JP2007129002A - 電子部品パッケージ - Google Patents
電子部品パッケージ Download PDFInfo
- Publication number
- JP2007129002A JP2007129002A JP2005319060A JP2005319060A JP2007129002A JP 2007129002 A JP2007129002 A JP 2007129002A JP 2005319060 A JP2005319060 A JP 2005319060A JP 2005319060 A JP2005319060 A JP 2005319060A JP 2007129002 A JP2007129002 A JP 2007129002A
- Authority
- JP
- Japan
- Prior art keywords
- component
- electronic component
- cover
- package
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
【解決手段】部品基板1と、この部品基板1上に所定間隔にて配置された複数の電子部品素子2と、これら複数の電子部品素子2を接続する配線と、前記複数の電子部品素子2および配線を覆うように前記部品基板1に設けた部品カバー3を備え、前記複数の電子部品素子2を仕切るように前記部品基板1に向けて仕切り壁4を前記部品カバー3に設けた。
【選択図】図1
Description
2,2a,2b,2c,2d,2e,2f,2g,2h,2i SAW素子
3 部品カバー
4 仕切り壁
5 SAWパッケージ
6 接続電極
7 実装基板
8 モールド樹脂
21 マスク
22 開口部
31ab,31cd,31e,31fg,31hi 凹部
32 連通路
33 配線
34 送信端子
35 受信端子
36 アンテナ端子
54,55,56,57 電極パッド
Claims (4)
- 部品基板と、この部品基板上に所定間隔にて配置された複数の電子部品素子と、これら複数の電子部品素子を接続する配線と、前記複数の電子部品素子および配線を覆うように前記部品基板に設けた部品カバーを備え、前記複数の電子部品素子を仕切るように前記部品基板に向けて仕切り壁を前記部品カバーに設けた電子部品パッケージ。
- 仕切り壁により仕切られた空洞間に連通路を設けた請求項1記載の電子部品パッケージ。
- 連通路は、配線の非形成部に設けた請求項2記載の電子部品パッケージ。
- 部品基板と、この部品基板上に所定間隔にて配置された複数の電子部品素子と、これら複数の電子部品素子を接続する配線と、前記複数の電子部品素子および配線を覆うように前記部品基板に設けた部品カバーを備え、前記複数の電子部品素子を仕切るように前記部品基板に向けて複数の支柱を前記部品カバーに設けた電子部品パッケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005319060A JP4779579B2 (ja) | 2005-11-02 | 2005-11-02 | 電子部品パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005319060A JP4779579B2 (ja) | 2005-11-02 | 2005-11-02 | 電子部品パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007129002A true JP2007129002A (ja) | 2007-05-24 |
JP4779579B2 JP4779579B2 (ja) | 2011-09-28 |
Family
ID=38151405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005319060A Active JP4779579B2 (ja) | 2005-11-02 | 2005-11-02 | 電子部品パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4779579B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170117188A (ko) | 2015-03-27 | 2017-10-20 | 가부시키가이샤 무라타 세이사쿠쇼 | 전자 부품 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6020538A (ja) * | 1983-07-15 | 1985-02-01 | Hitachi Ltd | 半導体装置 |
JP2001185976A (ja) * | 1999-12-24 | 2001-07-06 | Kyocera Corp | 弾性表面波装置 |
-
2005
- 2005-11-02 JP JP2005319060A patent/JP4779579B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6020538A (ja) * | 1983-07-15 | 1985-02-01 | Hitachi Ltd | 半導体装置 |
JP2001185976A (ja) * | 1999-12-24 | 2001-07-06 | Kyocera Corp | 弾性表面波装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170117188A (ko) | 2015-03-27 | 2017-10-20 | 가부시키가이샤 무라타 세이사쿠쇼 | 전자 부품 |
US10812042B2 (en) | 2015-03-27 | 2020-10-20 | Murata Manufacturing Co., Ltd. | Electronic component |
Also Published As
Publication number | Publication date |
---|---|
JP4779579B2 (ja) | 2011-09-28 |
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