JP2007125636A - Electroformed thin edge grinding wheel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electroformed thin edge grinding wheel for use in cutting an electronic material part such as a QFN (quad flat non-leaded package), an optical transmission module (IrDA) or an LED work, not only restraining the generation of burr, but also having high linearity to achieve high-accuracy cutting, further superior in wear resistance and peeling resistance to attain a long life of a grinding wheel and stably maintain a high grade to the cut electronic material part. <P>SOLUTION: This electroformed thin edge grinding wheel includes a thin edge abrasive layer 1 formed by dispersing abrasive grains 3 in a metal plated phase 2, wherein the thin edge abrasive grain layer 1 has first to fifth abrasive grain layers 1A to 1E sequentially stacked in the direction of a layer thickness. Among these, the content of abrasive grains 3 in the first, third and fifth abrasive grain layers 1A, 1C, 1E is set larger than that of abrasive grains 3 in the second and fourth abrasive grain layers 1B, 1D. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention is an electroformed thin blade suitable for use in cutting after molding, particularly when an electronic material part is manufactured by cutting it after mounting it on a substrate and molding it after molding. It relates to a grindstone.

  Conventionally, an electroformed thin blade whetstone composed of an ultrathin abrasive layer in which superabrasive grains such as diamond are dispersed in a metal plating phase such as nickel has been used for cutting when manufacturing such electronic material parts. . However, in recent years, as such electronic material parts, a large number of elements are collectively mounted on a lead frame and molded together, such as a so-called QFN (quad flat non-leaded package). Substrates made of glass epoxy resin, such as electronic material parts manufactured by cutting into individual pieces and optical transmission modules (hereinafter simply referred to as IrDA) conforming to IrDA (Infrared Data Communication Association) standards Electrodes such as those having a substrate plated with Ni, Au, Cu, etc. on the inner peripheral surface of the through-hole formed in the above, or an LED work having a base made of glass epoxy resin having a metal electrode The number of material parts is increasing, and when manufacturing such electronic material parts, molding resin Since the thin-blade grindstone cuts highly ductile metal lead frames such as Cu, plating, and electrodes that are spaced apart from each other, the thin-blade grindstone feed direction and rotational direction (downward) during cutting There is a problem that metal burrs such as lead frames and electrodes are easily generated.

Thus, for example, Patent Document 1 discloses a cutting blade in which an annular cutting edge portion is configured by an electroformed abrasive grain layer in which abrasive grains are fixed by plating, and the annular cutting edge portion is a low-concentration abrasive. A central electroformed abrasive grain layer formed of a grain layer and outer electroformed abrasive grains formed on both sides of the central electroformed abrasive grain layer formed of an abrasive grain layer having a higher concentration than the central electroformed abrasive grain layer. A cutting blade (electroformed thin blade grindstone) composed of a cast abrasive grain layer has been proposed. According to Patent Document 1, according to such a cutting blade, a large amount of the central electroformed abrasive layer is worn by dressing or use, and an annular recess is formed in the center in the width direction of the outer periphery of the annular cutting edge. It is described that burrs are prevented from being generated because chips are taken in and removed from the annular recess.
JP 2002-331464 A

  However, in such a three-layer electroformed thin blade whetstone composed of the central electroformed abrasive grain layer described in Patent Document 1 and the outer electroformed abrasive grain layers on both sides thereof, the central electroforming component is cut when the electronic material component is cut as described above. When the cast abrasive layer wears out and an annular recess is formed, a pair of outer electroformed abrasive layers on both sides are cut in advance to intermittently cut the metal lead frame and metal electrode in the molding resin. Therefore, for example, when cutting, the pair of outer electroformed abrasive layers are not simultaneously cut into contact with the lead frame and the electrodes, and resistance and load acting on both outer electroformed abrasive layers are not affected. If it becomes uniform, the thin-blade grindstone may wobble in the direction of the thickness of the abrasive layer, and there is a risk of meandering. And if the thin blade grindstone meanders during cutting in this way, the cutting width by the grindstone must be set large, so the number of electronic material parts that can be manufactured from a limited size substrate etc. may decrease. In some cases, the cutting itself may be impossible.

  In addition, the annular recess formed by the wear of the central electroformed abrasive layer is to remove the chips generated by the outer electroformed abrasive layer in one recess as described above, There is also a problem that peeling must occur between each layer from the boundary between the central electroformed abrasive grain layer and the outer electroformed abrasive grain layer that are greatly dented in this way. Furthermore, since the central electroformed abrasive layer with a low concentration of abrasive grains and easy to wear is provided in a large width and depth, the overall wear resistance of the electroformed thin blade grinding wheel is poor and the life is shortened early. There is also the problem of spending.

  The present invention has been made under such a background, and can be used for cutting electronic material parts such as the above-described QFN, IrDA, and LED work to suppress the occurrence of burrs. Highly accurate cutting is possible, and it has excellent wear resistance and peeling resistance, has a long grinding wheel life, and stably maintains high quality for the cut electronic material parts. An object of the present invention is to provide an electroformed thin-blade grindstone that can be used.

  In order to solve the above-described problems and achieve such an object, the present invention includes a thin-blade abrasive grain layer formed by dispersing abrasive grains in a metal plating phase, and the thin-blade abrasive grain layer includes the thin-blade abrasive grain. The first to fifth abrasive grain layers are sequentially laminated in the layer thickness direction of the layers, and the content of the abrasive grains in the first, third, and fifth abrasive grain layers is the second. The content of the abrasive grains in the fourth abrasive grain layer is increased.

  In the electroformed thin blade grindstone of the present invention, the thin blade abrasive layer is composed of the first, third and fifth abrasive layers having a large abrasive content and the second and fourth abrasives having a small abrasive content. It has a five-layer structure in which grain layers are alternately laminated, that is, an abrasive grain layer having a large abrasive grain content is disposed at both ends and the center in the layer thickness direction of the thin blade abrasive grain layer. . Therefore, first, the first and fifth abrasive layers having a large abrasive content disposed at both ends in the layer thickness direction are used to intersect the ridge line between the circumferential surface and both side surfaces of the thin-blade abrasive layer acting as a cutting edge. It is possible to prevent the cutting edge from being rounded, that is, to prevent so-called corner sagging of the thin-blade abrasive grain layer, and to maintain the sharpness and to generate burrs when cutting electronic material parts as described above. Can be suppressed.

  In the second and fourth abrasive layers having a small abrasive content disposed between the first and fifth abrasive layers and the third abrasive layer, such an electronic material is used. Wearing is promoted by cutting and dressing of parts compared to the first, third, and fifth abrasive layers to form recesses, and thus the abrasive layer having a low abrasive content is divided into two layers. Thus, the individual widths of the second and fourth abrasive grain layers are kept small relative to the thickness of the entire thin-blade abrasive grain layer, and the depth of the recesses is also reduced accordingly. For this reason, in combination with the high wear resistance of the first, third and fifth abrasive grain layers having a large abrasive content, the wear resistance of the thin blade abrasive grain layer as a whole is secured and sustained. In addition, it is possible to prevent the abrasive grain layer from being peeled off from the concave portion, thereby extending the life of the grindstone.

  And in the layer thickness direction center of the thin-blade abrasive grain layer between the second and fourth abrasive grain layers thus forming the recesses, the abrasive grains than those of the second and fourth abrasive grain layers as described above. A third abrasive layer having a high content is disposed, and when the thin blade abrasive layer cuts the electronic material component, the third abrasive layer and the first and fifth abrasive layers are disposed. Since the grain layer is first cut into the lead frame or electrode in the resin mold, even one of the first and fifth abrasive grain layers at both ends in the layer thickness direction is formed on the lead frame or the like. Even if the thin-blade abrasive layer is cut in a state where the other is not in contact, if the third abrasive layer in the center is in contact, the thin-blade abrasive layer will shake in the layer thickness direction. This can suppress the meandering of the thin blade grindstone. Therefore, according to the electroformed thin-blade grindstone having the above-described configuration, high straightness can be ensured and high-precision cutting can be performed. Moreover, generation of burrs can be suppressed and wear resistance is also high. High-quality electronic material parts can be manufactured stably over a long period of time by cutting workpieces such as electronic material parts.

  Here, it is desirable that the content of abrasive grains in the first, third and fifth abrasive layers is in the range of 15 to 40 vol%, and the abrasive grains in the second and fourth abrasive layers. The content of is desirably in the range of 1 to 10 vol%. That is, when the abrasive content of the first, third and fifth abrasive layers is less than 15 vol%, the wear resistance is remarkably reduced, and the first and fifth cutting edges are particularly formed as described above. On the other hand, even if the abrasive grain content exceeds 40 vol%, the sharpness is dulled without being promoted by the self-growth of the cutting edge due to falling off of the abrasive grains. However, there is a possibility that the generation of burrs cannot be reliably prevented.

  Further, if the abrasive content of the second and fourth abrasive layers is less than 1 vol%, the concave portion due to wear may become too deep and easily peel off, whereas if it exceeds 10 vol%, the first, The difference in the abrasive content with the third and fifth abrasive layers becomes small, and it becomes difficult to form a recess for discharging chips, which may also prevent the generation of burrs. It is desirable that the first, third, and fifth abrasive layers have the same abrasive content, and the second and fourth abrasive layers have the same abrasive content. desirable.

  Furthermore, it is desirable that the thicknesses of these first to fifth abrasive layers are all in the range of 1/6 to 1/4 of the thickness of the entire thin blade abrasive layer. That is, if the layer thickness of the first and fifth abrasive layers acting as the cutting edge as described above is less than 1/6 of the total thickness of the thin blade abrasive layer, the wear resistance of the cutting edge portion is reduced. And the sag cannot be reliably prevented, and if the second and fourth abrasive layers are thin, the recess for discharging chips is reduced, and both can prevent the occurrence of burrs. There is a possibility that it will not be possible, and if the thickness of the third abrasive layer is thin, there is a possibility that sufficient straightness cannot be obtained.

  On the other hand, if the thickness of any one of these abrasive layers is greater than 1/4 of the total thickness of the thin blade abrasive layer, the thickness of any other abrasive layer is the entire thin blade abrasive layer. Therefore, there is a possibility that the effects of preventing the generation of burrs and ensuring the straightness at the time of cutting cannot be sufficiently obtained. In order to reliably achieve such an effect, the layer thicknesses of the first to fifth abrasive grain layers are preferably equal to each other, i.e., all of them should be 1/5 of the entire thickness of the thin blade abrasive grain layer. .

  Furthermore, it is desirable that the grain size of the abrasive grains dispersed in the first to fifth abrasive grain layers be 1/5 or less of the layer thickness of the whole thin blade abrasive grain layer. When the grain size of the abrasive grain increases, abrasive grains having a large grain size protrude from one to the other between the abrasive grain layers adjacent in the layer thickness direction, making it difficult to control the interface between the abrasive grain layers. There is a possibility that the above-mentioned layer thickness cannot be secured in the abrasive layer 5. However, even if the grain size of the abrasive grains becomes too small, there is a possibility that the grinding resistance will increase and the workpiece may be burned. Therefore, this abrasive grain size is 1/30 of the total thickness of the thin blade abrasive grain layer. The above is desirable.

  1 and 2 show an embodiment of the present invention. As shown in FIG. 1, the electroformed thin blade grindstone of the present embodiment has an annular shape centering on the axis O and has a thin plate shape with a thickness of about 0.05 to 0.5 mm, as shown in FIG. The thin-blade abrasive grain layer 1 is formed by being sent out in a direction perpendicular to the axis O while being rotated around the axis O while the inner diameter portion thereof is attached to the main shaft of the cutting device. QFN and IrDA described above by the outer peripheral edge of each of the outer peripheral surfaces, that is, the outer peripheral surface having a very small width equal to the thickness, the outer peripheral side of both side surfaces, and both circumferential edge portions intersecting the outer peripheral surface and both side surfaces. It is used for cutting electronic component materials having a metal material in a resin such as an LED work.

  And this thin blade abrasive grain layer 1 is laminated | stacked one by one in the layer thickness direction (the direction orthogonal to drawing in FIG. 1, the left-right direction in FIG. 2) as shown in FIG. Each of the abrasive layers 1A to 1E is composed of a metal plating phase 2 such as nickel and abrasive grains (superabrasive grains) 3 such as diamond and cBN, respectively. However, the content of the abrasive grains 3 in each of the abrasive grain layers 1A to 1E is the content in the first, third, and fifth abrasive grain layers 1A, 1C, and 1E. The amount is larger than the content in the second and fourth abrasive grain layers 1B and 1D.

  Here, the contents of the abrasive grains 3 in the first and fifth abrasive grain layers 1A and 1E are equal to each other, and are within the range of 15 to 40 vol%, and the abrasive grains 3 of the third abrasive grain layer 1C. Is also made equal to the first and fifth abrasive layers 1A and 1E. Further, the contents of the abrasive grains 3 between the second and fourth abrasive grain layers 1B and 1D are also equal to each other, and in the present embodiment, they are in the range of 1 to 10 vol%. Furthermore, the layer thicknesses of the first to fifth abrasive grain layers 1A to 1E are set within a range of 1/6 to 1/4 of the layer thickness of the entire thin-blade abrasive grain layer 1. The layer thicknesses of the abrasive grain layers 1A to 1E are equal, that is, 1/5 of the layer thickness of the thin blade abrasive grain layer 1 as a whole.

  Further, the abrasive grains 3 dispersed in these abrasive grain layers 1A to 1E are of the same type, and the grain size thereof is in the range of 1/5 to 1/30 of the layer thickness of the thin blade abrasive grain layer 1 as a whole. , Having a certain average particle diameter. Therefore, in this embodiment, the thin-blade abrasive grain layer 1 has the third abrasive grain layer 1C located at the center in the layer thickness direction, and the first and second abrasive grains 1C with respect to the third abrasive grain layer 1C. The grain layers 1A and 1B and the fifth and fourth abrasive grain layers 1E and 1D are arranged symmetrically, and the both side surfaces of the thin-blade abrasive grain layer 1 are the first and fifth abrasive grain layers 1A. , 1E.

  In addition to the abrasive grains 3, fillers 4 such as ceramics may be dispersed in each of the abrasive grain layers 1A to 1E as shown in FIG. However, the content of these fillers 4 is also equal between the first, third, and fifth abrasive grain layers 1A, 1C, and 1E and between the second and fourth abrasive grain layers 1B and 1D. However, while being made equal to each other, the contents of the first, third, and fifth abrasive layers 1A, 1C, and 1E are made larger than the contents of the second and fourth abrasive layers 1B and 1D, and It is desirable that the average grain size is also made equal in the first to fifth abrasive grain layers 1A to 1E, so that the symmetry in the thickness direction of the thin-blade abrasive grain layer 1 described above is maintained as shown in FIG.

  Thus, in order to manufacture an electroformed thin blade grindstone having a five-layer structure in which the thin blade abrasive grain layer 1 is composed of the first to fifth abrasive grain layers 1A to 1E, the abrasive grains 3 and the filler 4 are dispersed as required. The base metal is immersed in the metal plating solution, and the abrasive grains 3 are formed on the upper surface while growing the metal plating phase 2 having a predetermined layer thickness in the order of, for example, the first to fifth abrasive grain layers 1A to 1E. By fixing, the abrasive layers 1A to 1E are sequentially laminated, and the dispersion amount of the abrasive grains 3 and filler 4 dispersed in the metal plating solution is controlled for each of the abrasive layers 1A to 1E. And what is necessary is just to set it as a different quantity according to content of the abrasive grain 3 or the filler 4. FIG. For example, the content of the abrasive grains 3 in the first, third, and fifth abrasive layers 1A, 1C, and 1E and the content of the abrasive grains 3 in the second and fourth abrasive layers 1B and 1D are made equal. In the electroformed thin-blade grindstone of this embodiment, the metal plating phase 2 is grown by alternately immersing the base metal in the metal plating solution in which the abrasive grains 3 are dispersed in a dispersion amount corresponding to each content. The fifth abrasive grain layers 1A to 1E may be sequentially laminated to form the thin blade abrasive grain layer 1 and then peeled off from the base metal.

  Therefore, according to the electroformed thin blade whetstone configured in this way, first, the first and fifth abrasive particle layers 1A and 1E having a large content of the abrasive particles 3 are arranged at both ends in the thickness direction of the thin blade abrasive particle layer 1. Since it is provided, it is possible to improve the wear resistance of both circumferential edges of the outer peripheral edge of the thin blade abrasive grain layer 1 where the outer peripheral surface and both side surfaces cross each other. By rounding these two edge portions, it is possible to prevent the occurrence of corner sagging and maintain a sharpness as a cutting blade. For this reason, even when individual electronic material parts in which a metal lead frame or the like is included in the resin mold as described above or when cutting electronic material parts made of a resin base having metal electrodes, burrs are not formed on these metal parts. It is possible to suppress the occurrence and to provide a high-quality electronic material part.

  In addition, the second and fourth abrasive grain layers 1B and 1D with a small content of the abrasive grains 3 are disposed on the inner side in the layer thickness direction of the first and fifth abrasive grain layers 1A and 1E. Accordingly, the second and fourth abrasive grain layers 1B and 1D are relatively worn with respect to the first and fifth abrasive grain layers 1A and 1E due to the cutting of the electronic material component work and dressing before cutting. Thus, as shown in FIG. 2, an annular recess is defined on the outer peripheral surface of the thin-blade abrasive grain layer 1. And since the chips generated at the time of cutting are discharged through this recess, the generation of burrs and scratches on the cut surface due to the retention of such chips is prevented, and further high-quality cutting processing is promoted. Can do. In addition, the second and fourth abrasive grain layers 1B and 1D are adjacent to the inner side in the layer thickness direction of the first and fifth abrasive grain layers 1A and 1E, which are the cutting edge as described above. By forming the edge portion, the edge portion can be protruded relatively to the outer peripheral side, and the sharpness can be reliably maintained.

  On the other hand, the recesses are formed by the second and fourth abrasive layers 1B and 1D adjacent to the inner sides in the layer thickness direction of the first and fifth abrasive layers 1A and 1E, respectively. According to the electroformed thin blade grindstone having the above-described configuration, for example, the width and depth of the individual recesses compared to the electrocast thin blade grindstone described in Patent Document 1 in which one central electroformed abrasive grain layer having a low concentration is provided. Although the height is small, chips from the first and fifth abrasive grain layers 1A and 1E can be accommodated in the adjacent recesses and reliably discharged. For this reason, the concave portion becomes larger than necessary, and the wear resistance of the thin blade abrasive grain layer 1 as a whole is impaired, or the deep concave portion is formed in this way, thereby forming the first and fifth abrasive grain layers 1A and 1E. It is possible to prevent peeling and to provide an electroformed thin blade whetstone having a long life.

  And between these 2nd, 4th abrasive grain layers 1B and 1D, the 3rd abrasive grain layer with more content of the abrasive grain 3 than this 2nd and 4th abrasive grain layers 1B and 1D Therefore, the third abrasive grain layer 1C protrudes from the second and fourth abrasive grain layers 1B and 1D that define the recesses, and the first and fifth abrasive grains. Cutting edges similar to those of the layers 1A and 1E are formed, and when cutting electronic material parts as described above, these cutting edges are preceded by metal parts such as the lead frame and the electrodes. Will be cut. For this reason, even if one of the first and fifth abrasive layers 1A and 1E does not contact this metal portion, the other and the third abrasive layer 1C in the center in the layer thickness direction are in contact. If this is the case, it is possible to prevent the thin-blade abrasive grain layer 1 from wobbling, that is, to ensure straightness of the electroformed thin-blade grindstone and to prevent meandering.

  Therefore, according to the electroformed thin-blade grindstone having the above-described configuration, the cutting width cannot be set by such meandering, or the cutting width is set to be large in consideration of meandering even if it cannot be cut. Therefore, it is possible to prevent a situation in which the number of electronic material parts that can be manufactured from a limited-sized substrate is reduced. In addition, since the cut surface of the workpiece does not meander, it is possible to manufacture higher-quality electronic material parts. By extending the life of the grindstone as described above, such electronic material parts can be used for a long time. Therefore, it is possible to provide a stable and efficient manner.

  Moreover, in the electroformed thin blade grindstone of this embodiment, while content of the abrasive grain 3 in 1st, 3rd, 5th abrasive grain layer 1A, 1C, 1E is made into the range of 15-40 vol%, The content of the abrasive grains 3 in the second and fourth abrasive grain layers 1B and 1D is in the range of 1 to 10 vol%, and such an effect can be achieved more reliably. That is, if the content of the abrasive grains 3 in the first, third, and fifth abrasive grain layers 1A, 1C, and 1E is less than 15 vol%, the wear resistance is reduced, and the generation of burrs as described above. The first and fifth abrasive grain layers 1A and 1E serving as cutting edge edges to be suppressed are subject to corner sagging, or the third abrasive grain layer 1C serving as a cutting edge edge that ensures straightness is retracted to cause the first, There is a possibility that simultaneous contact with the metal part with the fifth abrasive grain layers 1A and 1E may not be achieved. On the other hand, if the content of the abrasive grains 3 exceeds 40 vol%, the hardness of the first and fifth abrasive grain layers 1A and 1E will be too high, and the abrasive grains 3 will be difficult to fall off. There is a risk that the generation of burrs may not be reliably suppressed due to the dullness of the burr without being promoted.

  On the other hand, if the content of the abrasive grains 3 in the second and fourth abrasive grain layers 1B and 1D is so low that it is less than 1 vol%, the recesses defined by the wear will be too deep even if the width is narrow. The fifth abrasive grain layers 1A and 1E may be easily peeled. Conversely, when the amount exceeds 10 vol%, the abrasive grains with the first, third and fifth abrasive grain layers 1A, 1C and 1E 3 The difference in the content becomes small and the concave portion becomes too shallow, so that the chip discharging property is hindered and the burr suppressing effect may be insufficient. In order to ensure the simultaneous contact between the first and fifth abrasive grain layers 1A, 1E and the third abrasive grain layer 1C, the abrasive grains in these abrasive grain layers 1A, 1C, 1E are assured. The content of 3 is preferably equal to each other as in this embodiment, and the recesses by the second and fourth abrasive grain layers 1B and 1D are set to the same depth to discharge chips without unevenness. In addition, it is desirable that the abrasive grain 3 contents of these abrasive grain layers 1B and 1D are also equal to each other as in this embodiment.

  In the present embodiment, the layer thicknesses of the first to fifth abrasive grain layers 1A to 1E are set to 1/5 of the entire layer thickness of the thin blade abrasive grain layer 1, that is, the layer thicknesses are equal to each other. The first and fifth abrasive grain layers 1A and 1E exhibiting the effect of suppressing / preventing burrs, the second and fourth abrasive grain layers 1B and 1C for ensuring chip discharge, and the straightness are ensured. Therefore, the third abrasive layer 1C can be arranged in a balanced manner, and the respective effects can be reliably achieved. That is, when the layer thickness of any one of these abrasive grain layers 1A to 1E is too thick, for example, at least one of the remaining abrasive grain layers 1A to 1E becomes too thin, and the at least one abrasive grain layer is If the first and fifth abrasive layers 1A and 1E are not effective in suppressing burrs, if the second and fourth abrasive layers 1B and 1D are used, chip evacuation is impaired and burrs are also suppressed. If the effect is insufficient and the third abrasive grain layer 1C is used, there is a possibility that the straightness of the electroformed thin blade grindstone at the time of cutting is impaired.

  In addition, in order to reliably achieve the effects of the first to fifth abrasive grain layers 1A to 1E as described above, each of these layer thicknesses is 1 of the total thickness of the thin blade abrasive grain layer 1 as described above. What is necessary is just to be in the range of / 6 to 1/4. For example, three of the abrasive grain layers 1A to 1E may be 1/6 of the total thickness of the thin-blade abrasive grain layer 1, and the remaining two layers may be 1/4. However, in order to ensure the symmetry of the thin-blade abrasive grain layer 1 as described above, the first abrasive grain layer 1A and the fifth abrasive grain layer 1E have the same layer thickness, and the second abrasive grain layer. It is desirable that the layer thicknesses of 1B and the fourth abrasive layer 1D are also equal to each other, and the layer thicknesses of the first and fifth abrasive layer 1A, 1E and the third abrasive layer 1C are also equal to each other. In particular, it is more desirable that the thicknesses of all the abrasive grain layers 1A to 1E are equal to each other and be １ ／ of the entire thickness of the thin-blade abrasive grain layer 1 as in this embodiment.

  In addition, the layer thickness of the first to fifth abrasive grain layers 1A to 1E is thus within the range of 1/6 to 1/4 of the layer thickness of the entire thin blade abrasive grain layer 1, particularly the entire layer thickness of the thin blade abrasive grain layer 1. In order to control to 1/5 reliably, the particle diameter (average particle diameter) of the abrasive grains 3 dispersed in the metal plating phase 2 of the abrasive grain layers 1A to 1E is also 1 of the total thickness of the thin-blade abrasive grain layer 1 / 5 or less is desirable. That is, when the grain size of the abrasive grains 3 is too large, even if the thickness of the metal plating phase 2 of the abrasive grain layers 1A to 1E is 1/6 or more of the layer thickness of the thin blade abrasive grain layer 1, the metal plating phase The abrasive grain 3 protrudes from 2 and is contained in the adjacent abrasive grain layers 1A to 1E. As a result, the interface (boundary surface) between the abrasive grain layers adjacent to each other in the layer thickness direction cannot be controlled, and the layer partially There is a possibility that the thickness may vary, and the effects of the abrasive layers 1A to 1E cannot be reliably achieved. However, even if the grain size of the abrasive grains 3 becomes too small, there is a risk that the grinding resistance increases and the workpiece may be burned. Therefore, the average grain size of the abrasive grains 3 is the thin-blade abrasive grain layer 1. It is desirable to be 1/30 or more with respect to the total layer thickness.

  Hereinafter, the effects of the present invention will be described with reference to more specific examples. In this example, the electroformed thin-blade grindstone based on the above embodiment is used to cut the LED workpiece 13 made of the glass epoxy resin substrate 12 having the metal (Cu) electrode 11 as shown in FIG. The size of the burr 14 generated from the electrode 11 (however, as shown in FIG. 3, the size of the burr 14 extending in the lateral direction (feeding direction) is X, and the size of the burr 14 extending downward is Y). Was measured at the beginning of cutting and at the time of cutting 50 m. The results are shown in Table 1 as Example 1 together with the abrasive content in the first to fifth abrasive layers of the thin blade abrasive layer. In addition, the code | symbol 15 part of the LED workpiece 13 is a product made from an epoxy resin.

  However, in this Example 1, the electroformed thin blade grindstone has an outer diameter of 58 mm, an inner diameter of 40 mm, and a thickness (layer thickness of the thin blade abrasive grain layer) of 0.15 mm, and the layer thicknesses of the first to fifth abrasive grain layers are Each is 0.03 mm, the metal plating phase is Ni, the abrasive grains are diamond abrasive grains having a particle diameter of 8/20 μm, and the filler is not dispersed. The cutting conditions were a spindle rotation speed of 18000 (1 / min) and a feed rate of 100 (mm / sec), and 1.6 (L / min) of cooling water from the feed direction side of the thin-blade grindstone toward the cutting site. Further, cutting was performed while supplying 1.2 (L / min) of cooling water from both sides. In addition, the dimension of the cut | disconnected LED workpiece 13 is as showing in FIG.

  On the other hand, as a comparative example with respect to Example 1, a thin blade abrasive layer having the same outer dimensions formed by dispersing similar abrasive grains in the same metal plating phase as the electroformed thin blade grindstone of Example 1 is provided. The grain layer has first to third abrasive layers sequentially laminated in the layer thickness direction, and the abrasive content in the first and third abrasive layers is the abrasive in the second abrasive layer. The electrocast thin blade whetstone having a three-layer structure (Comparative Example 1) having a larger content than the grain content and the single layer structure electroformed thin blade whetstone (Comparative Example 2) consisting of only the first abrasive layer are the same. The size of the burr 14 generated under the conditions was measured. The results are shown in Table 1 together with the abrasive content of the first to third abrasive layers. However, in Comparative Example 1, the layer thickness of the first to third abrasive grain layers was 1/3 of the layer thickness of the thin blade abrasive grain layer of 0.15 mm.

  From the results shown in Table 1, first, in Comparative Example 2 in which the thin-blade abrasive layer is composed of a single first abrasive layer in which abrasive grains are dispersed with a constant abrasive content (25 vol%), the feed direction from the beginning of cutting In addition, both the size X and Y of the burr 14 in the downward direction are large, and gradually increase as the cutting distance increases. When cutting 50 m, both X and Y exceed 100 μm, and can be used as products. It was impossible. Further, in Comparative Example 1 according to Patent Document 1, the burrs 14 at the initial stage of cutting were kept small in both X and Y, but meandering occurred in the electroformed thin blade whetstone as the cutting distance increased. Then, it started to protrude greatly from the predetermined street, and cutting itself became impossible. On the other hand, according to the electroformed thin-blade grindstone of Example 1 according to the present invention, the size of the burrs is small from the beginning of cutting, both X and Y, and is kept small even at the time of cutting 50 m, and the meandering also occurs. High-quality cutting was possible.

  Next, in the electroformed thin blade grindstone of the embodiment of the present invention, the abrasive content of the second, fourth abrasive layer is constant at 5 vol%, and the abrasive of the first, third, fifth abrasive layer is set. Seven types of electroformed thin blade whetstones with various changes in the grain content, and conversely, the second, fourth, and fourth abrasive grain contents of the first, third, and fifth abrasive layers are constant at 25 vol%. The sizes of burrs 14 when cutting the same LED workpiece 13 under the same conditions as in Example 1 with four types of electroformed thin blade whetstones having various abrasive grain contents in the abrasive layer. Was measured for each predetermined cutting distance. These results are shown in Tables 2 and 3 as Examples 11 to 17 and Examples 21 to 24, respectively. In Table 3, as Comparative Example 3, the abrasive content of the second and fourth abrasive layers is 0 vol%, that is, no abrasive particles are dispersed in the second and fourth abrasive layers. The result of measuring the sizes X and Y of the burr 14 is also shown. However, the outer dimensions, the metal plating phase, the abrasive grains, and the layer thickness of each abrasive grain layer of each electroformed thin blade grindstone are the same as those in the first embodiment.

  Among these, first, from the results of Table 2, in Example 11 in which the abrasive content of the first, third, and fifth abrasive layers was increased to 45 vol%, X, X, In both Y, the burrs 14 were so large that they approached 100 μm and did not increase remarkably as the cutting distance increased. However, the tendency continued until 50 m was cut, and in particular, Y exceeded 100 μm. Further, in Example 17 in which the abrasive content of the first, third, and fifth abrasive layers was reduced to 10 vol%, the generation of burrs 14 was small at the initial stage of cutting, but as the cutting distance progressed, As the amount of increase becomes large, large burrs 14 are suddenly generated in both X and Y, and large burrs 14 substantially the same as in Example 11 are generated when cutting 50 m.

  On the other hand, in Examples 12 to 16 in which the abrasive content of the first, third, and fifth abrasive layers was 15 to 40 vol%, the burrs 14 at the initial stage of cutting were compared to Example 11. On the other hand, as compared with Example 17, the amount of increase in the burr 14 as the cutting distance was increased was suppressed to a small amount for both X and Y, and was suppressed to less than 80 μm even when cutting 50 m. In particular, in Examples 13 to 15 in which the abrasive content of the first, third, and fifth abrasive layers was 20 to 35 vol%, the size of the burrs 14 at the initial stage of cutting and up to the time of cutting 50 m were obtained. It can be seen that the amount of increase is smaller, that is, a high burr suppression effect is stably maintained.

  On the other hand, the results of Table 3 show that the abrasive content of the second and fourth abrasive layers is 0 vol%, that is, the second and fourth abrasive layers are simply Ni-plated phases containing no abrasive grains. In Example 3, although the burr 14 is small at the initial stage of cutting, the wear of the second and fourth abrasive layers is significant, and the first and fifth abrasive layers are peeled off before cutting 50 m, so that the cutting is not performed. It has become possible. On the contrary, in Example 24 in which the abrasive content of the second and fourth abrasive layers is 15 vol%, which is higher than those of other Examples 21 to 23, compared to Examples 21 to 23 and Comparative Example 2. However, the burr 14 tended to be large from the beginning of cutting.

  On the other hand, in Examples 21 to 23 in which the abrasive content of the second and fourth abrasive layers was 1 to 10 vol%, the burrs 14 at the initial stage of cutting were small in both X and Y, and up to 50 m cutting time. The increase amount of the burr 14 is also suppressed to a small value, and this tendency is particularly remarkable in Example 22 in which the abrasive grain content of the second and fourth abrasive grain layers is 5 vol%. Tables 4 and 5 show that the abrasive content of the first, third, and fifth abrasive layers is 35 vol% and 20 vol%, respectively, and the abrasive content 1 of the second and fourth abrasive layers is 1, respectively. Although the result by Examples 31-33 and Examples 41-43 set to 10 vol% is shown, the tendency similar to Examples 21-23 of Table 3 is recognized.

  Next, Table 6 shows that the first, third, and fifth abrasive layers have an abrasive content of 25 vol%, the second and fourth abrasive layers have an abrasive content of 5 vol%, and the first, The cutting | disconnection result by Examples 51-55 which changed the layer thickness of the 3rd, 5th abrasive grain layer and the layer thickness of the 2nd, 4th abrasive grain layer is shown, Other conditions etc. are implemented. It is the same as that of Example 1, ie, the layer thickness of the whole thin blade abrasive grain layer is 0.15 mm, and is common.

  From the results of Table 6, the thicknesses of the first, third, and fifth abrasive layers are 0.02 mm, which is thinner than 1/6 (0.025 mm) of the thin-blade abrasive layer, 2. In Example 51 in which the layer thickness of the fourth abrasive layer is 0.045 mm and is larger than 1/4 (0.0375 mm) of the thin blade abrasive layer, the size of the burr 14 in the downward direction is particularly large. The length Y was large from the beginning of cutting, and this tendency continued until cutting 50 m. On the other hand, the thickness of the first, third, and fifth abrasive layers is 0.04 mm, which is larger than 1/4 of the thickness of the thin-blade abrasive layer, and the second and fourth abrasive layers are In Example 55 in which the layer thickness was 0.015 mm and less than 1/6 of the layer thickness of the thin-blade abrasive layer, the size X of the burr 14 in the feed direction and the amount of increase were particularly large from the initial cutting to the 50 m cutting. .

  On the other hand, in Examples 52 to 54 in which the layer thicknesses of the first to fifth abrasive layers are all within the range of 1/6 to 1/4 of the layer thickness of the entire thin blade abrasive layer, cutting is performed. The initial burr 14 and the amount of increase thereof are small in both X and Y, and the layer thicknesses of the first to fifth abrasive grain layers are particularly equal to each other, that is, 1/5 (0.03 mm) of the layer thickness of the thin blade abrasive grain layer. In Example 53, this tendency is most prominent.

  Finally, Table 7 shows that the abrasive content of the first, third, and fifth abrasive layers is 25 vol%, and the abrasive content of the second and fourth abrasive layers is 5 vol%. The cutting result by Examples 61-65 which changed the particle size of the particle | grains variously is shown, Other conditions etc. are the same as that of Example 1. FIG.

  From the results shown in Table 7, in Example 65 where the abrasive grain size is 30/40 μm, which exceeds 1/5 (0.03 mm) of the entire thickness of the thin blade abrasive grain layer, the burrs 14 are X, Y from the beginning of cutting. Although both were large and the amount of increase was not so large, the trend continued until cutting 50 m. On the other hand, in Examples 61 to 64 in which the abrasive grain size was set to 1/5 or less of the entire thickness of the thin-blade abrasive grain layer, the burr 14 was small from the initial stage of cutting, and the amount increased as the cutting distance increased. However, it is sufficiently small even when cutting 50 m. However, in Example 61 in which the abrasive grain size is less than 1/30 (0.005 mm) of the total thickness of the thin-blade abrasive grain layer, the burr 14 itself is small, but the LED work 13 is burned on the base 12 made of glass epoxy resin. It was unsuitable for a product as it was.

It is a side view of the electroformed thin blade grindstone which shows one Embodiment of this invention. It is an expanded sectional view of the outer periphery part of the thin blade abrasive grain layer 1 of embodiment shown in FIG. It is sectional drawing of the LED workpiece 13 cut | disconnected by the Example and comparative example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Thin blade abrasive grain layer 1A 1st abrasive grain layer 1B 2nd abrasive grain layer 1C 3rd abrasive grain layer 1D 4th abrasive grain layer 1E 5th abrasive grain layer 2 Metal plating phase 3 Abrasive grain 4 Filler

Claims (4)

  A thin-blade abrasive layer is formed by dispersing abrasive grains in the metal plating phase, and this thin-blade abrasive layer has first to fifth abrasive layers sequentially laminated in the layer thickness direction of the thin-blade abrasive layer. Of these, the content of the abrasive grains in the first, third, and fifth abrasive layers is greater than the content of the abrasive grains in the second and fourth abrasive layers. An electroformed thin blade whetstone.   The content of the abrasive grains in the first, third, and fifth abrasive layers is in the range of 15 to 40 vol%, and the content of the abrasive grains in the second and fourth abrasive layers is 1. The electroformed thin-blade grindstone according to claim 1, which is in a range of -10 vol%.   The thickness of each of the first to fifth abrasive grain layers is within a range of 1/6 to 1/4 of the layer thickness of the entire thin blade abrasive grain layer. 2. An electroformed thin-blade grindstone according to 2. The electroformed thin blade grindstone according to any one of claims 1 to 3, wherein the grain size of the abrasive grains is 1/5 or less of the layer thickness of the entire thin blade abrasive grain layer.

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