </ b> A is recessed in a semicircular arc shape in the longitudinal direction (X direction in FIG. 12) so as to be away from the center of the liquid crystal panel 2. As shown in FIG. 12, the fourth concave portion 76 </ b> B is recessed in a semicircular arc shape in the longitudinal direction (X direction in FIG. 12) so as to approach the center of the liquid crystal panel 2.

  The first concave portion 75A and the third concave portion 76A are collectively formed by punching, for example, and the second concave portion 75B and the fourth concave portion 76B are collectively formed by punching.

  As described above, according to this modification, the first concave portion 75A and the third concave portion 76A are collectively formed by punching, for example, and the second concave portion 75B and the fourth concave portion 76B are It is formed at once by punching. For this reason, for example, the semicircular arc first concave portion 75A and the third concave portion 76A can be collectively formed by punching, so that the manufacturing cost can be reduced.

  Further, the ACF 77 is pushed out into the third concave portion 76A and the fourth concave portion 76B formed in the first heater flexible substrate 76 at the time of pressure bonding. For this reason, the first heater electrode 75 and the like can be securely bonded to the transparent conductive film 41 by reducing the pressing area and increasing the pressure.

  (Fourth modification)

  Next, a liquid crystal device of a fourth modification according to the present invention will be described.

  FIG. 13 is a partial plan view of the heater electrode of the liquid crystal device of the fourth modification.

  This modification is different from the liquid crystal device shown in FIG. 6 in the position of the through-hole 44a formed in the first heater flexible substrate 44. The same applies to the position of the through-hole 45a formed in the second heater flexible substrate 45, and the description thereof is omitted.

  In this modification, instead of the first heater flexible substrate 44 in which the through hole 44a of the second modification is formed, the first heater flexible substrate 244 in which the through hole 244a is formed is used. I have.

  As shown in FIG. 13, the first heater flexible substrate 244 has a plurality of through holes 244a. As shown in FIG. 13, the through hole 244 a is disposed so as to be adjacent to the outside of the outer edge of the first heater electrode 70 in a plan view. The through hole 244a has, for example, a semicircular shape. The ACF 71 flows into the through-hole 244a as shown in FIG.

  The semicircular through hole 244a can be formed by etching using, for example, the first heater electrode 70 as a mask.

  Thus, according to the present modification, the through hole 244a is provided so as to be adjacent to the outside of the outer edge of the first heater electrode 70 in a planar manner. Therefore, for example, when the first heater electrode 70 is pressure-bonded to the transparent conductive film 41 via the ACF 71, the ACF 71 between the transparent conductive film 41 and the first heater electrode 70 is indicated by an arrow P as shown in FIG. It can immediately flow into the through hole 244a. Therefore, the first heater electrode 70 and the first heater flexible substrate 244 can be more reliably prevented from floating.

  In addition, the adhesion area between the ACF 71 flowing into the through-hole 244a and the first heater flexible substrate 244 can be increased. Therefore, the adhesion of the first heater flexible substrate 244 and the first heater electrode 70 to the transparent conductive film 41 can be improved.

  In this modification, a semicircular through hole 244a formed in the first flexible substrate for heater 244 is used as a circular through hole, and the peripheral edge of this through hole (for example, a half peripheral edge). A concave portion may be formed in the first heater electrode 70 so as to overlap with the two. As a result, when the first heater flexible substrate 244 is pressure-bonded, the ACF can flow out from the circular through-hole more effectively, and the adhesion of the first heater electrode 70 can be improved. .

  (Fifth modification)

  Next, a liquid crystal device of a fifth modification according to the present invention will be described.

  FIG. 14 is a partial plan view of a heater electrode of a liquid crystal device of a fifth modification, and FIG. 15 is a cross-sectional view taken along the line DD of the liquid crystal device of FIG.

  Compared with the liquid crystal device shown in FIG. 6, the present modification includes the first heater electrode 80 shown in FIG. 14 instead of the rectangular first heater electrode 70 shown in FIG. 15 NCFs (Non Conductive Film) 81 are provided.

  The first heater electrode 80 has a rectangular shape, and includes a plurality of projecting portions 80 </ b> A that protrude toward the transparent conductive film 41 and are in contact with the transparent conductive film 41. The first heater electrode 80 is connected to the transparent conductive film 41 through a plurality of protrusions 80A.

  NCF81 is an adhesive that does not contain conductive particles contained in, for example, ACF.

  The NCF 81 is disposed with at least a second width w2 between the first heater flexible substrate 44 and the transparent conductive film 41. Further, the NCF 81 also flows into the through hole 44a.

  As described above, according to this modification, the first heater electrode 80 includes the plurality of protruding portions 80 </ b> A that protrude toward the transparent conductive film 41 and are in contact with the transparent conductive film 41. For this reason, for example, even if NCF81 is used as the adhesive, it is possible to achieve conduction between the transparent conductive film 41 and the first heater electrode 80 via the plurality of protrusions 80A of the first heater electrode 80. Further, the NCF 81 is disposed between the first heater flexible substrate 44 and the transparent conductive film 41 with at least the second width w2, and also flows into the through hole 44a. Therefore, the adhesion area between the NCF 81 and the first heater flexible substrate 44 can be increased, and the adhesion between the first heater flexible substrate 44 and the transparent conductive film 41 can be improved.

  Second Embodiment Electronic Device

  Next, an electronic apparatus provided with the above-described liquid crystal device 1 will be described.

  16 is a schematic external view of a mobile phone according to the present invention, and FIG. 17 is a schematic external view of a personal computer.

  For example, the mobile phone 500 includes, for example, the liquid crystal device 1 in an outer frame having a mouthpiece 572 and a mouthpiece 573 in addition to a plurality of operation buttons 571 as shown in FIG.

  Further, as shown in FIG. 17, the personal computer 600 includes a main body 682 having a keyboard 681 and a liquid crystal display unit 683. The liquid crystal display unit 683 includes, for example, the liquid crystal device 1 in an outer frame. Yes.

  In addition to the liquid crystal device 1, these electronic devices include various circuits such as a display information output source and a display information processing circuit, and a display signal generation unit including a power supply circuit that supplies power to these circuits, although not shown. Consists of.

  Further, for example, in the case of the personal computer 600, the liquid crystal device 1 is supplied with a display signal generated by the display signal generation unit based on information input from the keyboard 681, so that a display image is supplied to the liquid crystal device 1. Is displayed.

  According to the present embodiment, since the liquid crystal device 1 having excellent adhesion and electrical reliability in the connection between the transparent conductive film 41 and the first heater electrode 42 is provided, an electronic device having excellent display quality can be obtained. it can.

  In addition, examples of the electronic device include a touch panel equipped with a liquid crystal device, a projector, a liquid crystal television, a viewfinder type, a monitor direct view type video tape recorder, a car navigation, a pager, an electronic notebook, a calculator, and the like. And it cannot be overemphasized that the liquid crystal device 1 mentioned above is applicable as a display part of these various electronic devices, for example.

  The present invention is not limited to any of the above-described embodiments, and can be implemented with appropriate modifications within the scope of the technical idea of the present invention. In addition, the above-described embodiments can be combined without departing from the scope of the present invention.

  For example, in the above-described embodiments, the thin film transistor element active matrix type liquid crystal device has been described as an example of the liquid crystal device. However, the present invention is not limited to this. For example, the thin film diode element active matrix type or passive matrix type liquid crystal device may be used. Also good.

  In the above-described embodiment and the like, an example in which the shape of the through hole 44a and the like is a circular shape or a semicircular shape is shown. However, the shape of the through hole 44a is not limited to these. For example, a polygonal shape or a slit shape may be used.

  Moreover, in the said embodiment etc., the 1st heater electrode 42 showed the example provided with the 1st recessed part 42A and the 2nd recessed part 42B in the center side of the liquid crystal panel 2, and the opposite side. However, the present invention is not limited to this. For example, the first heater electrode 42 may include the second concave portion 42B and may not include the first concave portion 42A. By doing so, the amount of the ACF 46 protruding to the center side of the liquid crystal panel 2 can be reliably reduced, and the polarizing plate and the like can be accurately arranged.

  Moreover, in the said Example etc., it demonstrated that the recessed part or through-hole formed in the flexible substrate for heaters was formed along each edge | side of the side which becomes a pair. However, the present invention is not limited to this, and a concave portion or a through hole may be formed along one of the sides.

1 is a schematic perspective view of a liquid crystal device according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of the liquid crystal device of FIG. 1 taken along line AA. The bottom view of the liquid crystal device of FIG. FIG. 4 is a plan view of a region E (heater electrode) of the liquid crystal device of FIG. 3. 5 is a flowchart showing a manufacturing process of the liquid crystal device of the first embodiment. The partial top view of the heater electrode (solid electrode) of a liquid crystal device. BB sectional drawing of the liquid crystal device of FIG. FIG. 6 is an overview perspective view of a liquid crystal device according to a first modification. CC sectional drawing of the liquid crystal device of FIG. FIG. 9 is a partial plan view of a heater electrode (region F) of the liquid crystal device of FIG. 8. The partial top view of the heater electrode of the liquid crystal device of a 2nd modification. The partial top view of the heater electrode of the liquid crystal device of the 3rd modification. The partial top view of the heater electrode of the liquid crystal device of a 4th modification. The partial top view of the heater electrode of the liquid crystal device of the 5th modification. FIG. 15 is a cross-sectional view taken along the line DD of the liquid crystal device in FIG. 14. 1 is a schematic external view of a mobile phone according to the present invention. 1 is a schematic external view of a personal computer.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ', 1 ... Liquid crystal device, 2', 2 ... Liquid crystal panel, 3 ... Circuit board, 4 ', 4 ... Liquid crystal panel heater, 5, 6, 60 ... Substrate, 5A ... One side, 5a ... Overhang | projection part, 6a ... Common Electrode, 7 ... Sealing material, 8 ... Gate electrode, 9 ... Source electrode, 10 ... Pixel electrode, 11, 12, 13, 33 ... Input wiring, 11a ... Substrate side input terminal, 11b ... Other end, 14, 15, DESCRIPTION OF SYMBOLS 16, 32 ... Output wiring, 14a ... Board | substrate side output terminal, 17, 18, 19 ... Driver IC, 20 ... Base material, 20a ... Mounting surface, 21,22 ... Electrode pad, 23 ... Driver side input terminal, 24 ... Driver Side output terminals, 25, 46 ', 46, 56', 56, 71, 77 ... ACF, 28, 46A ', 46A, 56A' ... conductive particles, 29 ... adhesive, 31 ... flexible substrate, 34 ... Semiconductor IC 36 ... wiring 37 ... connecting member 41 ', 4 ... Transparent conductive film, 42 ', 42, 70, 75, 80 ... First heater electrode, 42A', 42A, 75A ... First concave portion, 42B ', 42B, 43B', 75B ... Second concave portion , 42H ... outer edge, 43 ', 43 ... second heater electrode, 44', 44, 76, 144, 244 ... first heater flexible substrate, 44a, 45a, 144a, 244a ... through hole, 44A ' , 76A ... third concave portion, 44B ', 76B ... fourth concave portion, 45', 45 ... second heater flexible substrate, 47 ', 47 ... first heater wiring, 48', 48 ... second heater wiring, 49 ', 49 ... first wiring, 50', 50 ... first heater wiring board, 51 ', 51 ... second wiring, 52', 52 ... for second heater Wiring board, 55... Polarizing plate, 60 A... Surface, 80 A. Cellular phone, 600 ... personal computer, d1 ', d1, d2', d2 ... dent length, E, F ... area, K1, first corner, K2, second corner, L ... diagonal, P ... Arrow, T ... thin film transistor element, w1 ... first width, w2 ... second width.

Claims (7)

An electro-optical panel in which an electro-optical material is sealed with a first substrate and a second substrate disposed opposite to each other, and a sealing material provided between the first substrate and the second substrate;
A transparent conductive film disposed on an outer surface side of the first substrate or the second substrate;
A substrate having a heater electrode electrically connected to the transparent conductive film;
The transparent conductive film and the heater electrode, and the transparent conductive film and an adhesive that bonds the base material,
The adhesive is shaped to seal the heater electrode between the transparent conductive film and the substrate.
It is composed and contains conductive particles and is bonded by thermocompression bonding,
The base is extended to the outside of the electro-optical panel at a corner of the electro-optical panel.
Having a wiring board portion formed in a
The heater electrode is arranged closer to a position overlapping the sealing material in a plan view, the
At the corner of the electro-optic panel, the heater electrode is pulled to the outside of the electro-optic panel.
An electro-optical device, wherein the electro-optical device is electrically connected to a power source through a wiring formed on the wiring board portion . The heater electrode has a concave portion formed on the outer edge of the heater electrode,
2. The adhesive material is filled in the concave portion of the heater electrode.
The electro-optical device according to 1. The concave portion of the heater electrode is located on the opposite side of the first concave portion formed on the outer edge of the side of the heater electrode located on the center side of the electro-optic panel and the center side of the electro-optic panel. The second concave portion formed on the outer edge of the side of the heater electrode has the second concave portion,
The electro-optical device according to claim 2, wherein the length of the recess is longer than that of the first recess. The substrate includes a portion that overlaps the heater electrode in a plane and a portion that does not overlap the heater electrode in a plane, and a through-hole is formed in the substrate that does not overlap the heater electrode in a plane. The adhesive material is filled in the through hole.
The electro-optical device according to 1. The substrate includes a portion that overlaps the heater electrode in a plane and a portion that does not overlap the heater electrode in a plane, and the substrate is a portion that does not overlap the heater electrode in a plane, and The electro-optical device according to claim 2, wherein a through-hole is formed outside an outer edge of the concave portion of the heater electrode, and the adhesive material is also filled in the through-hole. The electro-optical device according to claim 1, wherein the adhesive is an anisotropic conductive film. An electronic apparatus comprising the electro-optical device according to any one of claims 1 to 6.

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