JP2007235015A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2007235015A5 JP2007235015A5 JP2006057407A JP2006057407A JP2007235015A5 JP 2007235015 A5 JP2007235015 A5 JP 2007235015A5 JP 2006057407 A JP2006057407 A JP 2006057407A JP 2006057407 A JP2006057407 A JP 2006057407A JP 2007235015 A5 JP2007235015 A5 JP 2007235015A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- layer
- insulating layer
- resin insulating
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 70
- 229920005989 resin Polymers 0.000 claims description 70
- 238000007747 plating Methods 0.000 claims description 32
- 239000004020 conductor Substances 0.000 claims description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 229910052802 copper Inorganic materials 0.000 claims description 28
- 239000010949 copper Substances 0.000 claims description 28
- 239000011889 copper foil Substances 0.000 claims description 18
- 238000009413 insulation Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000007788 roughening Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 118
- 238000000034 method Methods 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000005755 formation reaction Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 239000004593 Epoxy Substances 0.000 description 7
- 239000011651 chromium Substances 0.000 description 7
- 125000003700 epoxy group Chemical group 0.000 description 7
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000011701 zinc Substances 0.000 description 7
- 229910052804 chromium Inorganic materials 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229910052725 zinc Inorganic materials 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- CURLTUGMZLYLDI-UHFFFAOYSA-N carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 230000003449 preventive Effects 0.000 description 4
- 230000001681 protective Effects 0.000 description 4
- 230000002829 reduced Effects 0.000 description 4
- 239000004760 aramid Substances 0.000 description 3
- 229920003235 aromatic polyamide Polymers 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 210000004940 Nucleus Anatomy 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002452 interceptive Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- -1 or printing Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- NPDODHDPVPPRDJ-UHFFFAOYSA-N permanganate Chemical compound [O-][Mn](=O)(=O)=O NPDODHDPVPPRDJ-UHFFFAOYSA-N 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006057407A JP2007235015A (ja) | 2006-03-03 | 2006-03-03 | 多層配線基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006057407A JP2007235015A (ja) | 2006-03-03 | 2006-03-03 | 多層配線基板及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007235015A JP2007235015A (ja) | 2007-09-13 |
| JP2007235015A5 true JP2007235015A5 (de) | 2009-04-16 |
Family
ID=38555265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006057407A Pending JP2007235015A (ja) | 2006-03-03 | 2006-03-03 | 多層配線基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007235015A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20140077441A (ko) * | 2012-12-14 | 2014-06-24 | 타이코에이엠피(유) | 인쇄회로기판 및 그 제조방법 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3476264B2 (ja) * | 1993-12-24 | 2003-12-10 | 三井金属鉱業株式会社 | プリント回路内層用銅箔およびその製造方法 |
| JP4127442B2 (ja) * | 1999-02-22 | 2008-07-30 | イビデン株式会社 | 多層ビルドアップ配線板及びその製造方法 |
| JP4087369B2 (ja) * | 2003-11-11 | 2008-05-21 | 古河サーキットフォイル株式会社 | キャリア付き極薄銅箔、およびプリント配線板 |
| JP2005150447A (ja) * | 2003-11-17 | 2005-06-09 | Matsushita Electric Ind Co Ltd | 配線基板とその製造方法 |
-
2006
- 2006-03-03 JP JP2006057407A patent/JP2007235015A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7681310B2 (en) | Method for fabricating double-sided wiring board | |
| JP6314085B2 (ja) | プリント配線板の製造方法及びレーザー加工用銅箔 | |
| US9756735B2 (en) | Method for manufacturing printed wiring board | |
| US9711440B2 (en) | Wiring board and method for manufacturing the same | |
| KR20070037671A (ko) | 프린트 배선판, 다층 프린트 배선판 및 그 제조방법 | |
| JP5580135B2 (ja) | プリント配線板の製造方法及びプリント配線板 | |
| US20090236130A1 (en) | Multilayered printed circuit board and method of manufacturing the same | |
| JP5506877B2 (ja) | 多層プリント基板及びその製造方法 | |
| JP4508140B2 (ja) | 部品内蔵モジュール | |
| JP4964322B2 (ja) | 放熱基板およびその製造方法 | |
| JP4508141B2 (ja) | ステンレス転写基材、メッキ回路層付きステンレス転写基材 | |
| JP2007235015A5 (de) | ||
| JP2007235015A (ja) | 多層配線基板及びその製造方法 | |
| JP2004087697A (ja) | 配線基板の製造方法 | |
| JP4730072B2 (ja) | 回路基板の製造方法 | |
| JP2015090980A (ja) | 複合金属フィルムおよびこれを用いるプリント回路基板の回路パターン形成方法 | |
| JP6098118B2 (ja) | 多層プリント配線板およびその製造方法 | |
| JP4466169B2 (ja) | 半導体装置用基板の製造方法 | |
| JP4492071B2 (ja) | 配線基板の製造方法 | |
| JP4328195B2 (ja) | 配線基板及びその製造方法並びに電気装置 | |
| JP4144439B2 (ja) | 配線板、多層配線板及びその製造方法 | |
| JPH1168291A (ja) | プリント配線板及びその製造方法 | |
| JP2015088544A (ja) | プリント配線板の製造方法およびプリント配線板 | |
| JPH0353796B2 (de) | ||
| JP2009290233A (ja) | 配線基板とその製造方法 |