JP3571825B2

JP3571825B2 - Liquid crystal display

Info

Publication number: JP3571825B2
Application number: JP25968795A
Authority: JP
Inventors: 関口　　金孝
Original assignee: Citizen Watch Co Ltd
Current assignee: Citizen Watch Co Ltd
Priority date: 1995-10-06
Filing date: 1995-10-06
Publication date: 2004-09-29
Anticipated expiration: 2015-10-06
Also published as: JPH09101533A

Description

【０００１】
【発明の属する技術分野】
本発明は液晶表示パネルを構成する第１の基板上に、この液晶表示装置を駆動するための駆動用集積回路を接続する液晶表示装置の実装構造に関する。
【０００２】
【従来の技術】
近年、各種情報端末用や計測器やパーソナルコンピュータ用のディスプレイにマトリクス型の液晶表示パネルが数多く利用されている。
【０００３】
この液晶表示パネルを表示するために外部からの駆動信号を供給する手段として、液晶表示パネルの外部に設ける駆動用集積回路（ＩＣ）から信号を印加する手段がある。駆動用集積回路と液晶表示パネルとの接続方法としては、様々な手段が提案され、そして実用化されている。
【０００４】
とくに、大表示容量のマトリクス型液晶表示パネルの場合には、駆動用集積回路を直接液晶表示パネルを構成する基板上に実装する構造が、集積度やコストの優位性のために開発されてきている。
【０００５】
上記の駆動用集積回路を直接液晶表示パネルを構成する基板上に実装する構造は、チップ・オン・グラス（以下ＣＯＧと記載する）実装法と呼ばれ、広く利用されている。
【０００６】
ＣＯＧ実装法以外の実装手段としては、導電性薄膜と絶縁性樹脂とを用いて形成する薄膜フィルム上に駆動用集積回路を実装し、薄膜フィルム上の導電性薄膜と液晶表示パネルの接続用パターン電極とを異方性導電性フィルム（ＡＣＦ）で接続するテープ・オートメイティド・ボンディング（ＴＡＢ）実装法、あるいは一度プリント基板上に駆動用集積回路を実装し、さらに導電性薄膜と絶縁性樹脂とを用いて形成する薄膜フィルムをプリント基板と液晶表示パネルとの接続に利用するチップ・オン・ボード（ＣＯＢ）実装法などがある。
【０００７】
これらのＴＡＢやＣＯＢ実装構造のうちとくにＣＯＧ実装法は、他の実装手段に比較して、高密度化と小面積化と低コスト化とが可能であり、これらの面で他の実装構造より優位性が高い。
【０００８】
さらに近年、ノートブックパーソナルコンピューターあるいはノートブックワールドプロセッサーにできるだけ大型のディスプレイを搭載するため、駆動用集積回路の実装領域を小さくするが重要である。
【０００９】
つぎにＣＯＧ実装構造を採用する液晶表示装置における従来例を、図面を用いて説明する。図９は従来例における液晶表示装置の液晶表示パネルに駆動用集積回路を実装した実装構造を示す平面図であり、図１０は図９におけるＥ−Ｅ線での断面を示す断面図である。以下図９と図１０とを交互に用いて従来技術を説明する。
【００１０】
第１の基板１上には、パターン電極４と駆動用集積回路６の突起電極７と対応するパネル接続用パターン電極３を設ける。そしてパターン電極４とパネル接続用パターン電極３とはいずれも導電性薄膜にて構成し、同一工程で形成する。
【００１１】
この第１の基板１上に設けるパネル接続用パターン電極３上には、導電性接着剤８を介して、突起電極７を設ける駆動用集積回路６を実装する。
【００１２】
この導電性接着剤８によって、駆動用集積回路６の突起電極７は、第１の基板１のパネル接続用パターン電極３に電気的にしかも機械的に接続することができる。
【００１３】
さらに、第１の基板１にシール剤１０を介して張り合わせる第２の基板２には画素パターン５を設ける。液晶表示パネルは、第１の基板１と第２の基板２とを所定の距離を隔ててパターン電極３と画素パターン５とを対向させ、その周辺をシール剤１０で封止している。
【００１４】
第１の基板１と第２の基板２との重なった領域でかつシール剤１０の内側の領域には液晶層１１を封入する。
【００１５】
第１の基板１上に設けるパネル接続用パターン電極３と駆動用集積回路６に設ける突起電極７とを、導電性接着剤８にて接続するＣＯＧ実装構造を採用する。そして、パネル接続用パターン電極３と駆動用集積回路６とを電気的接続と機械的接続とを行い、さらに駆動用集積回路６を含む第１の基板１表面に硬化性樹脂９を用いて樹脂封止する。
【００１６】
さらに、駆動用集積回路６へ外部信号を印加するために、駆動用集積回路６の入力部においても、第１の基板１に設ける外部回路接続用パターン電極１２と駆動用集積回路６に設ける突起電極７とを、導電性接着剤８にて接続するＣＯＧ実装構造を採用する。また、外部回路接続用パターン電極１２と外部回路を接続するため、ポリイミド樹脂１３に導電性薄膜として銅（Ｃｕ）薄膜からなる金属箔１４をパターン形成したフレキシブルプリント基板（ＦＰＣ）１５を熱硬化性異方性導電フィルム（ＡＣＦ）１６を介して接続する。
【００１７】
この熱硬化性異方性導電フィルム１６は熱硬化性樹脂１７に導電粒１８を混入したものを用いる。
【００１８】
【発明が解決しようとする課題】
図９と図１０とを用いて説明したＣＯＧ実装構造は簡便な実装手段で、高密度で多端子接続が可能で、そのうえ小型化でしかも低コスト化を達成する上で有効である。
【００１９】
しかしながら、ＣＯＧ実装構造と駆動用集積回路６から外部回路接続用パターン電極１２を張り出し、熱硬化性異方性導電フィルム（ＡＣＦ）１６を用いて第１の基板１上でフレキシブルプリント基板１５と接続を行う場合には、フレキシブルプリント基板１５と熱硬化性異方性導電フィルム１６の接続を行うための、ある程度の距離を有する外部回路接続長さ（Ｗ１）が必要となる。この外部回路接続長さＷ１は、図９に示すようにパネル接続用パターン電極３と第１の基板１の端面部との距離である。
【００２０】
この外部回路接続長さＷ１は、駆動用集積回路６と外部回路との接続手段に、ＣＯＧ実装構造とフレキシブルプリント基板１５と熱硬化性異方性導電フィルム１６を利用する手段においては、熱硬化性異方性導電フィルム１６の張り合わせ誤差や、あるいはフレキシブルプリント基板１５にパターン形成する銅薄膜からなる金属箔１４のパターン精度や、あるいは熱硬化性異方性導電フィルム１６による接続強度を確保するための面積が必要である。このため、熱硬化性異方性導電フィルム１６によってフレキシブルプリント基板１５を接続する外部回路接続長さＷ１を短くするには限度がある。
【００２１】
本発明は上記の問題点に着目し、その目的はフレキシブルプリント基板を接続する領域であるパネル接続用パターン電極と第１の基板の端面部との距離である外部回路接続長さを短くすることが可能な液晶表示装置における実装手段を提供することにある。
【００２２】
【課題を解決するための手段】
上記の目的を解決するために本発明の液晶表示装置は、以下に記載の構造を採用する。
【００２３】
本発明の液晶表示装置は、第１の基板と第２の基板を所定の距離を設けて張り合わせるためのシール剤と、第１の基板と第２の基板の重なり部に封入する液晶層と、第１の基板上に設ける駆動用集積回路と接続するためのパネル接続用パターン電極と外部回路接続用パターン電極と、パネル接続用パターン電極と外部回路接続用パターン電極に駆動用集積回路を接続するための導電性接着剤あるいは異方性導電フィルムを有し、導電性接着剤あるいは異方性導電フィルムによりパネル接続用パターン電極と外部回路接続用パターン電極と駆動用集積回路との電気的接続をおこない液晶層に所定の電圧を印加する液晶表示装置であり、駆動用集積回路へ外部より電気信号を印加する接続手段は、駆動用集積回路の裏面に設ける裏面パターンと第１の基板上の外部回路接続用パターン電極とを導電性パターンにより接続して駆動用集積回路の裏面パターンより外部へ接続することを特徴とする。
【００２４】
本発明の液晶表示装置は、第１の基板と第２の基板を所定の距離を設けて張り合わせるためのシール剤と、第１の基板と第２の基板の重なり部に封入する液晶層と、第１の基板上に設ける駆動用集積回路と接続するためのパネル接続用パターン電極と外部回路接続用パターン電極と、パネル接続用電極と外部回路接続用パターン電極に駆動用集積回路を接続するための導電性接着剤あるいは異方性導電フィルムを有し、導電性接着剤あるいは異方性導電フィルムによりパネル接続用電極と外部回路接続用パターン電極と駆動用集積回路との電気的接続をおこない液晶層に所定の電圧を印加する液晶表示装置であり、駆動用集積回路へ外部より電気信号を印加する接続手段は駆動用集積回路の裏面にフレキシブルプリント基板を設け、フレキシブルプリント基板は第１の基板上の外部回路接続用パターン電極と駆動用集積回路の側壁部の導電性パターンを介して接続して外部へ接続することを特徴とする。
【００２５】
本発明の液晶表示装置は、第１の基板と第２の基板を所定の距離を設けて張り合わせるためのシール剤と、第１の基板と第２の基板の重なり部に封入する液晶層と、第１の基板上に設ける駆動用集積回路と接続するためのパネル接続用パターン電極と外部回路接続用パターン電極と、パネル接続用電極と外部回路接続用パターン電極に駆動用集積回路を接続するための導電性接着剤あるいは異方性導電フィルムを有し、導電性接着剤あるいは異方性導電フィルムによりパネル接続用電極と外部回路接続用パターン電極と駆動用集積回路との電気的接続をおこない液晶層に所定の電圧を印加する液晶表示装置であり、駆動用集積回路へ外部より電気信号を印加する接続手段は駆動用集積回路の裏面に熱硬化性異方性導電フィルムを介してフレキシブルプリント基板を設け、フレキシブルプリント基板は第１の基板上の外部回路接続用パターン電極と駆動用集積回路の側壁部の導電性パターンを介して接続して外部へ接続することを特徴とする。
【００２６】
本発明の液晶表示装置は、第１の基板と第２の基板を所定の距離を設けて張り合わせるためのシール剤と、第１の基板と第２の基板の重なり部に封入する液晶層と、第１の基板上に設ける駆動用集積回路と接続するためのパネル接続用パターン電極と外部回路接続用パターン電極と、駆動用集積回路の回路素子形成面側とパネル接続用パターン電極と外部回路接続用パターン電極とを対向させ、駆動用集積回路の突起電極とパネル接続用パターン電極と外部回路接続用パターン電極とを接続する導電性接着剤あるいは異方性導電フィルムを有し、導電性接着剤あるいは異方性導電フィルムによりパネル接続用電極と外部回路接続用パターン電極と駆動用集積回路上の突起電極を向かい合わせに張り合わせて電気的接続をおこない液晶層に所定の電圧を印加する液晶表示装置であり、駆動用集積回路へ外部より電気信号を印加する接続手段は、駆動用集積回路の裏面に設ける裏面パターンから斜面状の側壁部を介して第１の基板上の外部回路接続用パターン電極に導電性パターンにより接続して駆動用集積回路の裏面パターンより外部へ接続することを特徴とする。
【００２７】
本発明の液晶表示装置は、第１の基板と第２の基板を所定の距離を設けて張り合わせるためのシール剤と、第１の基板と第２の基板の重なり部に封入する液晶層と、第１の基板上に設ける駆動用集積回路と接続するためのパネル接続用パターン電極と外部回路接続用パターン電極と、パネル接続用電極と外部回路接続用パターン電極と駆動用集積回路の突起電極とを接続する導電性接着剤とを有し、駆動用集積回路へ外部より電気信号を印加する接続手段は、フレキシブルプリント基板と駆動用集積回路の裏面に設ける裏面パターンと駆動用集積回路の側壁部に設ける導電性インクからなる導電性パターンと導電性インクからなる導電性パターンに接続する第１の基板上の外部回路接続用パターン電極とを有することを特徴とする。
【００２９】
本発明の参考例である液晶表示装置は、第１の基板と第２の基板を所定の距離を設けて張り合わせるためのシール剤と、第１の基板と第２の基板の重なり部に封入する液晶層と、第１の基板上に設ける駆動用集積回路と接続するためのパネル接続用パターン電極と、駆動用集積回路を第１の基板に接続するための硬化性樹脂と、フレキシブルプリント基板と第１の基板と駆動用集積回路を固着するための接着樹脂とを有し、パネル接続用パターン電極と駆動用集積回路との電気的接続を行い液晶層に所定の電圧を印加する液晶表示装置であり、駆動用集積回路へ外部より電気信号を印加する接続手段は、フレキシブルプリント基板と駆動用集積回路に設ける突起電極とこれらを接続する導電性配線であり、また、駆動用集積回路の突起電極とパネル接続用パターン電極とを接続する導電性配線と保護用接着樹脂とを有することを特徴とする。
【００３０】
本発明の液晶表示装置は、第１の基板と第２の基板を所定の距離を設けて張り合わせるためのシール剤と、第１の基板と第２の基板の重なり部に封入する液晶層と、第１の基板上に設ける駆動用集積回路と接続するためのパネル接続用パターン電極と外部回路接続用パターン電極と、パネル接続用電極と外部回路接続用パターン電極に駆動用集積回路を接続する導電性接着剤あるいは異方性導電フィルムを有し、導電性接着剤あるいは異方性導電フィルムによりパネル接続用電極と外部回路接続用パターン電極と駆動用集積回路との電気的接続をおこない液晶層に所定の電圧を印加する液晶表示装置であり、駆動用集積回路へ外部より電気信号を印加する接続手段は、駆動用集積回路の裏面にフレキシブルプリント基板を設け、フレキシブルプリント基板あるいは第１の基板に基板用合わせマークあるいは回路用位置合わせマークあるいはフレキシブルプリント基板用位置合わせマークを有することを特徴とする。
【００３１】
本発明の液晶表示装置は、第１の基板と第２の基板を所定の距離を設けて張り合わせるためのシール剤と、第１の基板と第２の基板の重なり部に封入する液晶層と、第１の基板上に設ける駆動用集積回路と接続するためのパネル接続用パターン電極と外部回路接続用パターン電極と、パネル接続用電極と外部回路接続用パターン電極に駆動用集積回路を接続するための導電性接着剤あるいは異方性導電フィルムを有し、導電性接着剤あるいは異方性導電フィルムによりパネル接続用電極と外部回路接続用パターン電極と駆動用集積回路との電気的接続をおこない液晶層に所定の電圧を印加する液晶表示装置であり、駆動用集積回路へ外部より電気信号を印加する接続手段は、駆動用集積回路の側壁部に設ける導電粒と熱硬化性樹脂を含む異方性導電フィルムを有し、駆動用集積回路の側壁部の異方性導電フィルムを介して外部回路接続用パターン電極を外部へ接続することを特徴とする。
【００３２】
本発明の液晶表示装置は、第１の基板と第２の基板を所定の距離を設けて張り合わせるためのシール剤と、第１の基板と第２の基板の重なり部に封入する液晶層と、第１の基板上に設ける駆動用集積回路と接続するためのパネル接続用パターン電極と外部回路接続用パターン電極と、パネル接続用電極と外部回路接続用パターン電極と駆動用集積回路の突起電極とを接続する導電性接着剤あるいは異方性導電フィルムと、第１の基板を挟むように設ける保護用台座とを有し、駆動用集積回路へ外部より電気信号を印加する接続手段は、フレキシブルプリント基板と駆動用集積回路の側壁部に設ける異方性導電フィルムを介して設ける導電性パターンと導電性パターンに接続する第１の基板上の外部回路接続用パターン電極とを有することを特徴とする。
【００３３】
本発明の液晶表示装置においては、駆動用集積回路への外部回路からの信号を印加するための接続部を駆動用集積回路の上面側に設けて、フレキシブルプリント基板の接続を行う。これにより、外部回路接続用パターン電極の長さを小さくすることができる。
【００３４】
このため本発明の液晶表示装置においては、液晶表示パネルの周辺に設けるフレキシブルプリント基板の実装部の占有面積を小さくすることができる。
【００３５】
【発明の実施の形態】
以下、図面を用いて本発明の実施例における液晶表示装置の構造を説明する。まずはじめに本発明の第１の実施例における液晶表示装置の構成を図面に基づいて説明する。図１は、本発明の第１の実施例における液晶表示パネルの駆動用集積回路の実装構造を示す平面図である。図２は、図１のＡ−Ａ線における断面を示す断面図である。以下、図１と図２とを交互に用いて本発明の第１の実施例における液晶表示装置を説明する。
【００３６】
液晶表示パネルを構成する第１の基板１には、パターン電極４と、このパターン電極４に接続するパネル接続用パターン電極３とを有する。さらに、第１の基板１に対向する第２の基板２には、パターン電極４に対向するように画素パターン５を設ける。
【００３７】
パターン電極４と画素パターン５とは液晶層１１を介して対向し、第１の基板１と第２の基板２は、スペーサー（図示せず）とシール剤１０にて一定の間隙を保っている。さらに、第１の基板１と第２の基板２間には液晶層１１を封入してある。
【００３８】
第１の基板１には、駆動用集積回路６に設ける突起電極７に対応する外部回路接続用パターン電極１２を設ける。この第１の基板１上に設ける外部回路接続用パターン電極１２と、駆動用集積回路６に設ける突起電極７とを導電性接着剤８を用いて接続する、いわゆるチップ・オン・ガラス（ＣＯＧ）実装構造とする。
【００３９】
さらに、駆動用集積回路６上に設ける突起電極７は駆動用集積回路６の回路素子形成面側に設けてあり、接続を行う外部回路接続用パターン電極１２と駆動用集積回路６の回路素子形成面が向かい合うように張り合わせてある。駆動用集積回路６と第１の基板１の間には硬化性樹脂９を設ける。このＣＯＧ実装を用いて電気的接続と機械的接続との接続を行う。
【００４０】
さらに、外部回路と接続する外部回路接続用パターン電極１２は、駆動用集積回路６の側壁部からわずかの距離Ｌ１に張り出している。そして駆動用集積回路６の側壁部には外部回路接続用パターン電極１２に対応した箇所に導電性パターン２２を有する。
【００４１】
さらに、駆動用集積回路６の素子形成面と反対側の裏面に、裏面パターン２０を導電性パターン２２に対応する箇所に設ける。
【００４２】
駆動用集積回路６の側壁に設ける導電性パターン２２と駆動用集積回路６の裏面に設ける裏面パターン２０と側壁に設ける導電性パターン２２は、有機金属ガスを利用しレーザー光線を駆動用集積回路７に照射して裏面パターン２０と導電性パターン２２に相当する部分に金属膜を直接描画をおこない、導電性パターン２２と裏面パターン２０を形成する。
【００４３】
あるいはこの裏面パターン２０と導電性パターン２２は、導電性インクで構成してもよい。このときはインクジェットプリンタを利用して形成する。導電性インクは有機溶媒と粒径が１μｍの金属ボールとで構成し、インクジェットプリンタを用いて駆動用集積回路６の裏面に印刷し、その後温度１００℃から１５０℃の熱処理を行い、裏面パターン２０と導電性パターン２２とする。
【００４４】
外部回路用接続用パターン電極１２は、ＣＯＧ実装構造の突起電極７と導電性接着剤８の接続強度を保つための硬化性樹脂９の側壁部２１と駆動用集積回路６の側壁部１９を介して駆動用集積回路６の裏面に設ける裏面パターン２０に接続する。駆動用集積回路６の側壁は導電性パターン２２の断線を防止するため、斜面状の側壁部１９とする。
【００４５】
さらに、裏面パターン２０上に熱硬化性異方性導電フィルム（ＡＣＦ）１６を設けフレキシブルプリント基板（ＦＰＣ）１５と接続を行う。熱硬化性異方性導電フィルム１６は、熱硬化性樹脂１７中にプラスチックボールに金（Ａｕ）をメッキした導電粒１８を混入したものである。
【００４６】
したがって、駆動用集積回路６と外部回路との接続は、駆動用集積回路６上の突起電極７と、導電性接着剤８と、外部回路接続用パターン電極１２と、駆動用集積回路６の側壁に設ける導電性パターン２２と、駆動用集積回路６の裏面に設ける裏面パターン２０と、熱硬化性異方性導電フィルム１６とを介してフレキシブルプリント基板１５に接続する。
【００４７】
さらに駆動用集積回路６とフレキシブルプリント基板１５との機械的接続を行うための接着樹脂２３を、その間に設ける。
【００４８】
以上の説明から明らかなように、駆動用集積回路６と外部回路との接続を駆動用集積回路６の裏面パターン２０を利用することにより、パネル接続用パターン電極３と第１の基板１の端面部との距離である外部回路接続長さＷ２を小さくすることができる。
【００４９】
そのため、液晶表示装置の周辺に設けるフレキシブルプリント基板１５の実装面積を小さくできる。さらに、外部回路用接続用パターン電極１２の長さを短くすることができるため、外部回路との接続抵抗値を小さくできる。
【００５０】
つぎに本発明の参考例における液晶表示パネルの駆動用集積回路の実装構造の構成を図面に基づいて説明する。図３は、本発明の参考例における液晶表示パネルの駆動用集積回路の実装構造を示す平面図であり、図４は図３のＢ−Ｂ線における断面を示す断面図である。以下、図３と図４を用いて本発明の参考例を説明する。
【００５１】
本発明の参考例は、パネル接続用パターン電極３を導電性配線２６にて駆動用集積回路６の突起電極７に接続し、さらに駆動用集積回路６の突起電極７とフレキシブルプリント基板１５の銅薄膜からなる金属箔１４の接続も同様に導電性配線２７にておこなう。
【００５２】
さらに液晶表示パネルを構成する第１の基板１には、パターン電極４と、このパターン電極４に接続するパネル接続用パターン電極３とを有する。さらに、第１の基板１に対向する第２の基板２には、パターン電極４に対向するように画素パターン５を設ける。
【００５３】
パターン電極４と画素パターン５とは液晶層１１を介して対向し、第１の基板１と第２の基板２は、スペーサー（図示せず）とシール剤１０にて一定の間隙を保っている。また、第１の基板１と第２の基板２間に液晶層１１を封入する。
【００５４】
この第１の基板１上に設けるパネル接続用パターン電極３と、駆動用集積回路６に設ける突起電極７とを導電性配線２６を用いて接続するいわゆるチップ・オン・ガラス（ＣＯＧ）実装構造とする。また、駆動用集積回路６上に設ける突起電極７は駆動用集積回路６の回路素子形成面に設けてある。さらに、駆動用集積回路６と第１の基板１との間には、熱硬化性樹脂９を有し、この熱硬化性樹脂９により機械的接続が行われる。
【００５５】
さらにまた、第１の基板１上には第１の実施例と異なり外部回路接続用パターン電極を設けてはいない。また、駆動用集積回路６の突起電極７とフレキシブルプリント基板１５の銅薄膜からなる金属箔１４の間には、導電性配線２７を設ける。さらに、駆動用集積回路６とフレキシブルプリント基板１５の機械的接続をおこなうため、接着樹脂２３が設ける。
【００５６】
フレキシブルプリント基板１５は、ポリイミド樹脂１３上に銅薄膜からなる金属箔１４を有し、さらに、導線性配線２７との接続領域以外には、銅薄膜からなる金属箔１４を覆うポリイミド樹脂２５を有する。銅薄膜からなる金属箔１４を両側からポリイミド樹脂１３とポリイミド樹脂２５により覆うことにより水分からの銅薄膜からなる金属箔１４の腐食や、あるいは傷からフレキシブルプリント基板１５を保護することができる。
【００５７】
さらに、パネル接続用パターン電極３と駆動用集積回路６の突起電極７と接続する導電性配線２６と、フレキシブルプリント基板１５の銅薄膜からなる金属箔１４と駆動用集積回路６上の突起電極７とを接続する導電性配線２７とを保護する保護用接着樹脂２８を、駆動用集積回路６と導電性配線２６と導電性配線２７とフレキシブルプリント基板１５との周囲領域に設ける。
【００５８】
以上の説明から明らかなように本発明の参考例では、駆動用集積回路６と外部回路との接続のために、駆動用集積回路６の突起電極７とフレキシブルプリント基板１５の銅薄膜からなる金属箔１４とを導電性配線２７により接続し、さらにパネル接続用パターン電極３と駆動用集積回路６の突起電極７とを導電性配線２６により接続する。
【００５９】
このことにより、導電性配線２６と導電性配線２７とを同時に設けることができ、さらにパネル接続用パターン電極３と第１の基板１の端面部との距離である外部回路接続長さＷ２を小さくすることができる。そのため、液晶表示装置の周辺に設けるフレキシブルプリント基板１５の実装面積を小さくできる。
【００６０】
つぎに本発明の第２の実施例における液晶表示パネルの駆動用集積回路の実装構造の構成を図面に基づいて説明する。図５は、本発明の第２の実施例における液晶表示パネルの駆動用集積回路の実装構造を示す平面図である。図６は、図５のＣ−Ｃ線における断面を示す断面図である。以下、図５と図６とを交互に用いて本発明の第２の実施例における液晶表示装置を説明する。
【００６１】
本発明の第２の実施例では、パネル接続用パターン電極３と駆動用集積回路６との接続と、外部回路接続用パターン電極１２と駆動用集積回路６との接続に導電粒３２と熱硬化性樹脂３１からなる異方性導電フィルム（ＡＣＦ）３３を利用する。さらに、駆動用集積回路６の側壁部３４を斜面状の形状にし、異方性導電フィルム３３を側壁部３４に設け、駆動用集積回路６の裏面パターン２０と接続を行う。
【００６２】
さらに、フレキシブルプリント基板１５と、駆動用集積回路６の素子形成面と反対側の裏面パターン２０との接続は、熱硬化性異方性導電フィルム１６を利用しておこなう。さらに外部回路接続用パターン電極１２と突起電極７との接続に利用する異方性導電フィルム３３と裏面パターン２０とフレキシブルプリント基板１５との接続に使用する熱硬化性異方性導電フィルム１６を接触させ電気的導通を取るものである。
【００６３】
液晶表示パネルを構成する第１の基板１には、パターン電極４と、このパターン電極４に接続するパネル接続用パターン電極３とを有する。さらに、第１の基板１に対向する第２の基板２には、パターン電極４に対向して画素パターン５を設ける。
【００６４】
パターン電極４と画素パターン５とは液晶層１１を介して対向し、第１の基板１と第２の基板２は、スペーサー（図示せず）とシール剤１０にて一定の間隙を保っている。また、第１の基板１と第２の基板２間には液晶層１１を封入する。
【００６５】
第１の基板１上には、駆動用集積回路６に設ける突起電極７に対応する位置に外部回路接続用パターン電極１２を設ける。この第１の基板１上に設ける外部回路接続用パターン電極１２と、駆動用集積回路６に設ける突起電極７とを光硬化性の異方性導電フイルム３３を用いて接続する、いわゆるチップ・オン・ガラス（ＣＯＧ）実装構造とする。
【００６６】
この異方性導電フィルム３３は、光硬化性の樹脂３１と金（Ａｕ）ボールからなる導電粒３２からなる。また、駆動用集積回路６の側壁部３４は、異方性導電フィルム３３の剥がれと段切れを防止するために斜面部を設けている。この駆動用集積回路６の側壁部３４にも異方性導電フィルム３３を有する。
【００６７】
さらに駆動用集積回路６上に設ける突起電極７は、駆動用集積回路６の回路素子形成面側に設け、接続を行う外部回路接続用パターン電極１２と駆動用集積回路６の回路面が向かい合うように張り合わせてある。このＣＯＧ実装を用いて電気的接続と機械的接続との接続を行う。
【００６８】
また、外部回路と接続する外部回路接続用パターン電極１２は、駆動用集積回路６の側壁部からわずかな距離Ｌ１張り出している。駆動用集積回路６の側壁部３４には、前述のように異方性導電フィルム３３を有する。また、駆動用集積回路６の裏面に裏面パターン２０を設ける。
【００６９】
外部回路接続用パターン電極１２は、ＣＯＧ実装構造の突起電極７と光硬化型の異方性導電フィルム３３により接続する。さらに駆動用集積回路６の側壁部３４の異方性導電フィルム３３を介して駆動用集積回路６の裏面パターン２０に接続する。さらに、駆動用集積回路６の側壁部３４の第異方性導電フィルム３３は、直接、駆動用集積回路６の裏面に設ける熱硬化性異方性導電フィルム１６に接続する。
【００７０】
さらに、裏面パターン２０上に熱硬化性異方性導電フィルム１６を設けフレキシブルプリント基板１５と接続を行う。熱硬化性異方性導電フィルム１６は、熱硬化性樹脂１７中にプラスチックボールに金（Ａｕ）をメッキした導電粒１８を混入したものである。
【００７１】
したがって、駆動用集積回路６と外部回路の接続は、駆動用集積回路６の突起電極７と、異方性導電フィルム３３と、外部回路接続用パターン電極１２と、駆動用集積回路６の側壁に設ける異方性導電フィルム３３と、駆動用集積回路６の裏面に設ける裏面パターン２０と、熱硬化性異方性導電フィルム１６とを介し、フレキシブルプリント基板１５に接続する。
【００７２】
以上の説明から明らかなように本発明の第２の実施例では、駆動用集積回路６と外部回路との接続に駆動用集積回路６の裏面パターン２０を利用する。このことによりパネル接続用パターン電極３と第１の基板１の端面部との距離である外部回路接続長さＷ２を小さ
くすることができる。
【００７３】
そのため、液晶表示装置の周辺に設けるフレキシブルプリント基板１５の実装面積を小さくできる。さらに、外部回路用接続用パターン電極１２を長さを短くできるため、外部回路との接続抵抗値を小さくできる。
【００７４】
この本発明の第２の実施例の構成を利用することにより、駆動用集積回路６の側壁部３４に導電性パターンを設けることなく、異方性導電フィルム３３を設けて、フレキシブルプリント基板１５の銅薄膜からなる金属箔１４に接続することができる。
【００７５】
さらに本発明の第２の実施例においては、駆動用集積回路６の裏面に裏面パターン２０を設けているが、裏面パターン２０を設けないで、外部回路接続用パターン電極１２とフレキシブルプリント基板１５の金属箔１４とを熱硬化性異方性導電フィルム１６で接続する構成でも、以上説明した本発明の効果は得られる。
【００７６】
つぎに本発明の第３の実施例における液晶表示パネルの駆動用集積回路の実装構造を図面に基づいて説明する。図７は、本発明の第３の実施例における液晶表示パネルの駆動用集積回路の実装構造を示す平面図である。図８は、図７のＤ−Ｄ線における断面を示す断面図である。以下、図７と図８とを交互に用いて本発明の第３の実施例における液晶表示装置を説明する。
【００７７】
液晶表示パネルを構成する第１の基板１には、パターン電極４と、このパターン電極４に接続するパネル接続用パターン電極３とを有する。さらに、第１の基板１に対向する第２の基板２には、パターン電極４に対向して画素パターン５を設ける。
【００７８】
パターン電極４と画素パターン５とは液晶層１１を介して対向し、第１の基板１と第２の基板２は、スペーサー（図示せず）とシール剤１０にて一定の間隙を保っている。また、第１の基板１と第２の基板２間には液晶層１１を封入する。
【００７９】
第１の基板１には、駆動用集積回路６に設ける突起電極７に対応する外部回路接続用パターン電極１２を設ける。この第１の基板１上に設ける外部回路接続用パターン電極１２と、駆動用集積回路６に設ける突起電極７とは、光硬化型あるいは熱硬化型の異方性導電フイルム３３を用いて接続する、いわゆるチップ・オン・ガラス（ＣＯＧ）実装構造とする。
【００８０】
この異方性導電フィルム３３は、光硬化性あるいは熱硬化性の樹脂３１と金ボールからなる導電粒３２とからなる。また、駆動用集積回路６の側壁部３４は、異方性導電フィルム３３の剥離と段切れを防止するために斜面形状としている。この駆動用集積回路６の側壁部３４にも異方性導電フィルム３３を有する。
【００８１】
また、駆動用集積回路６上に設ける突起電極７は駆動用集積回路６の回路素子形成面側に設けてあり、接続を行う外部回路接続用パターン電極１２と駆動用集積回路６の回路素子形成面が向かい合うように張り合わせてある。このＣＯＧ実装を用いて電気的接続と機械的接続との接続を行う。
【００８２】
また、外部回路と接続する外部回路接続用パターン電極１２は駆動用集積回路６の側壁部からわずか距離Ｌ１張り出している。
【００８３】
さらに、パネル接続用パターン電極３と駆動用集積回路６との接続と、外部回路接続用パターン電極１２と駆動用集積回路６との接続に導電粒３２と光硬化性あるいは熱硬化性の樹脂３１とからなる異方性導電フィルム３３を利用する。さらに駆動用集積回路６の側壁部３４を斜面形状にし、異方性導電フィルム３３を側壁部３４に設けている。
【００８４】
さらに異方性導電フィルム３３は、駆動用集積回路６の側壁部３４を覆い駆動用集積回路６の裏面まで延びている。また、駆動用集積回路６とフレキシブルプリント基板１５との機械的接続と、駆動用集積回路６の側壁部３４に設ける異方性導電フィルム３３との接続は、熱硬化性異方性導電フィルム１６を利用して行う。
【００８５】
熱硬化性異方性導電フィルム１６によりフレキシブルプリント基板１５の接続を行う。熱硬化性異方性導電フィルム１６は、熱硬化性樹脂１７中にプラスチックボールに金（Ａｕ）をメッキした導電粒１８を混入したものである。
【００８６】
さらに、駆動用集積回路６の側壁部３４に設ける異方性導電フィルム３３の外側領域には、保護用台座４１を設ける。さらに、保護用台座４１と異方性導電フィルム３３の接触する面には導電性パターン４２を有する。導電性パターン４２は、一方は外部回路接続用パターン電極１２と接続し、他方は熱硬化性異方性導電フィルム１６と接続点４３により接続している。
【００８７】
保護用台座４１は、第１の基板１の側壁を覆い、補強用接着剤４８にて固定している。さらにフレキシブルプリント基板１５と保護用台座４１との間にも補強用接着剤４４を設ける。
【００８８】
さらに第１の基板１上には、駆動用集積回路６と第１の基板１との実装作業時の位置合わせを行うための回路用位置合わせマーク４５を有する。さらにまた、フレキシブルプリント基板１５と第１の基板１との位置合わせを行うための位置合わせマークとして、第１の基板１上にフレキシブルプリント基板用位置合わせマーク４６を設け、フレキシブルプリント基板１５上に基板用位置合わせマーク４７を有する。
【００８９】
回路用位置合わせマーク４５とフレキシブルプリント基板用位置合わせマーク４６は第１の基板１上に設ける電極材料を利用する。たとえば、パターン電極４材料を利用し、平面形状がＬ字状の回路用位置合わせマーク４５とフレキシブルプリント基板用位置合わせマーク４６を形成する。
【００９０】
また、基板用位置合わせマーク４７は、フレキシブルプリント基板１５の銅薄膜からなる金属箔１４の一部を利用し、平面形状が＋字状の基板用位置合わせマーク４７を形成する。
【００９１】
この回路用位置合わせマーク４５とフレキシブルプリント基板用位置合わせマーク４６と基板用位置合わせマーク４７とを設けることにより、位置合わせ精度が向上し、実装歩留まりと実装面積の低減が可能となる。
【００９２】
したがって駆動用集積回路６と外部回路との接続は、駆動用集積回路６上の突起電極７と、異方性導電フィルム３３と、外部回路接続用パターン電極１２と、駆動用集積回路６の側壁に設ける異方性導電フィルム３３と、駆動用集積回路６の側壁部３４に設ける保護用台座４１の導電性パターン４２と、熱硬化性異方性導電フィルム１６を介して、フレキシブルプリント基板１５の銅薄膜からなる金属箔１４に接続する。
【００９３】
このように本発明の第３の実施例では、駆動用集積回路６と外部回路との接続に駆動用集積回路６の側壁と裏面を利用することにより、パネル接続用パターン電極３と第１の基板１の端面部との距離である外部回路接続長さＷ２を小さくすることができる。
【００９４】
そのため、液晶表示装置の周辺に設けるフレキシブルプリント基板１５の実装面積を小さくできる。さらに、外部回路用接続用パターン電極１２の長さを短くできるため、外部回路との接続抵抗値を小さくできる。この本発明の第３の実施例の構造を利用することにより、駆動用集積回路６の側壁部３４に導電性パターンを設けることなく、異方性導電フ
ィルム３３と保護用台座４１を設け、フレキシブルプリント基板１５の銅薄膜からなる金属箔１４との接続ができる。
【００９５】
さらに、本発明の第３の実施例においては、第１の基板１上に駆動用集積回路６と第１の基板１との回路用位置合わせマーク４５と、フレキシブルプリント基板１５と第１の基板１との位置合わせマークとしてフレキシブルプリント基板用位置合わせマーク４６と基板用位置合わせマーク４７とを設ける。このことにより、精度よく第１の基板１とフレキシブルプリント基板１５との相互の位置合わせを行うことができる。
【００９６】
なお、以上図１から図８を用いて説明した実施例において、第１の基板１に駆動用集積回路６とフレキシブルプリント基板１５とを実装する例を示したが、第２の基板へ本発明の構造を適用して駆動用集積回路とフレキシブルプリント基板とを実装するができ、さらに第１の基板と第２の基板との双方に本発明の構造を適用して駆動用集積回路とフレキシブルプリント基板とを実装するができる。
【００９７】
図７と図８とを用いて説明した実施例では、位置合わせマークとして第１の基板とフレキシブルプリント基板に設ける例で説明したが、駆動用集積回路に駆動用集積回路の構成材料、たとえばアルミニウム配線あるいは金属シリサイド配線を用いて位置合わせマークを設けてもよい。
【００９８】
【発明の効果】
以上の説明から明らかなように、本発明の液晶表示パネルの駆動用集積回路の実装構造を用いることにより、フレキシブルプリント基板を設ける外部回路接続長さを小さくし、外部回路接続用パターン電極長さを短くするすることが可能となる。このことにより、液晶表示パネルの表示領域以外の部分を小さくできる。
【００９９】
さらに、外部回路接続用パターン電極の長さを短くできるため、接続部における接続抵抗値の増加を抑えることができ、表示品質が向上する。さらに、第１の基板とフレキシブルプリント基板に合わせマークを設けることにより合わせ精度が向上し実装面積の低減と安定化とを達成できる。
【図面の簡単な説明】
【図１】本発明の第１の実施例における液晶表示装置の駆動用集積回路とフレキシブルプリント基板の実装構成を示す平面図である。
【図２】本発明の第１の実施例における液晶表示装置の駆動用集積回路とフレキシブルプリント基板の実装構成を示す断面図である。
【図３】本発明の参考例における液晶表示装置の駆動用集積回路とフレキシブルプリント基板の実装構成を示す平面図である。
【図４】本発明の参考例における液晶表示装置の駆動用集積回路とフレキシブルプリント基板の実装構成を示す断面図である。
【図５】本発明の第２の実施例における液晶表示装置の駆動用集積回路とフレキシブルプリント基板の実装構成を示す平面図である。
【図６】本発明の第２の実施例における液晶表示装置の駆動用集積回路とフレキシブルプリント基板の実装構成を示す断面図である。
【図７】本発明の第３の実施例における液晶表示装置の駆動用集積回路とフレキシブルプリント基板の実装構成を示す平面図である。
【図８】本発明の第３の実施例における液晶表示装置の駆動用集積回路とフレキシブルプリント基板の実装構成を示す断面図である。
【図９】従来技術における液晶表示装置の駆動用集積回路とフレキシブルプリント基板の実装構成を示す平面図である。
【図１０】従来技術における液晶表示装置の駆動用集積回路とフレキシブルプリント基板の実装構成を示す断面図である。
【符号の説明】
１第１の基板
３パネル接続用パターン電極
６駆動用集積回路
７突起電極
８導電性接着剤
１２外部回路接続用パターン電極
１５フレキシブルプリント基板（ＦＰＣ）
１６熱硬化性異方性導電フィルム
１９側壁部
２０裏面パターン
２２導電性パターン
２３接着樹脂
２６、２７導電性配線
３３異方性導電フィルム
４１保護用台座
４２導電性パターン [0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a mounting structure of a liquid crystal display device in which a driving integrated circuit for driving the liquid crystal display device is connected to a first substrate constituting a liquid crystal display panel.
[0002]
[Prior art]
In recent years, many matrix-type liquid crystal display panels have been used for displays for various information terminals, measuring instruments, and personal computers.
[0003]
As means for supplying an external drive signal for displaying the liquid crystal display panel, there is a means for applying a signal from a driving integrated circuit (IC) provided outside the liquid crystal display panel. Various means have been proposed and put into practical use as a method of connecting the driving integrated circuit to the liquid crystal display panel.
[0004]
In particular, in the case of a matrix-type liquid crystal display panel having a large display capacity, a structure in which a driving integrated circuit is directly mounted on a substrate constituting the liquid crystal display panel has been developed due to the advantages of integration degree and cost. I have.
[0005]
The structure in which the driving integrated circuit is directly mounted on a substrate constituting a liquid crystal display panel is called a chip-on-glass (hereinafter referred to as COG) mounting method and is widely used.
[0006]
As a mounting means other than the COG mounting method, a driving integrated circuit is mounted on a thin film formed using a conductive thin film and an insulating resin, and a connection pattern between the conductive thin film on the thin film and the liquid crystal display panel. Tape automated bonding (TAB) mounting method, in which electrodes are connected with an anisotropic conductive film (ACF), or a drive integrated circuit once mounted on a printed circuit board, and a conductive thin film and insulating resin And a chip-on-board (COB) mounting method in which a thin film formed by using the method described above is used to connect a printed circuit board to a liquid crystal display panel.
[0007]
Among these TAB and COB mounting structures, the COG mounting method, in particular, can achieve higher density, smaller area, and lower cost than other mounting means. High advantage.
[0008]
Furthermore, in recent years, in order to mount a display as large as possible on a notebook personal computer or a notebook world processor, it is important to reduce the mounting area of the driving integrated circuit.
[0009]
Next, a conventional example of a liquid crystal display device employing a COG mounting structure will be described with reference to the drawings. FIG. 9 is a plan view showing a mounting structure in which a driving integrated circuit is mounted on a liquid crystal display panel of a conventional liquid crystal display device, and FIG. 10 is a cross-sectional view showing a cross section taken along line EE in FIG. Hereinafter, the prior art will be described with reference to FIGS. 9 and 10 alternately.
[0010]
On the first substrate 1, a pattern electrode 4 and a panel connection pattern electrode 3 corresponding to the protruding electrode 7 of the driving integrated circuit 6 are provided. Each of the pattern electrode 4 and the panel connection pattern electrode 3 is made of a conductive thin film and is formed in the same step.
[0011]
On the pattern electrode 3 for panel connection provided on the first substrate 1, a driving integrated circuit 6 provided with a protruding electrode 7 is mounted via a conductive adhesive 8.
[0012]
With the conductive adhesive 8, the protruding electrodes 7 of the driving integrated circuit 6 can be electrically and mechanically connected to the panel connection pattern electrodes 3 of the first substrate 1.
[0013]
Further, a pixel pattern 5 is provided on the second substrate 2 which is bonded to the first substrate 1 via a sealant 10. In the liquid crystal display panel, the pattern electrode 3 and the pixel pattern 5 are opposed to each other with a predetermined distance between the first substrate 1 and the second substrate 2, and the periphery thereof is sealed with a sealant 10.
[0014]
A liquid crystal layer 11 is sealed in a region where the first substrate 1 and the second substrate 2 overlap and a region inside the sealant 10.
[0015]
A COG mounting structure is used in which the panel connection pattern electrode 3 provided on the first substrate 1 and the protruding electrode 7 provided on the driving integrated circuit 6 are connected by a conductive adhesive 8. Then, the panel connection pattern electrode 3 and the driving integrated circuit 6 are electrically and mechanically connected to each other, and a resin is formed on the surface of the first substrate 1 including the driving integrated circuit 6 by using a curable resin 9. Seal.
[0016]
Furthermore, in order to apply an external signal to the driving integrated circuit 6, the external circuit connecting pattern electrode 12 provided on the first substrate 1 and the projection provided on the driving integrated circuit 6 are also provided at the input portion of the driving integrated circuit 6. A COG mounting structure for connecting the electrode 7 with the conductive adhesive 8 is employed. Further, in order to connect the external circuit connection pattern electrode 12 and the external circuit, a flexible printed circuit (FPC) 15 in which a metal foil 14 made of a copper (Cu) thin film is formed as a conductive thin film on a polyimide resin 13 is thermosetting. The connection is made via an anisotropic conductive film (ACF) 16.
[0017]
The thermosetting anisotropic conductive film 16 is obtained by mixing conductive particles 18 into a thermosetting resin 17.
[0018]
[Problems to be solved by the invention]
The COG mounting structure described with reference to FIGS. 9 and 10 is a simple mounting means, enables high-density multi-terminal connection, and is effective in achieving a reduction in size and cost.
[0019]
However, the external circuit connection pattern electrode 12 is extended from the COG mounting structure and the driving integrated circuit 6 and connected to the flexible printed board 15 on the first substrate 1 using the thermosetting anisotropic conductive film (ACF) 16. In order to connect the flexible printed board 15 and the thermosetting anisotropic conductive film 16, an external circuit connection length (W1) having a certain distance is required. The external circuit connection length W1 is the distance between the panel connection pattern electrode 3 and the end surface of the first substrate 1 as shown in FIG.
[0020]
The connection length W1 of the external circuit is determined by a thermosetting anisotropic conductive film 16 using a COG mounting structure, a flexible printed circuit board 15, and a thermosetting anisotropic conductive film 16 for connecting the driving integrated circuit 6 to the external circuit. In order to secure the bonding error of the conductive anisotropic conductive film 16 or the pattern accuracy of the metal foil 14 made of a copper thin film for forming a pattern on the flexible printed circuit board 15 or the connection strength of the thermosetting anisotropic conductive film 16. Is required. For this reason, there is a limit in shortening the external circuit connection length W1 for connecting the flexible printed circuit board 15 by the thermosetting anisotropic conductive film 16.
[0021]
The present invention focuses on the above problems, and an object of the present invention is to reduce an external circuit connection length which is a distance between a panel connection pattern electrode which is a region for connecting a flexible printed circuit board and an end face of the first substrate. It is an object of the present invention to provide a mounting means in a liquid crystal display device capable of performing the above.
[0022]
[Means for Solving the Problems]
In order to solve the above object, a liquid crystal display device of the present invention employs the following structure.
[0023]
A liquid crystal display device of the present invention includes a sealant for bonding a first substrate and a second substrate at a predetermined distance, and a liquid crystal layer sealed in an overlapping portion between the first substrate and the second substrate. Connecting a panel connecting pattern electrode and an external circuit connecting pattern electrode for connecting to a driving integrated circuit provided on the first substrate, and connecting the driving integrated circuit to the panel connecting pattern electrode and the external circuit connecting pattern electrode A conductive adhesive or an anisotropic conductive film for connection, and an electrical connection between the panel connecting pattern electrode, the external circuit connecting pattern electrode and the driving integrated circuit by the conductive adhesive or the anisotropic conductive film. A liquid crystal display device for applying a predetermined voltage to the liquid crystal layer, and a connection means for externally applying an electric signal to the driving integrated circuit includes a back surface pattern provided on the back surface of the driving integrated circuit and a third pattern. Characterized in that the external circuit connection pattern electrode on the substrate are connected by a conductive pattern connected to the outside from the rear surface pattern of the driver integrated circuit.
[0024]
A liquid crystal display device of the present invention includes a sealant for bonding a first substrate and a second substrate at a predetermined distance, and a liquid crystal layer sealed in an overlapping portion between the first substrate and the second substrate. Connecting the driving integrated circuit to the panel connecting pattern electrode and the external circuit connecting pattern electrode for connecting to the driving integrated circuit provided on the first substrate; and connecting the panel connecting electrode and the external circuit connecting pattern electrode to each other. For electrically connecting panel connection electrodes, external circuit connection pattern electrodes, and driving integrated circuits with conductive adhesive or anisotropic conductive film A liquid crystal display device for applying a predetermined voltage to a liquid crystal layer. A connection means for applying an electric signal to the driving integrated circuit from outside is provided with a flexible printed circuit board on the back surface of the driving integrated circuit. Le PCB is characterized by connecting to the outside and connected via the conductive pattern of the side wall portion of the external circuit connection pattern electrode and the driving integrated circuit on the first substrate.
[0025]
A liquid crystal display device of the present invention includes a sealant for bonding a first substrate and a second substrate at a predetermined distance, and a liquid crystal layer sealed in an overlapping portion between the first substrate and the second substrate. Connecting the driving integrated circuit to the panel connecting pattern electrode and the external circuit connecting pattern electrode for connecting to the driving integrated circuit provided on the first substrate; and connecting the panel connecting electrode and the external circuit connecting pattern electrode to each other. For electrically connecting panel connection electrodes, external circuit connection pattern electrodes, and driving integrated circuits with conductive adhesive or anisotropic conductive film A liquid crystal display device for applying a predetermined voltage to the liquid crystal layer. A connection means for applying an external electric signal to the driving integrated circuit is provided on the back surface of the driving integrated circuit via a thermosetting anisotropic conductive film. Bull PCB provided, the flexible printed circuit board is characterized by connecting to the outside and connected via the conductive pattern of the side wall portion of the external circuit connection pattern electrode and the driving integrated circuit on the first substrate.
[0026]
A liquid crystal display device of the present invention includes a sealant for bonding a first substrate and a second substrate at a predetermined distance, and a liquid crystal layer sealed in an overlapping portion between the first substrate and the second substrate. , A panel connection pattern electrode for connecting to a driving integrated circuit provided on a first substrate, an external circuit connection pattern electrode, a circuit element forming surface side of the driving integrated circuit, a panel connection pattern electrode, and an external circuit A conductive adhesive or an anisotropic conductive film for connecting the projecting electrode of the driving integrated circuit, the panel connecting pattern electrode, and the external circuit connecting pattern electrode with the connection pattern electrode facing each other; The panel connection electrode, the external circuit connection pattern electrode, and the protruding electrode on the drive integrated circuit are bonded face to face with a liquid or anisotropic conductive film to establish electrical connection and to the liquid crystal layer. A liquid crystal display device for applying a voltage, wherein connection means for applying an electric signal to the driving integrated circuit from the outside is provided on a first substrate via a sloped side wall from a back surface pattern provided on the back surface of the driving integrated circuit. And an external circuit connection pattern electrode connected by a conductive pattern and connected to the outside from the back surface pattern of the driving integrated circuit.
[0027]
A liquid crystal display device of the present invention includes a sealant for bonding a first substrate and a second substrate at a predetermined distance, and a liquid crystal layer sealed in an overlapping portion between the first substrate and the second substrate. , A panel connecting pattern electrode and an external circuit connecting pattern electrode for connecting to a driving integrated circuit provided on the first substrate, a panel connecting electrode, an external circuit connecting pattern electrode, and a protruding electrode of the driving integrated circuit. A conductive adhesive that connects the flexible printed circuit board and the driving integrated circuit, the connection means for applying an electrical signal from the outside to the driving integrated circuit includes a back surface pattern provided on the back surface of the flexible printed circuit board and the driving integrated circuit, and a side wall of the driving integrated circuit. A conductive pattern made of conductive ink provided in the portion and a pattern electrode for external circuit connection on a first substrate connected to the conductive pattern made of conductive ink.
[0029]
Of the present inventionIs a reference exampleThe liquid crystal display device includes a sealant for bonding the first substrate and the second substrate at a predetermined distance, a liquid crystal layer sealed in an overlapping portion between the first substrate and the second substrate, Pattern electrode for panel connection to connect to the driving integrated circuit provided on the substrateWhen,Driving integrated circuit on first substrateToA curable resin for connection, and an adhesive resin for fixing the flexible printed circuit board, the first substrate, and the integrated circuit for driving, and a panel connection.ForElectrical connection between turn electrode and drive integrated circuitlineThe liquid crystal display device applies a predetermined voltage to the liquid crystal layer, and the connection means for applying an electric signal from the outside to the driving integrated circuit includes a flexible printed circuit board and projecting electrodes provided on the driving integrated circuit.Connect theseGuidanceElectricalwiringIn addition, the projecting electrode of the driving integrated circuit and the pattern electrode for panel connection areConnectingConductive wiringAnd a protective adhesive resin.
[0030]
A liquid crystal display device of the present invention includes a sealant for bonding a first substrate and a second substrate at a predetermined distance, and a liquid crystal layer sealed in an overlapping portion between the first substrate and the second substrate. Connecting the driving integrated circuit to the panel connecting pattern electrode and the external circuit connecting pattern electrode for connecting to the driving integrated circuit provided on the first substrate; and connecting the panel connecting electrode and the external circuit connecting pattern electrode to each other. A liquid crystal layer having a conductive adhesive or an anisotropic conductive film, and electrically connecting a panel connecting electrode, an external circuit connecting pattern electrode, and a driving integrated circuit with the conductive adhesive or the anisotropic conductive film. A liquid crystal display device for applying a predetermined voltage to the driving integrated circuit, and a connecting means for applying an electric signal to the driving integrated circuit from outside is provided with a flexible printed circuit board on the back surface of the driving integrated circuit, Characterized in that it has a PC board or the first alignment mark or an alignment mark or an alignment mark for a flexible printed board circuit board to the substrate.
[0031]
A liquid crystal display device of the present invention includes a sealant for bonding a first substrate and a second substrate at a predetermined distance, and a liquid crystal layer sealed in an overlapping portion between the first substrate and the second substrate. Connecting the driving integrated circuit to the panel connecting pattern electrode and the external circuit connecting pattern electrode for connecting to the driving integrated circuit provided on the first substrate; and connecting the panel connecting electrode and the external circuit connecting pattern electrode to each other. For electrically connecting panel connection electrodes, external circuit connection pattern electrodes, and driving integrated circuits with conductive adhesive or anisotropic conductive film The liquid crystal display device applies a predetermined voltage to the liquid crystal layer. The connection means for applying an electric signal to the driving integrated circuit from the outside includes a conductive particle provided on a side wall of the driving integrated circuit and a thermosetting resin. One It has a conductive film, characterized by connecting the pattern electrode for external circuit connection to the outside via the anisotropic conductive film of the side wall portion of the driver integrated circuit.
[0032]
A liquid crystal display device of the present invention includes a sealant for bonding a first substrate and a second substrate at a predetermined distance, and a liquid crystal layer sealed in an overlapping portion between the first substrate and the second substrate. , A panel connecting pattern electrode and an external circuit connecting pattern electrode for connecting to a driving integrated circuit provided on the first substrate, a panel connecting electrode, an external circuit connecting pattern electrode, and a protruding electrode of the driving integrated circuit. A conductive adhesive or an anisotropic conductive film connecting the first substrate and a protective pedestal provided so as to sandwich the first substrate, and a connecting means for externally applying an electric signal to the driving integrated circuit is flexible. Printed boardAnd driveIt is characterized by having a conductive pattern provided through an anisotropic conductive film provided on a side wall portion of a moving integrated circuit, and a pattern electrode for connecting an external circuit on a first substrate connected to the conductive pattern.
[0033]
In the liquid crystal display device of the present invention, a connection portion for applying a signal from an external circuit to the driving integrated circuit is connected to the driving integrated circuit.Provided on the top side,Flexible printed circuit board connectionRowU.This, External circuit connectionPattern electrodeThe length can be reduced.
[0034]
Therefore, in the liquid crystal display device of the present invention, the area occupied by the mounting portion of the flexible printed board provided around the liquid crystal display panel can be reduced.
[0035]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the structure of a liquid crystal display device according to an embodiment of the present invention will be described with reference to the drawings. First, the configuration of the liquid crystal display device according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a mounting structure of an integrated circuit for driving a liquid crystal display panel according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view showing a cross section taken along line AA of FIG. Hereinafter, the liquid crystal display device according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2 alternately.
[0036]
A first substrate 1 constituting a liquid crystal display panel has a pattern electrode 4 and a panel connection pattern electrode 3 connected to the pattern electrode 4. Further, a pixel pattern 5 is provided on the second substrate 2 facing the first substrate 1 so as to face the pattern electrode 4.
[0037]
The pattern electrode 4 and the pixel pattern 5 face each other with the liquid crystal layer 11 interposed therebetween, and the first substrate 1 and the second substrate 2 maintain a certain gap with a spacer (not shown) and a sealant 10. . Further, a liquid crystal layer 11 is sealed between the first substrate 1 and the second substrate 2.
[0038]
An external circuit connection pattern electrode 12 corresponding to the protruding electrode 7 provided on the driving integrated circuit 6 is provided on the first substrate 1. A so-called chip-on-glass (COG) for connecting an external circuit connecting pattern electrode 12 provided on the first substrate 1 and a protruding electrode 7 provided on the driving integrated circuit 6 using a conductive adhesive 8. Mounting structure.
[0039]
Further, the protruding electrode 7 provided on the driving integrated circuit 6 is provided on the circuit element forming surface side of the driving integrated circuit 6, and the external circuit connecting pattern electrode 12 for connection and the circuit element forming of the driving integrated circuit 6 are formed. Laminated so that the faces face each other. A curable resin 9 is provided between the driving integrated circuit 6 and the first substrate 1. The electrical connection and the mechanical connection are made using this COG mounting.
[0040]
Further, the external circuit connection pattern electrode 12 connected to the external circuit projects a small distance L1 from the side wall of the driving integrated circuit 6. The conductive pattern 22 is provided on the side wall of the driving integrated circuit 6 at a position corresponding to the external circuit connection pattern electrode 12.
[0041]
Further, on the back surface opposite to the element forming surface of the driving integrated circuit 6, a back surface pattern 20 is provided at a position corresponding to the conductive pattern 22.
[0042]
The conductive pattern 22 provided on the side wall of the driving integrated circuit 6, the back surface pattern 20 provided on the back surface of the driving integrated circuit 6, and the conductive pattern 22 provided on the side wall are formed by applying a laser beam to the driving integrated circuit 7 using an organic metal gas. Irradiation directly draws a metal film on a portion corresponding to the back pattern 20 and the conductive pattern 22 to form the conductive pattern 22 and the back pattern 20.
[0043]
Alternatively, the back pattern 20 and the conductive pattern 22 may be made of conductive ink. At this time, it is formed using an ink jet printer. The conductive ink is composed of an organic solvent and metal balls having a particle diameter of 1 μm, printed on the back surface of the driving integrated circuit 6 using an ink jet printer, and then subjected to a heat treatment at a temperature of 100 ° C. to 150 ° C. And the conductive pattern 22.
[0044]
The external circuit connection pattern electrode 12 is provided via the side wall 21 of the curable resin 9 and the side wall 19 of the driving integrated circuit 6 for maintaining the connection strength between the bump electrode 7 of the COG mounting structure and the conductive adhesive 8. To the back surface pattern 20 provided on the back surface of the driving integrated circuit 6. The side wall of the driving integrated circuit 6 has a sloped side wall portion 19 in order to prevent disconnection of the conductive pattern 22.
[0045]
Further, a thermosetting anisotropic conductive film (ACF) 16 is provided on the back surface pattern 20 and connected to a flexible printed circuit board (FPC) 15. The thermosetting anisotropic conductive film 16 is obtained by mixing conductive particles 18 obtained by plating gold (Au) on a plastic ball in a thermosetting resin 17.
[0046]
Therefore, the connection between the driving integrated circuit 6 and the external circuit is made by connecting the protruding electrode 7 on the driving integrated circuit 6, the conductive adhesive 8, the external circuit connecting pattern electrode 12, and the side wall of the driving integrated circuit 6. Is connected to the flexible printed circuit board 15 via the conductive pattern 22 provided on the back surface, the back surface pattern 20 provided on the back surface of the driving integrated circuit 6, and the thermosetting anisotropic conductive film 16.
[0047]
Further, an adhesive resin 23 for mechanically connecting the driving integrated circuit 6 and the flexible printed board 15 is provided therebetween.
[0048]
As is apparent from the above description, the connection between the driving integrated circuit 6 and the external circuit is performed by using the back surface pattern 20 of the driving integrated circuit 6, and the panel connection pattern electrode 3 and the end surface of the first substrate 1 are used. The external circuit connection length W2, which is the distance to the portion, can be reduced.
[0049]
Therefore, the mounting area of the flexible printed board 15 provided around the liquid crystal display device can be reduced. Further, since the length of the external circuit connection pattern electrode 12 can be reduced, the connection resistance value with the external circuit can be reduced.
[0050]
Next, the present inventionreferenceThe configuration of the mounting structure of the driving integrated circuit of the liquid crystal display panel in the example will be described with reference to the drawings. FIG.referenceFIG. 4 is a plan view illustrating a mounting structure of a driving integrated circuit of a liquid crystal display panel in an example, and FIG. 4 is a cross-sectional view illustrating a cross section taken along line BB of FIG. Hereinafter, the present invention will be described with reference to FIGS.referenceAn example will be described.
[0051]
Of the present inventionreferenceIn the example, the projecting electrode 7 of the driving integrated circuit 6 is formed by connecting the panel connecting pattern electrode 3 with the conductive wiring 26.ContactSubsequently, the connection between the protruding electrode 7 of the driving integrated circuit 6 and the metal foil 14 made of a copper thin film on the flexible printed circuit board 15 is also performed by the conductive wiring 27.
[0052]
Further, the first substrate 1 constituting the liquid crystal display panel has a pattern electrode 4 and a panel connection pattern electrode 3 connected to the pattern electrode 4. Further, a pixel pattern 5 is provided on the second substrate 2 facing the first substrate 1 so as to face the pattern electrode 4.
[0053]
The pattern electrode 4 and the pixel pattern 5 face each other with the liquid crystal layer 11 interposed therebetween, and the first substrate 1 and the second substrate 2 maintain a certain gap with a spacer (not shown) and a sealant 10. . Further, a liquid crystal layer 11 is sealed between the first substrate 1 and the second substrate 2.
[0054]
A so-called chip-on-glass (COG) mounting structure in which the panel connection pattern electrode 3 provided on the first substrate 1 and the protruding electrode 7 provided on the driving integrated circuit 6 are connected using conductive wiring 26. I do. The protruding electrode 7 provided on the driving integrated circuit 6 is provided on the circuit element forming surface of the driving integrated circuit 6. Further, a thermosetting resin 9 is provided between the driving integrated circuit 6 and the first substrate 1, and a mechanical connection is made by the thermosetting resin 9.
[0055]
Furthermore, unlike the first embodiment, no external circuit connection pattern electrode is provided on the first substrate 1. In addition, a conductive wiring 27 is provided between the protruding electrode 7 of the driving integrated circuit 6 and the metal foil 14 made of the copper thin film of the flexible printed board 15. Further, an adhesive resin 23 is provided to make a mechanical connection between the driving integrated circuit 6 and the flexible printed board 15.
[0056]
The flexible printed board 15 has a metal foil 14 made of a copper thin film on the polyimide resin 13, and further has a polyimide resin 25 covering the metal foil 14 made of the copper thin film, except for a connection region with the conductive wiring 27. . By covering the metal foil 14 made of the copper thin film with the polyimide resin 13 and the polyimide resin 25 from both sides, the flexible printed circuit board 15 can be protected from corrosion or damage of the metal foil 14 made of the copper thin film from moisture.
[0057]
Further, a conductive wiring 26 connected to the panel connection pattern electrode 3 and the protruding electrode 7 of the driving integrated circuit 6, a metal foil 14 made of a copper thin film of the flexible printed board 15, and the protruding electrode 7 on the driving integrated circuit 6 A protective adhesive resin 28 for protecting the conductive wiring 27 connecting the conductive wiring 27 and the conductive wiring 27 is provided in the peripheral area of the driving integrated circuit 6, the conductive wiring 26, the conductive wiring 27, and the flexible printed board 15.
[0058]
As is clear from the above description, the present inventionreferenceIn the example, the connection between the driving integrated circuit 6 and an external circuit is shown.for,The protruding electrode 7 of the driving integrated circuit 6 is connected to the metal foil 14 made of a copper thin film of the flexible printed board 15 by a conductive wiring 27, and the panel connection pattern electrode 3 and the protruding electrode 7 of the driving integrated circuit 6 Are connected by a conductive wiring 26.
[0059]
Thus, the conductive wiring 26 and the conductive wiring 27 can be provided at the same time, and the external circuit connection length W2, which is the distance between the panel connection pattern electrode 3 and the end surface of the first substrate 1, is reduced. can do. Therefore, the mounting area of the flexible printed board 15 provided around the liquid crystal display device can be reduced.
[0060]
Next, the present invention2The configuration of the mounting structure of the integrated circuit for driving the liquid crystal display panel in the embodiment of the present invention will be described with reference to the drawings. FIG. 5 shows a second embodiment of the present invention.2FIG. 10 is a plan view showing a mounting structure of a driving integrated circuit for a liquid crystal display panel in the example of FIG. FIG. 6 is a sectional view showing a section taken along line CC of FIG. Hereinafter, FIG. 5 and FIG.2The liquid crystal display device according to the embodiment will be described.
[0061]
The present invention2In this embodiment, the connection between the panel connection pattern electrode 3 and the driving integrated circuit 6 and the connection between the external circuit connection pattern electrode 12 and the driving integrated circuit 6 are made of conductive particles 32 and a thermosetting resin 31. An anisotropic conductive film (ACF) 33 is used. Further, the side wall portion 34 of the driving integrated circuit 6 is formed into a slope shape, and the anisotropic conductive film 33 is provided on the side wall portion 34, and is connected to the back surface pattern 20 of the driving integrated circuit 6.
[0062]
Further, the connection between the flexible printed board 15 and the back surface pattern 20 on the side opposite to the element forming surface of the driving integrated circuit 6 is performed using the thermosetting anisotropic conductive film 16. Further, the anisotropic conductive film 33 used for connecting the external circuit connection pattern electrode 12 and the protruding electrode 7 and the thermosetting anisotropic conductive film 16 used for connecting the back pattern 20 and the flexible printed board 15 are brought into contact with each other. The electrical connection is made.
[0063]
A first substrate 1 constituting a liquid crystal display panel has a pattern electrode 4 and a panel connection pattern electrode 3 connected to the pattern electrode 4. Further, a pixel pattern 5 is provided on the second substrate 2 facing the first substrate 1 so as to face the pattern electrode 4.
[0064]
The pattern electrode 4 and the pixel pattern 5 face each other with the liquid crystal layer 11 interposed therebetween, and the first substrate 1 and the second substrate 2 maintain a certain gap with a spacer (not shown) and a sealant 10. . Further, a liquid crystal layer 11 is sealed between the first substrate 1 and the second substrate 2.
[0065]
An external circuit connection pattern electrode 12 is provided on the first substrate 1 at a position corresponding to the protruding electrode 7 provided on the driving integrated circuit 6. A so-called chip-on connection, in which an external circuit connection pattern electrode 12 provided on the first substrate 1 and a protruding electrode 7 provided on the driving integrated circuit 6 are connected using a photocurable anisotropic conductive film 33. -Glass (COG) mounting structure.
[0066]
This anisotropic conductive film 33 is composed of a photocurable resin 31 and conductive particles 32 made of gold (Au) balls. Further, the side wall portion 34 of the driving integrated circuit 6 is provided with a slope portion in order to prevent the anisotropic conductive film 33 from peeling off and cutting off. The side wall part 34 of the driving integrated circuit 6 also has an anisotropic conductive film 33.
[0067]
Further, the protruding electrode 7 provided on the driving integrated circuit 6 is provided on the circuit element forming surface side of the driving integrated circuit 6 so that the external circuit connecting pattern electrode 12 for connection and the circuit surface of the driving integrated circuit 6 face each other. It is stuck to. The electrical connection and the mechanical connection are made using this COG mounting.
[0068]
Further, the external circuit connection pattern electrode 12 connected to the external circuit extends a small distance L1 from the side wall of the driving integrated circuit 6. The side wall portion 34 of the driving integrated circuit 6 has the anisotropic conductive film 33 as described above. Further, a back surface pattern 20 is provided on the back surface of the driving integrated circuit 6.
[0069]
OutsideTimesRoad contactThe connection pattern electrode 12 is connected to the projection electrode 7 having the COG mounting structure by a photocurable anisotropic conductive film 33. Furthermore, it is connected to the back surface pattern 20 of the driving integrated circuit 6 via the anisotropic conductive film 33 on the side wall portion 34 of the driving integrated circuit 6. Further, the anisotropic conductive film 33 on the side wall portion 34 of the driving integrated circuit 6 is directly connected to the thermosetting anisotropic conductive film 16 provided on the back surface of the driving integrated circuit 6.
[0070]
Further, a thermosetting anisotropic conductive film 16 is provided on the back surface pattern 20 and connected to the flexible printed board 15. The thermosetting anisotropic conductive film 16 is obtained by mixing conductive particles 18 obtained by plating gold (Au) on a plastic ball in a thermosetting resin 17.
[0071]
Therefore, the connection between the driving integrated circuit 6 and the external circuit is made by the protruding electrode of the driving integrated circuit 6.7 andAnisotropic conductive film 33, external circuit connection pattern electrode 12, anisotropic conductive film 33 provided on the side wall of driving integrated circuit 6, back surface pattern 20 provided on the back surface of driving integrated circuit 6, It is connected to the flexible printed board 15 via the curable anisotropic conductive film 16.
[0072]
As is apparent from the above description, the present invention2In the embodiment, the connection between the driving integrated circuit 6 and the external circuit is performed.ToThe back surface pattern 20 of the driving integrated circuit 6 is used. As a result, the external circuit connection length W2, which is the distance between the panel connection pattern electrode 3 and the end surface of the first substrate 1, is reduced.
Can be done.
[0073]
Therefore, the mounting area of the flexible printed board 15 provided around the liquid crystal display device can be reduced. Further, since the length of the external circuit connection pattern electrode 12 can be reduced, the connection resistance value with the external circuit can be reduced.
[0074]
The present invention2By using the configuration of the embodiment, the anisotropic conductive film 33 is provided without providing a conductive pattern on the side wall portion 34 of the driving integrated circuit 6, and the metal foil made of the copper thin film of the flexible printed board 15 is provided. 14 can be connected.
[0075]
Furthermore, the present invention2In the embodiment, the back surface pattern 20 is provided on the back surface of the driving integrated circuit 6, but the back surface pattern 20 is not provided, and the external circuit connection pattern electrode 12 and the metal foil 14 of the flexible printed board 15 are heated. The effect of the present invention described above can be obtained even in a configuration in which the connection is made with the curable anisotropic conductive film 16.
[0076]
Next, the present invention3Structure of Driving Integrated Circuit for Driving Liquid Crystal Display Panel in Third EmbodimentBuildThis will be described with reference to the drawings. FIG. 7 shows a second embodiment of the present invention.3FIG. 10 is a plan view showing a mounting structure of a driving integrated circuit for a liquid crystal display panel in the example of FIG. FIG. 8 is a cross-sectional view showing a cross section taken along line DD of FIG. Hereinafter, FIG. 7 and FIG.3The liquid crystal display device according to the embodiment will be described.
[0077]
A first substrate 1 constituting a liquid crystal display panel has a pattern electrode 4 and a panel connection pattern electrode 3 connected to the pattern electrode 4. Further, a pixel pattern 5 is provided on the second substrate 2 facing the first substrate 1 so as to face the pattern electrode 4.
[0078]
The pattern electrode 4 and the pixel pattern 5 face each other with the liquid crystal layer 11 interposed therebetween, and the first substrate 1 and the second substrate 2 maintain a certain gap with a spacer (not shown) and a sealant 10. . Further, a liquid crystal layer 11 is sealed between the first substrate 1 and the second substrate 2.
[0079]
An external circuit connection pattern electrode 12 corresponding to the protruding electrode 7 provided on the driving integrated circuit 6 is provided on the first substrate 1. The external circuit connecting pattern electrode 12 provided on the first substrate 1 and the protruding electrode 7 provided on the driving integrated circuit 6 are connected by using a light-curing or thermosetting anisotropic conductive film 33. A so-called chip-on-glass (COG) mounting structure.
[0080]
The anisotropic conductive film 33 includes a photo-curable or thermo-curable resin 31 and conductive particles 32 made of gold balls. Further, the side wall portion 34 of the driving integrated circuit 6 has an inclined surface shape in order to prevent the anisotropic conductive film 33 from peeling off and cutting off. The side wall part 34 of the driving integrated circuit 6 also has an anisotropic conductive film 33.
[0081]
The protruding electrode 7 provided on the driving integrated circuit 6 is provided on the circuit element forming surface side of the driving integrated circuit 6, and the external circuit connecting pattern electrode 12 for connection and the circuit element forming of the driving integrated circuit 6 are formed. Laminated so that the faces face each other. The electrical connection and the mechanical connection are made using this COG mounting.
[0082]
Further, the external circuit connection pattern electrode 12 connected to the external circuit extends a slight distance L1 from the side wall of the driving integrated circuit 6.
[0083]
Further, the conductive particles 32 and the photo-curing or thermosetting resin 31 are used for the connection between the panel connection pattern electrode 3 and the driving integrated circuit 6 and the connection between the external circuit connection pattern electrode 12 and the driving integrated circuit 6. The anisotropic conductive film 33 is used. Further, the side wall portion 34 of the driving integrated circuit 6 has a slope shape, and the anisotropic conductive film 33 is provided on the side wall portion 34.
[0084]
Further, the anisotropic conductive film 33 covers the side wall 34 of the driving integrated circuit 6 and extends to the back surface of the driving integrated circuit 6. The mechanical connection between the driving integrated circuit 6 and the flexible printed circuit board 15 and the connection between the driving integrated circuit 6 and the anisotropic conductive film 33 provided on the side wall 34 of the driving integrated circuit 6 correspond to the thermosetting anisotropic conductive film 16. Perform using.
[0085]
The flexible printed circuit board 15 is connected by the thermosetting anisotropic conductive film 16. The thermosetting anisotropic conductive film 16 is obtained by mixing conductive particles 18 obtained by plating gold (Au) on a plastic ball in a thermosetting resin 17.
[0086]
Further, a protective pedestal 41 is provided in a region outside the anisotropic conductive film 33 provided on the side wall portion 34 of the driving integrated circuit 6. Further, a conductive pattern 42 is provided on a surface where the protective pedestal 41 and the anisotropic conductive film 33 are in contact with each other. One of the conductive patterns 42 is connected to the external circuit connection pattern electrode 12, and the other is connected to the thermosetting anisotropic conductive film 16 at a connection point 43.
[0087]
The protection pedestal 41 covers the side wall of the first substrate 1 and is fixed with a reinforcing adhesive 48. Further, a reinforcing adhesive 44 is also provided between the flexible printed board 15 and the protection pedestal 41.
[0088]
Further, the first substrate 1 has a circuit alignment mark 45 for aligning the driving integrated circuit 6 with the first substrate 1 during the mounting operation. Furthermore, a flexible printed board alignment mark 46 is provided on the first board 1 as an alignment mark for performing alignment between the flexible printed board 15 and the first board 1, and is provided on the flexible printed board 15. It has a substrate alignment mark 47.
[0089]
The circuit alignment mark 45 and the flexible printed board alignment mark 46 use an electrode material provided on the first substrate 1. For example, using the material of the pattern electrode 4, an alignment mark 45 for a circuit and an alignment mark 46 for a flexible printed board having an L-shaped planar shape are formed.
[0090]
The board alignment mark 47 is formed by using a part of the metal foil 14 made of the copper thin film of the flexible printed board 15 and has a + shape in plan view.
[0091]
By providing the circuit positioning mark 45, the flexible printed board positioning mark 46, and the board positioning mark 47, the positioning accuracy is improved, and the mounting yield and the mounting area can be reduced.
[0092]
Therefore, the connection between the driving integrated circuit 6 and the external circuit is made by connecting the protruding electrode 7 on the driving integrated circuit 6, the anisotropic conductive film 33, the external circuit connecting pattern electrode 12, and the side wall of the driving integrated circuit 6. , A conductive pattern 42 of a protection pedestal 41 provided on a side wall 34 of the driving integrated circuit 6, and a thermosetting anisotropic conductive film 16. It is connected to a metal foil 14 made of a copper thin film.
[0093]
Thus, the present invention3In the embodiment, the connection between the driving integrated circuit 6 and the external circuit is performed.ToBy using the side wall and the back surface of the driving integrated circuit 6, the external circuit connection length W2, which is the distance between the panel connection pattern electrode 3 and the end surface of the first substrate 1, can be reduced.
[0094]
Therefore, the flexible printed circuit board 15 provided around the liquid crystal display deviceofThe mounting area can be reduced. Furthermore, since the length of the external circuit connection pattern electrode 12 can be shortened, the connection resistance value with the external circuit can be reduced. The present invention3By using the structure of the embodiment, the conductive pattern is not provided on the side wall portion 34 of the driving integrated circuit 6 and the anisotropic conductive film is provided.
A film 33 and a pedestal 41 for protection are provided to connect the flexible printed circuit board 15 to the metal foil 14 made of a copper thin film.
[0095]
Further, the present invention3In the embodiment of the present invention, the circuit alignment mark 45 for the driving integrated circuit 6 and the first substrate 1 and the alignment mark for the flexible printed board 15 and the first substrate 1 are formed on the first substrate 1. A flexible printed board alignment mark 46 and a board alignment mark 47 are provided. Thereby, the mutual alignment between the first substrate 1 and the flexible printed board 15 can be performed with high accuracy.
[0096]
In the embodiment described above with reference to FIGS. 1 to 8, an example in which the driving integrated circuit 6 and the flexible printed board 15 are mounted on the first substrate 1 has been described. The drive integrated circuit and the flexible printed circuit board can be mounted by applying the structure of the present invention, and the drive integrated circuit and the flexible printed circuit can be mounted by applying the structure of the present invention to both the first substrate and the second substrate. The board can be mounted.
[0097]
In the embodiment described with reference to FIGS. 7 and 8, an example is described in which the alignment marks are provided on the first substrate and the flexible printed circuit board. The alignment mark may be provided using a wiring or a metal silicide wiring.
[0098]
【The invention's effect】
As is apparent from the above description, by using the mounting structure of the integrated circuit for driving a liquid crystal display panel of the present invention, the length of the external circuit connection on which the flexible printed board is provided is reduced, and the length of the external circuit connection pattern electrode is reduced. Can be shortened. As a result, portions other than the display area of the liquid crystal display panel can be reduced.
[0099]
Further, since the length of the external circuit connection pattern electrode can be reduced, an increase in connection resistance value at the connection portion can be suppressed, and display quality can be improved. Furthermore, by providing alignment marks on the first substrate and the flexible printed substrate, alignment accuracy is improved, and a reduction in mounting area and stabilization can be achieved.
[Brief description of the drawings]
FIG. 1 is a plan view showing a mounting configuration of a driving integrated circuit and a flexible printed board of a liquid crystal display device according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view illustrating a mounting configuration of a driving integrated circuit and a flexible printed board of the liquid crystal display device according to the first embodiment of the present invention.
FIG. 3 of the present invention.referenceFIG. 3 is a plan view showing a mounting configuration of a driving integrated circuit and a flexible printed board of a liquid crystal display device in an example.
FIG. 4 of the present invention.referenceIt is sectional drawing which shows the mounting structure of the drive integrated circuit of the liquid crystal display device in an example, and a flexible printed circuit board.
FIG. 5 of the present invention.2FIG. 5 is a plan view showing a mounting configuration of a driving integrated circuit and a flexible printed circuit board of the liquid crystal display device in the example of FIG.
FIG. 6 of the present invention.2FIG. 6 is a cross-sectional view illustrating a mounting configuration of a driving integrated circuit and a flexible printed circuit board of the liquid crystal display device according to the example.
FIG. 7 of the present invention;3FIG. 5 is a plan view showing a mounting configuration of a driving integrated circuit and a flexible printed circuit board of the liquid crystal display device in the example of FIG.
FIG. 8 shows a second embodiment of the present invention.3FIG. 6 is a cross-sectional view illustrating a mounting configuration of a driving integrated circuit and a flexible printed circuit board of the liquid crystal display device according to the example.
FIG. 9 is a plan view showing a mounting structure of a driving integrated circuit of a liquid crystal display device and a flexible printed circuit board according to a conventional technique.
FIG. 10 is a cross-sectional view showing a mounting configuration of a driving integrated circuit and a flexible printed board of a liquid crystal display device according to a conventional technique.
[Explanation of symbols]
1 First substrate
3 Pattern electrode for panel connection
6. Driving integrated circuit
7 Protruding electrode
8 Conductive adhesive
12 External circuit connection pattern electrode
15 Flexible Printed Circuit Board (FPC)
16 Thermosetting anisotropic conductive film
19 Side wall
20 Back pattern
22 Conductive pattern
23 Adhesive resin
26, 27 conductive wiring
33 Anisotropic conductive film
41 pedestal for protection
42 conductive pattern

Claims

A first substrate and a second substrate are attached to each other at a predetermined distance, a liquid crystal layer is sealed between the first substrate and the second substrate, and a panel connection is provided on the first substrate. includes a use pattern electrodes and the external circuit connection pattern electrode, connect the driving integrated circuits to the said panel connecting pattern electrodes for connection to external circuitry pattern electrodes, applying an electrical signal from an external circuit to the driving integrated circuit A liquid crystal display device for applying a predetermined voltage to the liquid crystal layer,
The driving integrated circuit includes a back surface pattern on a surface opposite to a surface connected to the panel connection pattern electrode and the external circuit connection pattern electrode, and the back surface pattern and the external circuit connection pattern electrode are connected to each other. Te Yes, a liquid crystal display device, characterized in that said external circuit through the backside pattern with the driving integrated circuit is connected.

The liquid crystal display device according to claim 1,
Before The the back pattern Kigaibu circuit connection pattern electrode, a liquid crystal display device you characterized in that it is connected by a conductive pattern provided on a side wall portion of the driver integrated circuit.

The liquid crystal display device according to claim 2,
It said driving integrated circuits liquid crystal display device you characterized by comprising a side wall portion of the tapered.

The liquid crystal display device according to claim 1,
Liquid crystal display device wherein the back surface patterns you characterized in that it is formed by a metal film.

The liquid crystal display device according to claim 1,
The back pattern liquid crystal display device you characterized in that it is composed of a conductive ink.

The liquid crystal display device according to claim 1,
Wherein a back surface pattern and the external circuit, the liquid crystal display device you characterized by being connected via a printed circuit board.

The liquid crystal display device according to claim 6,
Connecting portion between the printed circuit board and the driver IC is, characterized in that it is covered with adhesive resin liquid crystal display device.

A first substrate and a second substrate are attached to each other at a predetermined distance, a liquid crystal layer is sealed between the first substrate and the second substrate, and a panel connection is provided on the first substrate. A pattern electrode for external circuit connection and a pattern electrode for external circuit connection, a driving integrated circuit is connected to the panel connection pattern electrode and the external circuit connection pattern electrode, and an electric signal is applied from the external circuit to the driving integrated circuit. A liquid crystal display device for applying a predetermined voltage to the liquid crystal layer,
Wherein an external circuit connection pattern electrode and the driver IC are connected by a conductive film Rutotomoni, conductive film reaches the upper surface through the side wall portion of the driving integrated circuit,
The printed circuit board to be connected to an external circuit is provided so as to cover at least part of the driving integrated circuit that end, also during the movement for the integrated circuits and printed circuit boards drive, and further established a conductive film, each conductive film There the liquid crystal display device you characterized in that said external circuit and the driver IC are connected by being electrically connected.

The liquid crystal display device according to claim 8,
The conductive film to be connected to an external circuit connection pattern electrode and the driving integrated circuit is a liquid crystal display device you being a conductive film of the photocurable.

The liquid crystal display device according to claim 8,
Liquid crystal display device you wherein a conductive film for connecting the printed circuit board and the driver IC is a conductive film of thermosetting.

The liquid crystal display device according to claim 8,
The driving integrated circuit includes a back surface pattern on a surface opposite to a surface connected to the panel connection pattern electrode and the external circuit connection pattern electrode, and connects the external circuit connection pattern electrode to the drive integrated circuit. liquid crystal display device that the conductive film to reach the upper surface through the side wall portion of the driving integrated circuit to characterized in that connected to the back pattern.

The liquid crystal display device according to claim 8,
Liquid crystal display device characterized by providing a protective base on the outside of the conductive film before Symbol sidewall portion.

The liquid crystal display device according to claim 12,
A conductive pattern is provided between the conductive film and the protection pedestal . liquid crystal display device characterized by electrically connecting the pattern electrode.

The liquid crystal display device according to claim 12,
The protective pedestal liquid crystal display device you characterized by covering the side wall of the first substrate.