JP2007173877A5 - - Google Patents
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- Publication number
- JP2007173877A5 JP2007173877A5 JP2007084580A JP2007084580A JP2007173877A5 JP 2007173877 A5 JP2007173877 A5 JP 2007173877A5 JP 2007084580 A JP2007084580 A JP 2007084580A JP 2007084580 A JP2007084580 A JP 2007084580A JP 2007173877 A5 JP2007173877 A5 JP 2007173877A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- semiconductor device
- heat sink
- hole
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 43
- 238000004519 manufacturing process Methods 0.000 claims 13
- 229910000679 solder Inorganic materials 0.000 claims 11
- 125000006850 spacer group Chemical group 0.000 claims 10
- 239000002184 metal Substances 0.000 claims 4
- 238000005476 soldering Methods 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007084580A JP4345835B2 (ja) | 2007-03-28 | 2007-03-28 | 半導体装置及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007084580A JP4345835B2 (ja) | 2007-03-28 | 2007-03-28 | 半導体装置及びその製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13360298A Division JP3959839B2 (ja) | 1998-05-15 | 1998-05-15 | 半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007173877A JP2007173877A (ja) | 2007-07-05 |
| JP2007173877A5 true JP2007173877A5 (enExample) | 2009-05-14 |
| JP4345835B2 JP4345835B2 (ja) | 2009-10-14 |
Family
ID=38299920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007084580A Expired - Fee Related JP4345835B2 (ja) | 2007-03-28 | 2007-03-28 | 半導体装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4345835B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5496845B2 (ja) * | 2010-09-30 | 2014-05-21 | 本田技研工業株式会社 | 電動車両 |
| JP5755196B2 (ja) * | 2012-07-27 | 2015-07-29 | 三菱電機株式会社 | 電力用半導体装置 |
| JP2017107419A (ja) * | 2015-12-10 | 2017-06-15 | 凸版印刷株式会社 | 温度センサを内蔵したｒｆｉｄタグおよび温度センサ付ｉｃパッケージ基板 |
-
2007
- 2007-03-28 JP JP2007084580A patent/JP4345835B2/ja not_active Expired - Fee Related
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