TW200732614A - Heat treatment apparatus - Google Patents

Heat treatment apparatus

Info

Publication number
TW200732614A
TW200732614A TW095140584A TW95140584A TW200732614A TW 200732614 A TW200732614 A TW 200732614A TW 095140584 A TW095140584 A TW 095140584A TW 95140584 A TW95140584 A TW 95140584A TW 200732614 A TW200732614 A TW 200732614A
Authority
TW
Taiwan
Prior art keywords
heat treatment
treatment apparatus
placement
rack
base part
Prior art date
Application number
TW095140584A
Other languages
English (en)
Inventor
Toshiro Kanda
Yukio Nagano
Kenji Ashida
Original Assignee
Espec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Espec Corp filed Critical Espec Corp
Publication of TW200732614A publication Critical patent/TW200732614A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
TW095140584A 2005-11-15 2006-11-02 Heat treatment apparatus TW200732614A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005330544A JP2007139234A (ja) 2005-11-15 2005-11-15 熱処理装置

Publications (1)

Publication Number Publication Date
TW200732614A true TW200732614A (en) 2007-09-01

Family

ID=38076015

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140584A TW200732614A (en) 2005-11-15 2006-11-02 Heat treatment apparatus

Country Status (4)

Country Link
JP (1) JP2007139234A (zh)
KR (1) KR20070051719A (zh)
CN (1) CN1967118A (zh)
TW (1) TW200732614A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4896954B2 (ja) * 2008-12-05 2012-03-14 エスペック株式会社 熱処理装置
CN103173823B (zh) * 2013-04-09 2015-09-30 上海华力微电子有限公司 一种应用于铜电镀机台中的退火腔体
SG10201805658QA (en) * 2018-06-29 2020-01-30 Innovative Tool Tech Pte Ltd Heater for semiconductor chips
CN115161558B (zh) * 2022-07-12 2024-04-16 鞍钢股份有限公司 一种超高强度钢丝帘线用盘条、钢丝、帘线及制造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4669125B2 (ja) * 2000-12-28 2011-04-13 成雄 安藤 水硬性材料により形成される成形品の支持受体およびその支持受体により支持される水硬性材料により形成された成形品の養生方法
JP2003194469A (ja) * 2001-12-27 2003-07-09 Tokai Konetsu Kogyo Co Ltd プッシャー式トンネル炉用台板
JP4181809B2 (ja) * 2002-07-22 2008-11-19 井前工業株式会社 焼成用セッター
JP4051500B2 (ja) * 2002-09-19 2008-02-27 光洋サーモシステム株式会社 熱処理装置用ワーク積載装置

Also Published As

Publication number Publication date
CN1967118A (zh) 2007-05-23
JP2007139234A (ja) 2007-06-07
KR20070051719A (ko) 2007-05-18

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