JP2007126703A - Film deposition apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film deposition apparatus for performing the film deposition on one surface side of a substrate while conveying the substrate mounted on a carrier together with the carrier in-line, which is capable of eliminating any adverse effect in the quality aspect caused by wear scraps even when the wear scraps consisting of a ferromagnetic material are generated in a conveying system. <P>SOLUTION: A wear scrap attraction unit 10 for preventing diffusion of wear scraps from a wear scrap generation part by attracting the wear scraps consisting of a ferromagnetic material by the magnetic force generated at the wear scrap generation part is provided near the wear scrap generation part in a conveying system. In the first wear scrap attraction unit 10, a magnet 12 is arranged in contact with an attraction member 11 consisting of a magnetic material, and the attraction member 11 is magnetized. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a film forming apparatus for forming a film on one surface side of a processing substrate while carrying the entire substrate in-line with the processing substrate mounted on the carrier, and in particular, a large-sized glass for a display panel. Sputtering equipment that sputters an ITO film for an electrode on one side of the processing substrate by carrying out sputtering processing while carrying it in-line while the processing substrate having the substrate as a base substrate is mounted on a carrier. And a carrier for a sputtering apparatus used therefor.

In recent years, progress toward an information society has been remarkable, and the use of display devices has been diversified, and various display devices have been developed and put into practical use.
In particular, liquid crystal display devices have been widely used in place of CRT (Cathode-Ray Tube, CRT).
In a liquid crystal panel for color display for a liquid crystal display device, light from a backlight is displayed through a colored layer of each color, but the light passing through the colored layer of each color is liquid crystal for each pixel. Are controlled on and off as switching elements.
A transparent conductive ITO film (indium oxide doped with tin) has been conventionally used as a material for a control electrode for on-off control using a liquid crystal as a switching element for each pixel.
As a method for forming an ITO film, a method for forming a desired ITO film by sputtering an ITO on a substrate under a predetermined sputtering condition using an ITO sintered body as a target is disclosed in JP-A-6-24826. It is known in Japanese Patent Publication (Patent Document 1), Japanese Patent Laid-Open No. 6-247765 (Patent Document 2), and the like.
Japanese Patent Laid-Open No. 6-24826 JP-A-6-247765

Impositional production is carried out from the viewpoint of productivity improvement and cost reduction, but there is a strong demand for enlargement of the transparent glass substrate used for this, and recently, the G6 generation (1800 mm x 1500 mm size) ) Mass production with large glass substrates is becoming a reality.
And, from the aspect of productivity, in-line deposition of the ITO film on the processing substrate using such a large glass substrate is performed in-line, as shown in FIG. An inline ITO sputter deposition apparatus has also been proposed.
In the sputtering apparatus shown here, as shown in FIG. 6 (b), a processing substrate 863 having a large glass substrate as a base substrate is mounted on a carrier 860 and placed in a vertical direction 892, in-line. Then, sputtering is performed while being conveyed, and an ITO film for electrodes is formed on one surface side of the processing substrate 863 by sputtering.
Briefly, the processing substrate 863 is put into the loading chamber 811, passed through the preliminary chamber 812, put into the first sputter chamber 883, sputtered while being transported, and carried into the rotation processing unit 820, where Each carrier is rotated 180 degrees by the rotating unit, the direction is changed, and the carrier is put into the second sputtering chamber 833 and sputtered while being conveyed.
Then, after sputtering, the material is unloaded through the preliminary chamber 832 and the unloading chamber 831.
Here, as illustrated in FIG. 6B, in a state where the processing substrate 863 is placed on a support member having a frame body 861 for holding the processing substrate 863, which is called a carrier (also referred to as a substrate holder) 860. The carrier 860 is conveyed in a standing state.
The carrier 860 includes a processing substrate holding portion 101 that holds the processing substrate 863 in order by fitting the processing substrate 863 and the back plate 861 into the frame 861, and the processing substrate 863 is arranged along the vertical direction 892. The carrier 860 is fitted into the processing substrate holding part 101 in a state where it stands upright.
Then, as shown in FIG. 6A, the processing substrate 863 is mounted on the carrier 860 together with the processing substrate holding unit 101, transported in the horizontal direction 891, and stood along the vertical direction 892. Sputtering is performed parallel to 871 and facing.
In FIG. 6A, a dotted arrow indicates the conveyance direction of the carrier 860.
Although not shown, the sputtering method here is designed so that the magnetic field is closed between the outer magnetic pole and the inner magnetic pole on the back side of the target 871 (the side opposite to the processing substrate 863 side). Is of a magnetron sputtering method, so that it exists only in the vicinity of the target 871.
An example of a large-size processing substrate is a color filter-formed substrate in which a colored layer of each color is formed as a color filter (hereinafter also referred to as CF) on one surface side of a large-size transparent glass substrate. An ITO film for electrodes is formed on the CF forming surface side of the substrate.

In the carrier 860 shown in FIG. 6B, a groove in which a groove for transmitting a driving force from a driving motor (not shown on the carrier side) (not shown) by meshing with a gear (not shown) is cut. A forming portion 868 is provided at the lower portion thereof, and in order to suppress wear by the gears as much as possible, conveyance support rails 866 and 867 having flat portions on both sides in the traveling direction of the groove forming portion 868 of the carrier 860 and below, It is provided to support the load of the carrier, and the flat portions of the carrier support rails 866 and 868 are placed on a rotating body 869 such as a bobbin different from the gear on the main body side.
The carrier 860 is conveyed by receiving the driving force from the driving motor by the engagement of the gears at the groove forming portion 868 while being held by the conveying support rails 866 and 867 provided below the carrier 860.
In the G6 generation, the combined weight of the processing substrate 863 to be sputtered and the carrier 860a is about 100 kg, so wear is inevitably generated. Thus, the fitting between the groove forming portion 200 and the gear is reduced as much as possible. is doing.
As a material of the carrier 860, Ti is preferably used from the viewpoint of weight and rigidity.
Sputtering is performed in an Ar gas atmosphere under a pressure of 10 ⁻⁵ torr to 10 ⁻² torr using a ITO film having a film composition to be deposited as a target.
In this case, it is required to form the film at a low temperature from the viewpoint of heat resistance (degassing from CF) of the colored layer forming CF.
In addition, in such a magnetron sputtering method, for example, a sintered target material having a composition of In ₂ O ₃ , 90 w% + SnO ₂ , 10 w% is used in a low temperature sputtering with a thickness of 8 mm to 15 mm.
For example, as a target, a Cu plate is used as a backing material, an indium solder is used as an adhesive layer, and the joints are slanted to join six sintered target materials.

In such a sputtering apparatus, as described above, the conveyance support rails 866 and 867 for supporting the load of the carrier and the rotating body 869 come into contact with each other in a state where the load is applied, so that the carrier is roller-conveyed. Wear debris is generated at the contact point.
Further, since the gear 210 and the groove forming portion 200 are fitted to each other and used as a transport driving force, wear debris is generated here.
In particular, in a processing substrate based on a glass substrate of the G6 generation size, the combined weight of the processing substrate 863 to be sputtered and the carrier 860 is about 100 kg.
As much as possible, the fitting between the groove forming portion 200 and the gear 200 is reduced.
As a material of the carrier 860, Ti is preferably used from the viewpoint of weight and rigidity.

As described above, in recent years, progress toward the information society has been remarkable, and the use of display devices has been diversified. In particular, liquid crystal display devices have become widespread, improving productivity and reducing costs. Therefore, imposition production is performed, but there is a strong demand for larger processing based on the glass substrate used for this, and recently, a large transparent glass substrate of G6 generation (1800 mm × 1500 mm size). Mass production at has become a reality.
In such a situation, in the sputtering apparatus as shown in FIG. 6A, the sputtering process is performed while the target 871 and the processing substrate 863 face each other in an upright state. However, wear debris is inevitably generated, which is a problem in terms of quality, and this countermeasure has been demanded.
The present invention is corresponding to this, and is a film forming apparatus for forming a film on one surface side of the processing substrate while carrying the entire substrate in-line with the processing substrate mounted on the carrier. An object of the present invention is to provide a film forming apparatus capable of eliminating the adverse effects on the quality caused by the wear debris even when the wear debris made of the body material is generated.
In particular, when processing a large-sized processing substrate of G6 generation or more with a vertical in-line sputtering apparatus that performs sputtering processing while transporting the target and the processing substrate facing each other in a standing state, ferromagnetic An object of the present invention is to provide a sputtering apparatus capable of eliminating the adverse effect on quality due to wear debris made of body material.

The sputtering apparatus of the present invention is a film forming apparatus for forming a film on one surface side of a processing substrate while carrying the entire substrate in-line with the processing substrate mounted on the carrier, and generates wear debris in the transport system. A first wear debris adsorbing portion is provided in the vicinity of the location for attracting the wear debris made of a ferromagnetic material generated at the location where the wear debris is generated by magnetism to prevent dispersion from the location where the wear debris is generated. The first wear residue adsorbing portion is characterized in that a magnet is disposed in contact with the adsorbing material made of a magnetic material, and the adsorbing material is magnetized. is there.
In the above-described film forming apparatus, the first wear residue adsorbing portion is configured to shield the wear residue occurrence site or to arrange the adsorption material on the lower side where the wear residue occurrence site is shielded. It is characterized by the above-mentioned, and the partition part which distribute | arranged and divided | segmented the said adsorption | suction material so that the said wear residue generation | occurrence | production site | part may be shielded is locally characterized.
Further, in any one of the above film forming apparatuses, the wear residue generating source of the wear residue generation site is made of a magnet material.
Further, in any one of the film forming apparatuses described above, the wear debris carried along with the carrier conveyance below the loading chamber and the unloading chamber, and the lower side due to the change in vacuum pressure during loading or unloading. The second wear debris adsorbing portion that adsorbs the wear debris falling on the magnet by magnetism, the second wear debris adsorbing portion is arranged in contact with the adsorbing material made of a magnetic material, The adsorption material is magnetized.
Further, in any one of the above film forming apparatuses, the processing substrate is roller-transferred using the carrier as a drive source and a gear separate from the carrier as a driving source, and the carrier has a roller-transporting rail below the carrier. And a fitting tooth portion to be fitted with the gear is provided in a straight line, and a driving force for conveyance is obtained from the fitting tooth portion, and is roller-conveyed. is there.
Further, in any one of the above film forming apparatuses, the processing substrate is a color filter forming substrate in which a glass substrate is used as a base substrate and a colored layer of each color is formed as a color filter on one surface side of the glass substrate. It is a sputtering apparatus for sputtering an ITO film on the filter forming surface side.

(Function)
The sputtering apparatus according to the present invention is a film forming apparatus for forming a film on one surface side of the processing substrate while carrying the carrier in-line in a state where the processing substrate is mounted on the carrier. Even if wear debris made of a ferromagnetic material is generated in the transport system, it is possible to provide a film forming apparatus that can eliminate the adverse effect on quality due to the wear debris.
In particular, when processing a large size processing substrate of G6 generation or more with a vertical in-line sputtering apparatus that performs sputtering processing while transporting the target and the processing substrate facing each other in a standing state, wear debris is lost. It is possible to provide a sputtering apparatus that can eliminate the adverse effects on quality due to the above.
Specifically, in order to prevent the dispersion of the wear debris from being generated by attracting the wear debris made of the ferromagnetic material generated at the wear debris generation site in the vicinity of the wear debris generation site in the transport system. The first wear debris adsorbing portion is provided with a magnet in contact with the adsorbing material made of a magnetic material so that the adsorbing material becomes magnetized. This is achieved by being
Specifically, the first wear debris adsorbing portion is formed by placing a magnet in contact with an adsorbing material made of a magnetic material, and magnetizing the adsorbing material, and there are various shapes for the adsorbing material. Can be taken.
Also, wear debris can be easily adsorbed simply by placing a magnet in contact therewith.
Specifically, the first wear debris adsorbing portion is configured to dispose the adsorbing material on the lower side so as to shield the wear debris generation site or to shield the wear debris generation site. Examples of the invention may be mentioned.
In the case where the adsorbent is disposed so as to shield the wear residue generation site, the distribution of the wear residue from the wear residue generation site can be reliably prevented.
Of course, even if the shielding object that shields the wear debris generation site is not the first wear debris adsorption part, the wear debris generation site is reliably provided by arranging the adsorbing material on the lower side that shields the wear debris occurrence site. It is possible to prevent the dispersion of the wear residue from.
In the invention of claim 2, the partition portion is locally exhausted by partitioning the adsorbing material so as to shield the wear debris generation site. The pressure is lower than the outside, and the wear residue can be effectively prevented from flowing out of the partition part.
The wear residue generation source of the wear residue generation site is made of a magnet material, and the wear residue is a magnet. Therefore, the wear residue is a magnet. It is possible to reduce the probability of adhering to the adhesion preventing plate and adhering to the glass substrate to be formed.
Further, the second wear residue adsorbing portion is disposed below the loading chamber and the unloading chamber, so that the lower side is caused by a change in vacuum pressure during loading or unloading. The wear debris that falls can be adsorbed and the quality can be prevented from being deteriorated by repeated use of the carrier.
Then, the processing substrate is a carrier substrate, and a processing substrate having a G6 generation size glass substrate as a base substrate by roller transport using a gear separate from the carrier as a driving source. Even in the case where the load of the carrier and the processing substrate is large as in the case of the transfer, the transfer is possible.
Sputtering apparatus in which a processing substrate is a color filter forming substrate in which a glass substrate is used as a base substrate and a colored layer of each color is formed as a color filter on one surface side of the glass substrate, and an ITO film is formed on the color filter forming surface side by sputtering. Although the form of invention of Claim 7 is mentioned, it is effective in terms of mass productivity and quality.

As described above, the present invention is a film forming apparatus for forming a film on one surface side of a processing substrate while transferring the whole substrate in-line with the processing substrate mounted on the carrier. The present invention makes it possible to provide a film forming apparatus that can eliminate the adverse effects on quality due to wear debris even when wear debris made of material occurs.
In particular, in a vertical in-line sputtering apparatus that performs sputtering processing while conveying the target and the processing substrate in an upright state, a large glass substrate of G6 generation or more is used as a base substrate, When sputter processing is performed using a color filter-formed substrate in which a colored layer of each color is formed as a color filter on one side of a glass substrate as a processing substrate, the adverse effect on quality due to wear debris made of a ferromagnetic material in the transport system is eliminated. It is possible to provide a sputtering apparatus that can perform the above process.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 1A shows a first wear debris adsorbing portion at a gear fitting wear location of an example of an embodiment of the sputtering apparatus of the present invention, and FIG. 1B is a view of FIG. FIG. 2A is a view from the A1 side, and FIG. 2A shows a first wear debris adsorbing portion at a wear portion of the roller conveyance in one example of the embodiment of the sputtering apparatus of the present invention. 2 is a view from the B1 side of FIG. 2 (a), FIG. 3 is a view showing a second wear residue adsorbing portion disposed in the loading chamber, and FIG. 4 (a) shows a carrier and a rotating roll for conveyance. FIG. 4B is a schematic cross-sectional view, and FIG. 4B is a view showing the carrier and the gear for driving the drive, as viewed from the direction C1 in FIG. 4A. FIG. FIG.
FIGS. 1 and 2 are views showing gears and the like as seen through the adsorbing material of the first wear residue adsorbing portion.
FIG. 4 shows a rotating roller and a gear in addition to the carrier.
1 to 5, 10 is a first wear debris adsorbing part, 11 is an adsorbing material, 12 is a magnet, 15 is a second wear debris adsorbing part, 20 is a target, 21 is a shielding plate, 22 is a backing plate, Reference numeral 23 denotes a holding portion, 30 denotes a loading chamber, 31 denotes a chamber chamber, 32 denotes a wall portion, 100 denotes a carrier, 101 denotes a processing substrate holding portion, 110 denotes a frame, 120 denotes a back plate, 130 denotes a processing substrate, and 150 denotes a supporting portion 161, 162 are positioning rotary rolls, 161a, 162a are shafts, 171 and 172 are conveyance support rails (also simply referred to as support parts), 190 is a rotary roll (also referred to as a rotating body), 190a is a shaft, and 200 is a groove forming part. , 210 is a gear.

First, an example of an embodiment of a sputtering apparatus of the present invention will be described with reference to the drawings.
The sputtering apparatus of this example is in-line with a processing substrate 130 having a large transparent glass substrate of G6 generation size (1800 mm × 1500 mm size) or larger for a display panel as a base substrate mounted on a carrier. 6 is a magnetron sputtering type sputtering apparatus that performs sputtering processing while transporting and sputter-deposits an ITO film for electrodes on one surface side of the processing substrate, and has the same arrangement as the arrangement shown in FIG. It is.
In this example, in the sputtering process, the processing substrate 130 is mounted on the carrier 100 shown in FIG. 4A, and as shown in FIG. The sputtering process is carried out while facing and parallel to each other.
In particular, the apparatus is provided with a wear residue adsorbing portion that magnetically adsorbs wear residue made of a ferromagnetic material generated in the transport system.
In the sputtering apparatus of this example, as shown in FIG. 4, the carrier 100 includes a processing substrate holding unit 101 that holds the processing substrate 130 by fitting the processing substrate 130 and the back plate 120 into the frame 110 in order. .
Here, a color filter forming substrate in which a colored layer of each color is formed as a color filter on one surface side of a G6 generation size transparent glass substrate is used as the processing substrate 130, and an ITO film is formed by sputtering on the color filter forming surface side. To do.

In this example, as shown in FIG. 1, in the transport system, a first portion that magnetically adsorbs wear debris made of a ferromagnetic material at a gear fitting wear location where the gear 210 and the groove forming portion 200 are fitted. A wear residue adsorbing portion 10 is provided.
Here, an adsorption material 11 made of a magnetic material is disposed so as to cover a side surface and a lower portion of the wear residue generation site, and a magnet 12 is disposed on the lower inner surface of the adsorption material, so that the first wear residue adsorption unit 10 is disposed. It is said.
As described above, by arranging the magnet 12 in contact with the attracting material 11 made of a magnetic material, the attracting material 11 made of a magnetic material is magnetized, and wear debris made of a ferromagnetic material is attracted magnetically. .
Further, in this example, in the transport system, the rotating body 190 contacts the transport rails 171 and 172 in order to transport the transport rails 171 and 172 below the carrier 100 while supporting the load while rotating. As shown in FIG. 2, the first wear debris adsorbing portion 10 that magnetically adsorbs the wear debris made of a ferromagnetic material is provided so as to cover the side surface and the lower portion of the rotating body 190 as shown in FIG. Yes.
Also in this case, the magnet is disposed in contact with the adsorbing material made of the magnetic material, so that the adsorbing material 11 made of the magnetic material is magnetized, and wear debris made of the ferromagnetic material is adsorbed magnetically.

Further, in this example, as shown in FIG. 3, the wear debris carried along with the carrier (100 in FIG. 4) is transported to the lower portion of the loading chamber 30 due to a change in vacuum pressure during loading. A second wear residue adsorbing portion 15 that adsorbs the falling wear residue by magnetism is provided.
The second wear debris adsorbing portion 15 also has a magnet 12 in contact with the adsorbing material 11 made of a magnetic material, and magnetizes the adsorbing material. Here again, the adsorbing material made of the magnetic material Since the magnet 12 is disposed in contact with the magnet 11, the attracting material 11 made of a magnetic material is magnetized, and wear debris made of a ferromagnetic material is attracted magnetically.
Although not shown in the figure, in this example, the wear debris that has been carried along with the transport of the carrier also in the lower portion of the unloading chamber, and the debris that falls downward due to the change in the vacuum pressure during unloading. A second wear residue adsorbing portion 15 that is adsorbed by magnetism is provided.

Here, as the target 10, for example, a sintered target material having a composition of In ₂ O ₃ , 90 w% + SnO ₂ , 10 w% and having a thickness of 8 mm to 15 mm is used, but the size is increased. For this purpose, a Cu plate is used as a backing material, indium solder is used as an adhesive layer, and a plurality of sintered target materials are connected to form a square shape.
Sputtering is performed in an Ar gas atmosphere under a pressure of 10 ⁻⁵ torr to 10 ⁻² torr using a plate-shaped ITO having a film composition to be formed as a target.
In this case, film formation is performed at a low temperature from the viewpoint of heat resistance (degassing from CF) of the colored layer forming CF.

The sputtering apparatus of this example performs the sputtering process while being transported in the same way as the sputtering apparatus shown in FIG. 6. The flow from the placement of each chamber and the loading and unloading of the processing substrate is basically shown in FIG. This is the same as the sputtering apparatus shown in FIG.
The carrier 100 in this example is the same as the carrier 860 shown in FIG.
The carrier 100 is basically transported in the same manner as the sputtering apparatus shown in FIG. 6, and as shown in FIG. 4, a groove is formed by cutting a groove that transmits the driving force from the driving motor by meshing with the gear 210. The portion 200 is provided at the lower portion of the carrier 100, and further, in order to suppress wear due to the gear 210 as much as possible, a conveyance support rail 171 having a flat portion on both sides and below the groove forming portion 200 of the carrier 100, 172 is provided to support the load of the carrier so that the flat portions of the carrier-side transport support rails 171 and 172 ride on a rotating body 190 such as a bobbin different from the gear 210 on the main body side. It has become.
In this example, a plurality of such rotating bodies 190 and gears 210 are arranged along the conveyance path for conveyance.

In the sputtering apparatus of this example, simply, the processing substrate 130 (corresponding to 863 in FIG. 6) is put into a loading chamber (corresponding to 811 in FIG. 6), and a spare chamber (corresponding to 812 in FIG. 6) is provided. Then, it is put into a first sputtering chamber (corresponding to 813 in FIG. 6), sputtered while being transported, and carried into a rotation processing part (corresponding to 820 in FIG. 6). The direction is changed, the direction is changed, and the second sputter chamber (corresponding to 833 in FIG. 6) is charged and sputtered while being conveyed.
Then, after sputtering, it is unloaded through a preliminary chamber (corresponding to 832 in FIG. 6) and an unloading chamber (corresponding to 831 in FIG. 6).
In addition, there is a mechanical partition at the boundary of each chamber, and the opening of each partition is performed with the same degree of vacuum in the chambers on both sides.
Moreover, about the material of frame 110 other than the process board | substrate holding | maintenance part 101, rigidity, big, strong, and a light thing are preferable, and Ti and stainless steel are mentioned.

The sputtering apparatus of this example is one example, and the present invention is not limited to this.
The form which applies the structure of the 1st wear residue adsorption | suction part 10 of this example shown in FIG. 1 and the 2nd abrasion residue adsorption | suction part 15 to the magnetron type | system | group sputtering apparatus of another form is mentioned.
Moreover, the form which sputter | spatters in the state which inclined the process board | substrate 130 and the target 10 from the perpendicular direction, or was made into a horizontal state and mutually opposed in parallel is also mentioned.
Of course, it is good also as a form which provided the structure arrangement | positioning of each part shown in FIG. 6 linearly.

As a modification of the sputtering apparatus of this example, in this example, instead of the structure of the first wear residue adsorbing portion 10 shown in FIGS. The thing of the arranged structure is also mentioned.
Furthermore, a configuration is also possible in which a partition portion is configured by partitioning the adsorption material so as to shield a place where the wear residue is generated, and the partition portion is locally exhausted.
In this case, the partition portion can be set to a lower pressure than the outside, and wear debris can be effectively prevented from flowing out of the partition portion.
Moreover, the form by which the abrasion residue generation source of the abrasion residue generation | occurrence | production site | part is created with the magnet material is also mentioned.
In this case, since the abrasion debris is a magnet, it is possible to reduce the probability of adhering to the glass substrate on which the film is formed by being attracted to the chamber of the film forming apparatus and the deposition preventing plate at the time of film forming.

FIG. 1A shows a first wear debris adsorbing portion at a gear fitting wear location of an example of an embodiment of the sputtering apparatus of the present invention, and FIG. 1B is a view of FIG. It is the figure seen from the A1 side. FIG. 2 (a) shows the first wear residue adsorbing portion at the wear location of the roller conveyance in one example of the embodiment of the sputtering apparatus of the present invention. FIG. 2 (b) is a view of FIG. 2 (a). It is the figure seen from the B1 side. It is the figure which showed the 2nd wear residue adsorption | suction part arrange | positioned in the loading chamber. FIG. 4A is a schematic cross-sectional view showing a carrier and a rotating roll for conveyance, and FIG. 4B is a diagram showing a carrier and a gear for conveying driving as viewed from the direction C1 in FIG. is there. It is sectional drawing which showed the opposing state of the target and the carrier. FIG. 6A is a schematic arrangement view of an in-line type ITO sputtering film forming apparatus, and FIG. 6B is a view showing a carrier used in the ITO sputtering film forming apparatus shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 1st wear debris adsorption part 11 Adsorption material 12 Magnet 15 2nd wear debris adsorption part 20 Target 21 Shielding plate 22 Backing plate 23 Holding part 30 Loading chamber 31 Chamber room 32 Wall part 100 Carrier 101 Processing substrate holding part 110 Frame Body 120 Back plate 130 Processing substrate 150 Supporting portions 161 and 162 Positioning rotary rolls 161a and 162a Shafts 171 and 172 Conveyance support rails (also simply referred to as support portions)
190 Rotating roll (also called rotating body)
190a Shaft 200 Groove forming part 210 Gear 811 Loading chamber 812 Preliminary chamber 813 Sputtering chamber 820 Rotating processing part 821 Rotating part 831 Unloading chamber 832 Preliminary chamber 833 Sputtering chamber 841 to 843 Chamber partition 841a to 843a Chamber partition 860, 860a Carrier 860A Substrate Holding portion 861 Frame body 862 Back plate (also referred to as pressing plate)
863 Processing substrate 864 Support unit 865 Positioning rotation rollers 865a and 865b Shafts 866 and 867 Support unit (support unit for conveyance)
868 Groove forming portion 869 Rotating roller (also referred to as rotating portion)
869a shaft 871 target 891 horizontal direction 892 vertical direction

Claims (7)

  A film forming apparatus for forming a film on one surface side of a processing substrate while conveying the carrier in-line in a state where the processing substrate is mounted on the carrier. A first wear debris adsorbing portion for attracting the wear debris made of a ferromagnetic material generated at the occurrence location by magnetism and preventing dispersion from the occurrence location of the wear debris is provided. The film deposition apparatus according to claim 1, wherein the wear residue adsorbing portion is a magnet arranged in contact with an adsorbing material made of a magnetic material, and magnetized on the adsorbing material.   2. The film forming apparatus according to claim 1, wherein the first wear debris adsorbing portion is arranged so as to shield the wear debris generation site or to arrange the adsorbing material on the lower side where the wear debris generation site is shielded. A film forming apparatus characterized by that.   3. The film forming apparatus according to claim 2, wherein the adsorbing material is arranged and partitioned so as to shield the wear residue generation site, and the partition portion is locally evacuated.   4. The film forming apparatus according to claim 1, wherein a wear residue generating source of the wear residue generation site is made of a magnet material. 5.   5. The film forming apparatus according to claim 1, wherein the wear debris carried along with the carrier is transported to a lower portion of the loading chamber and the unloading chamber, and a vacuum at the time of loading or unloading. It is provided with a second wear residue adsorbing part that magnetically adsorbs the wear residue falling downward due to the pressure change, and the second wear residue adsorbing part is in contact with the adsorbing material made of a magnetic material. A film forming apparatus, wherein a magnet is provided and the adsorbing material is magnetized.   The film forming apparatus according to any one of claims 1 to 5, wherein the substrate is roller-rolled by using a processing substrate as a carrier and a gear separate from the carrier as a driving source. A roller conveying rail and a fitting tooth portion that engages with the gear are provided in a straight line at the bottom, and a driving force for conveyance is obtained from the fitting tooth portion, and the roller is conveyed. A film forming apparatus. 7. The film forming apparatus according to claim 1, wherein the processing substrate has a glass substrate as a base substrate, and a colored layer of each color is formed as a color filter on one surface side of the glass substrate. A film forming apparatus, comprising: a filter forming substrate, and a sputtering apparatus for forming an ITO film on the color filter forming surface side by sputtering.

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