JPH09101533A - Liquid crystal display device - Google Patents

Liquid crystal display device

Info

Publication number
JPH09101533A
JPH09101533A JP25968795A JP25968795A JPH09101533A JP H09101533 A JPH09101533 A JP H09101533A JP 25968795 A JP25968795 A JP 25968795A JP 25968795 A JP25968795 A JP 25968795A JP H09101533 A JPH09101533 A JP H09101533A
Authority
JP
Japan
Prior art keywords
substrate
integrated circuit
driving integrated
liquid crystal
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25968795A
Other languages
Japanese (ja)
Other versions
JP3571825B2 (en
Inventor
Kanetaka Sekiguchi
関口　　金孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP25968795A priority Critical patent/JP3571825B2/en
Publication of JPH09101533A publication Critical patent/JPH09101533A/en
Application granted granted Critical
Publication of JP3571825B2 publication Critical patent/JP3571825B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Abstract

PROBLEM TO BE SOLVED: To reduce the length of a pattern electrode for external circuit connection by reducing the connection length of an external circuit provided with a flexible printed board. SOLUTION: A sealant 10 for sticking of first and second substrates, a liquid crystal layer 11 which is sealed in the overlap part between these two substrates, a pattern electrode 3 for panel connection and a pattern electrode 12 for external circuit connection which are provided on the first substrate and are connected to a driving integrated circuit 6, and a conductive adhesive or an anisotropic conductive film for connection of the driving integrated circuit 6 are provided, and a connection means which applies an electric signal to the driving integrated circuit 6 from the outside connects a rear pattern 20 provided on the rear side face of the driving integrated circuit 6 and the pattern electrode 12 for external circuit connection on the first substrate by a conductive pattern 22 and connects them to the outside from the rear pattern of the driving integrated circuit 6.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は液晶表示パネルを構
成する第１の基板上に、この液晶表示装置を駆動するた
めの駆動用集積回路を接続する液晶表示装置の実装構造
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a liquid crystal display device in which a driving integrated circuit for driving the liquid crystal display device is connected on a first substrate which constitutes the liquid crystal display panel.

【０００２】[0002]

【従来の技術】近年、各種情報端末用や計測器やパーソ
ナルコンピュータ用のディスプレイにマトリクス型の液
晶表示パネルが数多く利用されている。2. Description of the Related Art In recent years, many matrix type liquid crystal display panels have been used as displays for various information terminals, measuring instruments and personal computers.

【０００３】この液晶表示パネルを表示するために外部
からの駆動信号を供給する手段として、液晶表示パネル
の外部に設ける駆動用集積回路（ＩＣ）から信号を印加
する手段がある。駆動用集積回路と液晶表示パネルとの
接続方法としては、様々な手段が提案され、そして実用
化されている。As a means for supplying an external drive signal for displaying the liquid crystal display panel, there is a means for applying a signal from a drive integrated circuit (IC) provided outside the liquid crystal display panel. As a method of connecting the driving integrated circuit and the liquid crystal display panel, various means have been proposed and put into practical use.

【０００４】とくに、大表示容量のマトリクス型液晶表
示パネルの場合には、駆動用集積回路を直接液晶表示パ
ネルを構成する基板上に実装する構造が、集積度やコス
トの優位性のために開発されてきている。Particularly in the case of a matrix type liquid crystal display panel having a large display capacity, a structure in which a driving integrated circuit is directly mounted on a substrate constituting the liquid crystal display panel has been developed for the sake of integration and cost advantage. Has been done.

【０００５】上記の駆動用集積回路を直接液晶表示パネ
ルを構成する基板上に実装する構造は、チップ・オン・
グラス（以下ＣＯＧと記載する）実装法と呼ばれ、広く
利用されている。The structure in which the above-mentioned driving integrated circuit is directly mounted on the substrate constituting the liquid crystal display panel is a chip-on-circuit.
It is called a glass (hereinafter referred to as COG) mounting method and is widely used.

【０００６】ＣＯＧ実装法以外の実装手段としては、導
電性薄膜と絶縁性樹脂とを用いて形成する薄膜フィルム
上に駆動用集積回路を実装し、薄膜フィルム上の導電性
薄膜と液晶表示パネルの接続用パターン電極とを異方性
導電性フィルム（ＡＣＦ）で接続するテープ・オートメ
イティド・ボンディング（ＴＡＢ）実装法、あるいは一
度プリント基板上に駆動用集積回路を実装し、さらに導
電性薄膜と絶縁性樹脂とを用いて形成する薄膜フィルム
をプリント基板と液晶表示パネルとの接続に利用するチ
ップ・オン・ボード（ＣＯＢ）実装法などがある。As a mounting means other than the COG mounting method, a driving integrated circuit is mounted on a thin film formed by using a conductive thin film and an insulating resin, and the conductive thin film on the thin film and the liquid crystal display panel are mounted. A tape automated bonding (TAB) mounting method in which a pattern electrode for connection is connected with an anisotropic conductive film (ACF), or a driving integrated circuit is mounted once on a printed circuit board, and a conductive thin film is further formed. There is a chip-on-board (COB) mounting method in which a thin film formed by using an insulating resin is used for connecting a printed circuit board and a liquid crystal display panel.

【０００７】これらのＴＡＢやＣＯＢ実装構造のうちと
くにＣＯＧ実装法は、他の実装手段に比較して、高密度
化と小面積化と低コスト化とが可能であり、これらの面
で他の実装構造より優位性が高い。Among these TAB and COB mounting structures, the COG mounting method, in particular, can achieve higher density, smaller area and lower cost than other mounting means. Superiority to mounting structure.

【０００８】さらに近年、ノートブックパーソナルコン
ピューターあるいはノートブックワールドプロセッサー
にできるだけ大型のディスプレイを搭載するため、駆動
用集積回路の実装領域を小さくするが重要である。Further, in recent years, in order to mount a display as large as possible on a notebook personal computer or a notebook world processor, it is important to reduce the mounting area of the driving integrated circuit.

【０００９】つぎにＣＯＧ実装構造を採用する液晶表示
装置における従来例を、図面を用いて説明する。図９は
従来例における液晶表示装置の液晶表示パネルに駆動用
集積回路を実装した実装構造を示す平面図であり、図１
０は図９におけるＥ−Ｅ線での断面を示す断面図であ
る。以下図９と図１０とを交互に用いて従来技術を説明
する。Next, a conventional example of a liquid crystal display device adopting a COG mounting structure will be described with reference to the drawings. FIG. 9 is a plan view showing a mounting structure in which a driving integrated circuit is mounted on a liquid crystal display panel of a liquid crystal display device in a conventional example.
0 is a cross-sectional view showing a cross section taken along the line EE in FIG. 9. The prior art will be described below by alternately using FIG. 9 and FIG.

【００１０】第１の基板１上には、パターン電極４と駆
動用集積回路６の突起電極７と対応するパネル接続用パ
ターン電極３を設ける。そしてパターン電極４とパネル
接続用パターン電極３とはいずれも導電性薄膜にて構成
し、同一工程で形成する。On the first substrate 1, a panel connection pattern electrode 3 corresponding to the pattern electrode 4 and the protruding electrode 7 of the driving integrated circuit 6 is provided. The pattern electrode 4 and the panel-connecting pattern electrode 3 are both made of a conductive thin film and formed in the same step.

【００１１】この第１の基板１上に設けるパネル接続用
パターン電極３上には、導電性接着剤８を介して、突起
電極７を設ける駆動用集積回路６を実装する。On the panel connection pattern electrode 3 provided on the first substrate 1, the drive integrated circuit 6 provided with the protruding electrode 7 is mounted via the conductive adhesive 8.

【００１２】この導電性接着剤８によって、駆動用集積
回路６の突起電極７は、第１の基板１のパネル接続用パ
ターン電極３に電気的にしかも機械的に接続することが
できる。The conductive adhesive 8 allows the protruding electrodes 7 of the driving integrated circuit 6 to be electrically and mechanically connected to the panel connecting pattern electrodes 3 of the first substrate 1.

【００１３】さらに、第１の基板１にシール剤１０を介
して張り合わせる第２の基板２には画素パターン５を設
ける。液晶表示パネルは、第１の基板１と第２の基板２
とを所定の距離を隔ててパターン電極３と画素パターン
５とを対向させ、その周辺をシール剤１０で封止してい
る。Further, a pixel pattern 5 is provided on the second substrate 2 which is attached to the first substrate 1 via a sealant 10. The liquid crystal display panel includes a first substrate 1 and a second substrate 2.
And the pixel electrode 5 are opposed to each other with a predetermined distance therebetween, and the periphery thereof is sealed with a sealant 10.

【００１４】第１の基板１と第２の基板２との重なった
領域でかつシール剤１０の内側の領域には液晶層１１を
封入する。A liquid crystal layer 11 is sealed in a region where the first substrate 1 and the second substrate 2 are overlapped with each other and inside the sealant 10.

【００１５】第１の基板１上に設けるパネル接続用パタ
ーン電極３と駆動用集積回路６に設ける突起電極７と
を、導電性接着剤８にて接続するＣＯＧ実装構造を採用
する。そして、パネル接続用パターン電極３と駆動用集
積回路６とを電気的接続と機械的接続とを行い、さらに
駆動用集積回路６を含む第１の基板１表面に硬化性樹脂
９を用いて樹脂封止する。A COG mounting structure is adopted in which the panel connection pattern electrode 3 provided on the first substrate 1 and the projecting electrode 7 provided on the driving integrated circuit 6 are connected by a conductive adhesive 8. Then, the panel connection pattern electrode 3 and the driving integrated circuit 6 are electrically and mechanically connected to each other, and the surface of the first substrate 1 including the driving integrated circuit 6 is cured with a curable resin 9. Seal.

【００１６】さらに、駆動用集積回路６へ外部信号を印
加するために、駆動用集積回路６の入力部においても、
第１の基板１に設ける外部回路接続用パターン電極１２
と駆動用集積回路６に設ける突起電極７とを、導電性接
着剤８にて接続するＣＯＧ実装構造を採用する。また、
外部回路接続用パターン電極１２と外部回路を接続する
ため、ポリイミド樹脂１３に導電性薄膜として銅（Ｃ
ｕ）薄膜からなる金属箔１４をパターン形成したフレキ
シブルプリント基板（ＦＰＣ）１５を熱硬化性異方性導
電フィルム（ＡＣＦ）１６を介して接続する。Further, in order to apply an external signal to the driving integrated circuit 6, even at the input portion of the driving integrated circuit 6,
External circuit connection pattern electrode 12 provided on the first substrate 1
A COG mounting structure in which the conductive adhesive 8 is used to connect the projection electrode 7 provided on the driving integrated circuit 6 with the conductive adhesive 8 is used. Also,
In order to connect the external circuit connection pattern electrode 12 and the external circuit, copper (C
u) A flexible printed circuit board (FPC) 15 on which a metal foil 14 made of a thin film is patterned is connected via a thermosetting anisotropic conductive film (ACF) 16.

【００１７】この熱硬化性異方性導電フィルム１６は熱
硬化性樹脂１７に導電粒１８を混入したものを用いる。As the thermosetting anisotropic conductive film 16, a thermosetting resin 17 mixed with conductive particles 18 is used.

【００１８】[0018]

【発明が解決しようとする課題】図９と図１０とを用い
て説明したＣＯＧ実装構造は簡便な実装手段で、高密度
で多端子接続が可能で、そのうえ小型化でしかも低コス
ト化を達成する上で有効である。The COG mounting structure described with reference to FIGS. 9 and 10 is a simple mounting means capable of high-density multi-terminal connection, and at the same time achieves downsizing and cost reduction. It is effective in doing.

【００１９】しかしながら、ＣＯＧ実装構造と駆動用集
積回路６から外部回路接続用パターン電極１２を張り出
し、熱硬化性異方性導電フィルム（ＡＣＦ）１６を用い
て第１の基板１上でフレキシブルプリント基板１５と接
続を行う場合には、フレキシブルプリント基板１５と熱
硬化性異方性導電フィルム１６の接続を行うための、あ
る程度の距離を有する外部回路接続長さ（Ｗ１）が必要
となる。この外部回路接続長さＷ１は、図９に示すよう
にパネル接続用パターン電極３と第１の基板１の端面部
との距離である。However, the external circuit connecting pattern electrode 12 is overhanging from the COG mounting structure and the driving integrated circuit 6, and the thermosetting anisotropic conductive film (ACF) 16 is used to form the flexible printed circuit board on the first substrate 1. When connecting to the flexible printed circuit board 15 and the thermosetting anisotropic conductive film 16, an external circuit connection length (W1) having a certain distance is required to connect the flexible printed circuit board 15 and the thermosetting anisotropic conductive film 16. The external circuit connection length W1 is the distance between the panel connection pattern electrode 3 and the end face portion of the first substrate 1 as shown in FIG.

【００２０】この外部回路接続長さＷ１は、駆動用集積
回路６と外部回路との接続手段に、ＣＯＧ実装構造とフ
レキシブルプリント基板１５と熱硬化性異方性導電フィ
ルム１６を利用する手段においては、熱硬化性異方性導
電フィルム１６の張り合わせ誤差や、あるいはフレキシ
ブルプリント基板１５にパターン形成する銅薄膜からな
る金属箔１４のパターン精度や、あるいは熱硬化性異方
性導電フィルム１６による接続強度を確保するための面
積が必要である。このため、熱硬化性異方性導電フィル
ム１６によってフレキシブルプリント基板１５を接続す
る外部回路接続長さＷ１を短くするには限度がある。This external circuit connection length W1 is obtained by using the COG mounting structure, the flexible printed circuit board 15 and the thermosetting anisotropic conductive film 16 as means for connecting the driving integrated circuit 6 and the external circuit. , The bonding error of the thermosetting anisotropic conductive film 16, the pattern accuracy of the metal foil 14 made of a copper thin film that is patterned on the flexible printed board 15, or the connection strength of the thermosetting anisotropic conductive film 16. An area is needed to secure it. Therefore, there is a limit to shortening the external circuit connection length W1 for connecting the flexible printed circuit board 15 with the thermosetting anisotropic conductive film 16.

【００２１】本発明は上記の問題点に着目し、その目的
はフレキシブルプリント基板を接続する領域であるパネ
ル接続用パターン電極と第１の基板の端面部との距離で
ある外部回路接続長さを短くすることが可能な液晶表示
装置における実装手段を提供することにある。The present invention focuses on the above-mentioned problems, and its purpose is to determine the external circuit connection length, which is the distance between the panel connection pattern electrode, which is the region for connecting the flexible printed circuit board, and the end face of the first substrate. An object of the present invention is to provide mounting means for a liquid crystal display device that can be shortened.

【００２２】[0022]

【課題を解決するための手段】上記の目的を解決するた
めに本発明の液晶表示装置は、以下に記載の構造を採用
する。In order to solve the above-mentioned object, the liquid crystal display device of the present invention adopts the structure described below.

【００２３】本発明の液晶表示装置は、第１の基板と第
２の基板を所定の距離を設けて張り合わせるためのシー
ル剤と、第１の基板と第２の基板の重なり部に封入する
液晶層と、第１の基板上に設ける駆動用集積回路と接続
するためのパネル接続用パターン電極と外部回路接続用
パターン電極と、パネル接続用パターン電極と外部回路
接続用パターン電極に駆動用集積回路を接続するための
導電性接着剤あるいは異方性導電フィルムを有し、導電
性接着剤あるいは異方性導電フィルムによりパネル接続
用パターン電極と外部回路接続用パターン電極と駆動用
集積回路との電気的接続をおこない液晶層に所定の電圧
を印加する液晶表示装置であり、駆動用集積回路へ外部
より電気信号を印加する接続手段は、駆動用集積回路の
裏面に設ける裏面パターンと第１の基板上の外部回路接
続用パターン電極とを導電性パターンにより接続して駆
動用集積回路の裏面パターンより外部へ接続することを
特徴とする。In the liquid crystal display device of the present invention, a sealing agent for adhering the first substrate and the second substrate to each other with a predetermined distance provided therebetween is sealed in the overlapping portion of the first substrate and the second substrate. A liquid crystal layer, a panel connection pattern electrode for connecting to a drive integrated circuit provided on the first substrate, an external circuit connection pattern electrode, a panel connection pattern electrode, and an external circuit connection pattern electrode. Having a conductive adhesive or an anisotropic conductive film for connecting a circuit, the conductive adhesive or the anisotropic conductive film is used to connect the pattern electrode for panel connection, the pattern electrode for external circuit connection, and the driving integrated circuit. A liquid crystal display device for applying a predetermined voltage to a liquid crystal layer by making an electrical connection, and a connecting means for externally applying an electric signal to the driving integrated circuit is a back surface provided on the back surface of the driving integrated circuit. And wherein the connecting turn and to the outside from the back surface patterns of the external circuit connection pattern electrode connected by the conductive pattern driving integrated circuit on the first substrate.

【００２４】本発明の液晶表示装置は、第１の基板と第
２の基板を所定の距離を設けて張り合わせるためのシー
ル剤と、第１の基板と第２の基板の重なり部に封入する
液晶層と、第１の基板上に設ける駆動用集積回路と接続
するためのパネル接続用パターン電極と外部回路接続用
パターン電極と、パネル接続用電極と外部回路接続用パ
ターン電極に駆動用集積回路を接続するための導電性接
着剤あるいは異方性導電フィルムを有し、導電性接着剤
あるいは異方性導電フィルムによりパネル接続用電極と
外部回路接続用パターン電極と駆動用集積回路との電気
的接続をおこない液晶層に所定の電圧を印加する液晶表
示装置であり、駆動用集積回路へ外部より電気信号を印
加する接続手段は駆動用集積回路の裏面にフレキシブル
プリント基板を設け、フレキシブルプリント基板は第１
の基板上の外部回路接続用パターン電極と駆動用集積回
路の側壁部の導電性パターンを介して接続して外部へ接
続することを特徴とする。In the liquid crystal display device of the present invention, a sealant for adhering the first substrate and the second substrate with a predetermined distance therebetween and a sealant for the first substrate and the second substrate are sealed. A liquid crystal layer, a panel connection pattern electrode for connecting to the drive integrated circuit provided on the first substrate, an external circuit connection pattern electrode, and a panel connection electrode and an external circuit connection pattern electrode. Has a conductive adhesive or an anisotropic conductive film for connecting the electrodes, and the conductive adhesive or the anisotropic conductive film electrically connects the panel connection electrode, the external circuit connection pattern electrode, and the driving integrated circuit. This is a liquid crystal display device in which a predetermined voltage is applied to the liquid crystal layer by making a connection, and a connecting means for externally applying an electric signal to the driving integrated circuit is provided with a flexible printed circuit board on the back surface of the driving integrated circuit. The flexible printed board first
The external circuit connection pattern electrode on the substrate is connected to the outside via the conductive pattern on the side wall of the driving integrated circuit.

【００２５】本発明の液晶表示装置は、第１の基板と第
２の基板を所定の距離を設けて張り合わせるためのシー
ル剤と、第１の基板と第２の基板の重なり部に封入する
液晶層と、第１の基板上に設ける駆動用集積回路と接続
するためのパネル接続用パターン電極と外部回路接続用
パターン電極と、パネル接続用電極と外部回路接続用パ
ターン電極に駆動用集積回路を接続するための導電性接
着剤あるいは異方性導電フィルムを有し、導電性接着剤
あるいは異方性導電フィルムによりパネル接続用電極と
外部回路接続用パターン電極と駆動用集積回路との電気
的接続をおこない液晶層に所定の電圧を印加する液晶表
示装置であり、駆動用集積回路へ外部より電気信号を印
加する接続手段は駆動用集積回路の裏面に熱硬化性異方
性導電フィルムを介してフレキシブルプリント基板を設
け、フレキシブルプリント基板は第１の基板上の外部回
路接続用パターン電極と駆動用集積回路の側壁部の導電
性パターンを介して接続して外部へ接続することを特徴
とする。In the liquid crystal display device of the present invention, a sealing agent for adhering the first substrate and the second substrate to each other with a predetermined distance provided therebetween is sealed in the overlapping portion of the first substrate and the second substrate. A liquid crystal layer, a panel connection pattern electrode for connecting to the drive integrated circuit provided on the first substrate, an external circuit connection pattern electrode, and a panel connection electrode and an external circuit connection pattern electrode. Has a conductive adhesive or an anisotropic conductive film for connecting the electrodes, and the conductive adhesive or the anisotropic conductive film electrically connects the panel connection electrode, the external circuit connection pattern electrode, and the driving integrated circuit. This is a liquid crystal display device in which a predetermined voltage is applied to the liquid crystal layer by making a connection, and the connecting means for externally applying an electric signal to the driving integrated circuit is a thermosetting anisotropic conductive film on the back surface of the driving integrated circuit. A flexible printed circuit board is provided, and the flexible printed circuit board is connected to the external circuit connection pattern electrode on the first substrate through the conductive pattern on the side wall of the driving integrated circuit to connect to the outside. To do.

【００２６】本発明の液晶表示装置は、第１の基板と第
２の基板を所定の距離を設けて張り合わせるためのシー
ル剤と、第１の基板と第２の基板の重なり部に封入する
液晶層と、第１の基板上に設ける駆動用集積回路と接続
するためのパネル接続用パターン電極と外部回路接続用
パターン電極と、駆動用集積回路の回路素子形成面側と
パネル接続用パターン電極と外部回路接続用パターン電
極とを対向させ、駆動用集積回路の突起電極とパネル接
続用パターン電極と外部回路接続用パターン電極とを接
続する導電性接着剤あるいは異方性導電フィルムを有
し、導電性接着剤あるいは異方性導電フィルムによりパ
ネル接続用電極と外部回路接続用パターン電極と駆動用
集積回路上の突起電極を向かい合わせに張り合わせて電
気的接続をおこない液晶層に所定の電圧を印加する液晶
表示装置であり、駆動用集積回路へ外部より電気信号を
印加する接続手段は、駆動用集積回路の裏面に設ける裏
面パターンから斜面状の側壁部を介して第１の基板上の
外部回路接続用パターン電極に導電性パターンにより接
続して駆動用集積回路の裏面パターンより外部へ接続す
ることを特徴とする。In the liquid crystal display device of the present invention, a sealing agent for adhering the first substrate and the second substrate to each other with a predetermined distance provided therebetween is sealed in the overlapping portion of the first substrate and the second substrate. A liquid crystal layer, a panel connection pattern electrode for connecting to a drive integrated circuit provided on the first substrate, an external circuit connection pattern electrode, a circuit element formation surface side of the drive integrated circuit, and a panel connection pattern electrode And a pattern electrode for external circuit connection are opposed to each other, and a conductive adhesive or an anisotropic conductive film for connecting the protruding electrode of the driving integrated circuit, the pattern electrode for panel connection, and the pattern electrode for external circuit connection is provided, Conductive adhesive or anisotropic conductive film is used to electrically connect the panel connection electrodes, external circuit connection pattern electrodes, and protruding electrodes on the drive integrated circuit to face each other. In the liquid crystal display device for applying a predetermined voltage to the crystal layer, the connecting means for externally applying an electric signal to the driving integrated circuit is provided from the back surface pattern provided on the back surface of the driving integrated circuit through the side wall portion having a slope shape. It is characterized in that it is connected to the external circuit connection pattern electrode on the first substrate by a conductive pattern and is connected to the outside from the back surface pattern of the driving integrated circuit.

【００２７】本発明の液晶表示装置は、第１の基板と第
２の基板を所定の距離を設けて張り合わせるためのシー
ル剤と、第１の基板と第２の基板の重なり部に封入する
液晶層と、第１の基板上に設ける駆動用集積回路と接続
するためのパネル接続用パターン電極と外部回路接続用
パターン電極と、パネル接続用電極と外部回路接続用パ
ターン電極と駆動用集積回路の突起電極とを接続する導
電性接着剤とを有し、駆動用集積回路へ外部より電気信
号を印加する接続手段は、フレキシブルプリント基板と
駆動用集積回路の裏面に設ける裏面パターンと駆動用集
積回路の側壁部に設ける導電性インクからなる導電性パ
ターンと導電性インクからなる導電性パターンに接続す
る第１の基板上の外部回路接続用パターン電極とを有す
ることを特徴とする。In the liquid crystal display device of the present invention, a sealing agent for adhering the first substrate and the second substrate to each other with a predetermined distance provided therebetween is sealed in the overlapping portion of the first substrate and the second substrate. A liquid crystal layer, a panel connection pattern electrode for connecting to a drive integrated circuit provided on the first substrate, a pattern electrode for external circuit connection, a panel connection electrode, a pattern electrode for external circuit connection, and a drive integrated circuit And a conductive adhesive for connecting to the projecting electrodes of the driving circuit, and a connecting means for applying an electric signal from the outside to the driving integrated circuit is a flexible printed circuit board and a back surface pattern provided on the back surface of the driving integrated circuit and the driving integrated circuit. It has a conductive pattern made of a conductive ink provided on a side wall of the circuit and an external circuit connection pattern electrode on the first substrate connected to the conductive pattern made of the conductive ink. .

【００２８】本発明の液晶表示装置は、第１の基板と第
２の基板を所定の距離を設けて張り合わせるためのシー
ル剤と、第１の基板と第２の基板の重なり部に封入する
液晶層と、第１の基板上に設ける駆動用集積回路と接続
するためのパネル接続用パターン電極と外部回路接続用
パターン電極と、駆動用集積回路を第１の基板接続する
ための硬化性樹脂とを有し、パネル接続用電極と外部回
路接続用パターン電極と駆動用集積回路との電気的接続
をおこない液晶層に所定の電圧を印加する液晶表示装置
であり、駆動用集積回路へ外部より電気信号を印加する
接続手段は、フレキシブルプリント基板と駆動用集積回
路に設ける突起電極と導電極性配線と導電極性配線に接
続する第１の基板上の外部回路接続用パターン電極と保
護用接着樹脂とを有することを特徴とする。In the liquid crystal display device of the present invention, a sealing agent for adhering the first substrate and the second substrate to each other with a predetermined distance provided therebetween is sealed in the overlapping portion of the first substrate and the second substrate. A liquid crystal layer, a panel connection pattern electrode for connecting to a drive integrated circuit provided on the first substrate, an external circuit connection pattern electrode, and a curable resin for connecting the drive integrated circuit to the first substrate. And a liquid crystal display device for applying a predetermined voltage to the liquid crystal layer by electrically connecting the panel connection electrode, the external circuit connection pattern electrode, and the driving integrated circuit to the driving integrated circuit from the outside. The connecting means for applying an electric signal includes a pattern electrode for connecting an external circuit and a protective adhesive resin on the first substrate for connecting to the flexible printed circuit board, the projecting electrode provided on the driving integrated circuit, the conductive polarity wiring and the conductive polarity wiring. To Characterized in that it.

【００２９】本発明の液晶表示装置は、第１の基板と第
２の基板を所定の距離を設けて張り合わせるためのシー
ル剤と、第１の基板と第２の基板の重なり部に封入する
液晶層と、第１の基板上に設ける駆動用集積回路と接続
するためのパネル接続用パターン電極と外部回路接続用
パターン電極と、駆動用集積回路を第１の基板接続する
ための硬化性樹脂と、フレキシブルプリント基板と第１
の基板と駆動用集積回路を固着するための接着樹脂とを
有し、パネル接続用電極と外部回路接続用パターン電極
と駆動用集積回路との電気的接続をおこない液晶層に所
定の電圧を印加する液晶表示装置であり、駆動用集積回
路へ外部より電気信号を印加する接続手段は、フレキシ
ブルプリント基板と駆動用集積回路に設ける突起電極と
導電極性配線と導電極性配線に接続する第１の基板上の
外部回路接続用パターン電極と保護用接着樹脂とを有す
ることを特徴とする。In the liquid crystal display device of the present invention, a sealing agent for adhering the first substrate and the second substrate at a predetermined distance to each other and a sealing agent are sealed in the overlapping portion of the first substrate and the second substrate. A liquid crystal layer, a panel connection pattern electrode for connecting to a drive integrated circuit provided on the first substrate, an external circuit connection pattern electrode, and a curable resin for connecting the drive integrated circuit to the first substrate. And flexible printed circuit board and first
, And an adhesive resin for fixing the driving integrated circuit to each other, electrically connect the panel connecting electrode, the external circuit connecting pattern electrode and the driving integrated circuit to apply a predetermined voltage to the liquid crystal layer. In the liquid crystal display device, the connecting means for applying an electric signal from the outside to the driving integrated circuit is a flexible printed board, a protruding electrode provided on the driving integrated circuit, a conductive polarity wiring, and a first substrate connecting to the conductive polarity wiring. It is characterized by having the above external circuit connection pattern electrode and a protective adhesive resin.

【００３０】本発明の液晶表示装置は、第１の基板と第
２の基板を所定の距離を設けて張り合わせるためのシー
ル剤と、第１の基板と第２の基板の重なり部に封入する
液晶層と、第１の基板上に設ける駆動用集積回路と接続
するためのパネル接続用パターン電極と外部回路接続用
パターン電極と、パネル接続用電極と外部回路接続用パ
ターン電極に駆動用集積回路を接続する導電性接着剤あ
るいは異方性導電フィルムを有し、導電性接着剤あるい
は異方性導電フィルムによりパネル接続用電極と外部回
路接続用パターン電極と駆動用集積回路との電気的接続
をおこない液晶層に所定の電圧を印加する液晶表示装置
であり、駆動用集積回路へ外部より電気信号を印加する
接続手段は、駆動用集積回路の裏面にフレキシブルプリ
ント基板を設け、フレキシブルプリント基板あるいは第
１の基板に基板用合わせマークあるいは回路用位置合わ
せマークあるいはフレキシブルプリント基板用位置合わ
せマークを有することを特徴とする。In the liquid crystal display device of the present invention, a sealing agent for adhering the first substrate and the second substrate with a predetermined distance therebetween, and a sealant for the first substrate and the second substrate are sealed. A liquid crystal layer, a panel connection pattern electrode for connecting to the drive integrated circuit provided on the first substrate, an external circuit connection pattern electrode, and a panel connection electrode and an external circuit connection pattern electrode. It has a conductive adhesive or an anisotropic conductive film for connecting the electrodes, and the conductive adhesive or the anisotropic conductive film is used to electrically connect the panel connection electrode, the external circuit connection pattern electrode and the driving integrated circuit. In the liquid crystal display device for applying a predetermined voltage to the liquid crystal layer, the connecting means for externally applying an electric signal to the driving integrated circuit is provided with a flexible printed circuit board on the back surface of the driving integrated circuit. Characterized in that it has a lexical Bull PCB or the first alignment mark or an alignment mark, a flexible printed alignment mark substrate circuit board to the substrate.

【００３１】本発明の液晶表示装置は、第１の基板と第
２の基板を所定の距離を設けて張り合わせるためのシー
ル剤と、第１の基板と第２の基板の重なり部に封入する
液晶層と、第１の基板上に設ける駆動用集積回路と接続
するためのパネル接続用パターン電極と外部回路接続用
パターン電極と、パネル接続用電極と外部回路接続用パ
ターン電極に駆動用集積回路を接続するための導電性接
着剤あるいは異方性導電フィルムを有し、導電性接着剤
あるいは異方性導電フィルムによりパネル接続用電極と
外部回路接続用パターン電極と駆動用集積回路との電気
的接続をおこない液晶層に所定の電圧を印加する液晶表
示装置であり、駆動用集積回路へ外部より電気信号を印
加する接続手段は、駆動用集積回路の側壁部に設ける導
電粒と熱硬化性樹脂を含む異方性導電フィルムを有し、
駆動用集積回路の側壁部の異方性導電フィルムを介して
外部回路接続用パターン電極を外部へ接続することを特
徴とする。In the liquid crystal display device of the present invention, a sealing agent for adhering the first substrate and the second substrate to each other with a predetermined distance provided therebetween, and the sealing material is sealed in the overlapping portion of the first substrate and the second substrate. A liquid crystal layer, a panel connection pattern electrode for connecting to the drive integrated circuit provided on the first substrate, an external circuit connection pattern electrode, and a panel connection electrode and an external circuit connection pattern electrode. Has a conductive adhesive or an anisotropic conductive film for connecting the electrodes, and the conductive adhesive or the anisotropic conductive film electrically connects the panel connection electrode, the external circuit connection pattern electrode, and the driving integrated circuit. A liquid crystal display device that applies a predetermined voltage to the liquid crystal layer by making a connection, and the connecting means for applying an electric signal from the outside to the driving integrated circuit includes conductive particles and a thermosetting resin provided on the side wall of the driving integrated circuit. Has an anisotropic conductive film comprising,
The pattern electrode for external circuit connection is connected to the outside through the anisotropic conductive film on the side wall of the driving integrated circuit.

【００３２】本発明の液晶表示装置は、第１の基板と第
２の基板を所定の距離を設けて張り合わせるためのシー
ル剤と、第１の基板と第２の基板の重なり部に封入する
液晶層と、第１の基板上に設ける駆動用集積回路と接続
するためのパネル接続用パターン電極と外部回路接続用
パターン電極と、パネル接続用電極と外部回路接続用パ
ターン電極と駆動用集積回路の突起電極とを接続する導
電性接着剤あるいは異方性導電フィルムと、第１の基板
を挟むように設ける保護用台座とを有し、駆動用集積回
路へ外部より電気信号を印加する接続手段は、フレキシ
ブルプリント基板と駆動用集積回路の裏面に設ける裏面
パターンと駆動用集積回路の側壁部に設ける異方性導電
フィルムを介して設ける導電性パターンと導電性パター
ンに接続する第１の基板上の外部回路接続用パターン電
極とを有することを特徴とする。In the liquid crystal display device of the present invention, a sealant for adhering the first substrate and the second substrate at a predetermined distance and encapsulating the sealant in the overlapping portion of the first substrate and the second substrate. A liquid crystal layer, a panel connection pattern electrode for connecting to a drive integrated circuit provided on the first substrate, a pattern electrode for external circuit connection, a panel connection electrode, a pattern electrode for external circuit connection, and a drive integrated circuit Connecting means for applying an electric signal from the outside to the driving integrated circuit, which has a conductive adhesive or an anisotropic conductive film for connecting to the projecting electrode and a protection pedestal provided so as to sandwich the first substrate. Is a conductive pattern provided through a back surface pattern provided on the back surface of the flexible printed circuit board and the driving integrated circuit, and an anisotropic conductive film provided on the side wall of the driving integrated circuit, and the first pattern connecting to the conductive pattern. And having an external circuit connection pattern electrode on the substrate.

【００３３】本発明の液晶表示装置においては、駆動用
集積回路への外部回路からの信号を印加するための接続
部を駆動用集積回路の裏面に裏面パターンを設ける。さ
らに裏面パターンとフレキシブルプリント基板の接続を
裏面パターン上にて行う。そのため、外部回路接続長さ
を小さくすることができる。In the liquid crystal display device of the present invention, the back surface pattern is provided on the back surface of the driving integrated circuit for the connection portion for applying the signal from the external circuit to the driving integrated circuit. Further, the back surface pattern and the flexible printed circuit board are connected on the back surface pattern. Therefore, the external circuit connection length can be reduced.

【００３４】このため本発明の液晶表示装置において
は、液晶表示パネルの周辺に設けるフレキシブルプリン
ト基板の実装部の占有面積を小さくすることができる。Therefore, in the liquid crystal display device of the present invention, the area occupied by the mounting portion of the flexible printed board provided around the liquid crystal display panel can be reduced.

【００３５】[0035]

【発明の実施の形態】以下、図面を用いて本発明の実施
例における液晶表示装置の構造を説明する。まずはじめ
に本発明の第１の実施例における液晶表示装置の構成を
図面に基づいて説明する。図１は、本発明の第１の実施
例における液晶表示パネルの駆動用集積回路の実装構造
を示す平面図である。図２は、図１のＡ−Ａ線における
断面を示す断面図である。以下、図１と図２とを交互に
用いて本発明の第１の実施例における液晶表示装置を説
明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of a liquid crystal display device according to an embodiment of the present invention will be described below with reference to the drawings. First, the configuration of the liquid crystal display device according to the first embodiment of the present invention will be described with reference to the drawings. 1 is a plan view showing a mounting structure of a driving integrated circuit of a liquid crystal display panel according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view showing a cross section taken along the line AA of FIG. Hereinafter, the liquid crystal display device in the first embodiment of the present invention will be described by alternately using FIG. 1 and FIG.

【００３６】液晶表示パネルを構成する第１の基板１に
は、パターン電極４と、このパターン電極４に接続する
パネル接続用パターン電極３とを有する。さらに、第１
の基板１に対向する第２の基板２には、パターン電極４
に対向するように画素パターン５を設ける。The first substrate 1 constituting the liquid crystal display panel has a pattern electrode 4 and a panel connection pattern electrode 3 connected to the pattern electrode 4. Furthermore, the first
On the second substrate 2 facing the substrate 1 of the
The pixel pattern 5 is provided so as to face the.

【００３７】パターン電極４と画素パターン５とは液晶
層１１を介して対向し、第１の基板１と第２の基板２
は、スペーサー（図示せず）とシール剤１０にて一定の
間隙を保っている。さらに、第１の基板１と第２の基板
２間には液晶層１１を封入してある。The pattern electrode 4 and the pixel pattern 5 face each other with the liquid crystal layer 11 in between, and the first substrate 1 and the second substrate 2
Maintain a constant gap with a spacer (not shown) and the sealant 10. Further, a liquid crystal layer 11 is sealed between the first substrate 1 and the second substrate 2.

【００３８】第１の基板１には、駆動用集積回路６に設
ける突起電極７に対応する外部回路接続用パターン電極
１２を設ける。この第１の基板１上に設ける外部回路接
続用パターン電極１２と、駆動用集積回路６に設ける突
起電極７とを導電性接着剤８を用いて接続する、いわゆ
るチップ・オン・ガラス（ＣＯＧ）実装構造とする。On the first substrate 1, an external circuit connecting pattern electrode 12 corresponding to the protruding electrode 7 provided on the driving integrated circuit 6 is provided. The so-called chip-on-glass (COG), in which the pattern electrode 12 for external circuit connection provided on the first substrate 1 and the protruding electrode 7 provided on the driving integrated circuit 6 are connected using the conductive adhesive 8. It has a mounting structure.

【００３９】さらに、駆動用集積回路６上に設ける突起
電極７は駆動用集積回路６の回路素子形成面側に設けて
あり、接続を行う外部回路接続用パターン電極１２と駆
動用集積回路６の回路素子形成面が向かい合うように張
り合わせてある。駆動用集積回路６と第１の基板１の間
には硬化性樹脂９を設ける。このＣＯＧ実装を用いて電
気的接続と機械的接続との接続を行う。Further, the protruding electrode 7 provided on the driving integrated circuit 6 is provided on the circuit element forming surface side of the driving integrated circuit 6, and the external circuit connecting pattern electrode 12 for connection and the driving integrated circuit 6 are connected. The circuit element forming surfaces are laminated so as to face each other. A curable resin 9 is provided between the driving integrated circuit 6 and the first substrate 1. This COG mounting is used to make electrical and mechanical connections.

【００４０】さらに、外部回路と接続する外部回路接続
用パターン電極１２は、駆動用集積回路６の側壁部から
わずかの距離Ｌ１に張り出している。そして駆動用集積
回路６の側壁部には外部回路接続用パターン電極１２に
対応した箇所に導電性パターン２２を有する。Further, the external circuit connecting pattern electrode 12 for connecting to the external circuit projects over a slight distance L1 from the side wall of the driving integrated circuit 6. The side wall of the driving integrated circuit 6 has a conductive pattern 22 at a position corresponding to the external circuit connecting pattern electrode 12.

【００４１】さらに、駆動用集積回路６の素子形成面と
反対側の裏面に、裏面パターン２０を導電性パターン２
２に対応する箇所に設ける。Further, a back surface pattern 20 is provided on the back surface of the driving integrated circuit 6 on the side opposite to the element formation surface, and the conductive pattern 2 is formed.
It is provided at the location corresponding to 2.

【００４２】駆動用集積回路６の側壁に設ける導電性パ
ターン２２と駆動用集積回路６の裏面に設ける裏面パタ
ーン２０と側壁に設ける導電性パターン２２は、有機金
属ガスを利用しレーザー光線を駆動用集積回路７に照射
して裏面パターン２０と導電性パターン２２に相当する
部分に金属膜を直接描画をおこない、導電性パターン２
２と裏面パターン２０を形成する。The conductive pattern 22 provided on the side wall of the driving integrated circuit 6, the back surface pattern 20 provided on the back surface of the driving integrated circuit 6 and the conductive pattern 22 provided on the side wall of the driving integrated circuit 6 use a metal organic gas to drive and integrate a laser beam. By irradiating the circuit 7, a metal film is directly drawn on a portion corresponding to the back surface pattern 20 and the conductive pattern 22, and the conductive pattern 2 is formed.
2 and the back surface pattern 20 are formed.

【００４３】あるいはこの裏面パターン２０と導電性パ
ターン２２は、導電性インクで構成してもよい。このと
きはインクジェットプリンタを利用して形成する。導電
性インクは有機溶媒と粒径が１μｍの金属ボールとで構
成し、インクジェットプリンタを用いて駆動用集積回路
６の裏面に印刷し、その後温度１００℃から１５０℃の
熱処理を行い、裏面パターン２０と導電性パターン２２
とする。Alternatively, the back surface pattern 20 and the conductive pattern 22 may be made of conductive ink. At this time, it is formed using an inkjet printer. The conductive ink is composed of an organic solvent and a metal ball having a particle size of 1 μm, is printed on the back surface of the driving integrated circuit 6 by using an inkjet printer, and is then heat-treated at a temperature of 100 ° C. to 150 ° C. to form a back surface pattern 20. And conductive pattern 22
And

【００４４】外部回路用接続用パターン電極１２は、Ｃ
ＯＧ実装構造の突起電極７と導電性接着剤８の接続強度
を保つための硬化性樹脂９の側壁部２１と駆動用集積回
路６の側壁部１９を介して駆動用集積回路６の裏面に設
ける裏面パターン２０に接続する。駆動用集積回路６の
側壁は導電性パターン２２の断線を防止するため、斜面
状の側壁部１９とする。The external circuit connection pattern electrode 12 is C
It is provided on the back surface of the driving integrated circuit 6 via the side wall portion 21 of the curable resin 9 and the side wall portion 19 of the driving integrated circuit 6 for maintaining the connection strength between the protruding electrode 7 of the OG mounting structure and the conductive adhesive 8. Connect to the back surface pattern 20. The side wall of the driving integrated circuit 6 has a sloped side wall portion 19 in order to prevent disconnection of the conductive pattern 22.

【００４５】さらに、裏面パターン２０上に熱硬化性異
方性導電フィルム（ＡＣＦ）１６を設けフレキシブルプ
リント基板（ＦＰＣ）１５と接続を行う。熱硬化性異方
性導電フィルム１６は、熱硬化性樹脂１７中にプラスチ
ックボールに金（Ａｕ）をメッキした導電粒１８を混入
したものである。Further, a thermosetting anisotropic conductive film (ACF) 16 is provided on the back surface pattern 20 to be connected to the flexible printed board (FPC) 15. The thermosetting anisotropic conductive film 16 is a thermosetting resin 17 into which conductive particles 18 obtained by plating a plastic ball with gold (Au) are mixed.

【００４６】したがって、駆動用集積回路６と外部回路
との接続は、駆動用集積回路６上の突起電極７と、導電
性接着剤８と、外部回路接続用パターン電極１２と、駆
動用集積回路６の側壁に設ける導電性パターン２２と、
駆動用集積回路６の裏面に設ける裏面パターン２０と、
熱硬化性異方性導電フィルム１６とを介してフレキシブ
ルプリント基板１５に接続する。Therefore, the driving integrated circuit 6 and the external circuit are connected to each other by the protruding electrodes 7 on the driving integrated circuit 6, the conductive adhesive 8, the external circuit connecting pattern electrodes 12, and the driving integrated circuit. A conductive pattern 22 provided on the side wall of 6;
A back surface pattern 20 provided on the back surface of the driving integrated circuit 6,
It is connected to the flexible printed board 15 via the thermosetting anisotropic conductive film 16.

【００４７】さらに駆動用集積回路６とフレキシブルプ
リント基板１５との機械的接続を行うための接着樹脂２
３を、その間に設ける。Further, an adhesive resin 2 for mechanically connecting the driving integrated circuit 6 and the flexible printed board 15 to each other.
3 is provided between them.

【００４８】以上の説明から明らかなように、駆動用集
積回路６と外部回路との接続を駆動用集積回路６の裏面
パターン２０を利用することにより、パネル接続用パタ
ーン電極３と第１の基板１の端面部との距離である外部
回路接続長さＷ２を小さくすることができる。As is clear from the above description, by utilizing the back surface pattern 20 of the driving integrated circuit 6 for connecting the driving integrated circuit 6 and the external circuit, the panel connection pattern electrode 3 and the first substrate are connected. The external circuit connection length W2, which is the distance from the end face portion 1, can be reduced.

【００４９】そのため、液晶表示装置の周辺に設けるフ
レキシブルプリント基板１５の実装面積を小さくでき
る。さらに、外部回路用接続用パターン電極１２の長さ
を短くすることができるため、外部回路との接続抵抗値
を小さくできる。Therefore, the mounting area of the flexible printed board 15 provided around the liquid crystal display device can be reduced. Furthermore, since the length of the external circuit connection pattern electrode 12 can be shortened, the connection resistance value with the external circuit can be reduced.

【００５０】つぎに本発明の第２の実施例における液晶
表示パネルの駆動用集積回路の実装構造の構成を図面に
基づいて説明する。図３は、本発明の第２の実施例にお
ける液晶表示パネルの駆動用集積回路の実装構造を示す
平面図であり、図４は図３のＢ−Ｂ線における断面を示
す断面図である。以下、図３と図４を用いて本発明の第
２の実施例を説明する。Next, the structure of the mounting structure of the driving integrated circuit of the liquid crystal display panel in the second embodiment of the present invention will be described with reference to the drawings. 3 is a plan view showing a mounting structure of a driving integrated circuit of a liquid crystal display panel according to a second embodiment of the present invention, and FIG. 4 is a sectional view showing a section taken along line BB in FIG. The second embodiment of the present invention will be described below with reference to FIGS. 3 and 4.

【００５１】本発明の第２の実施例は、パネル接続用パ
ターン電極３を導電性配線２６にて駆動用集積回路６の
突起電極７にへ接続し、さらに駆動用集積回路６の突起
電極７とフレキシブルプリント基板１５の銅薄膜からな
る金属箔１４の接続も同様に導電性配線２７にておこな
う。In the second embodiment of the present invention, the panel connection pattern electrode 3 is connected to the protruding electrode 7 of the driving integrated circuit 6 by the conductive wiring 26, and the protruding electrode 7 of the driving integrated circuit 6 is further connected. The conductive wiring 27 is also used to connect the metal foil 14 made of the copper thin film of the flexible printed circuit board 15.

【００５２】さらに液晶表示パネルを構成する第１の基
板１には、パターン電極４と、このパターン電極４に接
続するパネル接続用パターン電極３とを有する。さら
に、第１の基板１に対向する第２の基板２には、パター
ン電極４に対向するように画素パターン５を設ける。Further, the first substrate 1 constituting the liquid crystal display panel has a pattern electrode 4 and a panel connection pattern electrode 3 connected to the pattern electrode 4. Furthermore, the pixel pattern 5 is provided on the second substrate 2 facing the first substrate 1 so as to face the pattern electrode 4.

【００５３】パターン電極４と画素パターン５とは液晶
層１１を介して対向し、第１の基板１と第２の基板２
は、スペーサー（図示せず）とシール剤１０にて一定の
間隙を保っている。また、第１の基板１と第２の基板２
間に液晶層１１を封入する。The pattern electrode 4 and the pixel pattern 5 face each other with the liquid crystal layer 11 in between, and the first substrate 1 and the second substrate 2
Maintain a constant gap with a spacer (not shown) and the sealant 10. In addition, the first substrate 1 and the second substrate 2
The liquid crystal layer 11 is enclosed between them.

【００５４】この第１の基板１上に設けるパネル接続用
パターン電極３と、駆動用集積回路６に設ける突起電極
７とを導電性配線２６を用いて接続するいわゆるチップ
・オン・ガラス（ＣＯＧ）実装構造とする。また、駆動
用集積回路６上に設ける突起電極７は駆動用集積回路６
の回路素子形成面に設けてある。さらに、駆動用集積回
路６と第１の基板１との間には、熱硬化性樹脂９を有
し、この熱硬化性樹脂９により機械的接続が行われる。A so-called chip-on-glass (COG) for connecting the pattern electrode 3 for panel connection provided on the first substrate 1 and the protruding electrode 7 provided on the driving integrated circuit 6 by using the conductive wiring 26. It has a mounting structure. Further, the protruding electrode 7 provided on the driving integrated circuit 6 is the driving integrated circuit 6
Is provided on the circuit element formation surface of. Further, a thermosetting resin 9 is provided between the driving integrated circuit 6 and the first substrate 1, and the thermosetting resin 9 is used for mechanical connection.

【００５５】さらにまた、第１の基板１上には第１の実
施例と異なり外部回路接続用パターン電極を設けてはい
ない。また、駆動用集積回路６の突起電極７とフレキシ
ブルプリント基板１５の銅薄膜からなる金属箔１４の間
には、導電性配線２７を設ける。さらに、駆動用集積回
路６とフレキシブルプリント基板１５の機械的接続をお
こなうため、接着樹脂２３が設ける。Furthermore, unlike the first embodiment, no pattern electrode for external circuit connection is provided on the first substrate 1. Further, a conductive wiring 27 is provided between the protruding electrode 7 of the driving integrated circuit 6 and the metal foil 14 made of the copper thin film of the flexible printed board 15. Further, an adhesive resin 23 is provided to mechanically connect the driving integrated circuit 6 and the flexible printed board 15.

【００５６】フレキシブルプリント基板１５は、ポリイ
ミド樹脂１３上に銅薄膜からなる金属箔１４を有し、さ
らに、導線性配線２７との接続領域以外には、銅薄膜か
らなる金属箔１４を覆うポリイミド樹脂２５を有する。
銅薄膜からなる金属箔１４を両側からポリイミド樹脂１
３とポリイミド樹脂２５により覆うことにより水分から
の銅薄膜からなる金属箔１４の腐食や、あるいは傷から
フレキシブルプリント基板１５を保護することができ
る。The flexible printed circuit board 15 has a metal foil 14 made of a copper thin film on the polyimide resin 13, and a polyimide resin covering the metal foil 14 made of the copper thin film except for the connection region with the conductive wiring 27. 25.
From both sides of the metal foil 14 made of a copper thin film, polyimide resin 1
3 and the polyimide resin 25 can protect the flexible printed circuit board 15 from corrosion or damage to the metal foil 14 made of a copper thin film from moisture.

【００５７】さらに、パネル接続用パターン電極３と駆
動用集積回路６の突起電極７と接続する導電性配線２６
と、フレキシブルプリント基板１５の銅薄膜からなる金
属箔１４と駆動用集積回路６上の突起電極７とを接続す
る導電性配線２７とを保護する保護用接着樹脂２８を、
駆動用集積回路６と導電性配線２６と導電性配線２７と
フレキシブルプリント基板１５との周囲領域に設ける。Further, the conductive wiring 26 for connecting the panel connection pattern electrode 3 and the projecting electrode 7 of the driving integrated circuit 6
And a protective adhesive resin 28 that protects the conductive foil 27 that connects the metal foil 14 made of the copper thin film of the flexible printed circuit board 15 and the protruding electrode 7 on the driving integrated circuit 6,
It is provided in the peripheral area of the driving integrated circuit 6, the conductive wiring 26, the conductive wiring 27, and the flexible printed board 15.

【００５８】以上の説明から明らかなように本発明の第
２の実施例では、駆動用集積回路６と外部回路との接続
を駆動用集積回路６の突起電極７とフレキシブルプリン
ト基板１５の銅薄膜からなる金属箔１４とを導電性配線
２７により接続し、さらにパネル接続用パターン電極３
と駆動用集積回路６の突起電極７とを導電性配線２６に
より接続する。As is apparent from the above description, in the second embodiment of the present invention, the connection between the driving integrated circuit 6 and the external circuit is made by connecting the protruding electrode 7 of the driving integrated circuit 6 and the copper thin film of the flexible printed circuit board 15. The metal foil 14 made of a conductive material is connected to the metal foil 14 by the conductive wiring 27.
And the protruding electrode 7 of the driving integrated circuit 6 are connected by the conductive wiring 26.

【００５９】このことにより、導電性配線２６と導電性
配線２７とを同時に設けることができ、さらにパネル接
続用パターン電極３と第１の基板１の端面部との距離で
ある外部回路接続長さＷ２を小さくすることができる。
そのため、液晶表示装置の周辺に設けるフレキシブルプ
リント基板１５の実装面積を小さくできる。As a result, the conductive wiring 26 and the conductive wiring 27 can be provided at the same time, and the external circuit connection length, which is the distance between the panel connection pattern electrode 3 and the end face of the first substrate 1, can be provided. W2 can be reduced.
Therefore, the mounting area of the flexible printed board 15 provided around the liquid crystal display device can be reduced.

【００６０】つぎに本発明の第３の実施例における液晶
表示パネルの駆動用集積回路の実装構造の構成を図面に
基づいて説明する。図５は、本発明の第３の実施例にお
ける液晶表示パネルの駆動用集積回路の実装構造を示す
平面図である。図６は、図５のＣ−Ｃ線における断面を
示す断面図である。以下、図５と図６とを交互に用いて
本発明の第３の実施例における液晶表示装置を説明す
る。Next, the structure of the mounting structure of the driving integrated circuit of the liquid crystal display panel in the third embodiment of the present invention will be described with reference to the drawings. FIG. 5 is a plan view showing a mounting structure of a driving integrated circuit of a liquid crystal display panel according to a third embodiment of the present invention. FIG. 6 is a cross-sectional view showing a cross section taken along the line CC of FIG. Hereinafter, the liquid crystal display device according to the third embodiment of the present invention will be described by alternately using FIG. 5 and FIG.

【００６１】本発明の第３の実施例では、パネル接続用
パターン電極３と駆動用集積回路６との接続と、外部回
路接続用パターン電極１２と駆動用集積回路６との接続
に導電粒３２と熱硬化性樹脂３１からなる異方性導電フ
ィルム（ＡＣＦ）３３を利用する。さらに、駆動用集積
回路６の側壁部３４を斜面状の形状にし、異方性導電フ
ィルム３３を側壁部３４に設け、駆動用集積回路６の裏
面パターン２０と接続を行う。In the third embodiment of the present invention, the conductive particles 32 are used for connecting the panel connecting pattern electrode 3 and the driving integrated circuit 6 and for connecting the external circuit connecting pattern electrode 12 and the driving integrated circuit 6. An anisotropic conductive film (ACF) 33 composed of a thermosetting resin 31 is used. Further, the side wall portion 34 of the driving integrated circuit 6 is formed into a slope shape, the anisotropic conductive film 33 is provided on the side wall portion 34, and the back surface pattern 20 of the driving integrated circuit 6 is connected.

【００６２】さらに、フレキシブルプリント基板１５
と、駆動用集積回路６の素子形成面と反対側の裏面パタ
ーン２０との接続は、熱硬化性異方性導電フィルム１６
を利用しておこなう。さらに外部回路接続用パターン電
極１２と突起電極７との接続に利用する異方性導電フィ
ルム３３と裏面パターン２０とフレキシブルプリント基
板１５との接続に使用する熱硬化性異方性導電フィルム
１６を接触させ電気的導通を取るものである。Further, the flexible printed board 15
And the back surface pattern 20 on the side opposite to the element formation surface of the driving integrated circuit 6 are connected by the thermosetting anisotropic conductive film 16
Using. Further, the anisotropic conductive film 33 used for connecting the external circuit connecting pattern electrode 12 and the protruding electrode 7 is contacted with the thermosetting anisotropic conductive film 16 used for connecting the back surface pattern 20 and the flexible printed board 15. The electrical continuity is obtained.

【００６３】液晶表示パネルを構成する第１の基板１に
は、パターン電極４と、このパターン電極４に接続する
パネル接続用パターン電極３とを有する。さらに、第１
の基板１に対向する第２の基板２には、パターン電極４
に対向して画素パターン５を設ける。The first substrate 1 constituting the liquid crystal display panel has a pattern electrode 4 and a panel connection pattern electrode 3 connected to the pattern electrode 4. Furthermore, the first
On the second substrate 2 facing the substrate 1 of the
Pixel pattern 5 is provided so as to face.

【００６４】パターン電極４と画素パターン５とは液晶
層１１を介して対向し、第１の基板１と第２の基板２
は、スペーサー（図示せず）とシール剤１０にて一定の
間隙を保っている。また、第１の基板１と第２の基板２
間には液晶層１１を封入する。The pattern electrode 4 and the pixel pattern 5 face each other with the liquid crystal layer 11 in between, and the first substrate 1 and the second substrate 2
Maintain a constant gap with a spacer (not shown) and the sealant 10. In addition, the first substrate 1 and the second substrate 2
A liquid crystal layer 11 is enclosed between them.

【００６５】第１の基板１上には、駆動用集積回路６に
設ける突起電極７に対応する位置に外部回路接続用パタ
ーン電極１２を設ける。この第１の基板１上に設ける外
部回路接続用パターン電極１２と、駆動用集積回路６に
設ける突起電極７とを光硬化性の異方性導電フイルム３
３を用いて接続する、いわゆるチップ・オン・ガラス
（ＣＯＧ）実装構造とする。An external circuit connecting pattern electrode 12 is provided on the first substrate 1 at a position corresponding to the protruding electrode 7 provided on the driving integrated circuit 6. An external circuit connection pattern electrode 12 provided on the first substrate 1 and a protruding electrode 7 provided on the driving integrated circuit 6 are provided as a photocurable anisotropic conductive film 3.
A so-called chip-on-glass (COG) mounting structure is used in which 3 is used for connection.

【００６６】この異方性導電フィルム３３は、光硬化性
の樹脂３１と金（Ａｕ）ボールからなる導電粒３２から
なる。また、駆動用集積回路６の側壁部３４は、異方性
導電フィルム３３の剥がれと段切れを防止するために斜
面部を設けている。この駆動用集積回路６の側壁部３４
にも異方性導電フィルム３３を有する。The anisotropic conductive film 33 comprises a photo-curable resin 31 and conductive particles 32 made of gold (Au) balls. In addition, the side wall portion 34 of the driving integrated circuit 6 is provided with a slope portion in order to prevent the anisotropic conductive film 33 from peeling off and breaking. The side wall portion 34 of the driving integrated circuit 6
Also has an anisotropic conductive film 33.

【００６７】さらに駆動用集積回路６上に設ける突起電
極７は、駆動用集積回路６の回路素子形成面側に設け、
接続を行う外部回路接続用パターン電極１２と駆動用集
積回路６の回路面が向かい合うように張り合わせてあ
る。このＣＯＧ実装を用いて電気的接続と機械的接続と
の接続を行う。Further, the protruding electrodes 7 provided on the driving integrated circuit 6 are provided on the circuit element forming surface side of the driving integrated circuit 6,
The external circuit connecting pattern electrode 12 for connection and the circuit surface of the driving integrated circuit 6 are laminated so as to face each other. This COG mounting is used to make electrical and mechanical connections.

【００６８】また、外部回路と接続する外部回路接続用
パターン電極１２は、駆動用集積回路６の側壁部からわ
ずかな距離Ｌ１張り出している。駆動用集積回路６の側
壁部３４には、前述のように異方性導電フィルム３３を
有する。また、駆動用集積回路６の裏面に裏面パターン
２０を設ける。Further, the external circuit connecting pattern electrode 12 connected to the external circuit projects slightly from the side wall of the driving integrated circuit 6 by a distance L1. The side wall portion 34 of the driving integrated circuit 6 has the anisotropic conductive film 33 as described above. Further, the back surface pattern 20 is provided on the back surface of the driving integrated circuit 6.

【００６９】回路用接続用パターン電極１２は、ＣＯＧ
実装構造の突起電極７と光硬化型の異方性導電フィルム
３３により接続する。さらに駆動用集積回路６の側壁部
３４の異方性導電フィルム３３を介して駆動用集積回路
６の裏面パターン２０に接続する。さらに、駆動用集積
回路６の側壁部３４の第異方性導電フィルム３３は、直
接、駆動用集積回路６の裏面に設ける熱硬化性異方性導
電フィルム１６に接続する。The circuit connecting pattern electrode 12 is made of COG.
The bump electrodes 7 of the mounting structure are connected by a photo-curing anisotropic conductive film 33. Further, it is connected to the back surface pattern 20 of the driving integrated circuit 6 through the anisotropic conductive film 33 on the side wall portion 34 of the driving integrated circuit 6. Further, the anisotropic conductive film 33 on the side wall portion 34 of the driving integrated circuit 6 is directly connected to the thermosetting anisotropic conductive film 16 provided on the back surface of the driving integrated circuit 6.

【００７０】さらに、裏面パターン２０上に熱硬化性異
方性導電フィルム１６を設けフレキシブルプリント基板
１５と接続を行う。熱硬化性異方性導電フィルム１６
は、熱硬化性樹脂１７中にプラスチックボールに金（Ａ
ｕ）をメッキした導電粒１８を混入したものである。Further, a thermosetting anisotropic conductive film 16 is provided on the back surface pattern 20 to connect to the flexible printed board 15. Thermosetting anisotropic conductive film 16
Is a thermosetting resin 17 with gold (A
u) is mixed with conductive particles 18 plated.

【００７１】したがって、駆動用集積回路６と外部回路
の接続は、駆動用集積回路６の突起電極と７、異方性導
電フィルム３３と、外部回路接続用パターン電極１２
と、駆動用集積回路６の側壁に設ける異方性導電フィル
ム３３と、駆動用集積回路６の裏面に設ける裏面パター
ン２０と、熱硬化性異方性導電フィルム１６とを介し、
フレキシブルプリント基板１５に接続する。Therefore, the connection between the driving integrated circuit 6 and the external circuit is made by connecting the protruding electrodes and 7 of the driving integrated circuit 6, the anisotropic conductive film 33, and the external circuit connecting pattern electrode 12
Via the anisotropic conductive film 33 provided on the side wall of the driving integrated circuit 6, the back surface pattern 20 provided on the back surface of the driving integrated circuit 6, and the thermosetting anisotropic conductive film 16.
It is connected to the flexible printed board 15.

【００７２】以上の説明から明らかなように本発明の第
３の実施例では、駆動用集積回路６と外部回路との接続
を駆動用集積回路６の裏面パターン２０を利用する。こ
のことによりパネル接続用パターン電極３と第１の基板
１の端面部との距離である外部回路接続長さＷ２を小さ
くすることができる。As is clear from the above description, in the third embodiment of the present invention, the back surface pattern 20 of the driving integrated circuit 6 is used for the connection between the driving integrated circuit 6 and the external circuit. As a result, the external circuit connection length W2, which is the distance between the panel connection pattern electrode 3 and the end surface portion of the first substrate 1, can be reduced.

【００７３】そのため、液晶表示装置の周辺に設けるフ
レキシブルプリント基板１５の実装面積を小さくでき
る。さらに、外部回路用接続用パターン電極１２を長さ
を短くできるため、外部回路との接続抵抗値を小さくで
きる。Therefore, the mounting area of the flexible printed board 15 provided around the liquid crystal display device can be reduced. Furthermore, since the length of the external circuit connection pattern electrode 12 can be shortened, the connection resistance value with the external circuit can be reduced.

【００７４】この本発明の第３の実施例の構成を利用す
ることにより、駆動用集積回路６の側壁部３４に導電性
パターンを設けることなく、異方性導電フィルム３３を
設けて、フレキシブルプリント基板１５の銅薄膜からな
る金属箔１４に接続することができる。By utilizing the configuration of the third embodiment of the present invention, the anisotropic conductive film 33 is provided without providing the conductive pattern on the side wall portion 34 of the driving integrated circuit 6, and the flexible printing is performed. It can be connected to the metal foil 14 made of the copper thin film of the substrate 15.

【００７５】さらに本発明の第３の実施例においては、
駆動用集積回路６の裏面に裏面パターン２０を設けてい
るが、裏面パターン２０を設けないで、外部回路接続用
パターン電極１２とフレキシブルプリント基板１５の金
属箔１４とを熱硬化性異方性導電フィルム１６で接続す
る構成でも、以上説明した本発明の効果は得られる。Furthermore, in the third embodiment of the present invention,
Although the back surface pattern 20 is provided on the back surface of the driving integrated circuit 6, the pattern electrode 12 for external circuit connection and the metal foil 14 of the flexible printed circuit board 15 are not provided with the back surface pattern 20, and the thermosetting anisotropic conductive material is used. Even with the structure in which the film 16 is used for connection, the effects of the present invention described above can be obtained.

【００７６】つぎに本発明の第４の実施例における液晶
表示パネルの駆動用集積回路の実装構造の構成を図面に
基づいて説明する。図７は、本発明の第４の実施例にお
ける液晶表示パネルの駆動用集積回路の実装構造を示す
平面図である。図８は、図７のＤ−Ｄ線における断面を
示す断面図である。以下、図７と図８とを交互に用いて
本発明の第４の実施例における液晶表示装置を説明す
る。Next, the structure of the mounting structure of the driving integrated circuit of the liquid crystal display panel according to the fourth embodiment of the present invention will be described with reference to the drawings. FIG. 7 is a plan view showing a mounting structure of a driving integrated circuit of a liquid crystal display panel according to a fourth embodiment of the present invention. FIG. 8 is a cross-sectional view showing a cross section taken along line DD of FIG. Hereinafter, the liquid crystal display device according to the fourth embodiment of the present invention will be described by alternately using FIG. 7 and FIG.

【００７７】液晶表示パネルを構成する第１の基板１に
は、パターン電極４と、このパターン電極４に接続する
パネル接続用パターン電極３とを有する。さらに、第１
の基板１に対向する第２の基板２には、パターン電極４
に対向して画素パターン５を設ける。The first substrate 1 constituting the liquid crystal display panel has a pattern electrode 4 and a panel connection pattern electrode 3 connected to the pattern electrode 4. Furthermore, the first
On the second substrate 2 facing the substrate 1 of the
Pixel pattern 5 is provided so as to face.

【００７８】パターン電極４と画素パターン５とは液晶
層１１を介して対向し、第１の基板１と第２の基板２
は、スペーサー（図示せず）とシール剤１０にて一定の
間隙を保っている。また、第１の基板１と第２の基板２
間には液晶層１１を封入する。The pattern electrode 4 and the pixel pattern 5 face each other with the liquid crystal layer 11 in between, and the first substrate 1 and the second substrate 2
Maintain a constant gap with a spacer (not shown) and the sealant 10. In addition, the first substrate 1 and the second substrate 2
A liquid crystal layer 11 is enclosed between them.

【００７９】第１の基板１には、駆動用集積回路６に設
ける突起電極７に対応する外部回路接続用パターン電極
１２を設ける。この第１の基板１上に設ける外部回路接
続用パターン電極１２と、駆動用集積回路６に設ける突
起電極７とは、光硬化型あるいは熱硬化型の異方性導電
フイルム３３を用いて接続する、いわゆるチップ・オン
・ガラス（ＣＯＧ）実装構造とする。A pattern electrode 12 for external circuit connection corresponding to the protruding electrode 7 provided on the driving integrated circuit 6 is provided on the first substrate 1. The external circuit connection pattern electrode 12 provided on the first substrate 1 and the projecting electrode 7 provided on the driving integrated circuit 6 are connected using a photo-curing or thermosetting anisotropic conductive film 33. , A so-called chip-on-glass (COG) mounting structure.

【００８０】この異方性導電フィルム３３は、光硬化性
あるいは熱硬化性の樹脂３１と金ボールからなる導電粒
３２とからなる。また、駆動用集積回路６の側壁部３４
は、異方性導電フィルム３３の剥離と段切れを防止する
ために斜面形状としている。この駆動用集積回路６の側
壁部３４にも異方性導電フィルム３３を有する。The anisotropic conductive film 33 comprises a photo-curable or thermo-curable resin 31 and conductive particles 32 made of gold balls. In addition, the side wall portion 34 of the driving integrated circuit 6
Has an inclined surface shape to prevent the anisotropic conductive film 33 from peeling and breaking. The side wall portion 34 of the driving integrated circuit 6 also has the anisotropic conductive film 33.

【００８１】また、駆動用集積回路６上に設ける突起電
極７は駆動用集積回路６の回路素子形成面側に設けてあ
り、接続を行う外部回路接続用パターン電極１２と駆動
用集積回路６の回路素子形成面が向かい合うように張り
合わせてある。このＣＯＧ実装を用いて電気的接続と機
械的接続との接続を行う。Further, the protruding electrode 7 provided on the driving integrated circuit 6 is provided on the circuit element forming surface side of the driving integrated circuit 6, and the external circuit connecting pattern electrode 12 for connection and the driving integrated circuit 6 are connected. The circuit element forming surfaces are laminated so as to face each other. This COG mounting is used to make electrical and mechanical connections.

【００８２】また、外部回路と接続する外部回路接続用
パターン電極１２は駆動用集積回路６の側壁部からわず
か距離Ｌ１張り出している。Further, the external circuit connection pattern electrode 12 connected to the external circuit projects slightly from the side wall portion of the driving integrated circuit 6 by a distance L1.

【００８３】さらに、パネル接続用パターン電極３と駆
動用集積回路６との接続と、外部回路接続用パターン電
極１２と駆動用集積回路６との接続に導電粒３２と光硬
化性あるいは熱硬化性の樹脂３１とからなる異方性導電
フィルム３３を利用する。さらに駆動用集積回路６の側
壁部３４を斜面形状にし、異方性導電フィルム３３を側
壁部３４に設けている。Furthermore, the conductive particles 32 and the photo-curing or thermosetting are used for the connection between the panel connection pattern electrode 3 and the driving integrated circuit 6 and the connection between the external circuit connection pattern electrode 12 and the driving integrated circuit 6. An anisotropic conductive film 33 composed of the resin 31 is used. Further, the side wall portion 34 of the driving integrated circuit 6 is formed into a slope shape, and the anisotropic conductive film 33 is provided on the side wall portion 34.

【００８４】さらに異方性導電フィルム３３は、駆動用
集積回路６の側壁部３４を覆い駆動用集積回路６の裏面
まで延びている。また、駆動用集積回路６とフレキシブ
ルプリント基板１５との機械的接続と、駆動用集積回路
６の側壁部３４に設ける異方性導電フィルム３３との接
続は、熱硬化性異方性導電フィルム１６を利用して行
う。Further, the anisotropic conductive film 33 covers the side wall portion 34 of the driving integrated circuit 6 and extends to the back surface of the driving integrated circuit 6. Further, the mechanical connection between the driving integrated circuit 6 and the flexible printed board 15 and the connection between the anisotropic conductive film 33 provided on the side wall portion 34 of the driving integrated circuit 6 are performed by the thermosetting anisotropic conductive film 16. Using.

【００８５】熱硬化性異方性導電フィルム１６によりフ
レキシブルプリント基板１５の接続を行う。熱硬化性異
方性導電フィルム１６は、熱硬化性樹脂１７中にプラス
チックボールに金（Ａｕ）をメッキした導電粒１８を混
入したものである。The flexible printed board 15 is connected by the thermosetting anisotropic conductive film 16. The thermosetting anisotropic conductive film 16 is a thermosetting resin 17 into which conductive particles 18 obtained by plating a plastic ball with gold (Au) are mixed.

【００８６】さらに、駆動用集積回路６の側壁部３４に
設ける異方性導電フィルム３３の外側領域には、保護用
台座４１を設ける。さらに、保護用台座４１と異方性導
電フィルム３３の接触する面には導電性パターン４２を
有する。導電性パターン４２は、一方は外部回路接続用
パターン電極１２と接続し、他方は熱硬化性異方性導電
フィルム１６と接続点４３により接続している。Further, a protection pedestal 41 is provided in the outer region of the anisotropic conductive film 33 provided on the side wall portion 34 of the driving integrated circuit 6. Further, a conductive pattern 42 is provided on the contact surface between the protective pedestal 41 and the anisotropic conductive film 33. One of the conductive patterns 42 is connected to the external circuit connecting pattern electrode 12, and the other is connected to the thermosetting anisotropic conductive film 16 by a connection point 43.

【００８７】保護用台座４１は、第１の基板１の側壁を
覆い、補強用接着剤４８にて固定している。さらにフレ
キシブルプリント基板１５と保護用台座４１との間にも
補強用接着剤４４を設ける。The protection pedestal 41 covers the side wall of the first substrate 1 and is fixed with a reinforcing adhesive 48. Further, a reinforcing adhesive 44 is also provided between the flexible printed board 15 and the protection pedestal 41.

【００８８】さらに第１の基板１上には、駆動用集積回
路６と第１の基板１との実装作業時の位置合わせを行う
ための回路用位置合わせマーク４５を有する。さらにま
た、フレキシブルプリント基板１５と第１の基板１との
位置合わせを行うための位置合わせマークとして、第１
の基板１上にフレキシブルプリント基板用位置合わせマ
ーク４６を設け、フレキシブルプリント基板１５上に基
板用位置合わせマーク４７を有する。Further, on the first substrate 1, there is provided a circuit alignment mark 45 for aligning the drive integrated circuit 6 and the first substrate 1 during the mounting work. Furthermore, as the alignment mark for aligning the flexible printed board 15 and the first board 1, the first
The flexible printed circuit board alignment mark 46 is provided on the substrate 1 and the flexible printed circuit board alignment mark 47 is provided on the flexible printed circuit board 15.

【００８９】回路用位置合わせマーク４５とフレキシブ
ルプリント基板用位置合わせマーク４６は第１の基板１
上に設ける電極材料を利用する。たとえば、パターン電
極４材料を利用し、平面形状がＬ字状の回路用位置合わ
せマーク４５とフレキシブルプリント基板用位置合わせ
マーク４６を形成する。The circuit alignment mark 45 and the flexible printed board alignment mark 46 are formed on the first substrate 1.
The electrode material provided above is used. For example, the pattern electrode 4 material is used to form the circuit alignment mark 45 and the flexible printed circuit board alignment mark 46 having an L-shaped planar shape.

【００９０】また、基板用位置合わせマーク４７は、フ
レキシブルプリント基板１５の銅薄膜からなる金属箔１
４の一部を利用し、平面形状が＋字状の基板用位置合わ
せマーク４７を形成する。Further, the board alignment mark 47 is formed by the metal foil 1 made of the copper thin film of the flexible printed board 15.
A part of 4 is used to form a substrate alignment mark 47 having a + shape in plan view.

【００９１】この回路用位置合わせマーク４５とフレキ
シブルプリント基板用位置合わせマーク４６と基板用位
置合わせマーク４７とを設けることにより、位置合わせ
精度が向上し、実装歩留まりと実装面積の低減が可能と
なる。By providing the circuit alignment mark 45, the flexible printed board alignment mark 46, and the board alignment mark 47, the alignment accuracy is improved, and the mounting yield and the mounting area can be reduced. .

【００９２】したがって駆動用集積回路６と外部回路と
の接続は、駆動用集積回路６上の突起電極７と、異方性
導電フィルム３３と、外部回路接続用パターン電極１２
と、駆動用集積回路６の側壁に設ける異方性導電フィル
ム３３と、駆動用集積回路６の側壁部３４に設ける保護
用台座４１の導電性パターン４２と、熱硬化性異方性導
電フィルム１６を介して、フレキシブルプリント基板１
５の銅薄膜からなる金属箔１４に接続する。Therefore, the driving integrated circuit 6 and the external circuit are connected to each other by the protruding electrode 7 on the driving integrated circuit 6, the anisotropic conductive film 33, and the external circuit connecting pattern electrode 12.
An anisotropic conductive film 33 provided on the side wall of the driving integrated circuit 6, a conductive pattern 42 of a protection pedestal 41 provided on the side wall portion 34 of the driving integrated circuit 6, and a thermosetting anisotropic conductive film 16 Through flexible printed circuit board 1
5 is connected to the metal foil 14 made of a copper thin film.

【００９３】このように本発明の第４の実施例では、駆
動用集積回路６と外部回路との接続を駆動用集積回路６
の側壁と裏面を利用することにより、パネル接続用パタ
ーン電極３と第１の基板１の端面部との距離である外部
回路接続長さＷ２を小さくすることができる。As described above, in the fourth embodiment of the present invention, the drive integrated circuit 6 is connected to the external circuit.
By utilizing the side wall and the back surface of the external connection circuit, it is possible to reduce the external circuit connection length W2, which is the distance between the panel connection pattern electrode 3 and the end surface portion of the first substrate 1.

【００９４】そのため、液晶表示装置の周辺に設けるフ
レキシブルプリント基板１５実装面積を小さくできる。
さらに、外部回路用接続用パターン電極１２の長さを短
くできるため、外部回路との接続抵抗値を小さくでき
る。この本発明の第４の実施例の構造を利用することに
より、駆動用集積回路６の側壁部３４に導電性パターン
を設けることなく、異方性導電フィルム３３と保護用台
座４１を設け、フレキシブルプリント基板１５の銅薄膜
からなる金属箔１４との接続ができる。Therefore, the mounting area of the flexible printed board 15 provided around the liquid crystal display device can be reduced.
Furthermore, since the length of the external circuit connection pattern electrode 12 can be shortened, the connection resistance value with the external circuit can be reduced. By using the structure of the fourth embodiment of the present invention, the anisotropic conductive film 33 and the protection pedestal 41 are provided without providing a conductive pattern on the side wall portion 34 of the driving integrated circuit 6, and the flexible structure is provided. The printed circuit board 15 can be connected to the metal foil 14 made of a copper thin film.

【００９５】さらに、本発明の第４の実施例において
は、第１の基板１上に駆動用集積回路６と第１の基板１
との回路用位置合わせマーク４５と、フレキシブルプリ
ント基板１５と第１の基板１との位置合わせマークとし
てフレキシブルプリント基板用位置合わせマーク４６と
基板用位置合わせマーク４７とを設ける。このことによ
り、精度よく第１の基板１とフレキシブルプリント基板
１５との相互の位置合わせを行うことができる。Further, in the fourth embodiment of the present invention, the driving integrated circuit 6 and the first substrate 1 are provided on the first substrate 1.
And a circuit alignment mark 45, a flexible print substrate alignment mark 46 and a substrate alignment mark 47 are provided as alignment marks between the flexible printed circuit board 15 and the first substrate 1. This allows the first substrate 1 and the flexible printed circuit board 15 to be accurately aligned with each other.

【００９６】なお、以上図１から図８を用いて説明した
実施例において、第１の基板１に駆動用集積回路６とフ
レキシブルプリント基板１５とを実装する例を示した
が、第２の基板へ本発明の構造を適用して駆動用集積回
路とフレキシブルプリント基板とを実装するができ、さ
らに第１の基板と第２の基板との双方に本発明の構造を
適用して駆動用集積回路とフレキシブルプリント基板と
を実装するができる。In the embodiment described above with reference to FIGS. 1 to 8, an example in which the driving integrated circuit 6 and the flexible printed circuit board 15 are mounted on the first board 1 is shown, but the second board is used. The drive integrated circuit and the flexible printed circuit board can be mounted by applying the structure of the present invention to the drive integrated circuit by applying the structure of the present invention to both the first substrate and the second substrate. And a flexible printed circuit board can be mounted.

【００９７】図７と図８とを用いて説明した実施例で
は、位置合わせマークとして第１の基板とフレキシブル
プリント基板に設ける例で説明したが、駆動用集積回路
に駆動用集積回路の構成材料、たとえばアルミニウム配
線あるいは金属シリサイド配線を用いて位置合わせマー
クを設けてもよい。In the embodiment described with reference to FIGS. 7 and 8, the example in which the alignment mark is provided on the first substrate and the flexible printed circuit board has been described. The alignment mark may be provided by using, for example, aluminum wiring or metal silicide wiring.

【００９８】[0098]

【発明の効果】以上の説明から明らかなように、本発明
の液晶表示パネルの駆動用集積回路の実装構造を用いる
ことにより、フレキシブルプリント基板を設ける外部回
路接続長さを小さくし、外部回路接続用パターン電極長
さを短くするすることが可能となる。このことにより、
液晶表示パネルの表示領域以外の部分を小さくできる。As is apparent from the above description, by using the mounting structure of the driving integrated circuit for the liquid crystal display panel of the present invention, the external circuit connection length for providing the flexible printed circuit board can be reduced and the external circuit connection can be made. The pattern electrode length can be shortened. This allows
The area other than the display area of the liquid crystal display panel can be made small.

【００９９】さらに、外部回路接続用パターン電極の長
さを短くできるため、接続部における接続抵抗値の増加
を抑えることができ、表示品質が向上する。さらに、第
１の基板とフレキシブルプリント基板に合わせマークを
設けることにより合わせ精度が向上し実装面積の低減と
安定化とを達成できる。Furthermore, since the length of the external circuit connecting pattern electrode can be shortened, an increase in the connection resistance value at the connecting portion can be suppressed, and the display quality is improved. Further, by providing the alignment mark on the first substrate and the flexible printed circuit board, the alignment accuracy is improved and the mounting area can be reduced and stabilized.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の第１の実施例における液晶表示装置の
駆動用集積回路とフレキシブルプリント基板の実装構成
を示す平面図である。FIG. 1 is a plan view showing a mounting configuration of a driving integrated circuit and a flexible printed circuit board of a liquid crystal display device according to a first embodiment of the present invention.

【図２】本発明の第１の実施例における液晶表示装置の
駆動用集積回路とフレキシブルプリント基板の実装構成
を示す断面図である。FIG. 2 is a cross-sectional view showing a mounting configuration of a driving integrated circuit and a flexible printed circuit board of the liquid crystal display device according to the first embodiment of the present invention.

【図３】本発明の第２の実施例における液晶表示装置の
駆動用集積回路とフレキシブルプリント基板の実装構成
を示す平面図である。FIG. 3 is a plan view showing a mounting configuration of a driving integrated circuit and a flexible printed circuit board of a liquid crystal display device according to a second embodiment of the present invention.

【図４】本発明の第２の実施例における液晶表示装置の
駆動用集積回路とフレキシブルプリント基板の実装構成
を示す断面図である。FIG. 4 is a cross-sectional view showing a mounting structure of a driving integrated circuit and a flexible printed circuit board of a liquid crystal display device according to a second embodiment of the present invention.

【図５】本発明の第３の実施例における液晶表示装置の
駆動用集積回路とフレキシブルプリント基板の実装構成
を示す平面図である。FIG. 5 is a plan view showing a mounting configuration of a driving integrated circuit and a flexible printed circuit board of a liquid crystal display device according to a third embodiment of the present invention.

【図６】本発明の第３の実施例における液晶表示装置の
駆動用集積回路とフレキシブルプリント基板の実装構成
を示す断面図である。FIG. 6 is a cross-sectional view showing a mounting structure of a driving integrated circuit and a flexible printed circuit board of a liquid crystal display device according to a third embodiment of the present invention.

【図７】本発明の第４の実施例における液晶表示装置の
駆動用集積回路とフレキシブルプリント基板の実装構成
を示す平面図である。FIG. 7 is a plan view showing a mounting configuration of a driving integrated circuit and a flexible printed circuit board of a liquid crystal display device according to a fourth embodiment of the present invention.

【図８】本発明の第４の実施例における液晶表示装置の
駆動用集積回路とフレキシブルプリント基板の実装構成
を示す断面図である。FIG. 8 is a cross-sectional view showing a mounting structure of a driving integrated circuit and a flexible printed circuit board of a liquid crystal display device according to a fourth embodiment of the present invention.

【図９】従来技術における液晶表示装置の駆動用集積回
路とフレキシブルプリント基板の実装構成を示す平面図
である。FIG. 9 is a plan view showing a mounting configuration of a driving integrated circuit and a flexible printed circuit board of a liquid crystal display device in a conventional technique.

【図１０】従来技術における液晶表示装置の駆動用集積
回路とフレキシブルプリント基板の実装構成を示す断面
図である。FIG. 10 is a cross-sectional view showing a mounting structure of a driving integrated circuit and a flexible printed circuit board of a liquid crystal display device in a conventional technique.

【符号の説明】[Explanation of symbols]

１ 第１の基板 ３ パネル接続用パターン電極 ６ 駆動用集積回路 ７ 突起電極 １５ フレキシブルプリント基板（ＦＰＣ） １６ 熱硬化性異方性導電フィルム ３３ 異方性導電フィルム ４１ 保護用台座 DESCRIPTION OF SYMBOLS 1 1st board 3 Pattern electrode for panel connection 6 Integrated circuit for driving 7 Projection electrode 15 Flexible printed circuit board (FPC) 16 Thermosetting anisotropic conductive film 33 Anisotropic conductive film 41 Protection base

Claims (10)

【特許請求の範囲】[Claims] 【請求項１】 第１の基板と第２の基板を所定の距離を
設けて張り合わせるためのシール剤と、第１の基板と第
２の基板の重なり部に封入する液晶層と、第１の基板上
に設ける駆動用集積回路と接続するためのパネル接続用
パターン電極と外部回路接続用パターン電極と、パネル
接続用パターン電極と外部回路接続用パターン電極に駆
動用集積回路を接続するための導電性接着剤あるいは異
方性導電フィルムを有し、導電性接着剤あるいは異方性
導電フィルムによりパネル接続用パターン電極と外部回
路接続用パターン電極と駆動用集積回路との電気的接続
をおこない液晶層に所定の電圧を印加する液晶表示装置
であり、駆動用集積回路へ外部より電気信号を印加する
接続手段は、駆動用集積回路の裏面に設ける裏面パター
ンと第１の基板上の外部回路接続用パターン電極とを導
電性パターンにより接続して駆動用集積回路の裏面パタ
ーンより外部へ接続することを特徴とする液晶表示装
置。1. A sealant for adhering a first substrate and a second substrate at a predetermined distance, a liquid crystal layer sealed in an overlapping portion of the first substrate and the second substrate, and a first liquid crystal layer. For connecting the driving integrated circuit to the panel connecting pattern electrode and the external circuit connecting pattern electrode for connecting to the driving integrated circuit provided on the substrate of the panel connecting pattern electrode and the external circuit connecting pattern electrode Liquid crystal having a conductive adhesive or anisotropic conductive film, and electrically connecting the pattern electrode for panel connection, the pattern electrode for external circuit connection, and the driving integrated circuit by the conductive adhesive or anisotropic conductive film A liquid crystal display device for applying a predetermined voltage to a layer, and a connecting means for externally applying an electric signal to a driving integrated circuit includes a back surface pattern provided on the back surface of the driving integrated circuit and a first substrate. A liquid crystal display device characterized in that it is connected to an external circuit connecting pattern electrode by a conductive pattern and is connected to the outside from a back surface pattern of a driving integrated circuit. 【請求項２】 第１の基板と第２の基板を所定の距離を
設けて張り合わせるためのシール剤と、第１の基板と第
２の基板の重なり部に封入する液晶層と、第１の基板上
に設ける駆動用集積回路と接続するためのパネル接続用
パターン電極と外部回路接続用パターン電極と、パネル
接続用電極と外部回路接続用パターン電極に駆動用集積
回路を接続するための導電性接着剤あるいは異方性導電
フィルムを有し、導電性接着剤あるいは異方性導電フィ
ルムによりパネル接続用電極と外部回路接続用パターン
電極と駆動用集積回路との電気的接続をおこない液晶層
に所定の電圧を印加する液晶表示装置であり、駆動用集
積回路へ外部より電気信号を印加する接続手段は駆動用
集積回路の裏面にフレキシブルプリント基板を設け、フ
レキシブルプリント基板は第１の基板上の外部回路接続
用パターン電極と駆動用集積回路の側壁部の導電性パタ
ーンを介して接続して外部へ接続することを特徴とする
液晶表示装置。2. A sealant for adhering the first substrate and the second substrate at a predetermined distance, a liquid crystal layer sealed in an overlapping portion of the first substrate and the second substrate, and a first liquid crystal layer. Panel connection pattern electrodes and external circuit connection pattern electrodes for connecting to the driving integrated circuit provided on the substrate of, and conductivity for connecting the driving integrated circuit to the panel connection electrodes and external circuit connection pattern electrodes Conductive adhesive or anisotropic conductive film, and electrically connecting the panel connecting electrode, external circuit connecting pattern electrode, and driving integrated circuit with the conductive adhesive or anisotropic conductive film to form a liquid crystal layer. A liquid crystal display device for applying a predetermined voltage, and a connecting means for externally applying an electric signal to the driving integrated circuit is provided with a flexible printed board on the back surface of the driving integrated circuit, and a flexible printed circuit board is provided. The liquid crystal display device is characterized in that the substrate is connected to the external circuit connecting pattern electrode on the first substrate through the conductive pattern on the side wall of the driving integrated circuit to connect to the outside. 【請求項３】 第１の基板と第２の基板を所定の距離を
設けて張り合わせるためのシール剤と、第１の基板と第
２の基板の重なり部に封入する液晶層と、第１の基板上
に設ける駆動用集積回路と接続するためのパネル接続用
パターン電極と外部回路接続用パターン電極と、パネル
接続用電極と外部回路接続用パターン電極に駆動用集積
回路を接続するための導電性接着剤あるいは異方性導電
フィルムを有し、導電性接着剤あるいは異方性導電フィ
ルムによりパネル接続用電極と外部回路接続用パターン
電極と駆動用集積回路との電気的接続をおこない液晶層
に所定の電圧を印加する液晶表示装置であり、駆動用集
積回路へ外部より電気信号を印加する接続手段は駆動用
集積回路の裏面に熱硬化性異方性導電フィルムを介して
フレキシブルプリント基板を設け、フレキシブルプリン
ト基板は第１の基板上の外部回路接続用パターン電極と
駆動用集積回路の側壁部の導電性パターンを介して接続
して外部へ接続することを特徴とする液晶表示装置。3. A sealant for adhering the first substrate and the second substrate at a predetermined distance, and a liquid crystal layer sealed in an overlapping portion of the first substrate and the second substrate; Panel connection pattern electrodes and external circuit connection pattern electrodes for connecting to the driving integrated circuit provided on the substrate of, and conductivity for connecting the driving integrated circuit to the panel connection electrodes and external circuit connection pattern electrodes Conductive adhesive or anisotropic conductive film, and electrically connecting the panel connecting electrode, external circuit connecting pattern electrode, and driving integrated circuit with the conductive adhesive or anisotropic conductive film to form a liquid crystal layer. In the liquid crystal display device for applying a predetermined voltage, the connecting means for externally applying an electric signal to the driving integrated circuit is a flexible print on the back surface of the driving integrated circuit via a thermosetting anisotropic conductive film. A liquid crystal display, wherein a flexible printed circuit board is provided, and the flexible printed circuit board is connected to the external circuit connection pattern electrode on the first substrate through the conductive pattern on the side wall of the driving integrated circuit to connect to the outside. apparatus. 【請求項４】 第１の基板と第２の基板を所定の距離を
設けて張り合わせるためのシール剤と、第１の基板と第
２の基板の重なり部に封入する液晶層と、第１の基板上
に設ける駆動用集積回路と接続するためのパネル接続用
パターン電極と外部回路接続用パターン電極と、駆動用
集積回路の回路素子形成面側とパネル接続用パターン電
極と外部回路接続用パターン電極とを対向させ、駆動用
集積回路の突起電極とパネル接続用パターン電極と外部
回路接続用パターン電極とを接続する導電性接着剤ある
いは異方性導電フィルムを有し、導電性接着剤あるいは
異方性導電フィルムによりパネル接続用電極と外部回路
接続用パターン電極と駆動用集積回路上の突起電極を向
かい合わせに張り合わせて電気的接続をおこない液晶層
に所定の電圧を印加する液晶表示装置であり、駆動用集
積回路へ外部より電気信号を印加する接続手段は、駆動
用集積回路の裏面に設ける裏面パターンから斜面状の側
壁部を介して第１の基板上の外部回路接続用パターン電
極に導電性パターンにより接続して駆動用集積回路の裏
面パターンより外部へ接続することを特徴とする液晶表
示装置。4. A sealant for adhering the first substrate and the second substrate to each other with a predetermined distance provided therebetween, a liquid crystal layer sealed in an overlapping portion of the first substrate and the second substrate, and a first liquid crystal layer. Panel connection pattern electrode and external circuit connection pattern electrode for connecting to the drive integrated circuit provided on the substrate of, the circuit element formation surface side of the drive integrated circuit, the panel connection pattern electrode, and the external circuit connection pattern It has a conductive adhesive or an anisotropic conductive film that faces the electrodes and connects the protruding electrode of the driving integrated circuit, the pattern electrode for panel connection, and the pattern electrode for external circuit connection. A panel conductive electrode, a pattern electrode for external circuit connection, and a protruding electrode on the driving integrated circuit are laminated face to face with a conductive film to make electrical connection and a predetermined voltage is applied to the liquid crystal layer. The connecting means for applying an electric signal from the outside to the driving integrated circuit is an external circuit on the first substrate from the back surface pattern provided on the back surface of the driving integrated circuit through the inclined side wall portion. A liquid crystal display device, characterized in that it is connected to the connection pattern electrode by a conductive pattern and is connected to the outside from the back surface pattern of the driving integrated circuit. 【請求項５】 第１の基板と第２の基板を所定の距離を
設けて張り合わせるためのシール剤と、第１の基板と第
２の基板の重なり部に封入する液晶層と、第１の基板上
に設ける駆動用集積回路と接続するためのパネル接続用
パターン電極と外部回路接続用パターン電極と、パネル
接続用電極と外部回路接続用パターン電極と駆動用集積
回路の突起電極とを接続する導電性接着剤とを有し、駆
動用集積回路へ外部より電気信号を印加する接続手段
は、フレキシブルプリント基板と駆動用集積回路の裏面
に設ける裏面パターンと駆動用集積回路の側壁部に設け
る導電性インクからなる導電性パターンと導電性インク
からなる導電性パターンに接続する第１の基板上の外部
回路接続用パターン電極とを有することを特徴とする液
晶表示装置。5. A sealant for adhering the first substrate and the second substrate to each other with a predetermined distance provided therebetween, a liquid crystal layer sealed in an overlapping portion of the first substrate and the second substrate, and a first liquid crystal layer. The panel connection pattern electrode and the external circuit connection pattern electrode for connecting to the drive integrated circuit provided on the substrate are connected, and the panel connection electrode, the external circuit connection pattern electrode and the projecting electrode of the drive integrated circuit are connected. And a conductive adhesive for applying an electric signal to the driving integrated circuit from the outside, the connecting means is provided on the back surface of the flexible printed circuit board and the driving integrated circuit, and on the side wall portion of the driving integrated circuit. A liquid crystal display device comprising: a conductive pattern made of a conductive ink; and a pattern electrode for external circuit connection on a first substrate connected to the conductive pattern made of a conductive ink. 【請求項６】 第１の基板と第２の基板を所定の距離を
設けて張り合わせるためのシール剤と、第１の基板と第
２の基板の重なり部に封入する液晶層と、第１の基板上
に設ける駆動用集積回路と接続するためのパネル接続用
パターン電極と外部回路接続用パターン電極と、駆動用
集積回路を第１の基板接続するための硬化性樹脂とを有
し、パネル接続用電極と外部回路接続用パターン電極と
駆動用集積回路との電気的接続をおこない液晶層に所定
の電圧を印加する液晶表示装置であり、駆動用集積回路
へ外部より電気信号を印加する接続手段は、フレキシブ
ルプリント基板と駆動用集積回路に設ける突起電極と導
電極性配線と導電極性配線に接続する第１の基板上の外
部回路接続用パターン電極と保護用接着樹脂とを有する
ことを特徴とする液晶表示装置。6. A sealant for adhering the first substrate and the second substrate to each other at a predetermined distance, a liquid crystal layer sealed in the overlapping portion of the first substrate and the second substrate, and A panel connecting pattern electrode for connecting to a driving integrated circuit provided on the substrate, an external circuit connecting pattern electrode, and a curable resin for connecting the driving integrated circuit to the first substrate. A liquid crystal display device in which a predetermined voltage is applied to a liquid crystal layer by electrically connecting a connection electrode, an external circuit connection pattern electrode, and a driving integrated circuit, and a connection for externally applying an electric signal to the driving integrated circuit. The means has a flexible printed circuit board, a protruding electrode provided on the driving integrated circuit, a conductive polarity wiring, a pattern electrode for external circuit connection on the first substrate connected to the conductive polarity wiring, and a protective adhesive resin. Liquid Crystal display device. 【請求項７】 第１の基板と第２の基板を所定の距離を
設けて張り合わせるためのシール剤と、第１の基板と第
２の基板の重なり部に封入する液晶層と、第１の基板上
に設ける駆動用集積回路と接続するためのパネル接続用
パターン電極と外部回路接続用パターン電極と、駆動用
集積回路を第１の基板接続するための硬化性樹脂と、フ
レキシブルプリント基板と第１の基板と駆動用集積回路
を固着するための接着樹脂とを有し、パネル接続用電極
と外部回路接続用パターン電極と駆動用集積回路との電
気的接続をおこない液晶層に所定の電圧を印加する液晶
表示装置であり、駆動用集積回路へ外部より電気信号を
印加する接続手段は、フレキシブルプリント基板と駆動
用集積回路に設ける突起電極と導電極性配線と導電極性
配線に接続する第１の基板上の外部回路接続用パターン
電極と保護用接着樹脂とを有することを特徴とする液晶
表示装置。7. A sealant for adhering the first substrate and the second substrate at a predetermined distance, a liquid crystal layer sealed in an overlapping portion of the first substrate and the second substrate, and A panel connection pattern electrode for connecting to a drive integrated circuit provided on the substrate, an external circuit connection pattern electrode, a curable resin for connecting the drive integrated circuit to the first substrate, and a flexible printed board. The liquid crystal layer has a first substrate and an adhesive resin for fixing the driving integrated circuit, and electrically connects the panel connecting electrode, the external circuit connecting pattern electrode, and the driving integrated circuit to a predetermined voltage on the liquid crystal layer. In the liquid crystal display device for applying a voltage, the connecting means for applying an electric signal from the outside to the driving integrated circuit is the first connecting to the flexible printed board, the protruding electrode provided on the driving integrated circuit, the conductive polarity wiring and the conductive polarity wiring. 2. A liquid crystal display device, comprising: a pattern electrode for external circuit connection and a protective adhesive resin on the substrate. 【請求項８】 第１の基板と第２の基板を所定の距離を
設けて張り合わせるためのシール剤と、第１の基板と第
２の基板の重なり部に封入する液晶層と、第１の基板上
に設ける駆動用集積回路と接続するためのパネル接続用
パターン電極と外部回路接続用パターン電極と、パネル
接続用電極と外部回路接続用パターン電極に駆動用集積
回路を接続する導電性接着剤あるいは異方性導電フィル
ムを有し、導電性接着剤あるいは異方性導電フィルムに
よりパネル接続用電極と外部回路接続用パターン電極と
駆動用集積回路との電気的接続をおこない液晶層に所定
の電圧を印加する液晶表示装置であり、駆動用集積回路
へ外部より電気信号を印加する接続手段は、駆動用集積
回路の裏面にフレキシブルプリント基板を設け、フレキ
シブルプリント基板あるいは第１の基板に基板用合わせ
マークあるいは回路用位置合わせマークあるいはフレキ
シブルプリント基板用位置合わせマークを有することを
特徴とする液晶表示装置。8. A sealant for adhering the first substrate and the second substrate at a predetermined distance, a liquid crystal layer sealed in an overlapping portion of the first substrate and the second substrate, and a first liquid crystal layer. Panel connection pattern electrode and external circuit connection pattern electrode for connecting to the drive integrated circuit provided on the substrate of, and conductive adhesive for connecting the drive integrated circuit to the panel connection electrode and the external circuit connection pattern electrode Agent or an anisotropic conductive film, and a conductive adhesive or an anisotropic conductive film is used to electrically connect the panel connection electrode, the external circuit connection pattern electrode, and the driving integrated circuit to a predetermined liquid crystal layer. A liquid crystal display device for applying a voltage, wherein the connecting means for externally applying an electric signal to the driving integrated circuit includes a flexible printed board provided on the back surface of the driving integrated circuit. Alternatively, a liquid crystal display device characterized in that the first substrate has a substrate alignment mark, a circuit alignment mark, or a flexible printed substrate alignment mark. 【請求項９】 第１の基板と第２の基板を所定の距離を
設けて張り合わせるためのシール剤と、第１の基板と第
２の基板の重なり部に封入する液晶層と、第１の基板上
に設ける駆動用集積回路と接続するためのパネル接続用
パターン電極と外部回路接続用パターン電極と、パネル
接続用電極と外部回路接続用パターン電極に駆動用集積
回路を接続するための導電性接着剤あるいは異方性導電
フィルムを有し、導電性接着剤あるいは異方性導電フィ
ルムによりパネル接続用電極と外部回路接続用パターン
電極と駆動用集積回路との電気的接続をおこない液晶層
に所定の電圧を印加する液晶表示装置であり、駆動用集
積回路へ外部より電気信号を印加する接続手段は、駆動
用集積回路の側壁部に設ける導電粒と熱硬化性樹脂を含
む異方性導電フィルムを有し、駆動用集積回路の側壁部
の異方性導電フィルムを介して外部回路接続用パターン
電極を外部へ接続することを特徴とする液晶表示装置。9. A sealant for adhering the first substrate and the second substrate to each other with a predetermined distance provided therebetween, a liquid crystal layer sealed in an overlapping portion of the first substrate and the second substrate, and a first liquid crystal layer. Panel connection pattern electrodes and external circuit connection pattern electrodes for connecting to the driving integrated circuit provided on the substrate of, and conductivity for connecting the driving integrated circuit to the panel connection electrodes and external circuit connection pattern electrodes Conductive adhesive or anisotropic conductive film, and electrically connecting the panel connecting electrode, external circuit connecting pattern electrode, and driving integrated circuit with the conductive adhesive or anisotropic conductive film to form a liquid crystal layer. In the liquid crystal display device for applying a predetermined voltage, the connecting means for externally applying an electric signal to the driving integrated circuit is an anisotropic conductive material containing conductive particles and thermosetting resin provided on the side wall of the driving integrated circuit. fill And a pattern electrode for external circuit connection to the outside via an anisotropic conductive film on the side wall of the driving integrated circuit. 【請求項１０】 第１の基板と第２の基板を所定の距離
を設けて張り合わせるためのシール剤と、第１の基板と
第２の基板の重なり部に封入する液晶層と、第１の基板
上に設ける駆動用集積回路と接続するためのパネル接続
用パターン電極と外部回路接続用パターン電極と、パネ
ル接続用電極と外部回路接続用パターン電極と駆動用集
積回路の突起電極とを接続する導電性接着剤あるいは異
方性導電フィルムと、第１の基板を挟むように設ける保
護用台座とを有し、駆動用集積回路へ外部より電気信号
を印加する接続手段は、フレキシブルプリント基板と駆
動用集積回路の裏面に設ける裏面パターンと駆動用集積
回路の側壁部に設ける異方性導電フィルムを介して設け
る導電性パターンと導電性パターンに接続する第１の基
板上の外部回路接続用パターン電極とを有することを特
徴とする液晶表示装置。10. A sealant for adhering the first substrate and the second substrate at a predetermined distance, a liquid crystal layer sealed in an overlapping portion of the first substrate and the second substrate, and The panel connection pattern electrode and the external circuit connection pattern electrode for connecting to the drive integrated circuit provided on the substrate are connected, and the panel connection electrode, the external circuit connection pattern electrode and the projecting electrode of the drive integrated circuit are connected. Which has a conductive adhesive or an anisotropic conductive film and a protection pedestal provided so as to sandwich the first substrate, and a connecting means for externally applying an electric signal to the driving integrated circuit is a flexible printed circuit board. External circuit connection on the first substrate connecting to the conductive pattern and the conductive pattern provided through the back surface pattern provided on the back surface of the driving integrated circuit and the anisotropic conductive film provided on the side wall portion of the driving integrated circuit Liquid crystal display device having a pattern electrode for use.
JP25968795A 1995-10-06 1995-10-06 Liquid crystal display Expired - Fee Related JP3571825B2 (en)

Priority Applications (1)

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JP25968795A JP3571825B2 (en) 1995-10-06 1995-10-06 Liquid crystal display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25968795A JP3571825B2 (en) 1995-10-06 1995-10-06 Liquid crystal display

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JPH09101533A true JPH09101533A (en) 1997-04-15
JP3571825B2 JP3571825B2 (en) 2004-09-29

Family

ID=17337528

Family Applications (1)

Application Number Title Priority Date Filing Date
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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1065555A1 (en) * 1999-01-20 2001-01-03 Citizen Watch Co., Ltd. Structure for mounting semiconductor device on liquid crystal display, and semiconductor device
KR20010095014A (en) * 2000-03-31 2001-11-03 카나야 오사무 Multi-layer display panel, method of manufacturing the same, holding device, pressure-bonding jig and driver element mounting method
JP2002311452A (en) * 2001-04-13 2002-10-23 Citizen Watch Co Ltd Liquid crystal device
US6690032B1 (en) * 1999-07-22 2004-02-10 Seiko Epson Corporation Electro-optical device and method of manufacture thereof, and electronic instrument
JP2006072372A (en) * 2005-09-02 2006-03-16 Seiko Epson Corp Substrate for liquid crystal panel and liquid crystal panel
WO2010035551A1 (en) 2008-09-29 2010-04-01 シャープ株式会社 Substrate module and method for manufacturing the same
JP6439029B1 (en) * 2017-12-13 2018-12-19 株式会社正興電機製作所 Light control device and method of manufacturing the light control device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1065555A1 (en) * 1999-01-20 2001-01-03 Citizen Watch Co., Ltd. Structure for mounting semiconductor device on liquid crystal display, and semiconductor device
EP1065555A4 (en) * 1999-01-20 2005-05-04 Citizen Watch Co Ltd Structure for mounting semiconductor device on liquid crystal display, and semiconductor device
US6690032B1 (en) * 1999-07-22 2004-02-10 Seiko Epson Corporation Electro-optical device and method of manufacture thereof, and electronic instrument
KR20010095014A (en) * 2000-03-31 2001-11-03 카나야 오사무 Multi-layer display panel, method of manufacturing the same, holding device, pressure-bonding jig and driver element mounting method
JP2002311452A (en) * 2001-04-13 2002-10-23 Citizen Watch Co Ltd Liquid crystal device
JP2006072372A (en) * 2005-09-02 2006-03-16 Seiko Epson Corp Substrate for liquid crystal panel and liquid crystal panel
WO2010035551A1 (en) 2008-09-29 2010-04-01 シャープ株式会社 Substrate module and method for manufacturing the same
US8450753B2 (en) 2008-09-29 2013-05-28 Sharp Kabushiki Kaisha Board module and method of manufacturing same
JP6439029B1 (en) * 2017-12-13 2018-12-19 株式会社正興電機製作所 Light control device and method of manufacturing the light control device
JP2019105752A (en) * 2017-12-13 2019-06-27 株式会社正興電機製作所 Dimmer and method for manufacturing dimmer

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