JP2007173679A - 圧電セラミックおよびその製造方法ならびに圧電共振子およびその製造方法 - Google Patents
圧電セラミックおよびその製造方法ならびに圧電共振子およびその製造方法 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 103
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 30
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 23
- 150000001875 compounds Chemical class 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims description 24
- 239000013078 crystal Substances 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 13
- 238000010030 laminating Methods 0.000 claims description 5
- 239000002131 composite material Substances 0.000 claims description 3
- 238000010304 firing Methods 0.000 claims description 3
- 230000008859 change Effects 0.000 description 23
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 230000010287 polarization Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000003475 lamination Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000011780 sodium chloride Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 239000001103 potassium chloride Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- 101100513612 Microdochium nivale MnCO gene Proteins 0.000 description 1
- 229910017493 Nd 2 O 3 Inorganic materials 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02015—Characteristics of piezoelectric layers, e.g. cutting angles
- H03H9/02031—Characteristics of piezoelectric layers, e.g. cutting angles consisting of ceramic
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/176—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of ceramic material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/093—Forming inorganic materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/093—Forming inorganic materials
- H10N30/097—Forming inorganic materials by sintering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8561—Bismuth-based oxides
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/178—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of a laminated structure of multiple piezoelectric layers with inner electrodes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
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- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
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- Inorganic Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
【解決手段】圧電セラミック2を、それぞれ層状をなし、かつ交互に積層される第1および第2の部分11および12をもって構成する。第1および第2の部分11および12は、たとえば、少なくともSr、BiおよびNbを含む複合酸化物のようなビスマス層状構造を有する化合物からなり、c軸の配向度が互いに異なる。配向度によって共振周波数温度特性が変化することから、互いに異なる配向度を有する第1および第2の部分11および12を適宜組み合わせることによって、圧電セラミック2全体としての共振周波数温度特性を容易に調整することができる。
【選択図】図2
Description
P0={ΣI(001)/ΣI(hkl)}
同様にして、配向試料に対しても、反射強度について、ΣI(hkl)およびΣI(001)を求めて、それらの比をPとして次式により求める。
P={ΣI(001)/ΣI(hkl)}
そして、P0およびPを用いて、配向度Fは次式により求められる。
F={(P−P0)/(1−P0)}×100[%]
この発明は、また、上述のような圧電セラミックとこの圧電セラミックに接するように設けられる電極とを備える、圧電共振子にも向けられる。
{(fr125−fr−40)/(fr20×165)}×106[ppm/℃]
の式により求めた。式中、fr125、fr−40およびfr20は、それぞれ、125℃、−40℃および20℃での共振周波数を示す。
2 圧電セラミック
4,5 電極
11 第1の部分
12 第2の部分
21 第1のセラミックグリーンシート
22 第2のセラミックグリーンシート
Claims (8)
- ともにビスマス層状構造を有する化合物からなり、c軸の配向度が互いに異なる、少なくとも第1および第2の部分を有する、圧電セラミック。
- 前記第1および第2の部分は、それぞれ層状をなし、かつ交互に積層されている、請求項1に記載の圧電セラミック。
- 前記第1の部分は正の共振周波数温度係数を有し、前記第2の部分は負の共振周波数温度係数を有する、請求項1または2に記載の圧電セラミック。
- 前記ビスマス層状構造を有する化合物は、少なくともSr、BiおよびNbを含む複合酸化物である、請求項1ないし3のいずれかに記載の圧電セラミック。
- ロットゲーリング法によって測定した配向度において、前記第1の部分のc軸の配向度は70%以上であり、前記第2の部分のc軸の配向度は70%未満である、請求項4に記載の圧電セラミック。
- 請求項1ないし5のいずれかに記載の圧電セラミックと前記圧電セラミックに接するように設けられる電極とを備える、圧電共振子。
- ビスマス層状構造を有する板状結晶粒子を、第1の含有率をもって含有する、第1のセラミックグリーンシートを用意する工程と、
ビスマス層状構造を有する板状結晶粒子を、前記第1の含有率より低い第2の含有率(第2の含有率は0を含む。)をもって含有する、第2のセラミックグリーンシートを用意する工程と、
前記第1および第2のセラミックグリーンシートを交互に積層することによって、積層体を得る工程と、
前記積層体を焼成する工程と
を備える、圧電セラミックの製造方法。 - 請求項7に記載の圧電セラミックの製造方法によって圧電セラミックを得る工程と、前記圧電セラミックに接するように設けられる電極を形成する工程とを備える、圧電共振子の製造方法。
Priority Applications (6)
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---|---|---|---|
JP2005371773A JP4910390B2 (ja) | 2005-12-26 | 2005-12-26 | 圧電セラミックおよびその製造方法ならびに圧電共振子およびその製造方法 |
PCT/JP2006/319679 WO2007074566A1 (ja) | 2005-12-26 | 2006-10-02 | 圧電セラミックおよびその製造方法ならびに圧電共振子およびその製造方法 |
CN2006800491007A CN101346828B (zh) | 2005-12-26 | 2006-10-02 | 压电陶瓷及其制造方法和压电谐振子及其制造方法 |
KR20087015526A KR101021740B1 (ko) | 2005-12-26 | 2006-10-02 | 압전 세라믹 및 그 제조방법 및 압전 공진자 및 그제조방법 |
EP20060811027 EP1968127B1 (en) | 2005-12-26 | 2006-10-02 | Piezoelectric ceramic, process for producing said piezoelectric ceramic, piezoelectric resonator, and process for producing piezoelectric resonator |
US12/147,173 US7750541B2 (en) | 2005-12-26 | 2008-06-26 | Piezoelectric ceramic and method for making the same, and piezoelectric resonator and method for making the same |
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JP2005371773A JP4910390B2 (ja) | 2005-12-26 | 2005-12-26 | 圧電セラミックおよびその製造方法ならびに圧電共振子およびその製造方法 |
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JP2007173679A true JP2007173679A (ja) | 2007-07-05 |
JP4910390B2 JP4910390B2 (ja) | 2012-04-04 |
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US (1) | US7750541B2 (ja) |
EP (1) | EP1968127B1 (ja) |
JP (1) | JP4910390B2 (ja) |
KR (1) | KR101021740B1 (ja) |
CN (1) | CN101346828B (ja) |
WO (1) | WO2007074566A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009051718A (ja) * | 2007-08-29 | 2009-03-12 | Kyocera Corp | 圧電磁器および圧電素子 |
US7700067B2 (en) | 2008-01-21 | 2010-04-20 | Ngk Insulators, Ltd. | Crystallographically-oriented ceramic |
KR101453150B1 (ko) * | 2012-04-30 | 2014-10-23 | 울산대학교 산학협력단 | Rtgg 방법에 의한 무연 압전 세라믹스의 제조방법 및 그에 의해 제조된 무연 압전 세라믹스 |
JP2014529241A (ja) * | 2011-08-19 | 2014-10-30 | クゥアルコム・インコーポレイテッドQualcomm Incorporated | 複合圧電横振動共振器 |
WO2017086026A1 (ja) * | 2015-11-16 | 2017-05-26 | 日本碍子株式会社 | 配向焼結体の製法 |
US10707373B2 (en) | 2016-02-25 | 2020-07-07 | Ngk Insulators, Ltd. | Polycrystalline gallium nitride self-supported substrate and light emitting element using same |
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Publication number | Priority date | Publication date | Assignee | Title |
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WO2008105290A1 (ja) * | 2007-02-26 | 2008-09-04 | Ngk Insulators, Ltd. | 結晶配向セラミックス |
US8410868B2 (en) | 2009-06-04 | 2013-04-02 | Sand 9, Inc. | Methods and apparatus for temperature control of devices and mechanical resonating structures |
US8476809B2 (en) | 2008-04-29 | 2013-07-02 | Sand 9, Inc. | Microelectromechanical systems (MEMS) resonators and related apparatus and methods |
WO2010077313A1 (en) * | 2008-12-17 | 2010-07-08 | Sand9, Inc. | Mechanical resonating structures including a temperature compensation structure |
EP2377244A4 (en) | 2008-12-17 | 2013-09-18 | Sand 9 Inc | MULTI-PORT MECHANICAL RESONANT DEVICES AND RELATED METHODS |
US8689426B2 (en) | 2008-12-17 | 2014-04-08 | Sand 9, Inc. | Method of manufacturing a resonating structure |
US9048811B2 (en) | 2009-03-31 | 2015-06-02 | Sand 9, Inc. | Integration of piezoelectric materials with substrates |
US8736388B2 (en) | 2009-12-23 | 2014-05-27 | Sand 9, Inc. | Oscillators having arbitrary frequencies and related systems and methods |
WO2011109382A1 (en) | 2010-03-01 | 2011-09-09 | Sand9, Inc. | Microelectromechanical gyroscopes and related apparatus and methods |
WO2011133682A1 (en) | 2010-04-20 | 2011-10-27 | Guiti Zolfagharkhani | Microelectromechanical gyroscopes and related apparatus and methods |
WO2012040043A1 (en) | 2010-09-20 | 2012-03-29 | Sand9, Inc. | Resonant sensing using extensional modes of a plate |
US9383208B2 (en) | 2011-10-13 | 2016-07-05 | Analog Devices, Inc. | Electromechanical magnetometer and applications thereof |
CN103360082B (zh) * | 2012-03-31 | 2016-09-14 | 深圳光启创新技术有限公司 | 一种谐振子及制备方法、介质滤波器 |
US10800649B2 (en) | 2016-11-28 | 2020-10-13 | Analog Devices International Unlimited Company | Planar processing of suspended microelectromechanical systems (MEMS) devices |
US10843920B2 (en) | 2019-03-08 | 2020-11-24 | Analog Devices International Unlimited Company | Suspended microelectromechanical system (MEMS) devices |
CN116063072B (zh) * | 2023-01-16 | 2023-09-22 | 西安电子科技大学 | 一种高温压电陶瓷异质结材料及其制备方法 |
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2005
- 2005-12-26 JP JP2005371773A patent/JP4910390B2/ja not_active Expired - Fee Related
-
2006
- 2006-10-02 CN CN2006800491007A patent/CN101346828B/zh not_active Expired - Fee Related
- 2006-10-02 KR KR20087015526A patent/KR101021740B1/ko active IP Right Grant
- 2006-10-02 WO PCT/JP2006/319679 patent/WO2007074566A1/ja active Application Filing
- 2006-10-02 EP EP20060811027 patent/EP1968127B1/en not_active Not-in-force
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2008
- 2008-06-26 US US12/147,173 patent/US7750541B2/en not_active Expired - Fee Related
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Cited By (12)
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JP2009051718A (ja) * | 2007-08-29 | 2009-03-12 | Kyocera Corp | 圧電磁器および圧電素子 |
US7700067B2 (en) | 2008-01-21 | 2010-04-20 | Ngk Insulators, Ltd. | Crystallographically-oriented ceramic |
JP2014529241A (ja) * | 2011-08-19 | 2014-10-30 | クゥアルコム・インコーポレイテッドQualcomm Incorporated | 複合圧電横振動共振器 |
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US9406865B2 (en) | 2011-08-19 | 2016-08-02 | Qualcomm Incorporated | Composite piezoelectric laterally vibrating resonator |
JP2016158268A (ja) * | 2011-08-19 | 2016-09-01 | クゥアルコム・インコーポレイテッドQualcomm Incorporated | 複合圧電横振動共振器 |
KR101736446B1 (ko) * | 2011-08-19 | 2017-05-16 | 퀄컴 인코포레이티드 | 횡진동형 복합 압전 공진기 |
KR101453150B1 (ko) * | 2012-04-30 | 2014-10-23 | 울산대학교 산학협력단 | Rtgg 방법에 의한 무연 압전 세라믹스의 제조방법 및 그에 의해 제조된 무연 압전 세라믹스 |
WO2017086026A1 (ja) * | 2015-11-16 | 2017-05-26 | 日本碍子株式会社 | 配向焼結体の製法 |
CN108349823A (zh) * | 2015-11-16 | 2018-07-31 | 日本碍子株式会社 | 取向烧结体的制造方法 |
US10774002B2 (en) | 2015-11-16 | 2020-09-15 | Ngk Insulators, Ltd. | Method for producing oriented sintered body |
US10707373B2 (en) | 2016-02-25 | 2020-07-07 | Ngk Insulators, Ltd. | Polycrystalline gallium nitride self-supported substrate and light emitting element using same |
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KR20080080339A (ko) | 2008-09-03 |
CN101346828A (zh) | 2009-01-14 |
US7750541B2 (en) | 2010-07-06 |
EP1968127A4 (en) | 2011-07-06 |
WO2007074566A1 (ja) | 2007-07-05 |
JP4910390B2 (ja) | 2012-04-04 |
EP1968127B1 (en) | 2013-02-27 |
US20080284286A1 (en) | 2008-11-20 |
EP1968127A1 (en) | 2008-09-10 |
CN101346828B (zh) | 2010-09-22 |
KR101021740B1 (ko) | 2011-03-15 |
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