JP2007180267A - 混成集積回路装置 - Google Patents

混成集積回路装置 Download PDF

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Publication number
JP2007180267A
JP2007180267A JP2005377025A JP2005377025A JP2007180267A JP 2007180267 A JP2007180267 A JP 2007180267A JP 2005377025 A JP2005377025 A JP 2005377025A JP 2005377025 A JP2005377025 A JP 2005377025A JP 2007180267 A JP2007180267 A JP 2007180267A
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JP
Japan
Prior art keywords
resistor
power amplifying
amplifying element
metal substrate
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005377025A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007180267A5 (https=
Inventor
Hiroshi Takano
洋 高野
Makoto Murai
誠 村井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2005377025A priority Critical patent/JP2007180267A/ja
Publication of JP2007180267A publication Critical patent/JP2007180267A/ja
Publication of JP2007180267A5 publication Critical patent/JP2007180267A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Parts Printed On Printed Circuit Boards (AREA)
JP2005377025A 2005-12-28 2005-12-28 混成集積回路装置 Withdrawn JP2007180267A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005377025A JP2007180267A (ja) 2005-12-28 2005-12-28 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005377025A JP2007180267A (ja) 2005-12-28 2005-12-28 混成集積回路装置

Publications (2)

Publication Number Publication Date
JP2007180267A true JP2007180267A (ja) 2007-07-12
JP2007180267A5 JP2007180267A5 (https=) 2009-02-19

Family

ID=38305159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005377025A Withdrawn JP2007180267A (ja) 2005-12-28 2005-12-28 混成集積回路装置

Country Status (1)

Country Link
JP (1) JP2007180267A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249475A (ja) * 2010-05-25 2011-12-08 Denso Corp 電力半導体装置
WO2016075985A1 (ja) * 2014-11-13 2016-05-19 株式会社村田製作所 パワー半導体のパッケージ素子

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249475A (ja) * 2010-05-25 2011-12-08 Denso Corp 電力半導体装置
WO2016075985A1 (ja) * 2014-11-13 2016-05-19 株式会社村田製作所 パワー半導体のパッケージ素子
JPWO2016075985A1 (ja) * 2014-11-13 2017-08-31 株式会社村田製作所 パワー半導体のパッケージ素子

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