JP2007180267A - 混成集積回路装置 - Google Patents

混成集積回路装置 Download PDF

Info

Publication number
JP2007180267A
JP2007180267A JP2005377025A JP2005377025A JP2007180267A JP 2007180267 A JP2007180267 A JP 2007180267A JP 2005377025 A JP2005377025 A JP 2005377025A JP 2005377025 A JP2005377025 A JP 2005377025A JP 2007180267 A JP2007180267 A JP 2007180267A
Authority
JP
Japan
Prior art keywords
resistor
power amplifying
amplifying element
metal substrate
circuit device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005377025A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007180267A5 (enExample
Inventor
Hiroshi Takano
洋 高野
Makoto Murai
誠 村井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP2005377025A priority Critical patent/JP2007180267A/ja
Publication of JP2007180267A publication Critical patent/JP2007180267A/ja
Publication of JP2007180267A5 publication Critical patent/JP2007180267A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
JP2005377025A 2005-12-28 2005-12-28 混成集積回路装置 Withdrawn JP2007180267A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005377025A JP2007180267A (ja) 2005-12-28 2005-12-28 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005377025A JP2007180267A (ja) 2005-12-28 2005-12-28 混成集積回路装置

Publications (2)

Publication Number Publication Date
JP2007180267A true JP2007180267A (ja) 2007-07-12
JP2007180267A5 JP2007180267A5 (enExample) 2009-02-19

Family

ID=38305159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005377025A Withdrawn JP2007180267A (ja) 2005-12-28 2005-12-28 混成集積回路装置

Country Status (1)

Country Link
JP (1) JP2007180267A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249475A (ja) * 2010-05-25 2011-12-08 Denso Corp 電力半導体装置
WO2016075985A1 (ja) * 2014-11-13 2016-05-19 株式会社村田製作所 パワー半導体のパッケージ素子

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249475A (ja) * 2010-05-25 2011-12-08 Denso Corp 電力半導体装置
WO2016075985A1 (ja) * 2014-11-13 2016-05-19 株式会社村田製作所 パワー半導体のパッケージ素子
JPWO2016075985A1 (ja) * 2014-11-13 2017-08-31 株式会社村田製作所 パワー半導体のパッケージ素子

Similar Documents

Publication Publication Date Title
JP5885690B2 (ja) 電子部品および電子機器
CN102017135B (zh) 带有在多个接触平面中的元器件的基板电路模块
US9324684B2 (en) Semiconductor device and manufacturing method thereof
CN104051099A (zh) 大功率精密合金贴片电阻器的制作方法
WO2007026944A1 (ja) 回路装置およびその製造方法
JP6261642B2 (ja) 電力半導体装置
JP6508193B2 (ja) 半導体装置の製造方法および半導体装置
JP2016213223A (ja) 半導体装置の製造方法
JP2010537397A (ja) 電気的回路装置及び電気的回路装置の製造方法
CN104835794A (zh) 智能功率模块及其制造方法
CN112490232A (zh) 智能功率模块和智能功率模块的制造方法
JP2016207990A (ja) プリント配線板及び回路基板
JP3544757B2 (ja) 半導体装置及びその製造方法
JP6645362B2 (ja) 半導体装置
JP2007180267A (ja) 混成集積回路装置
JP2019161081A (ja) 電力変換装置及び電力変換装置の製造方法
JP7056364B2 (ja) 回路構成体及び電気接続箱
CN214099627U (zh) 智能功率模块
CN214705927U (zh) 智能功率模块
JP6060053B2 (ja) パワー半導体装置
WO2018168504A1 (ja) 部品実装体及び電子機器
JP5682511B2 (ja) 半導体モジュール
JP2006073943A (ja) 熱電変換装置
CN210349819U (zh) 功率器件模组
JP2010040569A (ja) 電子部品モジュール

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081225

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081225

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090413

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20090717