JPWO2013128621A1 - Organic EL device and manufacturing method thereof - Google Patents

Abstract

In the organic EL device, the risk of a short circuit between adjacent terminals in the connection space on the substrate can be reduced. A substrate 2, one or a plurality of organic EL elements 1U formed on the substrate 2, a plurality of connection terminals 4 provided on the substrate 2 and electrically connected to the electrodes of the organic EL elements 1U, and a connection Mounting including an insulating cover layer 10 that covers the substrate 2 between the terminal 4 and the connection terminal 4, and a connected terminal 3 </ b> A that is mounted via the anisotropic conductive layer 20 and electrically connected to the connection terminal 4. The anisotropic conductive layer 20 includes conductive particles 22 that electrically connect the connection terminals 4 and the connected terminals 3A. The conductive particles 22 pass through the cover layer 10 and connect to the connection terminals. 4 and the connected terminal 3A are electrically connected.

Description

  The present invention relates to an organic EL device and a method for manufacturing the same.

  A self-luminous device (organic EL device) including an organic EL element includes, for example, a display screen of a mobile phone, a monitor screen of an in-vehicle or household electronic device, an information display screen of a personal computer or a television receiver, a lighting panel for advertisement As various display devices used in various applications, as various light sources used in scanners, printers, etc., as illumination devices used in general illumination and backlights of liquid crystal display devices, etc., and as an optical communication device utilizing a photoelectric conversion function It can be used for various applications and models.

  In the organic EL device, an organic EL element is disposed on a substrate, and the organic EL element is disposed in a sealing region that is hermetically sealed by a sealing member. The electrode of the organic EL element is connected to an extraction electrode drawn out of the sealing region, and the extraction electrode is connected to the driving element and the wiring board in a connection space provided at the periphery of the substrate.

  In general, an ACF (Anisotropic Conductive Film) method or a eutectic method is used to connect the extraction electrode to the drive element or the wiring board. In the prior art described in Patent Document 1 below, a circuit pattern connected to an organic EL element is formed on a substrate outside a sealing member, and an IC chip mounting (COG) or flexible print is applied to the circuit pattern. It is shown that a substrate is mounted (FPC) and a resin is applied to an exposed portion of a circuit pattern.

JP 2009-289615 A

  In the organic EL device, an element formation space on which an organic EL element is arranged on a substrate is an effective space for obtaining light emission, and the outer space is a so-called frame space where light emission cannot be obtained. When mounting an organic EL device in a limited space such as an electronic device or an automobile, it is required to make the element forming space as an effective space as large as possible and to make the frame space as narrow as possible.

  In order to narrow the frame space described above in the organic EL device, the connection space outside the sealing region must be narrowed. When the connection space is narrowed, in COG or FPC mounting using an anisotropic conductive layer, the conductive particles flow from the connection region where the connection terminal exists within the narrow connection space to the non-connection region where the connection terminal does not exist, Densification of the conductive particles in the non-connected region occurs. According to this, the conductive particles are connected in the non-connection region, and there is a problem that a short circuit failure is likely to occur between adjacent terminals in the connection space. Such a short circuit between adjacent terminals causes a further problem when the electrode interval of the organic EL element is made dense in order to obtain high resolution.

  On the other hand, in the connection space described above, COG and FPC can be mounted by pulling out and exposing the connection terminal from the sealing region. On the other hand, when sealing the organic EL element with a sealing film, a mask pattern that covers the connection space is formed prior to the sealing film forming step in order to expose the connection terminals of the connection space. Alternatively, it is necessary to remove (lift off) the sealing film on the connection space after the sealing film forming step. In any method, in addition to the sealing film forming process, a separate process for exposing the connection terminal is required, and equipment for performing the process is required. There is an unavoidable problem that extension and increase in manufacturing cost are inevitable.

  This invention makes it an example of a subject to cope with such a problem. That is, in the organic EL device, the risk of a short circuit between adjacent terminals in the connection space on the substrate can be reduced, and when the organic EL element is sealed with a sealing film, the connection terminal is exposed in the connection space. It is an object of the present invention to eliminate necessary processes and equipment, avoiding an increase in tact time and an increase in manufacturing cost.

  In order to achieve such an object, an organic EL device and a manufacturing method thereof according to the present invention include at least the following configurations.

  A substrate, one or a plurality of organic EL elements formed on the substrate, a plurality of connection terminals provided on the substrate and electrically connected to electrodes of the organic EL elements, and the connection terminals; An insulating cover layer that covers the substrate between the connection terminals, and a mounting component that is mounted via an anisotropic conductive layer and includes a connected terminal that is electrically connected to the connection terminal, The anisotropic conductive layer includes conductive particles that electrically connect the connection terminals and the connected terminals, and the conductive particles pass through the cover layer to electrically connect the connection terminals and the connected terminals. An organic EL device characterized by being connected.

  Forming an organic EL element on the substrate, forming a connection terminal connected to an electrode of the organic EL element in a connection space on the substrate, and covering the connection terminal and the substrate in the connection space; A step of forming an insulating cover layer; and a mounting step of mounting a mounting component in the connection space via an anisotropic conductive layer, wherein the substrate and the mounting component are pressure-bonded in the mounting step. Then, the conductive particles of the anisotropic conductive layer penetrate the cover layer and electrically connect the connection terminal and the connected terminal of the mounting component.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory diagram showing an overall configuration of an organic EL device according to an embodiment of the present invention (FIG. 1A is an example of COG mounting, and FIG. 1B is an example of FPC mounting). It is a fragmentary sectional view of the organic EL device concerning the embodiment of the present invention, and shows the XX sectional view in Drawing 1 (a). It is X1-X1 sectional drawing in FIG. 2, and is explanatory drawing which expanded and showed the connection structure in a connection space. It is explanatory drawing which showed typically the form example of the preferable electroconductive particle in embodiment of this invention. It is explanatory drawing which showed the manufacturing method of the organic electroluminescent apparatus concerning embodiment of this invention. It is explanatory drawing which showed the manufacturing method of the organic electroluminescent apparatus concerning embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiment of the present invention includes the contents shown in the drawings, but is not limited thereto. FIG. 1 is an explanatory diagram showing the overall configuration of an organic EL device according to an embodiment of the present invention (FIG. 1A is an example of COG mounting, and FIG. 1B is an example of FPC mounting. ). FIG. 2 is a partial cross-sectional view of the organic EL device according to the embodiment of the present invention, and shows an XX cross-sectional view in FIG. 2A and 2B show cross-sectional views of different embodiments.

  The organic EL device 1 includes a substrate 2, one or more organic EL elements 1 </ b> U formed on the substrate 2, and a mounting component 3 mounted on the substrate 2. Examples of the mounting component 3 include a semiconductor chip 3-1 as illustrated in FIG. 1A and a flexible printed circuit board 3-2 as illustrated in FIG. 1B. It is not limited.

  On the substrate 2, an element formation space 2a in which the organic EL element 1U is formed is provided, and a connection space 2b is provided outside the element formation space 2a. In the connection space 2b, a plurality of connection terminals 4 that are electrically connected to the electrodes (lower electrode 11 or upper electrode 13) of the organic EL element 1U are provided. The connection terminal 4 is electrically connected to the electrode (lower electrode 11 or upper electrode 13) of the organic EL element 1U in the element formation space 2a via the lead wiring 5, the auxiliary electrode, or the like. In addition, the plurality of connection terminals connected to the electrodes of the organic EL element mentioned here include connection terminals connected to the TFTs in the active matrix driving type organic EL device. In this case, the connection terminal is indirectly connected to the organic EL element via the TFT. Further, the connection terminal 4 may have a multi-layer structure in which a treatment such as plating is performed with gold or copper. Thereby, the resistance of the wiring by the connection terminal 4 can be reduced.

  The organic EL element 1U formed in the element formation space 2a on the substrate 2 is hermetically sealed between the substrate 2 and the sealing member 6. As the sealing member 6, a sealing substrate 6A as shown in FIG. 2A is used, and the substrate 2 and the sealing substrate 6A are bonded to each other with the adhesive layer 7 interposed therebetween. The sealing space 6S may be formed between them (hollow sealing), or the sealing film 6B as shown in FIG. 2B is used, and the sealing film 6B has no space in the organic EL element 1U. What covers a component (film | membrane sealing) may be sufficient.

  The organic EL element 1U is laminated on the substrate 2 as shown in FIGS. 2 (a) and 2 (b). The organic EL element 1U includes at least a lower electrode 11, an organic layer 12, and an upper electrode 13. In the illustrated example, the lower electrode 11 is formed on the substrate 2, the organic layer 12 is formed thereon, and the upper electrode 13 is further formed thereon. Several film-forming layers may exist between them, and other layers may be laminated between the lower electrode 11, the organic layer 12, and the upper electrode 13. The organic layer 12 is composed of one light emitting layer or several functional layers for emitting light (hole injection / transport layer, light emitting layer, electron injection / transport layer, etc.). In the illustrated example, the organic EL element 1U includes an insulating film 14 that insulates a light emitting region of each organic EL element 1U on the lower electrode 11, and a partition wall 15 that is formed on the insulating film 14 and insulates the upper electrode 13 from each other. Prepare. The configuration example of the illustrated organic EL element 1U is an example, and the driving method of the organic EL element 1U in the embodiment of the present invention may be either a passive driving method or an active driving method.

  In the connection space 2 b on the substrate 2, an insulating cover layer 10 covering the substrate 2 between the connection terminals 4 and the connection terminals 4 is provided. In the example shown in FIG. 2A, the cover layer 10 is formed alone in the connection space 2b. In the example shown in FIG. 2B, the cover layer 10 is formed by extending a sealing film 6B. In this example, the cover layer 10 can be formed in the connection space 2b by forming the sealing film 6B on the entire substrate 2. In the connection space 2b, the mounting component 3 is mounted via the anisotropic conductive layer 20, and the connection terminal 4 and the connected terminal 3A of the mounting component 3 are conductive particles of the anisotropic conductive layer 20. Is electrically connected. At this time, the connection terminal 4 can have a multi-layer structure in which a treatment such as plating is performed with gold or copper. In this case, since the surface of the connection terminal 4 is covered with the cover layer 10, it is possible to actively reduce the resistance of the terminal by using a metal such as gold which is easily corroded as the surface layer of the connection terminal 4.

  FIG. 3 is a cross-sectional view taken along the line X1-X1 in FIG. 2, and is an explanatory diagram showing an enlarged connection structure in the connection space. In the connection space 2b, the anisotropic conductive layer 20 interposed between the substrate 2 and the mounting component 3 has a bonding layer 21 for physically bonding the substrate 2 and the mounting component 3, and a conductive material dispersed in the bonding layer 21. The particle | grains 22 are provided. As the anisotropic conductive layer 20, a thermocompression-bonding anisotropic conductive film (ACF), a material in which conductive particles 22 are dispersed in a bonding layer 21 made of a photocurable resin, or the like can be used.

  Before the substrate 2 and the mounting component 3 are pressure-bonded, the connection terminals 4 in the connection space 2b are individually covered with an insulating cover layer 10 so as to be insulatively partitioned. When the anisotropic conductive layer 20 is formed on the cover layer 10 and the substrate 2 and the mounting component 3 are pressure-bonded, between the connection terminal 4 of the substrate 2 and the connected terminal 3A of the mounting component 3. The cover layer 10 is penetrated by the sandwiched conductive particles 22. Thereby, in the connection area | region where the connection terminal 4 and the to-be-connected terminal 3A faced, the electrical connection with the connecting terminal 4 and the to-be-connected terminal 3A is made | formed in the location where the electroconductive particle 22 penetrated the cover layer 10. FIG.

  At this time, since the pressure contact force is not directly applied to the conductive particles 22 in the connected region between the adjacent connecting terminals 4 and 4 or the connected terminals 3A and 3A, the conductive particles 22 are not applied in this region. Does not penetrate the cover layer 10.

  Even when the organic EL device 1 having such a configuration has the connection space 2b narrowed for narrowing the frame and the density of the conductive particles 22 is increased in the connected region of the connection space 2b, Since the side surface of the connection terminal 4 is covered with the insulating cover layer 10, even if the conductive particles 22 are in a continuous state, a short circuit failure between the adjacent connection terminals 4 and 4 should be avoided. Can do.

  The condition for the conductive particles 22 sandwiched between the connection terminals 4 of the substrate 2 and the connected terminals 3A of the mounting component 3 to penetrate the cover layer 10 by the pressure contact between the substrate 2 and the mounting component 3 is that the conductive particles The hardness, particle size, and shape of 22 can be set experimentally in a relative relationship between the material of the cover layer 10 and the film thickness. As one condition, the diameter of the conductive particles 22 is preferably larger than the layer thickness of the cover layer 10. However, by providing fine protrusions on the surface of the connection terminal 4 or the surface of the connection terminal 3A, the conductive particles 22 sandwiched between the connection terminal 4 and the connection terminal 3A can be covered with the cover layer without satisfying this condition. It is possible to penetrate 10.

  As one condition of the form of the conductive particles 22, it is preferable to have corners on the surface or the overall shape of the conductive particles 22. FIG. 4 schematically shows a preferred embodiment of the conductive particles 22. In the example shown in FIGS. 4A and 4B, the overall shape is a triangle or a polygon, and the overall shape has corners. The example shown in FIGS. 4C, 4D, and 4E has a shape having protrusions on the surface, and has partial corners on the surface.

  Below, the specific structural example of the organic EL element 1U mentioned above is demonstrated.

The substrate 2 is light transmissive and is formed of a base material that can support the organic EL element 1U, such as glass or plastic. The transparent conductive film layer forming the lower electrode 11 is a transparent metal such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), zinc oxide-based transparent conductive film, SnO ₂ -based transparent conductive film, titanium dioxide-based transparent conductive film, etc. An oxide can be used.

  When the lower electrode 11 is patterned on a plurality of electrodes, an insulating film 14 is provided in order to ensure insulation between the electrodes. The insulating film 14 is made of a material such as polyimide resin, acrylic resin, silicon oxide, or silicon nitride. The insulating film 14 is formed by forming the material of the insulating film 14 on the substrate 2 on which the lower electrode 11 is patterned, and then forming an opening for forming a light emitting region for each organic EL element 1U on the lower electrode 11. Patterning is performed. Specifically, a film is formed on the substrate 2 on which the lower electrode 11 is formed to have a predetermined coating thickness by spin coating, and an exposure process and a development process are performed using an exposure mask, whereby an organic EL element is obtained. A layer of insulating film 14 having an opening pattern shape of 1U is formed. The insulating film 14 is formed so as to fill the space between the patterns of the lower electrode 11 and partially cover the side end portion thereof, and is formed in a lattice shape when the organic EL elements 1U are arranged in a dot matrix.

  The partition wall 15 is formed in a stripe shape in a direction intersecting the lower electrode 11 in order to form a pattern of the upper electrode 13 without using a mask or the like, or to completely electrically insulate the adjacent upper electrode 13. The Specifically, an insulating material such as a photosensitive resin is formed on the above-described insulating film 14 so that the film thickness is larger than the total thickness of the organic layer 12 and the upper electrode 13 that form the organic EL element 1U. Then, the photosensitive resin film is irradiated with ultraviolet rays or the like through a photomask having a stripe pattern intersecting with the lower electrode 11, and the development speed resulting from the difference in the exposure amount in the thickness direction of the layer is applied. By utilizing the difference, the partition wall 15 having a taper surface whose side faces downward is formed.

  The organic layer 12 has a laminated structure of light emitting functional layers including a light emitting layer. When one of the lower electrode 11 and the upper electrode 13 is an anode and the other is a cathode, a hole injection layer and a hole transport are sequentially formed from the anode side. A layer, a light emitting layer, an electron transport layer, an electron injection layer, and the like are selectively formed. As the film formation of the organic layer 12, a vacuum deposition method or the like is used as a dry film formation, and coating or various printing methods are used as a wet film formation.

  An example of forming the organic layer 12 will be described below. For example, first, NPB (N, N-di (naphtalence) -N, N-dipheneyl-benzidene) is formed as a hole transport layer. This hole transport layer has a function of transporting holes injected from the anode to the light emitting layer. The hole transport layer may be a single layer or a stack of two or more layers. In addition, the hole transport layer is not formed by a single material, but a single layer may be formed by a plurality of materials, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. Doping may be performed.

  Next, a light emitting layer is formed on the hole transport layer. As an example, red (R), green (G), and blue (B) light-emitting layers are formed in respective film formation regions by using a resistance heating vapor deposition method using a coating mask. As the red (R), an organic material that emits red light such as a styryl dye such as DCM1 (4- (dicyanomethylene) -2-methyl-6- (4'-dimethylaminostyryl) -4H-pyran) is used. An organic material that emits green light such as an aluminum quinolinol complex (Alq3) is used as green (G). As the blue (B), an organic material emitting blue light such as a distyryl derivative or a triazole derivative is used. Of course, other materials or a host-guest layer structure may be used, and the emission form may be a fluorescent light emitting material or a phosphorescent light emitting material.

  The electron transport layer formed on the light emitting layer is formed using various materials such as an aluminum quinolinol complex (Alq3) by various film forming methods such as resistance heating vapor deposition. The electron transport layer has a function of transporting electrons injected from the cathode to the light emitting layer. This electron transport layer may have a multilayer structure in which only one layer is stacked or two or more layers are stacked. In addition, the electron transport layer may be formed of a plurality of materials instead of a single material, and a guest material having a high charge donating (accepting) property may be formed on a host material having a high charge transport capability. It may be formed by doping.

When the upper electrode 13 formed on the organic layer 12 is a cathode, a material (metal, metal oxide, metal fluoride, alloy, etc.) having a work function smaller than that of the anode (for example, 4 eV or less) is used. Specifically, metal films such as aluminum (Al), indium (In), magnesium (Mg), amorphous semiconductors such as doped polyaniline and doped polyphenylene vinylene, Cr ₂ O ₃ , NiO , Oxides such as Mn ₂ O ₅ can be used. As the structure, a single layer structure made of a metal material, a laminated structure such as LiO ₂ / Al, or the like can be adopted.

For the sealing member 6 that seals the organic EL element 1U, a glass substrate or a metal substrate is used as the sealing substrate 6A that performs hollow sealing. As the sealing film 6B for film sealing, for example, a single layer or a multilayer film of metal, silicon oxide, nitride, or oxynitride formed by an atomic layer growth method can be used. . For example, an aluminum oxide film (for example, Al ₂ O) obtained by a reaction between an alkyl metal such as TMA (trimethylaluminum), TEA (triethylaluminum), DMAH (dimethylaluminum hydride) and water, oxygen, or alcohols. ₂ , Al ₂ O ₃ film), a silicon oxide film (for example, SiO ₂ film) obtained by a reaction between a vaporized gas of a silicon-based material and a vaporized gas of water can be used.

As described above, an appropriate material and film thickness are selected for the cover layer 10 in relation to the hardness, diameter, and form of the conductive particles 22, but when the cover layer 10 is formed by the sealing film 6B, The cover layer 10 preferably contains an inorganic material, particularly an aluminum oxide film such as Al ₂ O ₃ . A layer formed by atomic layer deposition (ALD) is preferable.

  5 and 6 are explanatory views showing a method for manufacturing an organic EL device according to an embodiment of the present invention.

  The example shown in FIG. 5 shows a manufacturing process corresponding to the embodiment shown in FIG. First, the organic EL element 1U is formed on the substrate 2, and the connection terminals 4 connected to the electrodes (upper electrode 11 and lower electrode 13) of the organic EL element 1U are formed in the connection space 2b on the substrate 2 (S1). Process). Next, the organic EL element 1U is sealed (step S2). In this step, the organic EL element 1U is sealed in the sealing space 6S by bonding the substrate 2 and the sealing substrate 6A together.

  Next, the cover layer 10 is formed in the connection space 2b (step S3), and the anisotropic conductive layer 20 is formed thereon (step S4). When the anisotropic conductive layer 20 is formed integrally with the mounting component 3 such as a flexible wiring board, the anisotropic conductive layer 20 is formed by arranging the connected terminal 3A of the mounting component 3 in the connection space 2b. Done in When the anisotropic conductive layer 20 is separately formed, an anisotropic conductive film (ACF) is disposed in the connection space 2b where the cover layer 10 is formed. Alternatively, the bonding layer 21 in which the conductive particles 22 are dispersed is applied to the connection space 2b in which the cover layer 10 is formed, or the conductive particles 22 are dispersed in the bonding layer 21 after the bonding layer 21 is applied. .

  Next, the substrate 2 and the mounting component 3 are pressure-bonded in the connection space 2b (step S5). When the bonding layer 21 of the anisotropic conductive layer 20 interposed between the substrate 2 and the mounting component 3 is heat-meltable, the substrate 2 and the mounting component 3 are pressure-bonded while being heated. When the bonding layer 21 is a photo-curing resin, the substrate 2 and the mounting component 3 are pressure-bonded under conditions where the resin is not cured. By this crimping, the cover layer 10 is penetrated by the conductive particles 22 sandwiched between the connection terminal 4 of the substrate 2 and the connection terminal 3A of the mounting component 3, and the connection terminal 4 and the connection terminal 3A face each other. In the connected area, the connection terminal 4 and the connected terminal 3A are electrically connected via the conductive particles 22. Thereafter, the bonding layer 21 is cured (step S6). When the bonding layer 21 is a photocurable resin, the bonding layer 21 is cured by irradiating the bonding layer 21 with light such as ultraviolet rays while maintaining the pressure-bonded state.

  The example shown in FIG. 6 shows a manufacturing process corresponding to the embodiment shown in FIG. First, as in the above-described example, the organic EL element 1U is formed on the substrate 2, and the connection terminals 4 connected to the electrodes (upper electrode 11 and lower electrode 13) of the organic EL element 1U are connected to the substrate 2. Form in the space 2b (step S1). Next, a sealing film 6B for sealing the organic EL element 1U is formed on the entire substrate. At this time, the organic EL element 1U is sealed by the sealing film 6B, and the cover layer 10 is formed in the connection space 2b by the sealing film 6B. The subsequent anisotropic conductive film forming step (S3-1), mounting component crimping step (S4-1), and bonding layer curing step (S5-1) are the same as the above-described S4 step, S5 step, and S6 step. .

  According to the manufacturing method shown in FIG. 6, when the organic EL element 1U is sealed with the sealing film 6B, a step for exposing the connection terminal 4 in the connection space 2b is not necessary. As a result, the tact time required to expose the connection terminal 4 in the connection space 2b can be eliminated, and the equipment required for the process can be eliminated, thereby shortening the manufacturing process of the organic EL device 1 that performs film sealing. Manufacturing cost can be reduced.

  As described above, the embodiments of the present invention have been described in detail with reference to the drawings. However, the specific configuration is not limited to these embodiments, and the design can be changed without departing from the scope of the present invention. Is included in the present invention. The embodiments described in the above drawings can be combined with each other as long as there is no particular contradiction or problem in the purpose, configuration, or the like. Moreover, the description content of each figure can become independent embodiment, respectively, and embodiment of this invention is not limited to one embodiment which combined each figure.

Claims (15)

A substrate,
One or more organic EL elements formed on the substrate;
A plurality of connection terminals provided on the substrate and electrically connected to the electrodes of the organic EL element;
An insulating cover layer covering the substrate between the connection terminals and the connection terminals;
A mounting component including a connected terminal that is mounted via an anisotropic conductive layer and electrically connected to the connection terminal,
The anisotropic conductive layer includes conductive particles that electrically connect the connection terminal and the connected terminal,
The organic EL device according to claim 1, wherein the conductive particles penetrate the cover layer and electrically connect the connection terminal and the connected terminal.   The anisotropic conductive layer includes an insulating bonding layer that physically bonds the substrate and the mounting component, and the conductive particles are dispersed in the bonding layer. The organic EL device described.   3. The organic EL device according to claim 2, wherein the conductive particles penetrate through the cover layer and electrically connect the connection terminal and the connection target terminal by pressure bonding of the substrate and the mounting component.   4. The organic EL device according to claim 3, wherein the connection terminal and the cover layer are arranged in a connection space where the substrate and the mounting component are connected.   The organic EL device according to claim 4, wherein the cover layer is formed of a sealing film that seals the organic EL element with the substrate.   The organic EL device according to claim 5, wherein the cover layer contains an inorganic substance.   The organic EL device according to claim 6, wherein the cover layer includes an aluminum oxide film.   6. The organic EL device according to claim 5, wherein the cover layer is a layer formed by atomic layer deposition (ALD).   The organic EL device according to claim 3, wherein the anisotropic conductive layer is a thermocompression-bonding anisotropic conductive film.   The organic EL device according to claim 2, wherein the bonding layer of the anisotropic conductive layer is a photocurable resin.   2. The organic EL device according to claim 1, wherein the diameter of the conductive particles is larger than the thickness of the cover layer.   The organic EL device according to claim 11, wherein the conductive particles have corners on the surface or the entire shape.   The organic EL device according to claim 1, wherein the connection terminal has a multilayer structure. Forming an organic EL element on the substrate and forming a connection terminal connected to an electrode of the organic EL element in a connection space on the substrate;
Forming an insulating cover layer covering the connection terminal and the substrate in the connection space;
A mounting step of mounting a mounting component in the connection space via an anisotropic conductive layer;
In the mounting step, the substrate and the mounting component are pressure-bonded so that the conductive particles of the anisotropic conductive layer penetrate the cover layer to electrically connect the connection terminal and the connected terminal of the mounting component. A method for manufacturing an organic EL device, characterized by comprising: Forming an organic EL element on the substrate and forming a connection terminal connected to an electrode of the organic EL element in a connection space on the substrate;
By forming a sealing film for sealing the organic EL element with the substrate, an insulating cover layer is formed by the sealing film to cover the connection terminals and the substrate in the connection space. And a process of
A mounting step of mounting a mounting component in the connection space via an anisotropic conductive layer;
In the mounting step, the substrate and the mounting component are pressure-bonded so that the conductive particles of the anisotropic conductive layer penetrate the cover layer to electrically connect the connection terminal and the connected terminal of the mounting component. A method for manufacturing an organic EL device, characterized by comprising:

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