JP2007234850A5 - - Google Patents
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- Publication number
- JP2007234850A5 JP2007234850A5 JP2006054460A JP2006054460A JP2007234850A5 JP 2007234850 A5 JP2007234850 A5 JP 2007234850A5 JP 2006054460 A JP2006054460 A JP 2006054460A JP 2006054460 A JP2006054460 A JP 2006054460A JP 2007234850 A5 JP2007234850 A5 JP 2007234850A5
- Authority
- JP
- Japan
- Prior art keywords
- gate
- semiconductor device
- temperature
- central region
- connection lines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims 10
- 238000001514 detection method Methods 0.000 claims 6
- 230000002093 peripheral Effects 0.000 claims 4
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006054460A JP5014646B2 (ja) | 2006-03-01 | 2006-03-01 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006054460A JP5014646B2 (ja) | 2006-03-01 | 2006-03-01 | 半導体装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007234850A JP2007234850A (ja) | 2007-09-13 |
JP2007234850A5 true JP2007234850A5 (zh) | 2009-02-26 |
JP5014646B2 JP5014646B2 (ja) | 2012-08-29 |
Family
ID=38555132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006054460A Active JP5014646B2 (ja) | 2006-03-01 | 2006-03-01 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5014646B2 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6115050B2 (ja) * | 2012-09-10 | 2017-04-19 | トヨタ自動車株式会社 | 半導体装置 |
US9553575B2 (en) | 2012-12-21 | 2017-01-24 | Toyota Jidosha Kabushiki Kaisha | Semiconductor device |
DE102017110536B4 (de) * | 2017-05-15 | 2022-06-30 | Infineon Technologies Ag | Halbleitervorrichtung mit breiter Bandlücke, die Gatefinger zwischen Bondpads enthält, und Halbleitermodul |
JP7095316B2 (ja) * | 2018-03-06 | 2022-07-05 | 株式会社デンソー | 半導体装置 |
EP3817039B1 (en) * | 2019-02-07 | 2022-11-23 | Fuji Electric Co., Ltd. | Semiconductor device |
JP7242491B2 (ja) | 2019-09-20 | 2023-03-20 | 株式会社東芝 | 半導体装置及び半導体回路 |
JP7305589B2 (ja) | 2020-03-19 | 2023-07-10 | 株式会社東芝 | 半導体装置及び半導体回路 |
JP7490604B2 (ja) * | 2021-03-22 | 2024-05-27 | 株式会社東芝 | 半導体装置 |
CN117577672A (zh) * | 2023-11-30 | 2024-02-20 | 江苏易矽科技有限公司 | 一种具有多有效栅的igbt结构 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0823096A (ja) * | 1994-07-08 | 1996-01-23 | Toshiba Corp | 半導体装置 |
GB9818044D0 (en) * | 1998-08-20 | 1998-10-14 | Koninkl Philips Electronics Nv | Power transistor device |
JP2000101076A (ja) * | 1998-09-25 | 2000-04-07 | Toshiba Corp | 絶縁ゲート型半導体素子とその駆動方法 |
JP4086558B2 (ja) * | 2002-06-21 | 2008-05-14 | 三洋電機株式会社 | 半導体装置およびその製造方法 |
JP3997126B2 (ja) * | 2002-08-29 | 2007-10-24 | 株式会社ルネサステクノロジ | トレンチゲート型半導体装置 |
JP4130356B2 (ja) * | 2002-12-20 | 2008-08-06 | 株式会社東芝 | 半導体装置 |
JP3906213B2 (ja) * | 2004-03-10 | 2007-04-18 | 株式会社東芝 | 半導体装置 |
JP2005302953A (ja) * | 2004-04-09 | 2005-10-27 | Toshiba Corp | 半導体装置 |
-
2006
- 2006-03-01 JP JP2006054460A patent/JP5014646B2/ja active Active
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