JP2007186724A5 - - Google Patents

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Publication number
JP2007186724A5
JP2007186724A5 JP2006003443A JP2006003443A JP2007186724A5 JP 2007186724 A5 JP2007186724 A5 JP 2007186724A5 JP 2006003443 A JP2006003443 A JP 2006003443A JP 2006003443 A JP2006003443 A JP 2006003443A JP 2007186724 A5 JP2007186724 A5 JP 2007186724A5
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JP
Japan
Prior art keywords
circuit
target
power supply
oscillation
voltage
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JP2006003443A
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English (en)
Japanese (ja)
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JP2007186724A (ja
JP5016819B2 (ja
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Priority to JP2006003443A priority Critical patent/JP5016819B2/ja
Priority claimed from JP2006003443A external-priority patent/JP5016819B2/ja
Publication of JP2007186724A publication Critical patent/JP2007186724A/ja
Publication of JP2007186724A5 publication Critical patent/JP2007186724A5/ja
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Publication of JP5016819B2 publication Critical patent/JP5016819B2/ja
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JP2006003443A 2006-01-11 2006-01-11 スパッタリング方法及びスパッタリング装置 Active JP5016819B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006003443A JP5016819B2 (ja) 2006-01-11 2006-01-11 スパッタリング方法及びスパッタリング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006003443A JP5016819B2 (ja) 2006-01-11 2006-01-11 スパッタリング方法及びスパッタリング装置

Publications (3)

Publication Number Publication Date
JP2007186724A JP2007186724A (ja) 2007-07-26
JP2007186724A5 true JP2007186724A5 (enExample) 2009-02-19
JP5016819B2 JP5016819B2 (ja) 2012-09-05

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ID=38342094

Family Applications (1)

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JP2006003443A Active JP5016819B2 (ja) 2006-01-11 2006-01-11 スパッタリング方法及びスパッタリング装置

Country Status (1)

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JP (1) JP5016819B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5322235B2 (ja) * 2007-08-20 2013-10-23 株式会社アルバック スパッタリング方法
JP5500794B2 (ja) * 2008-06-30 2014-05-21 株式会社アルバック 電源装置
JP5429772B2 (ja) 2008-06-30 2014-02-26 株式会社アルバック 電源装置
DE102013110883B3 (de) * 2013-10-01 2015-01-15 TRUMPF Hüttinger GmbH + Co. KG Vorrichtung und Verfahren zur Überwachung einer Entladung in einem Plasmaprozess
EP2905801B1 (en) 2014-02-07 2019-05-22 TRUMPF Huettinger Sp. Z o. o. Method of monitoring the discharge in a plasma process and monitoring device for monitoring the discharge in a plasma
CN114481045A (zh) * 2021-12-22 2022-05-13 昆山浦元真空技术工程有限公司 电弧靶阳极辉光真空镀膜工艺及其所用的设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4326100B4 (de) * 1993-08-04 2006-03-23 Unaxis Deutschland Holding Gmbh Verfahren und Vorrichtung zum Beschichten von Substraten in einer Vakuumkammer, mit einer Einrichtung zur Erkennung und Unterdrückung von unerwünschten Lichtbögen
DE4441206C2 (de) * 1994-11-19 1996-09-26 Leybold Ag Einrichtung für die Unterdrückung von Überschlägen in Kathoden-Zerstäubungseinrichtungen
JP4963023B2 (ja) * 2006-01-11 2012-06-27 株式会社アルバック スパッタリング方法及びスパッタリング装置

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