JP2007214346A - 半導体装置、及び半導体装置の製造方法 - Google Patents
半導体装置、及び半導体装置の製造方法 Download PDFInfo
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- JP2007214346A JP2007214346A JP2006032371A JP2006032371A JP2007214346A JP 2007214346 A JP2007214346 A JP 2007214346A JP 2006032371 A JP2006032371 A JP 2006032371A JP 2006032371 A JP2006032371 A JP 2006032371A JP 2007214346 A JP2007214346 A JP 2007214346A
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Abstract
半田電極を使用したフリップチップ実装方式において、半導体チップと半田電極接合部分や、回路基板と半田電極の接合部分などに生ずるクラックや剥離を防止する封止構造を提供する。
【解決手段】
半導体チップ1は半田電極3を介して回路基板6上のパッド部5に電気的に接続されている。半導体チップ1と半田電極3の接合部分は第一の樹脂材料よりなる第一の固定部2によって固定されている。第一の樹脂材料よりなる第一の固定部2は、半導体チップ1の半田電極3側の表面に層状に設けられている。また、半田電極3と回路基板6上のパッド部5との接合部分は第二の樹脂材料よりなる第二の固定部4によって固定されている。第二の樹脂材料よりなる第二の固定部4は、第一の樹脂材料よりなる第一の固定部2とは異なる樹脂材料により作製されている。
【選択図】図1
Description
近年は半導体装置に、より高度の信頼性が求められつつあるが、上記のフリップチップ実装方式では、樹脂組成物を種々工夫しても接合部分の信頼性が向上しないという課題があった。
半導体チップと、
回路基板と、
前記半導体チップと前記回路基板とを電気的に接続する半田電極と、
前記半導体チップと前記半田電極との接合部分の周囲において、前記半導体チップと前記半田電極の両方に接する第一の樹脂材料よりなる第一の固定部と、
前記半田電極と前記回路基板との接合部分の周囲において、前記半田電極と前記回路基板の両方に接する、前記第一の樹脂材料とは異なる第二の樹脂材料よりなる第二の固定部と、
を備える半導体装置が提供される。
本発明の半導体装置は、第一の固定部と第二の固定部に異なる樹脂材料を用いているために、各接合部分に応じた材料を用いることが可能となり、より樹脂選択の自由度が増す。これにより、より信頼性の高い半導体装置を提供することができる。
このような構成とした場合、半導体チップと回路基板との間隙を完全に充填しないことにより、比較的高信頼性を確保しつつ、かつ、半導体装置の周辺に樹脂組成物がはみ出ることを抑制することができる。樹脂組成物のはみ出しが抑制されれば、半導体装置を近接して設計でき、半導体装置の高密度設計が可能となる利点がある。
前述の半導体装置の製造方法であって、
片側の表面に半田電極が設けられたウエハーを準備する工程と、
ウエハーの前記半田電極が設けられている側の表面に、第一の樹脂材料よりなる第一の固定部の領域を形成する工程と、
前記ウエハーをダイシングにより個片化して半導体チップを作製する工程と、
回路基板のパッド部周辺に樹脂組成物を付着させる工程と、
前記半導体チップに設けられている前記半田電極を前記回路基板の前記樹脂組成物を付着させた箇所に接触させ、次に前記樹脂組成物を硬化させて第二の樹脂材料よりなる第二の固定部を形成する工程と、
を含む半導体装置の製造方法が提供される。
この製法によれば、接合部分の信頼性に優れた半導体装置を安定的に製造することができる。
半導体装置の製造方法であって、
片側の表面に半田電極が設けられたウエハーを準備する工程と、
ウエハーの前記半田電極が設けられている側の表面に、第一の樹脂材料よりなる第一の固定部の領域を形成する工程と、
前記ウエハーをダイシングにより個片化して半導体チップを作成する工程と、
前記半導体チップの片側の表面に設けられた前記第一の固定部から突出している前記半田電極の先端周辺に樹脂組成物を付着させる工程と、
前記樹脂組成物が付着された前記半田電極を前記回路基板のパッド部に接触させ、次に前記樹脂組成物を硬化させて第二の樹脂材料よりなる第二の固定部を形成する工程と、
を含む半導体装置の製造方法が提供される。
この製法によれば、接合部分の信頼性に優れた半導体装置を安定的に製造することができる。
本実施形態に係る発明を図1、2を参照して説明する。
半導体チップと、
回路基板と、
前記半導体チップと前記回路基板とを電気的に接続する半田電極と、
前記半導体チップと前記半田電極との接合部分の周囲において、前記半導体チップと前記半田電極の両方に接する第一の樹脂材料よりなる第一の固定部と、
前記半田電極と前記回路基板との接合部分の周囲において、前記半田電極と前記回路基板の両方に接する、前記第一の樹脂材料とは異なる第二の樹脂材料よりなる第二の固定部と、
を備える半導体装置が提供される。
第二の樹脂材料よりなる第二の固定部4は、図1のように半田電極3と回路基板6上のパッド部5との接合部分の周囲に局所的に設けられてもよいし、図2のように回路基板6の半田電極3側に層状に設けられてもよい。
第一の樹脂材料よりなる第一の固定部2、及び第二の樹脂材料よりなる第二の固定部4の作製方法を適宜選択することによってその形態を最適なものに設計することが可能である。
また図1、2においては、半導体チップ1と回路基板6との間隙が、第一の樹脂材料と第二の樹脂材料によって完全に充填されておらず、空隙がある状態であるが、完全に充填することも可能である。
上記のように、第一の樹脂材料と第二の樹脂材料とが「異なって」いるということは、樹脂材料を構成する各成分の種類が異なっていることなので、樹脂材料としての物性を自由に選択することが可能である。従って、各接合部分に応じた材料を用いることが可能となり、半導体装置の接合部分のクラック・剥離等が比較的少なく、信頼性のより高い半導体装置が提供される。
前記半導体チップと前記回路基板との間隙が、前記第一の樹脂材料と前記第二の樹脂材料によって10%以上90%以下充填されている半導体装置が提供される。
前記第一の固定部が、前記半導体チップの前記半田電極側に層状に設けられており、前記層の厚みが前記半導体チップと前記回路基板との隙間幅の5%以上50%以下である半導体装置が提供される。
またその層の厚みが、半導体チップ1と回路基板6との隙間幅の5%以上であると、半導体チップ1と半田電極3の接合部分を適切に固定することができ、隙間幅の50%以下であると樹脂材料が半導体チップ1と回路基板6との隙間からはみ出していく現象がなく、半導体装置の高密度設計が可能となる。層の厚みは、半導体チップ1と回路基板6との隙間幅の10%以上30%以下であることが好ましい。
半導体チップと、
回路基板と、
前記半導体チップと前記回路基板とを電気的に接続する半田電極と、
前記半導体チップと前記半田電極との接合部分の周囲において、前記半導体チップと前記半田電極の両方に接する第一の樹脂材料よりなる第一の固定部と、
前記半田電極と前記回路基板との接合部分の周囲において、前記半田電極と前記回路基板の両方に接する、前記第一の樹脂材料とは異なる第二の樹脂材料よりなる第二の固定部と、
を備える半導体装置であって、
前記第二の固定部が、前記半田電極の周囲に局所的に設けられている半導体装置が提供される。
この第二の樹脂材料よりなる第二の固定部4は、半田電極3と回路基板6の両方に接するように設けられており、半田電極3が接続されることのない回路基板6上には第二の固定部4は設けられていない。第二の樹脂材料よりなる第二の固定部4は、半田電極3と回路基板6の接合部分を部分的に補強する作用を有する。
半田電極は直径30μm〜600μmの球状であり、その組成に応じて最適の温度範囲にて回路基板と溶融接合される。
これらのエポキシ樹脂の具体例としては、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、クレゾールナフトール型エポキシ樹脂、ビフェニル型エポキシ樹脂、ビフェニルアラルキル型エポキシ樹脂、ナフタレン骨格型エポキシ樹脂、アントラセン骨格型エポキシ樹脂等の常温で固形のエポキシ樹脂、ビスフェノールAジグリシジルエーテル型エポキシ、ビスフェノールFジグリシジルエーテル型エポキシ、ビスフェノールSジグリシジルエーテル型エポキシ、o−アリルビスフェノールA型ジグリシジルエーテル、3,3’,5,5’−テトラメチル4,4’−ジヒドロキシビフェニルジグリシジルエーテル型エポキシ、4,4’−ジヒドロキシビフェニルジグリシジルエーテル型エポキシ、1,6−ジヒドロキシビフェニルジグリシジルエーテル型エポキシ、フェノールノボラック型エポキシ、臭素型クレゾールノボラック型エポキシ、ビスフェノールDジグリシジルエーテル型エポキシ,1,6ナフタレンジオールのグリシジルエーテル、アミノフェノール類のトリグリシジルエーテルなどの常温で液状のエポキシ樹脂が挙げられる。これらは単独で用いても複数組み合わせて用いても良い。また、信頼性の優れた液状封止樹脂組成物を得るために、エポキシ樹脂のNa+、Cl-等のイオン性不純物はできるだけ少ないものが好ましい。
また、混練時の作業性の向上により、予め希釈剤に溶解させても液状エポキシ樹脂に溶解させてもよい。更に使用に耐えるエポキシ樹脂硬化剤はナトリウムイオンや塩化物イオンの含有量ができるだけ少ないものが望ましい。
具体例としては、2,3−ジヒドロキシ安息香酸、2,4−ジヒドロキシ安息香酸、2,5−ジヒドロキシ安息香酸、2,6−ジヒドロキシ安息香酸、3,4−ジヒドロキシ安息香酸、没食子酸、1,4−ジヒドロキシ−2−ナフトエ酸、3,5−ジヒドロキシ−2−ナフトエ酸、3,7−ジヒドロキシ−2−ナフトエ酸、フェノールフタリン、ジフェノール酸等が挙げられる。
またここでの(B)エポキシ樹脂とは、第一の樹脂材料と同様なエポキシ樹脂が同様の使用法で用いることができる。
(i)片側の表面に半田電極が設けられたウエハーを準備する工程と、
(ii)ウエハーの前記半田電極が設けられている側の表面に、第一の樹脂材料よりなる第一の固定部の領域を形成する工程と、
(iii)前記ウエハーをダイシングにより個片化して半導体チップを作製する工程と、
(iv)回路基板のパッド部周辺に樹脂組成物を付着させる工程と、
(v)前記半導体チップに設けられている前記半田電極を前記回路基板の前記樹脂組成物を付着させた箇所に接触させ、次に前記樹脂組成物を硬化させて第二の樹脂材料よりなる第二の固定部を形成する工程と、
を含む半導体装置の製造方法が提供される。
図3(a)のように、まず半田電極3が設けられたウエハー8を準備する。
(i)で準備されたウエハー8の半田電極3が設けられてある側の面に、第一の樹脂材料を、スピンコート法、スクリーン印刷法、または、マスク印刷法にて供給させる。
印刷法の場合、その性質上、半田電極3の高さより厚めに第一の樹脂材料を供給する必要がある。従って、第一の樹脂材料として溶剤を含むワニスを用い、加熱途中に溶剤を除去して厚みを目減りさせる方法が用いられる。別の方法としては、第一の樹脂材料を溶剤を含まない状態でウエハー8上に形成し、この第一の樹脂材料を半田電極3ごと切削し第一の樹脂材料の厚みを薄くした後に半田電極3面に再度半田電極を具備させるような方法が用いられる。
第一の樹脂材料の供給後、加熱によりBステージ状態(タックフリー状態)または硬化状態にする(図3(b))。
(ii)で準備されたウエハー8を、湿式もしくはレーザー法によるダイシングブレード7を行って個片化し、半導体チップ1を作成する(図3(c))。この際、第一の樹脂材料が柔らかすぎても堅すぎても適切にダイシングができないため、第一の樹脂材料の硬化具合を適度に調整する必要がある。
続いて、回路基板6のパッド部5周辺に樹脂組成物を付着させる(図3(d))。回路基板6のパッド部5周辺に樹脂組成物の供給する方法としては、エアー式、機械式、ジェット式などのディスペンス法や、スクリーン印刷、マスク印刷などの印刷法、ピン転写法などの転写法などが挙げられる。半導体チップ1搭載時に供給しても、あらかじめ供給してBステージ化させておいてもよい。
(iii)で準備された半導体チップ1を、(iv)で準備された回路基板6のパッド部5に搭載して加熱接続し、電気的接続を行う(図3(e))。この時、半導体チップやCSPなどを回路基板6に接触させるためには、フリップチップボンダーやダイボンダーが用いられる。
次に、樹脂組成物を硬化させて接続部分の固定を行う(図3(f))。これにより第二の樹脂材料よりなる第二の固定部が形成される。
(i)片側の表面に半田電極が設けられたウエハーを準備する工程と、
(ii)ウエハーの前記半田電極が設けられている側の表面に、第一の樹脂材料よりなる第一の固定部の領域を形成する工程と、
(iii)前記ウエハーをダイシングにより個片化して半導体チップを作成する工程と、
(vi)前記半導体チップの片側の表面に設けられた前記第一の固定部から突出している前記半田電極の先端周辺に樹脂組成物を付着させる工程と、
(vii)前記樹脂組成物が付着された前記半田電極を前記回路基板のパッド部に接触させ、次に前記樹脂組成物を硬化させて第二の樹脂材料よりなる第二の固定部を形成する工程と、
を含む半導体装置の製造方法が提供される。
(iii)で準備した個片化された半導体チップ1の半田電極3が設けられている面を下向きにして、半田電極3の先端がちょうど樹脂組成物の表面に接触する様に、半導体チップ1を樹脂組成物が満たされた容器に漬ける。このようにすることで半田電極3の先端周辺にのみ樹脂組成物を付着させることができる(図4(d))。この樹脂組成物は必要に応じて適度に硬化させ、取扱い性を向上させてもよい。
(vi)で準備された半導体チップ1を、回路基板6のパッド部5に搭載して加熱接続し、電気的接続を行う(図4(e))。この時、半導体チップ1やCSPなどを回路基板6に接触させるためには、フリップチップボンダーやダイボンダーが用いられる。
次に、樹脂組成物を硬化させて接続部分の固定を行う(図4(f))。これにより第二の樹脂材料よりなる第二の固定部4が形成される。
この点、本発明の実施形態は、第二の樹脂材料にフラックス特性が付与されているので、フラックス塗布工程や洗浄工程が不要である。また、半導体装置が中空状態であるため、ボイドなどの懸念が少なく、基板乾燥やプラズマ工程などを省くことが出来る。
この点、本発明の実施形態は、接合部分ごとに樹脂材料で固定してから半導体装置を組み立てるので、チップのサイズ、間隙や電極間のピッチ等に依存せず比較的高い信頼性で実装することが出来る。また、半導体チップと半田電極の接合部分と、回路基板と半田電極の接合部分とを別々の樹脂材料で固定している為、それぞれの接合部分に最適な樹脂材料を選択することができ、よりクラック・剥離などが生じにくい半導体装置が得られる。
この点、本発明の実施形態は、チップ周辺に樹脂材料がフィレットを形成せず、樹脂材料がはみ出すことが無いので、チップ周辺部の部品搭載への自由度が増し、加えて、チップ同士を極端に近づけることが可能なため、高密度実装も可能となる。
この点、本発明の実施形態は、半導体チップと半田電極の接合部分と、回路基板と半田電極の接合部分とは半導体装置を組み立てる前に樹脂材料によって固定されるため、無機フィラーを高充填しても注入性に問題が生じることが少ない。
この点、本発明の実施形態は、接合部分が独立して固定されているため、、接合部分にかかる応力が他の部分に影響を及ぼすことがなく、パッケージ反りが緩和され、低ストレス化ができるというメリットがある。
表1、2のように各成分を配合し、3本ロールにて分散混練し、真空下脱泡処理をして封止樹脂組成物を得た。この封止樹脂組成物を用いて樹脂組成物の評価実験を行った。その結果を表1、2に示した。
ビスフェノールF型エポキシ樹脂:大日本インキ化学工業(株)製、EXA−830LVP(エポキシ当量161)
ビフェニル型エポキシ樹脂:日本化薬社(株)製、NC3000(エポキシ当量272)
クレゾールナフトール型エポキシ樹脂:日本化薬社製(株)、NC7300L(エポキシ当量212)
ゲンチジン酸:みどり化学(株)製、2,5−ジヒドロキシ安息香酸
フェノールノボラック:住友デュレズ社(株)製、PR−51470
2P4MZ:四国化成(株)製、2−フェニル−4−メチルイミダゾール
スピンコーターを用い、およそ20gの第一の樹脂材料を6インチウエハーに供給し、薄膜を形成した。この20μm厚前後に第一の樹脂材料が塗布されたものをあらかじめ平行をとっておいた乾燥オーブン内で90℃90分にて乾燥させた。
Disco社製ダイシング装置を使用し、湿式ダイシングを行い、Aモードにて10mm角チップに個片化した。この際、平坦化した樹脂組成物の再溶融と、ダイシング面の形状変化を阻止するため、通常行われるウエハー乾燥は行わなかった。
澁谷工業社製フリップチップボンダーを用い、第二の樹脂材料の原料である樹脂組成物を供給しながらフリップチップ接合を行った。接続後のフリップチップは150℃90分にて後硬化させた。得られた半導体装置は第一実施形態で説明した図1のような半導体装置になっていた。この半導体装置について表3に示すような評価を行った。
はんだ:錫−銀(融点:221℃)、バンプ数:484バンプ、バンプ高さ:80μm、チップサイズ:10mm角、パッシベーション:ポリイミド、チップ厚み:525μm。
150℃3時間にて硬化させた液状樹脂組成物の硬化物を4mmX4mmX10mmに切り出し、SII社製TMA装置を用いて測定した。昇温時間は10℃/分とし、−100℃から300℃までスキャンし、得られた曲線の変曲点をガラス転移温度とし、曲線の傾きから平均線膨張係数(ガラス転移温度以下)を求めた。結果を表1、2にまとめた。
半田溶融、接続を行った半導体装置において、接続率をデイジーチェーンでつながった回路にて確認した。すなわちある半田電極においては一つでも接続不良が出た場合は導通しないため、接続率は導通不良半導体装置数/総半導体装置数でカウントした。結果を表3にまとめた。
接続率100%のパッケージを選び、30℃、60%、72時間吸湿させたあと最大温度260℃の温度プロファイルのリフローに3回通過させ、接続導通を調べた(各水準n=20)。接続不良が生じた半導体装置数をカウントした。結果を表3にまとめた。
耐リフロー試験を行ったパッケージを引き続き−55℃、30分/−125℃、30分の条件でT/C試験を行った(各水準n=20)。クラック、接続導通を150サイクル、250サイクル、500サイクル後に観察した。接続不良が生じた半導体装置数をカウントした。結果を表3にまとめた。
2 第一の固定部
3 半田電極
4 第二の固定部
5 パッド部
6 回路基板
7 ダイシングブレード
8 ウエハー
Claims (10)
- 半導体チップと、
回路基板と、
前記半導体チップと前記回路基板とを電気的に接続する半田電極と、
前記半導体チップと前記半田電極との接合部分の周囲において、前記半導体チップと前記半田電極の両方に接する第一の樹脂材料よりなる第一の固定部と、
前記半田電極と前記回路基板との接合部分の周囲において、前記半田電極と前記回路基板の両方に接する、前記第一の樹脂材料とは異なる第二の樹脂材料よりなる第二の固定部と、
を備える半導体装置。 - 前記半導体チップと前記回路基板との間隙が、前記第一の樹脂材料と前記第二の樹脂材料によって10%以上90%以下充填されている請求項1記載の半導体装置。
- 前記第一の固定部が、前記半導体チップの前記半田電極側に層状に設けられており、前記層の厚みが前記半導体チップと前記回路基板との隙間幅の5%以上50%以下である請求項1または2記載の半導体装置。
- 前記第二の固定部が、前記半田電極の周囲に局所的に設けられている請求項1乃至3のいずれかに記載の半導体装置。
- 前記第一の樹脂材料が、(A1)エポキシ樹脂、(B1)硬化剤を含む樹脂組成物を硬化させたものである請求項1乃至4のいずれかに記載の半導体装置。
- 前記第二の樹脂材料が、(A2)エポキシ樹脂、(B2)フラックス活性を有する硬化剤を含む樹脂組成物を硬化させたものである請求項1乃至5のいずれかに記載の半導体装置。
- 請求項1記載の半導体装置の製造方法であって、
片側の表面に半田電極が設けられたウエハーを準備する工程と、
前記ウエハーの前記半田電極が設けられている側の表面に、第一の樹脂材料よりなる第一の固定部の領域を形成する工程と、
前記ウエハーをダイシングにより個片化して半導体チップを作製する工程と、
回路基板のパッド部周辺に樹脂組成物を付着させる工程と、
前記半導体チップに設けられている前記半田電極を前記回路基板の前記樹脂組成物を付着させた箇所に接触させ、次に前記樹脂組成物を硬化させて第二の樹脂材料よりなる第二の固定部を形成する工程と、
を含む半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法であって、
片側の表面に半田電極が設けられたウエハーを準備する工程と、
前記ウエハーの前記半田電極が設けられている側の表面に、第一の樹脂材料よりなる第一の固定部の領域を形成する工程と、
前記ウエハーをダイシングにより個片化して半導体チップを作成する工程と、
前記半導体チップの片側の表面に設けられた前記第一の固定部から突出している前記半田電極の先端周辺に樹脂組成物を付着させる工程と、
前記樹脂組成物が付着された前記半田電極を回路基板のパッド部に接触させ、次に前記樹脂組成物を硬化させて第二の樹脂材料よりなる第二の固定部を形成する工程と、
を含む半導体装置の製造方法。 - 前記第一の樹脂材料が、(A1)エポキシ樹脂、(B1)硬化剤を含む樹脂組成物を硬化させたものである請求項7または8に記載の半導体装置の製造方法。
- 前記樹脂組成物が、(A2)エポキシ樹脂、(B2)フラックス活性を有する硬化剤を含む請求項7乃至9のいずれかに記載の半導体装置の製造方法。
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