JP2008083365A - Liquid crystal display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal display device in which a metal layer allowing wire bonding can be easily formed on an ITO film without giving influences on other film layers. <P>SOLUTION: The liquid crystal display device is constituted so that two substrates are adhered through a peripheral sealing material and a liquid crystal is charged between the two substrates, wherein one of the substrates is provided with an extended portion as one body so that the one side is protruded from the other substrate, a transparent electrode and an alignment layer formed in a display area are formed integrally on the inner face of the extended portion, and a FPC (flexible printed circuit) having a vertical conducting portion is fixed via a conductive adhesive on the alignment layer formed in the extended portion, and the FPC is subjected to wire bonding. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a liquid crystal display device.

  There is a type in which a liquid crystal display panel is mounted on a circuit board and wire bonding mounting is performed between an ITO electrode pad formed on the substrate constituting the liquid crystal display panel and an electrode pad of the circuit board. This is to cope with the thinning and miniaturization of the liquid crystal display device. At this time, a metal layer for wire bonding is formed on the surface of the electrode pad of ITO. (For example, Patent Document 1, Patent Document 2, Patent Document 3)

  FIG. 7 is an enlarged cross-sectional view of a main part of a liquid crystal display device according to the prior art disclosed in Patent Document 1. When quoting the description, the liquid crystal display device has two large and small glass substrates 10 and 20 as transparent substrates, transparent electrode patterns 12 and 22 as segment electrodes and common electrodes, an external connection pattern 13 and an IC connection pattern 14. , A bonding wire 15 as a connection member, and two polarizing plates 16 and 26, an IC chip 30, and the like. A liquid crystal LC is sealed between the glass substrates 10 and 20.

  In brief, a liquid crystal display device is basically a so-called COG (Chip On) in which two glass substrates 10 and 20 serving as a liquid crystal display surface are stacked and an IC chip 30 is directly mounted on the glass substrate 10. Glass). The larger glass substrate 10 is provided with an elongated extending portion 11 so that one side protrudes from the side portion 20 a of the other glass substrate 20. In this extension part 11, the surface facing the other substrate 20 side is called an exposed surface, and the opposite side of the exposed surface is called the back surface. Further, the overlapping portion of the substrates 10 and 20 is referred to as an inner surface portion.

  Transparent electrode patterns 12 and 22 made up of a large number of signal lines are formed from the inner surface portion to the exposed surface of the extending portion 11. On the other hand, an IC chip 30 is mounted on the back surface side of the extending portion 11, and an IC connection pattern 14 and an external connection pattern 13 are formed around the mounting position of the IC chip 30. The IC chip 30 is a driver IC for controlling liquid crystal display. The transparent electrode patterns 12 and 22 and the IC connection pattern 14 are connected to each other via bonding wires 15 corresponding to each other. The external connection pattern 13 is formed to connect the IC chip 30 to the outside. The polarizing plates 16 and 26 are bonded to the outer surfaces of the substrates 10 and 20 so as to face the inner surface portion.

  More specifically, the glass substrates 10 and 20 have a thin transparent shape by enclosing the liquid crystal LC on the inner surface, and a certain narrow space is formed in a portion along the periphery of the inner surface. Thus, the sealing material 40 is sandwiched. A transparent electrode pattern indicated by reference numeral 12 is formed on the inner surface of one substrate 10, and a transparent electrode pattern indicated by reference numeral 22 is formed on the inner surface of the other substrate 20. One of these transparent electrode patterns 12 and 22 functions as a segment electrode and the other functions as a common electrode. Further, the extending portion 11 which is a part of one substrate 10 is projected from the side portion 20 a of the other substrate 20.

  The transparent electrode patterns 12 and 22 are wired so as to cross each other on the inner surface portions of the glass substrates 10 and 20 by an ITO (Indium Tin Oxide) film or the like. One transparent electrode pattern 12 is continuously formed from the inner surface portion of the substrate indicated by reference numeral 10 to the extension portion 11, and the electrode terminal portion 12 a is located in the vicinity of the exposed surface edge 11 a of the extension portion 11. . Further, the other transparent electrode pattern 22 is formed on the inner surface portion of the other substrate 20 which is a separate body from the extending portion 11, but through the conductive material 50 provided outside the sealing material 40. It is guided onto the exposed surface of the extension part 11. And the electrode terminal part 22a of the transparent electrode pattern 22 is also located in the vicinity of the exposed surface edge end 11a of the extension part 11 like the one transparent electrode pattern 12 described above. These transparent electrode patterns 12 and 22 are twisted with each other and intersect at the inner surface portion, thereby generating an effective display area (not shown) in the form of a dot matrix. An alignment film or the like is provided on the surface of the transparent electrode patterns 12 and 22 on the inner surface, but the alignment film and the like are not particularly shown.

  The external connection pattern 13 and the IC connection pattern 14 are formed by performing vapor deposition, etching, or the like in the vicinity of the back surface of the extending portion 11 with, for example, aluminum. The base end portions 13 a and 14 a of the patterns 13 and 14 are formed at positions corresponding to the bumps 30 a and 30 b of the IC chip 30. The external connection terminal portion 13 b which is the other end side of the external connection pattern 13 is located at a predetermined location on the back surface of the extension portion 11. On the other hand, the connection terminal portion 14b on the other end side of the IC connection pattern 14 is located near the edge 11b on the back surface of the extension portion 11 corresponding to the electrode terminal portions 12a and 22a of the transparent electrode patterns 12 and 22. positioned. The external connection pattern 13 is used to supply an external power supply voltage and various control signals to the IC chip 30 that is a driver IC. The IC connection pattern 14 is used to electrically connect the IC chip 30 and the transparent electrode patterns 12 and 22.

  The bonding wires 15 are used to connect the electrode terminal portions 12a and 22a of the transparent electrode patterns 12 and 22 and the connection terminal portions 14b of the IC connection pattern 14 with, for example, gold wires. Therefore, the bonding wires 15 are formed by wire bonding so as to wrap around the outer edges 11a and 11b of the extending portion 11. The bonding wires 15 are bonded to the terminal portions 12a, 22a, and 14b on which the base plating is applied with nickel, gold or the like so as to ensure a good connection with the bonding surface. Further, the bonding wires 15 are sealed with an insulating resin 60 that covers the entire edges 11a and 11b of the extending portion 11, thereby protecting from the outside air and preventing the wires 15 from being damaged.

  FIG. 8 is a schematic cross-sectional view of a conventional liquid crystal display device disclosed in Patent Document 2. In FIG. To quote the explanation, in the liquid crystal display device, the driving IC 115 and the FPC as the circuit board are arranged on the glass substrate 102 as the other substrate.

  That is, as shown in FIG. 8, a liquid crystal 104 is interposed between a glass substrate 102 on the scanning side and the glass substrate 103 on the signal side, which is the one substrate having a size larger than that of the glass substrate 102, and the liquid crystal 104 is sealed by the seal member 105. 104 is enclosed, and a display screen is formed by the display area 106 formed by the transparent electrodes 107 and 108 provided on the glass substrates 102 and 103. Further, as is well known in the art, the glass substrates 102 and 103 are arranged to face each other so that the striped transparent electrodes 107 and 108 intersect with each other, and the transparent electrode 108 extends only to the non-display area 109 of the glass substrate 103. Further, the transparent electrode 107 is also temporarily transferred to the glass substrate 103 through a conductive member provided between the substrates 102 and 103 and further extended to the non-display area 109 of the glass substrate 103. A display electrode terminal 111 is formed on the extended transparent electrode 110 serving as the signal input electrode.

  The driving IC 115 is fixed to the liquid crystal panel P1 having such a configuration near the end of the glass substrate 102 with an adhesive made of an epoxy resin, and the FPC 120 is provided on the driving IC 115.

  Further, the electrode terminal 121 of the driving IC 115 and the display electrode terminal 111 are connected by a bonding wire 122 made of a gold wire or an aluminum wire as the connecting means. These electrode terminals 121 are pads that are surface-treated with gold, aluminum, or the like.

  Then, in order to protect the wire 122 and the driving IC 115, a resin protective layer 123 made of an epoxy-based or silicon-based resin or the like is coated thereon at a height of about 2 mm from the glass substrate 103.

  Further, if the wire bonding has a stepped structure such as the wire 122, the connection can be easily made, and higher reliability can be obtained. In addition, the provision of the FPC 120 facilitates connection with the input signal generation unit (system of the entire display device) to the driving IC 115, and a low cost can be achieved by not employing a complicated structure. It is.

  FIG. 9 is a perspective view of a liquid crystal display device according to the prior art disclosed in Patent Document 3. In FIG. According to the liquid crystal display device 212, a wiring made of transparent electrodes (not shown) formed on the scanning side glass substrate 215 and ITO (not shown) formed on the signal side glass substrate 214 is connected, and this wiring is connected to the signal side glass. It extends to a non-display area on the substrate 214, and a chromium layer and an aluminum layer are sequentially laminated on the end portion to form a terminal.

  Further, terminals 230 and 231 made of an Au layer are also formed on the FPC 216, the terminals (not shown) and the terminals 230 are connected by wire bonding 232, and the ITO (not shown) formed on the signal side glass substrate 214 is formed. When a chrome layer and an aluminum layer are sequentially laminated on each other and connected to the terminal 231 by wire bonding 233, the liquid crystal drive driver IC 205 passes through the wire bonding 232 and 233 to display on the liquid crystal display panel. Input signal to the part.

Japanese Patent Laid-Open No. 2001-33802 JP 2001-42784 A JP 2002-258310 A

The patent document discloses that nickel, gold, chromium + aluminum or a metal layer is formed and bonded on ITO (transparent electrode) formed on a glass substrate of a liquid crystal display device. This is because gold wire cannot be directly bonded on ITO. Although there is no detailed description of a method for forming a metal layer on the ITO by plating or the like, in the process of manufacturing a liquid crystal display device, for example, after forming an alignment film, forming a metal layer at a predetermined position is a metal Manufacturing processes such as film formation, resist film formation, exposure, etching, resist film peeling, and cleaning are necessary, and there is a high possibility that the ITO film is damaged or altered. This is especially true when a glass substrate having an antireflection layer on one surface and a refractive index-adjusted indium tin oxide (IMITO) layer on the other surface is used.
An object of the present invention is to provide a liquid crystal display device capable of easily forming a metal layer capable of wire bonding on an ITO film without affecting other film layers.

  A liquid crystal display device in which two substrates are bonded via a peripheral sealing material, and liquid crystal is sealed between the two substrates, and one substrate extends integrally so that at least one side protrudes from the other substrate. A protruding portion is provided, and a transparent electrode and an alignment film formed in the display area are integrally formed on an inner surface of the extending portion, and an FPC with a vertical conduction portion is formed on the alignment film formed in the extending portion. Is fixed through a conductive adhesive, and the liquid crystal display device is wire-bonded to the FPC.

  The alignment film formed on the extension part is removed, and an FPC with a vertical conduction part is fixed to the exposed transparent electrode with a conductive adhesive, and a liquid crystal display device is obtained by wire bonding to the FPC.

  A liquid crystal display device in which the FPC with the upper and lower conductive portions is a metal foil is used.

  The FPC is a liquid crystal display device plated with gold.

  A liquid crystal display device in which two substrates are bonded via a peripheral sealing material, and liquid crystal is sealed between the two substrates, and one substrate extends integrally so that at least one side protrudes from the other substrate. A protruding portion is provided, and a transparent electrode and an alignment film formed in the display area are integrally formed on the inner surface of the extending portion, and a conductive adhesive is applied on the alignment film formed in the extending portion. A plate-like metal piece is fixed through the metal foil, a metal foil provided with gold plating on the metal piece is fixed through a second conductive adhesive, and a liquid crystal display device wire-bonded to the gold plating is obtained.

  The alignment film formed on the extending portion is removed, a plate-like metal piece is fixed on the exposed transparent electrode via a conductive adhesive, and a metal foil provided with gold plating on the metal piece is secondly attached. A liquid crystal display device fixed through a conductive adhesive and wire-bonded to the gold plating is obtained.

  A liquid crystal display device in which the conductive adhesive is an anisotropic conductive adhesive or an anisotropic conductive film is used.

  The conductive adhesive is solder, and the solder breaks the alignment film and is a liquid crystal display device connected to the transparent electrode.

  The liquid crystal display device from which the alignment film has been removed is a liquid crystal display device in which the conductive adhesive is solder.

  The one substrate is a liquid crystal display device which is a glass substrate in which an antireflection layer is formed on the display side and a refractive index-adjusted indium tin oxide (IMITO) layer is formed on the opposite surface.

  According to the first aspect of the present invention, since the FPC with the upper and lower conductive portions is fixed on the alignment film of the extending portion via the conductive adhesive after completion of the liquid crystal panel, wire bonding can be performed locally and after the completion of the liquid crystal panel. As a result, the liquid crystal panel is not deteriorated.

  According to the second aspect of the invention, since the alignment film in the extending portion is removed, the electrical conduction between the ITO and the conductive adhesive is stabilized.

  According to the invention of claim 3, since the metal foil is used instead of the FPC, it can be manufactured at low cost.

  According to invention of Claim 4, the quality of wire bonding improves.

  According to invention of Claim 5, the electrical connection from ITO to wire bonding is stabilized more.

  According to the sixth aspect of the invention, the wire bonding surface can be smoothed and the wire bonding operation is stabilized.

  According to the invention of claim 7, since the alignment film is removed, the electrical conduction between the ITO and the conductive adhesive is stabilized.

  According to the eighth aspect of the present invention, it is possible to eliminate the occurrence of short circuit failure due to the flow of the conductive adhesive.

  According to the ninth aspect of the present invention, since the alignment film is broken with solder, it is possible to obtain more stable electrical conduction than breaking the alignment film with the conductive particles of the conductive adhesive to obtain conduction.

  The effect of the present invention becomes clearer when a glass substrate on which an antireflection layer or an IMITO layer is formed is used.

  A liquid crystal display device in which a glass substrate and a silicon substrate are bonded via a peripheral sealing material and liquid crystal is sealed between the two substrates, and the glass substrate on which the antireflection layer or the IMITO layer is formed is at least from the silicon substrate An extension part is provided so as to protrude, and an IMITO layer and an alignment film formed in the display area are integrally formed on the inner surface of the extension part, and the alignment film formed on the extension part is formed on the alignment film. A liquid crystal display device in which a gold-plated FPC with a vertical conductive part is fixed via an anisotropic conductive adhesive or an anisotropic conductive film and wire-bonded to the FPC is obtained.

  1A and 1B are views showing a first embodiment of a liquid crystal display device according to the present invention, in which FIG. 1A is a top view and FIG. 1B is a partial enlarged cross-sectional view taken along line AB.

  The liquid crystal display device includes, as main components, a glass substrate 1, a silicon substrate 2 and a sealing material 8 for bonding the two substrates, a liquid crystal LC sealed between the two substrates, and a vertical conductive portion with gold plating (not shown). The FPC 3 and the anisotropic conductive adhesive or the anisotropic conductive film 4 for bonding and fixing the FPC 3 and a bonding wire (gold wire electrode).

  The glass substrate 1 is provided with an extending portion 1A that protrudes from the silicon substrate 1 when bonded to the silicon substrate 2. An antireflective layer 1a is formed on the display surface side, an index matching layer 7 formed on the display area 1B on the inner surface, and an ITO electrode 5 that is a transparent electrode. -Tin (IMITO) and the alignment film 6 are formed. As the alignment film 6, an organic alignment film or an inorganic alignment film is formed according to the application. These layers are integrally formed up to the extending portion 1A, but the alignment film 6 of the extending portion 1A is removed. (It may not be formed in the extending portion 1A when forming the alignment film 6)

  A convex structure 2a constituting a display pixel or the like is formed on the inner side surface of the silicon substrate 2, and an alignment film 6 is formed on the surface thereof. An aluminum embedded electrode 2b for electrical connection to the opposing surface is formed at the end, and a gold coating 2c for improving the quality of wire bonding is formed on the surface of the aluminum embedded electrode 2b.

  The sealing material 8 is an adhesive mixed with particles (not shown) that determine the gap between the two substrates, and is applied to the outer peripheral edge of the substrate as shown in FIG. ing. Liquid crystal LC is injected from the opening and sealed with a sealing material.

  The gold-plated FPC 3 with upper and lower conductive portions is a flexible printed circuit board formed by sticking metal foils 3a and 3b on both surfaces of a base material. The upper and lower metal foils 3a and 3b are electrically connected by a conductive member 3c. Yes. In this embodiment, gold plating is formed on the outer surfaces of the metal foils 3a and 3b. Gold plating is for preventing oxidation and lowering the resistance of electrical connection, and may be an extremely thin film, and may be not only so-called wet plating but also flash plating or vapor deposition.

  An anisotropic conductive adhesive or anisotropic conductive film 4 mixed with conductive particles 4a is pasted on the ITO electrode 5 of the extending portion 1A of the glass substrate 1. An FPC 3 with a vertical conductive part plated with gold is mounted thereon and pressurized and heated. By applying pressure and heating, the ITO electrode 5, the conductive particles 4a, and the metal foil 3b of the FPC 3 are electrically connected, and the adhesive is cured and fixed. The anisotropic conductive adhesive may flow out by pressurization, but since it is anisotropic, it does not short-circuit with other electrodes.

  The metal foil 3a of the FPC 3 with the vertical conductive part plated with gold and the external circuit board (not shown) are connected by wire bonding the metal electrode, but the surface of the metal foil is smooth and stable wire bonding is possible. is there.

FIG. 2 is a partially enlarged sectional view showing a second embodiment of the liquid crystal display device according to the present invention.
Only the parts different from the first embodiment will be described, and the others will be omitted. This embodiment differs from the first embodiment in that the alignment film 6 formed on the extending portion 1A of the glass substrate 1 is not removed and an anisotropic conductive adhesive or The conductive particles mixed in the anisotropic conductive film 4 are polygonal metal particles 4b. When the FPC 3 is mounted on the anisotropic conductive adhesive or anisotropic conductive film 4 and pressed, the polygonal metal particles 4b penetrate the alignment film 6, and the ITO electrode 5, the polygonal metal particles 4b, and the metal foil 3b. Are electrically connected. Removing the alignment film 6 can be omitted.

FIG. 3 is a partially enlarged sectional view showing a third embodiment of the liquid crystal display device according to the present invention.
Only the parts different from the first embodiment will be described, and the others will be omitted. This embodiment is different from the first embodiment in that a special solder (for example, indium solder) is used as the conductive adhesive instead of the anisotropic conductive adhesive. A solder film 4 'is formed on the ITO electrode 5, and an FPC 3 is mounted thereon and soldered. The solder may be ordinary solder, but indium solder or Cerasolzer (manufactured by Kuroda Techno Co., Ltd.) containing the same components as ITO is preferable because of its bonding property with the ITO electrode.

FIG. 4 is a partial enlarged sectional view showing a fourth embodiment of the liquid crystal display device according to the present invention.
Only the parts different from the third embodiment will be described, and the others will be omitted. This embodiment differs from the third embodiment in that the alignment film 6 formed on the extending portion 1A of the glass substrate 1 is not removed. Therefore, when forming the solder film 4 ′ on the alignment film 6, a soldering iron tip that vibrates like an ultrasonic soldering iron is used to destroy the alignment film 6 and the ITO electrode 5 and the solder film. 4 'is connected. FPC3 is mounted on it and soldered. The solder may be ordinary solder, but indium solder or Cerasolzer (manufactured by Kuroda Techno Co.) containing the same components as ITO is preferable in the same manner as in the third embodiment because of its bonding property with the ITO electrode. In the case of an inorganic alignment film, the alignment film 6 where the solder film 4 'is formed may leave a large amount of alignment film as shown in the figure, but in the case of an organic alignment film (polyimide resin or the like), it is completely destroyed. It is preferable to remove it. Since the alignment film 6 is destroyed or removed simultaneously with the formation of the solder film 4 ′, the alignment film removing step can be omitted.

FIG. 5 is a partially enlarged sectional view showing a fifth embodiment of the liquid crystal display device according to the present invention.
Only the parts different from the first embodiment will be described, and the others will be omitted. This embodiment is different from the first embodiment in that a gold-plated metal foil 3a ′ (preferably copper foil) is used instead of the FPC 3 with the upper and lower conductive portions plated with gold. A metal foil 3 a ′ is directly pasted on the ITO electrode 5 via the anisotropic conductive film 4. If the smoothness of the surface of the metal foil 3a ′ can be ensured, it can be manufactured at a lower cost than the FPC 3.
In this embodiment, an anisotropic conductive film is preferable to an anisotropic conductive adhesive.

FIG. 6 is a partial enlarged sectional view showing a sixth embodiment of the liquid crystal display device according to the present invention.
Only the differences from the fifth embodiment will be described, and the others will be omitted. This embodiment differs from the fifth embodiment in that a solder film 4 ′ is formed on the ITO electrode 5, a pedestal 9 made of a metal piece is mounted thereon, and the anisotropic conductive film 4 is placed on the pedestal 9. The metal foil 3a ′ is pasted via (second conductive adhesive). Since the pedestal 9 is used, the smooth surface of the metal foil 3 ′ can be secured even when the solder 4 ′ is used, and the connection strength with the ITO electrode 5 can be secured.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the 1st Example of the liquid crystal display device by this invention, (a) is a top view, (b) is the elements on larger scale of AB. The figure which shows the 2nd Example of the liquid crystal display device by this invention, and is a partially expanded sectional view The figure which shows the 3rd Example of the liquid crystal display device by this invention, and is a partially expanded sectional view FIG. 4 is a partially enlarged sectional view showing a fourth embodiment of the liquid crystal display device according to the present invention. FIG. 5 is a partially enlarged sectional view showing a fifth embodiment of the liquid crystal display device according to the present invention. FIG. 7 is a partially enlarged cross-sectional view showing a sixth embodiment of the liquid crystal display device according to the present invention. Main section enlarged sectional view of a liquid crystal display device according to the prior art Schematic cross-sectional view of a conventional liquid crystal display device Perspective view of a liquid crystal display device according to the prior art

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Glass substrate 1A Extension part 1B Display area 1a Antireflection layer 2 Silicon substrate 2a Convex structure 2b Aluminum embedding structure 2c Gold coating | cover part 3 FPC with a vertical conduction part
3a Metal foil 3a 'Metal foil 3b Metal foil 3c Conductive member 4 Anisotropic conductive adhesive or anisotropic conductive film 4' Solder 4a Conductive grain 4b Polygonal metal grain 5 ITO electrode 6 Alignment film 7 Index matching ) Layer 8 Sealing material 9 Base 10 Glass substrate 11 Extension portion 11a Extension portion exposed surface edge 11b Extension portion exposure surface edge 12 Transparent electrode pattern 12a Electrode terminal portion 13 External connection pattern 13a External connection pattern base end Part 14 IC connection pattern 14a IC connection pattern base end part 14b IC connection pattern connection terminal part 15 Bonding wire 16 Polarizing plate 20 Glass substrate 20a Glass substrate side 22 Transparent electrode pattern 22a Electrode terminal part 26 Polarizing plate 30 IC Chip 40 Sealing material 50 Conductive material LC Liquid crystal 102 Glass substrate 103 Glass substrate 104 Liquid crystal 1 5 the sealing member 106 display area 107 transparent electrode 108 transparent electrode 109 non-display area 110 extending transparent electrode 111 display electrode terminals 115 drive IC
120 FPC
121 electrode terminal 122 wire 123 resin protective layer P1 liquid crystal panel 205 driver IC
212 Liquid crystal display device 214 Signal side glass substrate 215 Scanning side glass substrate 216 FPC
230 Terminal 231 Terminal 232 Wire bonding 233 Wire bonding

Claims (11)

  A liquid crystal display device in which two substrates are bonded via a peripheral sealing material, and liquid crystal is sealed between the two substrates, and one substrate extends integrally so that at least one side protrudes from the other substrate. A protruding portion is provided, and a transparent electrode and an alignment film formed in the display area are integrally formed on an inner surface of the extending portion, and an FPC with a vertical conduction portion is formed on the alignment film formed in the extending portion. Is fixed through a conductive adhesive and wire-bonded to the FPC.   The alignment film formed on the extension part is removed, and an FPC with a vertical conduction part is fixed to the exposed transparent electrode via a conductive adhesive, and wire-bonded to the FPC. 1. A liquid crystal display device according to 1.   The liquid crystal display device according to claim 1, wherein the FPC with the upper and lower conductive portions is a metal foil.   2. The liquid crystal display device according to claim 1, wherein the FPC is gold-plated.   The liquid crystal display device according to claim 2, wherein the FPC is plated with gold.   A liquid crystal display device in which two substrates are bonded via a peripheral sealing material, and liquid crystal is sealed between the two substrates, and one substrate extends integrally so that at least one side protrudes from the other substrate. A protruding portion is provided, and a transparent electrode and an alignment film formed in the display area are integrally formed on the inner surface of the extending portion, and a conductive adhesive is applied on the alignment film formed in the extending portion. A liquid crystal display device comprising a plate-like metal piece fixed through a metal foil, a metal foil provided with gold plating on the metal piece fixed through a second conductive adhesive, and wire-bonded to the gold plating.   The alignment film formed on the extending portion is removed, a plate-like metal piece is fixed on the exposed transparent electrode via a conductive adhesive, and a metal foil provided with gold plating on the metal piece is secondly attached. The liquid crystal display device according to claim 5, wherein the liquid crystal display device is fixed through a conductive adhesive and wire-bonded to the gold plating.   8. The liquid crystal display device according to claim 1, wherein the conductive adhesive is an anisotropic conductive adhesive or an anisotropic conductive film.   7. The liquid crystal display device according to claim 1, wherein the conductive adhesive is solder, and the solder destroys the alignment film and is connected to the transparent electrode.   The liquid crystal display device according to claim 2, wherein the conductive adhesive is solder.   11. The glass substrate according to claim 1, wherein the one substrate is a glass substrate having an antireflection layer formed on the display side and a refractive index-adjusted indium tin oxide (IMITO) layer formed on the opposite surface. Liquid crystal display device.

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