JP2007181851A - クリームはんだ、及びそれを使用したはんだ付け方法 - Google Patents
クリームはんだ、及びそれを使用したはんだ付け方法 Download PDFInfo
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- JP2007181851A JP2007181851A JP2006001057A JP2006001057A JP2007181851A JP 2007181851 A JP2007181851 A JP 2007181851A JP 2006001057 A JP2006001057 A JP 2006001057A JP 2006001057 A JP2006001057 A JP 2006001057A JP 2007181851 A JP2007181851 A JP 2007181851A
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- Prior art keywords
- solder
- cream solder
- powder alloy
- powder
- alloy
- Prior art date
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- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 62
- 239000006071 cream Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000005476 soldering Methods 0.000 title claims abstract description 14
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 39
- 239000000956 alloy Substances 0.000 claims abstract description 39
- 239000000843 powder Substances 0.000 claims abstract description 36
- 239000000203 mixture Substances 0.000 claims abstract description 20
- 230000008018 melting Effects 0.000 claims abstract description 17
- 238000002844 melting Methods 0.000 claims abstract description 17
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 9
- 230000004907 flux Effects 0.000 claims abstract description 9
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 8
- 229910017821 Cu—Ge Inorganic materials 0.000 claims abstract description 6
- 238000004898 kneading Methods 0.000 claims abstract description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 claims abstract description 3
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 claims abstract description 3
- 239000011800 void material Substances 0.000 abstract description 10
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 230000001629 suppression Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 239000013078 crystal Substances 0.000 description 12
- 239000010949 copper Substances 0.000 description 11
- 238000011156 evaluation Methods 0.000 description 5
- 239000011812 mixed powder Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910018100 Ni-Sn Inorganic materials 0.000 description 2
- 229910018532 Ni—Sn Inorganic materials 0.000 description 2
- 229910020836 Sn-Ag Inorganic materials 0.000 description 2
- 229910020988 Sn—Ag Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- PAFZNILMFXTMIY-UHFFFAOYSA-N Cyclohexylamine Natural products NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910007637 SnAg Inorganic materials 0.000 description 1
- 229910008433 SnCU Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】Sn-Ag-Cu-Geからなる第1粉末合金と、Sn-Cu-Ni-Geからなる第2粉末合金との混合物に、フラックスを混練りしてなるクリームはんだであって、溶融後の組成がAg1.0〜4.0wt%、Cu2.0wt%以下、Ni1.0wt%以下、Ge0.1wt%以下、残部Snとなるように調整したことを特徴とする。また、前記第1粉末合金は、Sn-Ag-Cu-Geに代えてSn-Ag-Cuとすることもできる。さらに、前記第2粉末合金は、Sn-Cu-Ni-Geに代えてSn-Cu-Niとすることもできる。また、電子部品のはんだ付け方法としては、上記いずれかのクリームはんだを使用する。
【選択図】なし
Description
(1)フラックスの調整
重合ロジン50部、ブチルカルビトール46部、シクロヘキシルアミンHBr塩0.5部、アジピン酸0.5部、水素添加ヒマシ油3部を容器に仕込み、加熱溶解させた。
(2)クリームはんだの調整
実施例および比較例に示すはんだ粉末組成(粒径25〜45μm)89wt%および(1)項で調整したフラックス11wt%を容器にとり、攪拌してクリームはんだを調整した。
(3)ボイド試験
プリント配線板上の30ヶ所のパッドにクリームはんだを塗布してから、大気リフロー炉で予備加熱温度150℃,60sec、本加熱温度240℃,20secとなるように温度プロファイルを作成し、上記プリント配線板5枚をはんだ付け後、はんだ付け部をX線検査装置にてボイドの発生数を測定した。合計150ヶ所のパッドに発生したボイドのうちボイドの面積がパッド面積に対して30%以上のものをボイド発生としてカウントし、ボイド発生率を求めた。
Claims (4)
- Sn-Ag-Cu-Geからなる第1粉末合金と、Sn-Cu-Ni-Geからなる第2粉末合金との混合物に、フラックスを混練りしてなるクリームはんだであって、溶融後の組成がAg1.0〜4.0wt%、Cu2.0wt%以下、Ni1.0wt%以下、Ge0.1wt%以下、残部Snとなるように調整したことを特徴とするクリームはんだ。
- 請求項1に記載のクリームはんだにおいて、前記第1粉末合金は、Sn-Ag-Cu-Geに代えてSn-Ag-Cuとしたことを特徴とするクリームはんだ。
- 請求項1に記載のクリームはんだにおいて、前記第2粉末合金は、Sn-Cu-Ni-Geに代えてSn-Cu-Niとしたことを特徴とするクリームはんだ。
- 請求項1ないし3のいずれか1項に記載のクリームはんだを使用することを特徴とする電子部品のはんだ付け方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006001057A JP4732900B2 (ja) | 2006-01-06 | 2006-01-06 | クリームはんだ、及びそれを使用したはんだ付け方法 |
Applications Claiming Priority (1)
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JP2006001057A JP4732900B2 (ja) | 2006-01-06 | 2006-01-06 | クリームはんだ、及びそれを使用したはんだ付け方法 |
Publications (2)
Publication Number | Publication Date |
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JP2007181851A true JP2007181851A (ja) | 2007-07-19 |
JP4732900B2 JP4732900B2 (ja) | 2011-07-27 |
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JP2006001057A Active JP4732900B2 (ja) | 2006-01-06 | 2006-01-06 | クリームはんだ、及びそれを使用したはんだ付け方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105479031A (zh) * | 2016-01-29 | 2016-04-13 | 谢拂晓 | 无铅钎料 |
US20190088611A1 (en) * | 2012-06-30 | 2019-03-21 | Senju Metal Industry Co., Ltd. | "Lead-Free Solder Ball" |
CN112743255A (zh) * | 2019-10-30 | 2021-05-04 | 深圳市聚飞光电股份有限公司 | 锡膏及其制备方法、发光器件 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1177366A (ja) * | 1997-07-16 | 1999-03-23 | Fuji Electric Co Ltd | はんだ合金 |
JP2002126893A (ja) * | 2000-08-17 | 2002-05-08 | Senju Metal Ind Co Ltd | ソルダペーストとはんだ付け方法 |
JP2003154485A (ja) * | 2001-11-20 | 2003-05-27 | Tdk Corp | 高温クリームはんだ用組成物 |
-
2006
- 2006-01-06 JP JP2006001057A patent/JP4732900B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1177366A (ja) * | 1997-07-16 | 1999-03-23 | Fuji Electric Co Ltd | はんだ合金 |
JP2002126893A (ja) * | 2000-08-17 | 2002-05-08 | Senju Metal Ind Co Ltd | ソルダペーストとはんだ付け方法 |
JP2003154485A (ja) * | 2001-11-20 | 2003-05-27 | Tdk Corp | 高温クリームはんだ用組成物 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190088611A1 (en) * | 2012-06-30 | 2019-03-21 | Senju Metal Industry Co., Ltd. | "Lead-Free Solder Ball" |
CN105479031A (zh) * | 2016-01-29 | 2016-04-13 | 谢拂晓 | 无铅钎料 |
CN112743255A (zh) * | 2019-10-30 | 2021-05-04 | 深圳市聚飞光电股份有限公司 | 锡膏及其制备方法、发光器件 |
Also Published As
Publication number | Publication date |
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JP4732900B2 (ja) | 2011-07-27 |
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