JP2007139234A - 熱処理装置 - Google Patents

熱処理装置 Download PDF

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Publication number
JP2007139234A
JP2007139234A JP2005330544A JP2005330544A JP2007139234A JP 2007139234 A JP2007139234 A JP 2007139234A JP 2005330544 A JP2005330544 A JP 2005330544A JP 2005330544 A JP2005330544 A JP 2005330544A JP 2007139234 A JP2007139234 A JP 2007139234A
Authority
JP
Japan
Prior art keywords
shelf
arrangement
heat treatment
placement
members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005330544A
Other languages
English (en)
Japanese (ja)
Inventor
Toshiro Kanda
敏朗 神田
Yukio Nagano
由亀雄 長野
Kenji Ashida
兼治 芦田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Espec Corp
Original Assignee
Espec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Espec Corp filed Critical Espec Corp
Priority to JP2005330544A priority Critical patent/JP2007139234A/ja
Priority to TW095140584A priority patent/TW200732614A/zh
Priority to KR1020060112020A priority patent/KR20070051719A/ko
Priority to CNA2006101465410A priority patent/CN1967118A/zh
Publication of JP2007139234A publication Critical patent/JP2007139234A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
JP2005330544A 2005-11-15 2005-11-15 熱処理装置 Pending JP2007139234A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005330544A JP2007139234A (ja) 2005-11-15 2005-11-15 熱処理装置
TW095140584A TW200732614A (en) 2005-11-15 2006-11-02 Heat treatment apparatus
KR1020060112020A KR20070051719A (ko) 2005-11-15 2006-11-14 열처리 장치
CNA2006101465410A CN1967118A (zh) 2005-11-15 2006-11-15 热处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005330544A JP2007139234A (ja) 2005-11-15 2005-11-15 熱処理装置

Publications (1)

Publication Number Publication Date
JP2007139234A true JP2007139234A (ja) 2007-06-07

Family

ID=38076015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005330544A Pending JP2007139234A (ja) 2005-11-15 2005-11-15 熱処理装置

Country Status (4)

Country Link
JP (1) JP2007139234A (zh)
KR (1) KR20070051719A (zh)
CN (1) CN1967118A (zh)
TW (1) TW200732614A (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010133666A (ja) * 2008-12-05 2010-06-17 Espec Corp 熱処理装置
CN115161558A (zh) * 2022-07-12 2022-10-11 鞍钢股份有限公司 一种超高强度钢丝帘线用盘条、钢丝、帘线及制造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103173823B (zh) * 2013-04-09 2015-09-30 上海华力微电子有限公司 一种应用于铜电镀机台中的退火腔体
SG10201805658QA (en) * 2018-06-29 2020-01-30 Innovative Tool Tech Pte Ltd Heater for semiconductor chips

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002200613A (ja) * 2000-12-28 2002-07-16 Shigeo Ando セメント等の成形品の支持受体およびその支持受体により支持される成形品の養生方法
JP2003194469A (ja) * 2001-12-27 2003-07-09 Tokai Konetsu Kogyo Co Ltd プッシャー式トンネル炉用台板
JP2004053147A (ja) * 2002-07-22 2004-02-19 Imae Kogyo Kk 焼成用セッター
JP2004108670A (ja) * 2002-09-19 2004-04-08 Koyo Thermo System Kk 熱処理装置用ワーク積載装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002200613A (ja) * 2000-12-28 2002-07-16 Shigeo Ando セメント等の成形品の支持受体およびその支持受体により支持される成形品の養生方法
JP2003194469A (ja) * 2001-12-27 2003-07-09 Tokai Konetsu Kogyo Co Ltd プッシャー式トンネル炉用台板
JP2004053147A (ja) * 2002-07-22 2004-02-19 Imae Kogyo Kk 焼成用セッター
JP2004108670A (ja) * 2002-09-19 2004-04-08 Koyo Thermo System Kk 熱処理装置用ワーク積載装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010133666A (ja) * 2008-12-05 2010-06-17 Espec Corp 熱処理装置
CN115161558A (zh) * 2022-07-12 2022-10-11 鞍钢股份有限公司 一种超高强度钢丝帘线用盘条、钢丝、帘线及制造方法

Also Published As

Publication number Publication date
CN1967118A (zh) 2007-05-23
KR20070051719A (ko) 2007-05-18
TW200732614A (en) 2007-09-01

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