JP2009224321A - Organic el display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL display with a smaller frame, can make an area occupied by a non-display region smaller, and achieve a wiring method for the small frame without giving damages to organic EL elements. <P>SOLUTION: The organic EL display is made by providing a laminate 4 made by pinching an organic layer 1 at least containing a light-emitting layer with a first electrode 2 and a second electrode 3 on a translucent substrate 10, and that 10 and a sealing substrate 20 to be jointed and sealed. An auxiliary wiring 5 is provided on a rear face of the sealing substrate 20, the auxiliary wiring 5 and the first electrode 2 or the second electrode 3 are electrically connected through a photocuring anisotropic conductive film 6. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an organic electroluminescence (hereinafter referred to as “organic EL”) display, and more specifically, an organic EL display (hereinafter also simply referred to as “display”) capable of displaying multiple colors with high definition and excellent visibility. The present invention relates to an organic EL display suitably used for a backlight of a color liquid crystal display or other lighting equipment.

  As an example of a light emitting element applied to a display device such as an organic EL display or a color liquid crystal display, an organic EL element having a thin film laminated structure of an organic compound is known. The organic EL element is a thin-film self-luminous element and has excellent characteristics such as a low driving voltage, high resolution, and a high viewing angle. Therefore, various studies have been made for its practical use.

  In a conventional organic EL device, a hole (hole) injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are sequentially formed on a glass substrate on which an anode is formed. The cathode has a structure formed thereon. In such an organic EL element, a structure in which a concave sealing glass made of a glass material covering an organic layer portion is hermetically disposed on a glass substrate via an ultraviolet curable adhesive is known. Yes. Such an organic EL panel is disclosed in Patent Document 1, for example.

  Further, as a display panel mounting structure constituted by arranging organic EL elements, a TCP (Tape Carrier Package) package in which a driver IC is mounted on a glass substrate or a driver IC is mounted on a tape is used. An ACF (Anisotropic Conductive Film) mounted on top is generally used. Patent Document 2 discloses an example of a structure in which a panel size can be reduced in a state after mounting by taking out a plurality of wirings on one side of a glass substrate.

  Patent Document 3 discloses a light emitting device having an EL element including an electrode including a reflective surface, an organic EL layer, and a transparent electrode, and an auxiliary electrode connected to the transparent electrode via a conductor. . Further, Patent Document 4 includes an auxiliary electrode, a conductive portion that is connected to the auxiliary electrode so as to be connectable to the electrode of the organic electroluminescent element, and an external electrode that is connected to the auxiliary electrode and exposed to the outer surface of the sealing member. An organic electroluminescent element sealing member is disclosed that is provided to seal an organic light emitting layer of an organic electroluminescent element.

JP 2002-8855 A JP-A-6-11721 JP 2002-33198 A JP 2006-127916 A

  However, when the conventional mounting configuration as described in Patent Document 2 is adopted, the wiring electrode is drawn around the glass substrate for a long time, and the portion of the organic EL element that performs pixel display has a peripheral area. The area occupied by the non-display area (so-called “frame” portion) must be large.

  In this regard, Patent Document 3 discloses that a transparent electrode and an auxiliary electrode are connected via an anisotropic conductor, but only a photolithography, an inkjet method, or a printing method is disclosed as a forming method. There is no disclosure of a detailed formation method for the ink jet method or the printing method. When the anisotropic conductor is formed by photolithography, it is considered that the organic EL element is destroyed because firing at about 200 ° C. is required in the process. Further, in order to ensure conduction using the ACF, it is necessary to crush the conductive particles between the two substrates by pressurization. However, there is no disclosure in Patent Document 3 regarding this point. Furthermore, Patent Document 4 mentions ACF as an example of the conductive part, but there is no specific example and there is no disclosure about the method of forming ACF. Therefore, similarly to Patent Document 3, Patent Document 4 does not indicate that a conductive portion made of ACF is provided without destroying the organic EL element. Therefore, in the conventional technique, the frame cannot be reduced without damaging the organic EL element.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-described problem, reduce the area occupied by the non-display region, and prevent the organic EL element from being damaged when the frame is narrowed. This is to provide an organic EL display with a smaller frame.

  As a result of intensive studies, the inventors of the present invention have provided an auxiliary wiring that is electrically connected to at least one of the first electrode and the second electrode on the back surface of the sealing substrate, and the auxiliary wiring pattern and the organic EL element are drawn out from the first. The inventors have found that the above problems can be solved by electrically connecting the wiring of one electrode or the second electrode with a photocurable ACF, and have completed the present invention.

That is, in the organic EL display of the present invention, a laminated body in which an organic layer including at least a light emitting layer is sandwiched between a first electrode and a second electrode is disposed on a light-transmitting substrate. In an organic EL display in which a sealing substrate is bonded and sealed,
An auxiliary wiring is provided on the back surface of the sealing substrate, and the auxiliary wiring and the first electrode or the second electrode are electrically connected via a photocurable anisotropic conductive film. It is characterized by.

  In the display of the present invention, the translucent substrate and the sealing substrate are joined at two locations of the anisotropic conductive film and an outer peripheral sealing portion disposed on a peripheral portion of both substrates. Can be.

  According to the present invention, with the above-described configuration, it is possible to reduce the area occupied by the frame by turning the wiring that has been conventionally arranged around the organic EL element to the back surface of the sealing substrate. In addition, since the photocurable ACF is used for the connection between the wirings, the organic EL element is not damaged at the time of connection, and the characteristic deterioration does not occur. Therefore, this can reduce the area occupied by the non-display region in the display device, and realize a wiring method that does not damage the organic EL element during the narrowing of the frame, thereby reducing the frame. An organic EL display can be obtained.

It is typical sectional drawing which shows one structural example of the organic electroluminescent display of this invention. (A) is the typical top view which looked at the direction of the organic layer from the BB section in Drawing 1, and (b) is a typical sectional view which meets the CC section in Drawing 2 (a). It is. It is typical sectional drawing which follows the DD cross section in Fig.2 (a).

DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 shows a schematic cross-sectional view of a preferred example of the organic EL display of the present invention. As shown in the drawing, in the organic EL display of the present invention, a laminate 4 in which an organic layer 1 including at least a light-emitting layer is sandwiched between a first electrode 2 and a second electrode 3 is disposed on a translucent substrate 10. The translucent substrate 10 and the sealing substrate 20 are bonded and sealed.

  In the display of the present invention, the auxiliary wiring 5 is disposed on the back surface of the sealing substrate 20, and the auxiliary wiring 5 and the first electrode 2 or the second electrode 3, in the illustrated example, the first electrode 2 are provided. They are electrically connected through a photocurable anisotropic conductive film (ACF) 6. That is, in this case, the first electrode 2 is connected to the connection portion 5a of the auxiliary wiring 5 and the auxiliary wiring 5 through the ACF 6, and further connected to the electrode lead portion 2a through the connection portion 5b and the ACF 6. A drive circuit (not shown) is connected to the electrode lead portion 2a.

  ACF is a film-like adhesive formed by dispersing conductive particles in an epoxy resin or an acrylic resin. After this ACF is applied between the electrode wirings, the conductive particles contained in the ACF are crushed by applying pressure and curing, and electrical connection can be obtained at the crushed conductive particles. . In the present invention, among the ACFs, a photocurable ACF that is cured by light irradiation is used. When wiring is connected by ACF, if a normal thermosetting ACF is used, heating at 180 ° C. or higher is required for thermosetting. Therefore, in an organic EL element having a heat resistant temperature of about 130 ° C., damage is caused when the ACF is thermoset. Therefore, it is expected that characteristic deterioration will occur. On the other hand, the damage given to an organic EL element can be avoided by connecting with the photocurable ACF according to the present invention.

  Specifically, the photocurable resin used for the photocurable ACF according to the present invention includes (1) a composition comprising an acrylic polyfunctional monomer and oligomer having a plurality of acroyl groups and methacryloyl groups, and a photopolymerization initiator. (1) a polymer film obtained by phototreatment of a material film to generate a photo radical and polymerized; (2) a composition comprising a polyvinyl cinnamate ester and a sensitizer, which is dimerized and cross-linked by phototreatment; 3) A composition film comprising a chain or cyclic olefin and a bisazide is phototreated to generate nitrene and crosslinked with the olefin, and (4) a composition comprising an epoxy group-containing monomer and a photoacid generator. Examples thereof include those obtained by photopolymerizing a material film to generate an acid (cation) and polymerize it. Among these, the photocurable resin (1) is particularly preferable in terms of reliability such as solvent resistance.

  In addition, as the conductive particles to be contained in the photocurable ACF, those obtained by applying metal plating to resin fine particles such as polyethylene and the like can be suitably used. The particle size is, for example, 1 to 10 μm.

  Such a photocurable ACF is generally used at a target location on one substrate after the laminate 4 is formed on the translucent substrate 10 and the auxiliary wiring 5 is formed on the back surface of the sealing substrate 20. Similarly to the sealing adhesive, it can be applied by applying using a dispenser, for example. Thereafter, both the substrates are stacked and pressed to crush the photocurable ACF, and then the two substrates can be bonded together by light irradiation. In this case, as shown in FIG. 1, by simultaneously applying a sealing adhesive to the peripheral portions of the light-transmitting substrate 10 and the sealing substrate 20, the photocurable ACF 6 and the sealing material are sealed between these substrates. It can join at two places with the outer periphery sealing part 7 using an adhesive agent.

  FIG. 2A shows a schematic plan view in which the direction of the organic layer is seen from the BB cross section in FIG. FIG. 1 corresponds to a cross-sectional view along the AA cross section in FIG. Moreover, FIG.2 (b) is typical sectional drawing which follows the CC cross section in Fig.2 (a). Furthermore, FIG. 3 is a schematic cross-sectional view along the DD cross section in FIG. As shown in FIG. 1, in this embodiment, the first electrode 2 is separated at the lower part of the organic layer 1, and the first electrode 2 on the electrode lead-out portion side is as shown in FIGS. The electrode lead part 2a is directly connected. On the other hand, the ACF 6 is formed on the first electrode 2 on the side opposite to the electrode lead portion, and as described above, the first electrode 2 in this portion is connected to the auxiliary wiring 5 via the ACF 6 and the connection portion 5a. Furthermore, it is connected to the electrode lead portion 2a via the connection portion 5b and the ACF 6. In this case, by using a material having a small resistance for the auxiliary wiring 5, the first electrode 2 on the side opposite to the electrode lead portion 2a is also substantially equal to the potential of the first electrode on the electrode lead portion 2a side. As shown in FIG. 2A, the second electrode 3 is also pulled out from the bottom of the outer peripheral sealing portion 7 and connected to the drive circuit.

  In the display of the present invention, there is no particular limitation except that the auxiliary wiring and the first electrode or the second electrode are electrically connected using the photocurable ACF, and a specific layer of the display is not limited. About a structure and the material of each layer, it can comprise suitably according to a conventional method.

  For example, the material of the auxiliary wiring 5 may be a metal such as Cu, Mo, or Al or a conductive oxide such as IZO or ITO. Among these, a transparent oxide such as IZO is used to transmit light at a portion where the wiring pattern formed on the sealing substrate 20 and the electrode wiring on the translucent substrate 10 are connected by the photocurable ACF. Must be used.

  The material of the translucent substrate 10 is particularly limited as long as it can withstand various conditions (for example, a solvent used, a temperature, and the like) used when forming layers sequentially stacked on the translucent substrate 10. Is not to be done. Preferably, those having excellent dimensional stability are used. Examples of suitable materials include a glass substrate or a rigid resin substrate formed of an acrylic resin such as polyolefin or polymethyl methacrylate, a polyester resin such as polyethylene terephthalate, a polycarbonate resin, or a polyimide resin. Examples of other suitable materials include flexible films formed of acrylic resins such as polyolefin and polymethyl methacrylate, polyester resins such as polyethylene terephthalate, polycarbonate resins, and polyimide resins.

The organic layer 1 which concerns on this invention is a layer which makes the core of a light emission part. As described above, the organic layer 1 includes at least a light emitting layer, and includes a hole transport layer, a hole injection layer, an electron transport layer, and / or an electron injection layer as necessary. For example, the following layer structure can be adopted for the organic layer 1.
(1) Organic light emitting layer (2) Hole injection layer / organic light emitting layer (3) Organic light emitting layer / electron injection layer (4) Hole injection layer / organic light emitting layer / electron injection layer (5) Hole transport layer / Organic light emitting layer / electron injection layer (6) Hole injection layer / hole transport layer / organic light emitting layer / electron injection layer (7) Hole injection layer / hole transport layer / organic light emitting layer / electron transport layer / electron injection Layer In each of the above configurations (1) to (7), the electrode functioning as the anode is connected to the left side, and the electrode functioning as the cathode is connected to the right side.

Among these, the material of the organic light emitting layer can be selected according to a desired color tone. For example, in order to obtain light emission from blue to blue-green, fluorescent whitening agents such as benzothiazole, benzimidazole, and benzoxazole, metal chelated oxonium compounds, styrylbenzene compounds, aromatic dimethylidin compounds, etc. Can be used. More specifically, 4,4′-bis (2,2-diphenylvinyl) biphenyl (DPVBi) can be mentioned. In order to obtain light emission at various wavelengths, a host compound (distyrylarylene compound, 4,4′-bis [N- (3-tolyl) -N-phenylamino] biphenyl (TPD), aluminum complex (for example, A tris (8-hydroxyquinolinato) aluminum complex (Alq ₃ ) or the like added with perylene, quinacridones, rubrene or the like as a dopant can also be used.

Moreover, the organic light emitting layer which emits the light of a various wavelength range can also be formed by adding a dopant to a host compound. In this case, a distyrylarylene compound, N, N′-ditolyl-N, N′-diphenylbiphenylamine (TPD), Alq ₃ or the like can be used as the host compound. On the other hand, as a dopant, perylene (blue purple), coumarin 6 (blue), quinacridone compounds (blue green to green), rubrene (yellow), 4-dicyanomethylene-2- (p-dimethylaminostyryl) -6 Methyl-4H-pyran (DCM, red), platinum octaethylporphyrin complex (PtOEP, red), or the like can be used.

  As a hole-injecting host material, phthalocyanines (such as copper phthalocyanine) or indanthrene compounds, BAPP (N, N-bis- (4′-biphenylamino-4-phenyl) -3-perynylamine) , BABP (N, N-bis- (4′-biphenylamino-4-biphenyl) -3-perinylamine), CzPP (N, N-bis- (N′-phenylcarbazole) -3-perinylamine), CzBP (N , N-bis- (4′-carbazole-4-biphenyl) -3-perinylamine) and the like can be used. Further, a hole transporting material can be used as a material having a carrier transport property superior to that of an injectable host material, such as triphenylamine derivative (TPD), N, N′-bis (1-naphthyl) -N, N′—. Diphenylbiphenylamine (α-NPD), 4,4 ′, 4 ″ -tris (N-3-tolyl-N-phenylamino) triphenylamine (m-MTDATA), N, N, N′-tetrabiphenyl-4 A known material including a triarylamine material such as 4,4'-biphenylenediamine (TBPB) can be used.

The materials for the electron transport layer and the electron injection layer are not particularly limited, and known materials can be used. For example, the electron transport layer may be an oxadiazole derivative such as 2- (4-biphenyl) -5- (pt-butylphenyl) -1,3,4-oxadiazole (PBD (check)), triazole Derivatives, triazine derivatives, phenylquinoxalines, quinolinol complexes of aluminum (eg, Alq ₃ ), and the like can be used. The electron injection layer can be formed using an alkali metal or alkaline earth metal such as Li, Ca, Cs, or Mg, or a fluoride or oxide of these metals.

  In addition, a buffer layer for further increasing the electron injection efficiency can be optionally formed between the organic layer 1 and the second electrode 3 (not shown). As the buffer layer, an electron injecting material such as an alkali metal, an alkaline earth metal or an alloy thereof, or a rare earth metal or a fluoride thereof can be used. Moreover, it is also preferable to form a damage mitigating layer (not shown) made of MgAg or the like on the organic layer 1 in order to mitigate damage when the second electrode 3 is formed.

The first electrode 2 has functions of charge injection into the organic layer 1 and connection with an external drive circuit. A desirable material when the first electrode 2 functions as a reflective electrode is a highly reflective metal (such as aluminum, silver, molybdenum, tungsten, nickel, or chromium) or an amorphous alloy (such as NiP, NiB, CrP, or CrB). The thing which consists of is mentioned. Desirable materials when the first electrode 2 functions as a transparent electrode include conductive metals such as SnO ₂ , In ₂ O ₃ , In—Sn oxide, In—Zn oxide, ZnO, or Zn—Al oxide. An oxide can be used.

  The second electrode 3 can be formed using the same material as that of the first electrode 2 regardless of whether the second electrode 3 functions as a reflective electrode or a transparent electrode. Further, the transmittance of the second electrode 3 is preferably 50% or more with respect to light having a wavelength of 400 to 800 nm in order to have an effective function of extracting light emitted from the organic layer 1 upward. Is more preferably 85% or more.

  As the sealing adhesive 7, for example, an epoxy-based UV (ultraviolet) curable adhesive or the like can be used. In the sealing adhesive 7, an element for supplementing the distance between the light-transmitting substrate 10 and the sealing substrate 20, for example, a material containing spacer particles such as glass beads may be used. Good.

  The sealing substrate 20 is used to isolate the organic EL element from the outside and make the light emitting function of the organic EL element effective. The preferred sealing substrate 20 is formed of, for example, a glass substrate, a metal sealing substrate such as SUS or Al, or an acrylic resin such as polyolefin or polymethyl methacrylate, a polyester resin such as polyethylene terephthalate, a polycarbonate resin, or a polyimide resin. And a rigid resin substrate. A flexible film formed of an acrylic resin such as polyolefin or polymethyl methacrylate, a polyester resin such as polyethylene terephthalate, a polycarbonate resin, or a polyimide resin is also preferably used.

  In addition, a color filter (CF), a CF + color conversion layer (CCM), a planarization layer (OCL), or the like is usually laminated below the first electrode 2 (reference numeral 8 in FIG. 1). The color filter is a layer that transmits only light in a desired wavelength range. When the color filter has a laminated structure with the color conversion layer, it is effective in that the color purity of the light whose wavelength distribution is converted by the color conversion layer can be improved. Examples of the color filter include those using a commercially available liquid crystal color filter material such as a color mosaic manufactured by FUJIFILM Electronics Materials Corporation.

  The light conversion layer is a layer containing a fluorescent dye for color conversion, and may contain a matrix resin. The light conversion layer is a layer for performing wavelength distribution conversion on the light emitted from the organic EL element and emitting light in different wavelength ranges. Here, the fluorescent dye constituting the light conversion layer is a dye that emits light in a desired wavelength range (for example, red, green, or blue).

  Examples of the fluorescent dye that absorbs light in the blue to blue-green region and emits fluorescence in the red region include rhodamine B, rhodamine 6G, rhodamine 3B, rhodamine 101, rhodamine 110, sulforhodamine, basic violet 11, and basic red 2. Such as rhodamine dyes, cyanine dyes, pyridine dyes such as 1-ethyl-2- [4- (p-dimethylaminophenyl) -1,3-butadienyl] -pyridinium-perchlorate (pyridine 1), or oxazine System dyes and the like. Furthermore, various dyes (direct dyes, acid dyes, basic dyes, disperse dyes, etc.) can be used as long as they have fluorescence.

  On the other hand, as a fluorescent dye that absorbs light in the blue or blue-green region and emits fluorescence in the green region, for example, 3- (2′-benzothiazolyl) -7-diethylaminocoumarin (coumarin 6), 3- (2 '-Benzimidazolyl) -7-diethylaminocoumarin (coumarin 7), 3- (2'-N-methylbenzimidazolyl) -7-diethylaminocoumarin (coumarin 30), 2,3,5,6-1H, 4H-tetrahydro-8 A coumarin dye such as trifluoromethylquinolidine (9,9a, 1-gh) coumarin (coumarin 153), or basic yellow 51 which is a coumarin dye dye, and further naphthalimide such as solvent yellow 11 and solvent yellow 116 System dyes and the like. Furthermore, various dyes (direct dyes, acid dyes, basic dyes, disperse dyes, etc.) can be used if they are fluorescent.

  As the matrix resin constituting the light conversion layer, an acrylic resin, various silicone polymers, or any material that can be substituted for them can be used. For example, straight silicone polymers and modified resin silicone polymers can be used.

Hereinafter, the present invention will be described in more detail with reference to examples.
Example 1
<Organic EL substrate>
A glass substrate having a thickness of 0.7 mm as the translucent substrate 10 was subjected to ultrasonic cleaning in pure water and dried, and then further subjected to UV ozone cleaning. A color mosaic CK-7800 (manufactured by Fuji Film Electronics Materials Co., Ltd.) is applied to this cleaned glass substrate using a spin coating method, and patterning is performed using a photolithographic method, resulting in a width of 0.03 mm. A black matrix in which a plurality of stripe-shaped portions having a film thickness of 1 μm are arranged at a pitch of 0.11 mm was formed.

  Subsequently, a color mosaic CB-7001 (manufactured by Fuji Film Electronics Materials Co., Ltd.) is applied and patterned using a photolithographic method, and a plurality of stripes extending in the first direction having a width of 0.1 mm and a thickness of 1 μm. A blue color filter layer in which the shape portions are arranged at a pitch of 0.33 mm was formed.

  Next, coumarin 6 (0.9 parts by mass) was dissolved in 120 parts by mass of propylene glycol monoethyl acetate (PGMEA) as a solvent. To this, 100 parts by weight of “V259PA / P5” (manufactured by Nippon Steel Chemical Co., Ltd.) as a photopolymerizable resin composition was added and dissolved to obtain a coating solution. This coating solution is applied onto the glass substrate using a spin coating method, and patterned by a photolithographic method. A plurality of stripe-shaped portions extending in the first direction having a width of 0.1 mm and a film thickness of 5 μm are pitched. A green color conversion layer arranged at 0.33 mm was obtained.

  Furthermore, Coumarin 6 (0.5 parts by mass), Rhodamine 6G (0.3 parts by mass) and Basic Violet 11 (0.3 parts by mass) were added to “V259PA / P5” (manufactured by Nippon Steel Chemical Co., Ltd.) 100 parts by mass. Was added and dissolved to obtain a coating solution. This coating solution is applied onto the glass substrate by spin coating, and patterned by photolithography, so that a plurality of stripe-shaped portions extending in the first direction having a width of 0.1 mm and a film thickness of 5 μm have a pitch of 0. A red conversion layer arranged at 33 mm was formed.

  “V259PA / P5” was applied to the glass substrate on which the color filter layer and the color conversion layer were formed as described above, and a flattening layer having a thickness of 8 μm was formed by irradiating light from a high-pressure mercury lamp. . At this time, no deformation occurred in the stripe shapes of the color filter layer and the color conversion layer, and the upper surface of the planarizing layer was flat.

  Next, a passivation layer composed of a 300 nm-thickness SiOx film was formed on the planarizing layer by sputtering. An RF-planar magnetron was used for the sputtering device, and Si was used for the target. A mixed gas of Ar and oxygen was used as a sputtering gas during film formation.

Next, IZO was deposited on the entire upper surface of the passivation layer by sputtering. Using a DC sputtering apparatus, 100 W electric power was applied using In ₂ O ₃ -10% ZnO as a target in an Ar atmosphere at a pressure of 0.3 Pa. The film formation speed at this time was 0.33 nm / s. Subsequently, patterning is performed by a photolithography method, and further, a drying process (150 ° C.) and a UV process (mercury lamp, room temperature and 150 ° C.) are performed. A transparent electrode (anode) composed of a plurality of stripe-shaped partial electrodes extending in the first direction with a thickness of 11 mm and a thickness of 100 nm was obtained.

Next, the glass substrate on which the transparent electrode is formed is mounted in a resistance heating vapor deposition apparatus, and an organic EL layer composed of a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer is sequentially formed without breaking the vacuum. did. During film formation, the internal pressure of the vacuum chamber was reduced to 1 × 10 ⁻⁵ Pa.

As the hole injection layer, a co-evaporated film of 4,4′-tris (3-methylphenylamine) -triphenylamine (m-NTDATA) and tetrafluorotetracyano-quinodimethane (F4-TCNQ) was used. Was formed at 75 nm so that m-NTDATA: F4-TCNQ = 100: 2. As the hole transport layer, 10 nm of n, n′-bis- (1-naphthyl) -n, n′-diphenyl-1,1′-biphenyl-4,4′-diamine (NPB) is laminated to form a light emitting layer. Are DPVBi, 4,4′-bis [2- {4- (N, N-diphenylamino) phenyl} vinyl] biphenyl (DPAVBi) and 4- (dicyanomethylene) -2-methyl-6- (p-dimethyl). A co-evaporated film with aminostyryl) -4H-pyran (DCM) was laminated at 35 nm so as to have a film thickness ratio of 100: 3: 0.15. Subsequently, the Alq ₃ as the electron transport layer was formed to a thickness of 20 nm.

  Then, using a mask that can obtain a stripe pattern with a width of 0.3 mm and a pitch of 0.33 mm extending in the second direction orthogonal to the first direction without breaking the vacuum, LiF (film thickness: 1 nm) / Al ( A reflective electrode composed of a plurality of stripe-shaped partial electrodes was formed.

  The glass substrate (organic EL substrate) formed up to the reflective electrode in this way was moved to a dry nitrogen atmosphere (moisture concentration of 10 ppm or less) in the glove box.

<Sealing substrate>
The sealing substrate was manufactured using a non-alkali glass (manufactured by Nippon Electric Glass Co., Ltd., OA-10) having a thickness of 0.7 mm. On this sealing substrate, a Cu pattern having a width of 0.094 mm, a pitch of 0.11 mm and a thickness of 1 μm was formed as an auxiliary wiring by sputtering. In addition, about the part joined with the lower electrode of an organic electroluminescent board | substrate, IZO was formed previously and parts other than a junction part were made into Cu wiring.

  Next, the portion of the glass where the wiring pattern was formed was left as it was, and a counterbore process was performed at a depth of 0.3 mm in other locations. Sand blasting was used to form the counterbored grooves. A paste-like desiccant was applied to the bottom of the counterbore groove using a dispenser system, dried by heating in an atmosphere having a moisture concentration of 10 ppm or less, and then naturally cooled.

<Sealing>
The sealing substrate obtained above was set on a coating stage in a bonding apparatus while maintaining an atmosphere having a moisture concentration of 10 ppm or less. Photocuring in which conductive fine particles in which resin fine particles (particle diameter φ10 μm, made of polyethylene) are plated with gold are mixed in the portion to be joined to the lower electrode of the organic EL substrate on the auxiliary wiring of the sealing substrate. Type adhesive (a composition film comprising an acrylic polyfunctional monomer and oligomer having a plurality of acroyl groups and methacryloyl groups and 5% by mass of a photopolymerization initiator was phototreated to generate photo radicals and polymerize them. Were applied by a dispenser system. Next, an outer peripheral sealing part is formed by applying an ultraviolet curable epoxy adhesive containing φ20 μm beads (XNR-5516, manufactured by Nagase Chemrax Co., Ltd.) as a peripheral sealing agent to the peripheral part of the sealing substrate. did.

  Then, the organic EL substrate and the sealing substrate face each other in the same apparatus, the pressure is reduced to 1 kPa, the two substrates are brought into contact, the ACF and the outer peripheral sealing portion are crushed by returning to atmospheric pressure, and both the substrates are attached. Combined. This was set in an ultraviolet irradiation device, and the ACF and the outer peripheral sealing portion were irradiated with ultraviolet rays to complete the bonding.

  The resulting organic EL display had a small non-display area and no damage to the organic EL element.

DESCRIPTION OF SYMBOLS 1 Organic layer 2 1st electrode 2a Electrode extraction part 3 2nd electrode 4 Laminated body 5 Auxiliary wiring 5a, 5b Connection part 6 Photocurable anisotropic conductive film (ACF)
7 Peripheral sealing part 10 Translucent substrate 20 Sealing substrate

Claims (2)

A laminated body in which an organic layer including at least a light emitting layer is sandwiched between a first electrode and a second electrode is disposed on a translucent substrate, and the translucent substrate and the sealing substrate are bonded and sealed. In the organic EL display which is made,
An auxiliary wiring is provided on the back surface of the sealing substrate, and the auxiliary wiring and the first electrode or the second electrode are electrically connected via a photocurable anisotropic conductive film. Organic EL display characterized by this.   2. The organic material according to claim 1, wherein the translucent substrate and the sealing substrate are bonded at two locations of the anisotropic conductive film and an outer peripheral sealing portion disposed at a peripheral portion of both substrates. EL display.

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