CN1958239A - Electroforming thin blade grinding wheel - Google Patents
Electroforming thin blade grinding wheel Download PDFInfo
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- CN1958239A CN1958239A CNA2006101436102A CN200610143610A CN1958239A CN 1958239 A CN1958239 A CN 1958239A CN A2006101436102 A CNA2006101436102 A CN A2006101436102A CN 200610143610 A CN200610143610 A CN 200610143610A CN 1958239 A CN1958239 A CN 1958239A
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- abrasive grain
- grain layer
- abrasive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/14—Zonally-graded wheels; Composite wheels comprising different abrasives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
- B24D5/12—Cut-off wheels
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- Engineering & Computer Science (AREA)
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- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Electroforming thin blade grinding wheel which can be utilized for cutting electronic material components such as QFN, IrDA, LED etc work piece and has advantages that not only preventing burr occurring but also cutting with excellent rectilinear character and high precision, superior abrasion resistance and shell resistance, long service life, and capable of stably keeping high quality of the cut electronic material components. The grinding wheel provided in this invention comprises a thin blade wear particle layer (1) formed by dispersing wear particles in metal coating phase (2). The thin blade wear particle layer (1) has first to fifth wear particle layers (1A-1E) sequentially laminated in layer thickness direction in which wear particle (3) amount of the first, third, fifth wear particle layer (1A,1C,1E) is more than that of the second, fourth wear particle layer (1B,1D).
Description
Technical field
The present invention be more particularly directed to cutting off on the substrate, after die casting and singualtion, the electroforming thin blade grinding wheel making under the situation of electronic material parts, use in the cut-out after being adapted at this die casting by element etc. is installed in together.
Background technology
In the cut-out when making such electronic material parts, the electroforming thin blade grinding wheel that in the past used as thin as a wafer the abrasive grain layer of the coat of metal in mutually that be distributed to nickel etc. by super abrasive particles such as making diamond to constitute.But, in recent years, as such electronic material parts, for example as the parts that are known as QFN (quad flat non-pin package) (quad flat non-leaded package), by a plurality of elements being installed in together on the lead frame, they are cut off and the electronic material parts of singualtion, manufacturing after the die casting together, or as the optical transport module of IrDA (infrared data communication association) standard (IrDA made in following only abbreviation.) like that, have on the inner peripheral surface of the through hole on the matrix of the glass epoxy resin system of being formed at and implemented Ni, Au, the electronic material parts of the substrate of coating such as Cu, the such electronic material parts of LED workpiece that the electrode that perhaps has a metal also possesses the basal disc of glass epoxy resin system have increased, when the manufacturing of such electronic material parts, cut off with thin blade grinding wheel and will separate a footpath between fields and be configured in the higher plain conductor frame of ductility such as Cu in the moulded resin, coating, electrode is so have the direction of feed of the thin blade grinding wheel when cutting off and direction of rotation (following direction) to go up the problem that the metal burr of this lead frame and electrode etc. take place easily.
So, in patent documentation 1 for example, following cutting tool (electroforming thin blade grinding wheel) has been proposed, the blade part of the ring-type of this cutting tool is made of the electroforming abrasive grain layer that is fixed with abrasive particle by coating, and the blade part of this ring-type comprises the central electroforming abrasive grain layer that formed by the lower abrasive grain layer of concentration degree and by the outside electroforming abrasive grain layer that forms in the both sides of this central authorities' electroforming abrasive grain layer respectively that forms than this central authorities' high abrasive grain layer of electroforming abrasive grain layer concentration degree.In this patent documentation 1, according to this cutting tool, central electroforming abrasive grain layer is because of finishing or use wearing and tearing in large quantities, forms annular recessed portion at the width central portion of the blade part periphery of ring-type, cut powder and be taken in this annular recessed portion and be excluded, so prevented the generation of burr.
Patent documentation 1: the spy opens the 2002-331464 communique
But, in 3 layers the electroforming thin blade grinding wheel that the outside electroforming abrasive grain layer by central electroforming abrasive grain layer and its both sides of record constitutes in such patent documentation 1, in the cut-out of electronic material parts as described above, if central electroforming abrasive grain layer weares and teares and forms annular recessed portion, the then pair of outside electroforming abrasive grain layer of its both sides incision in advance, plain conductor frame and metal electrode in the moulded resin are cut off intermittently, so if for example this does not simultaneously contact and cuts with lead frame and electrode outside electroforming abrasive grain layer when cutting off, the resistance and the load that act on the electroforming abrasive grain layer in two outsides become inhomogeneous, and then thin blade grinding wheel might produce vibration and swing on the bed thickness direction of abrasive grain layer.And, if thin blade grinding wheel swing when cutting off so then must be set the cut-out width of emery wheel bigger, thus the quantity of the electronic material parts that can make by the substrate of limited size etc. reduce, according to circumstances even might cut-out itself can not carry out.
In addition, central authorities' electroforming abrasive grain layer wearing and tearing and the annular recessed portion that forms be owing to will be taken into as described above and be got rid of by the powder of cutting that two outside electroforming abrasive grain layers generate by 1 recess, must and the problem of each splitting take place from the boundary portion of the central electroforming abrasive grain layer of depression and outside electroforming abrasive grain layer so significantly easily with bigger to a certain degree width and deep recess so exist.And then, because so lower, the central electroforming abrasive grain layer that is worn easily of the concentration degree of abrasive particle lacks as the mar proof of electroforming thin blade grinding wheel integral body, the problem that the life-span reaches earlier so exist with bigger width and degree of depth setting.
Summary of the invention
The present invention makes under such background, and purpose provides a kind of generation of using, not only can suppress burr in the cut-out of the such electronic material parts of above-mentioned QFN and IrDA, LED workpiece, can also carry out the higher and high-precision cut-out of rectilinear propagation, also have mar proof and anti-fissility is also outstanding, the emery wheel life-span is long, can stably keep the electroforming thin blade grinding wheel of higher quality for the electronic material parts after cutting off.
Realize such purpose in order to solve above-mentioned problem, the invention is characterized in, possess at the coat of metal and disperse abrasive particle in mutually and the thin sharpening granulosa that forms, should have the 1st～the 5th abrasive grain layer that stacks gradually by thin sharpening granulosa on the bed thickness direction of this thin sharpening granulosa, wherein the amount of the above-mentioned abrasive particle of the 1st, the 3rd, the 5th abrasive grain layer is more than the amount of the above-mentioned abrasive particle of the 2nd, the 4th abrasive grain layer.
In electroforming thin blade grinding wheel of the present invention, thin like this sharpening granulosa has the 1st, the 3rd, the 5th abrasive grain layer that the abrasive particle amount is more and the less 5 layers of alternately stacked structure of the 2nd, the 4th abrasive grain layer of abrasive particle amount, promptly at the two ends and the more abrasive grain layer of central configuration abrasive particle amount of the bed thickness direction of this thin sharpening granulosa.Thereby, at first suppress the side face of the thin sharpening granulosa that works as cutting blade cutting edge (edge) and the wearing and tearing of the crest line portion of intersecting of two sides by being configured in the 1st, the 5th more abrasive grain layer of abrasive particle amount on these bed thickness direction two ends, can prevent that this cutting blade cutting edge from becoming circle, the i.e. so-called arris wearing and tearing of thin sharpening granulosa, can keep good sharpness and suppress the generation of the burr in the cut-out of electronic material parts as described above.
In addition, in being configured in the 2nd, the 4th less abrasive grain layer of abrasive particle amount between these the 1st, the 5th abrasive grain layers and the 3rd abrasive grain layer, because the cut-out of such electronic material parts and finishing and compare with the 1st, the 3rd, the 5th abrasive grain layer and more to have promoted wearing and tearing, form recess, but be divided into 2 layers by like this that the abrasive particle amount is less abrasive grain layer, and each width of the 2nd, the 4th abrasive grain layer is suppressed for less with respect to the whole bed thickness of thin sharpening granulosa, concave depth also shoals thereupon.Therefore, high abrasion resistance acting in conjunction with more the 1st, the 3rd, the 5th abrasive grain layer of abrasive particle amount, can guarantee and keep the mar proof of thin sharpening granulosa integral body, can prevent to begin abrasive grain layer, to peel off simultaneously, can realize the emery wheel life-time dilatation from this recess.
And, forming the 2nd of recess like this, the bed thickness direction central authorities of the thin sharpening granulosa between the 4th abrasive grain layer, dispose as described above than these the 2nd, the 3rd abrasive grain layer that the 4th abrasive grain layer abrasive particle amount is many, when this thin sharpening granulosa cuts off above-mentioned electronic material parts, the 3rd abrasive grain layer and the above-mentioned the 1st, the 5th abrasive grain layer is cut in lead frame in the resin cast and electrode etc. in advance, even so at the 1st of bed thickness direction two ends, any of the 5th abrasive grain layer contacts with this lead frame etc., to approach the incision of sharpening granulosa under another discontiguous state, as long as the 3rd abrasive grain layer of central authorities contact, then can be suppressed in the thin sharpening granulosa and produce the vibration of bed thickness direction, and prevent the swing of thin blade grinding wheel.Thereby, electroforming thin blade grinding wheel according to said structure, can guarantee high rectilinear propagation and carry out high-precision cut-out, and can suppress the generation of burr, simultaneously, because mar proof is also higher, so use in the cut-out of workpiece such as electronic material parts as described above, can make high-quality electronic material parts steadily in the long term.
Here, the amount of the abrasive particle of above-mentioned the 1st, the 3rd, the 5th abrasive grain layer is preferably in the scope of 15～40vol%, and the amount of the abrasive particle of above-mentioned the 2nd, the 4th abrasive grain layer is preferably in the scope of 1～10vol%.Promptly, if 1st, the abrasive particle amount of the 3rd, the 5th abrasive grain layer is lower than 15vol%, then mar proof significantly reduces, particularly can not prevent arris wearing and tearing as described above as the 1st, the 5th abrasive grain layer of cutting blade cutting edge, on the other hand, if instead the abrasive particle amount surpasses 40vol%, can not promote the spontaneous of cutting blade that coming off of abrasive particle brought and make the sharpness rust, under which kind of situation, all can not prevent the generation of burr reliably.
In addition, if 2nd, the abrasive particle amount of the 4th abrasive grain layer is lower than 1vol% then the recess that brings that weares and teares deepens, might peel off easily, on the other hand, if it is many to surpassing 10vol%, then the difference with the abrasive particle amount of the 1st, the 3rd, the 5th abrasive grain layer diminishes, and is difficult to form be used for cutting the recess that powder is discharged, and also might be able to not prevent the generation of burr.In addition, the abrasive particle amount of the 1st, the 3rd, the 5th abrasive grain layer is equal to each other, and the abrasive particle amount of the 2nd, the 4th abrasive grain layer also is equal to each other.
And then the bed thickness of these the 1st～the 5th abrasive grain layers all is preferably in 1/6～1/4 scope of the whole bed thickness of above-mentioned thin sharpening granulosa.Promptly, as described above, if the bed thickness of the 1st, the 5th abrasive grain layer that works as the cutting blade cutting edge is 1/6 thinner than the whole bed thickness of thin sharpening granulosa, then can damage the mar proof of this cutting blade cutting edge part and can not prevent the arris wearing and tearing reliably, and, if the 2nd, the 4th abrasive grain layer is thinner, then being used for cutting the recess that powder discharges diminishes, all might be able to not prevent the generation of burr, and if the bed thickness of the 3rd abrasive grain layer thinner, then might can not obtain enough rectilinear propagations.
On the other hand, if instead certain bed thickness of these abrasive grain layers is 1/4 thicker than the whole bed thickness of thin sharpening granulosa, become 1/6 thin than the whole bed thickness of thin sharpening granulosa of the bed thickness of other certain abrasive grain layer then also might be able to not be given full play to the effect that burr prevent and the rectilinear propagation when cutting off is guaranteed.In addition, in order to bring into play such effect reliably, the bed thickness of the 1st～the 5th abrasive grain layer is preferably and is equal to each other, promptly all is 1/5 of the whole bed thickness of thin sharpening granulosa.
And then, the particle diameter that is dispersed in the abrasive particle in these the 1st～the 5th abrasive grain layers is preferably whole below 1/5 of bed thickness of above-mentioned thin sharpening granulosa, if it is big for the size ratio of abrasive particle, then the abrasive particle that particle diameter is bigger between the abrasive grain layer of adjacency on the bed thickness direction is outstanding from another layer of course, it is difficult that the Interface Control of mutual abrasive grain layer becomes, and might can not guarantee bed thickness as described above in the 1st～the 5th abrasive grain layer.But too small if the particle diameter of this abrasive particle becomes, it is big that grinding resistance becomes, and burn etc. also might take place on workpiece, so this abrasive particle diameter is preferably whole more than 1/30 of bed thickness of thin sharpening granulosa.
Description of drawings
Fig. 1 is the side view of the electroforming thin blade grinding wheel of expression an embodiment of the present invention.
Fig. 2 is the amplification view of outer peripheral edges portion of the thin sharpening granulosa 1 of embodiment shown in Figure 1.
Fig. 3 is the cutaway view by the LED workpiece 13 of embodiments of the invention and comparative example cut-out.
The specific embodiment
Fig. 1 and Fig. 2 are the figure of expression an embodiment of the present invention.The electroforming thin blade grinding wheel of present embodiment as shown in Figure 1, form with the axes O is the annular at center, be thickness and be lamellar about 0.05～0.5mm, himself is formed by thin sharpening granulosa 1 as shown in Figure 2, its inside diameter is installed on the main shaft of shearing device, by it is sent to the direction perpendicular to this axes O on one side around above-mentioned axes O rotation on one side, in outer peripheral edges portion by this thin sharpening granulosa 1, the i.e. outer peripheral face of the very little width that equates with above-mentioned thickness, the outer circumferential side of two sides, and the circle-shaped two-edged oral area that intersects of this outer peripheral face and the two sides above-mentioned QFN and the IrDA that carry out, have in the such resin of LED workpiece in the cut-out of electronic unit material of metal material and use.
And, this thin sharpening granulosa 1 as shown in Figure 2, by (being direction in Fig. 1 with the drawing quadrature along its bed thickness direction.It in Fig. 2 left and right directions.) stack gradually and incorporate the 1st～the 5th abrasive grain layer 1A～1E formation, these abrasive grain layers 1A～1E all the coat of metal of nickel etc. make in 2 mutually abrasive particles (super abrasive particle) 3 such as diamond and cBN in each layer equably dispersion form, but, in the amount of the abrasive particle 3 of each abrasive grain layer 1A～1E, make the amount among the 1st, the 3rd, the 5th abrasive grain layer 1A, 1C, the 1E more than the amount among the 2nd, the 4th abrasive grain layer 1B, the 1D.
Here, the amount of the abrasive particle 3 among above-mentioned the 1st, the 5th abrasive grain layer 1A, the 1E equates, in the scope of 15～40vol%, and the amount of the abrasive particle 3 of the 3rd abrasive grain layer 1C is also equated with the 1st, the 5th abrasive grain layer 1A, 1E.In addition, the amount of the 2nd, the 4th abrasive grain layer 1B, 1D abrasive particle 3 each other also is equal to each other, and is made as in the present embodiment in the scope of 1～10vol%.And then the bed thickness of these the 1st～the 5th abrasive grain layer 1A～1E is located in 1/6～1/4 the scope of thin sharpening granulosa 1 whole bed thickness, particularly in the present embodiment, the bed thickness of all abrasive grain layer 1A～1E is equated, is 1/5 of thin sharpening granulosa 1 whole bed thickness.
And then the above-mentioned abrasive particle 3 that is dispersed among these abrasive grain layers 1A～1E is abrasive particles of the same race, and its particle diameter is certain average grain diameter in 1/5～1/30 scope of thin sharpening granulosa 1 whole bed thickness.Thereby, in the present embodiment, thin sharpening granulosa 1 has been made following structure, the 3rd abrasive grain layer 1C is positioned at the central portion of its bed thickness direction, with respect to the 3rd abrasive grain layer 1C, 1st, the 2nd abrasive grain layer 1A, 1B and the 5th, the 4th abrasive grain layer 1E, 1D dispose symmetrically, and the above-mentioned two sides of thin sharpening granulosa 1 are formed by the 1st, the 5th abrasive grain layer 1A, 1E.
In addition, in each abrasive grain layer 1A～1E, except abrasive particle 3, also can be dispersed with fillers 4 such as pottery as shown in Figure 2.Wherein, for these fillers 4, its amount is equal to each other in the 1st, the 3rd, the 5th abrasive grain layer 1A, 1C, 1E and between the 2nd, the 4th abrasive grain layer 1B, 1D, also is equal to each other, on the other hand, make the amount of the 1st, the 3rd, the 5th abrasive grain layer 1A, 1C, 1E more than the amount of the 2nd, the 4th abrasive grain layer 1B, 1D, and its average grain diameter is also equated in the 1st～the 5th abrasive grain layer 1A～1E, as shown in Figure 2, preferably keep the symmetry of the bed thickness direction of above-mentioned thin sharpening granulosa 1.
Like this, in order to make the electroforming thin blade grinding wheel of 5 layers of structure that thin sharpening granulosa 1 is made of the 1st～the 5th abrasive grain layer 1A～1E, the platform gold is immersed in is dispersed with abrasive particle 3 and is dispersed with as required in the coat of metal liquid of filler 4, go up with for example order of the 1st～the 5th abrasive grain layer 1A～1E on the surface thereon, stack gradually abrasive grain layer 1A～1E by the bonded-abrasives 3 of growing up while the coat of metal phase 2 that makes set bed thickness, at this moment, every layer of control of each abrasive grain layer 1A～1E is dispersed in the abrasive particle 3 in the coat of metal liquid and the dispersion amount of filler 4, as long as be made as different amounts corresponding to the amount of its abrasive particle 3 and filler 4 just passable.For example, in the electroforming thin blade grinding wheel of the present embodiment that the amount of the abrasive particle 3 of the amount and the 2nd of the abrasive particle 3 that makes the 1st, the 3rd, the 5th abrasive grain layer 1A, 1C, 1E, the 4th abrasive grain layer 1B, 1D equates respectively, as long as the coat of metal 2 is grown up mutually, stack gradually the 1st～the 5th abrasive grain layer 1A～1E and form thin sharpening granulosa 1 back and peel off just passable from the platform gold by the platform gold alternately being immersed in be dispersed with dispersion amount corresponding to each amount.
Thereby, electroforming thin blade grinding wheel according to such formation, at first on the bed thickness direction two ends of thin sharpening granulosa 1, dispose more the 1st, the 5th abrasive grain layer 1A, the 1E of amount of abrasive particle 3, so can improve the mar proof of particularly outer peripheral face and the circle-shaped two-edged oral area that intersects of two sides in the above-mentioned outer peripheral edges portion of this thin sharpening granulosa 1, by making these two cutting edge portions become the round arris wearing and tearing that prevent, keep good sharpness as cutting off tool as the cutting blade cutting edge.Therefore, be surrounded by in resin cast as described above in the cut-out of singualtion of electronic material parts of plain conductor frame etc. and the electronic material parts that constitute by resin basal disc with metal electrode, also can be suppressed in these metal parts and produce burr, high-quality electronic material parts can be provided.
In addition, bed thickness direction inboard at these the 1st, the 5th abrasive grain layer 1A, 1E, dispose less the 2nd, the 4th abrasive grain layer 1B, the 1D of amount of abrasive particle 3, thereby, these the 2nd, the 4th abrasive grain layer 1B, 1D because the cut-out of above-mentioned electronic material parts workpiece and cut off before finishing and wear and tear significantly with respect to the 1st, the 5th abrasive grain layer 1A, 1E, thus, as shown in Figure 2, on the above-mentioned outer peripheral face of thin sharpening granulosa 1, mark the recess of ring-type.And,,, can promote more high-quality cut-out processing so can prevent to result from the generation of burr of the delay that this cuts powder and the damage of section because the powder of cutting that produces is discharged from via this recess when cutting off.In addition, as mentioned above, by the 2nd, the 4th abrasive grain layer 1B, 1D and inboard in abutting connection with forming such recess, make above-mentioned cutting edge portion relatively side-prominent and keep good sharpness more reliably to periphery as the bed thickness direction of the 1st, the 5th abrasive grain layer 1A, the 1E of cutting blade cutting edge.
On the other hand, by by forming recess with the 2nd, the 4th two-layer abrasive grain layer 1B, the 1D of the inboard adjacency of the bed thickness direction of the 1st, the 5th abrasive grain layer 1A, 1E respectively, electroforming thin blade grinding wheel according to above-mentioned formation, though with respect to the electroforming thin blade grinding wheel of record in the patent documentation 1 that for example is provided with the lower central electroforming abrasive grain layer of 1 layer of concentration degree etc., the width and the degree of depth of each recess are diminished, but cutting in the recess that powder is housed in adjacency respectively of the 1st, the 5th abrasive grain layer 1A, 1E can be discharged reliably.Therefore, can prevent that this recess from becoming the mar proof of greatly required above and thin sharpening granulosa 1 integral body of infringement or prevent to peel off etc. by the darker recess of such formation in the 1st, the 5th abrasive grain layer 1A, 1E, the life-span electroforming thin blade grinding wheel of length can be provided.
And, between these the 2nd, the 4th abrasive grain layer 1B, 1D, also dispose the 3rd abrasive grain layer 1C that the amount of abrasive particle 3 is Duoed than the 2nd, the 4th abrasive grain layer 1B, 1D, thereby, the 3rd abrasive grain layer 1C is more outstanding than the 2nd, the 4th abrasive grain layer 1B, the 1D that mark above-mentioned recess, form and the same cutting blade cutting edge of the 1st, the 5th abrasive grain layer 1A, 1E, when electronic material parts as described above were cut off, these cutting blade cutting edges were cut in the metal parts such as above-mentioned lead frame and electrode in advance.Therefore, even one among above-mentioned the 1st, the 5th abrasive grain layer 1A, the 1E is not divided with this metal part and contacts, as long as the 3rd abrasive grain layer 1C of another and bed thickness direction central portion contacts with this metal part branch, just can prevent from thin sharpening granulosa 1, to produce vibration, that is, can guarantee the rectilinear propagation of this electroforming thin blade grinding wheel and prevent swing.
Thereby, according to the electroforming thin blade grinding wheel of said structure, can prevent to cut off that processing itself can not be carried out or can not cut off but consider that swing has to cut off the situation that width is set greatly, the quantity of the electronic material parts that can make from the substrate of limited size reduces even without reaching because of such swing makes.And, because the also not swing of the section of workpiece, thus more high-quality electronic material parts can be made, by realizing the emery wheel life-time dilatation as described above, can be steady in a long-term and such electronic material parts are provided effectively.
In addition, in the electroforming thin blade grinding wheel of present embodiment, the amount of abrasive particle 3 that makes the 1st, the 3rd, the 5th abrasive grain layer 1A, 1C, 1E is in the scope of 15～40vol%, and the amount of abrasive particle 3 that makes the 2nd, the 4th abrasive grain layer 1B, 1D can be brought into play such effect more reliably in the scope of 1～10vol%.Promptly, if 1st, the amount of the abrasive particle 3 of the 3rd, the 5th abrasive grain layer 1A, 1C, 1E is less to being lower than 15vol%, then mar proof reduces, arris wearing and tearing that might be as described above take place in the 1st, the 5th abrasive grain layer 1A, 1E as the cutting blade cutting edge of the generation that suppresses burr or retreat as the 3rd abrasive grain layer 1C that guarantees the cutting blade cutting edge of rectilinear propagation and can not realize contacting in the metal part with the 1st, the 5th abrasive grain layer 1A, 1E.In addition, if instead how the amount of abrasive particle 3 is to surpassing 40vol%, then particularly the hardness of the 1st, the 5th abrasive grain layer 1A, 1E might become too high and make abrasive particle 3 be difficult to come off, and can not promote the spontaneous of cutting blade, the sharpness rust can not suppress the generation of burr reliably.
On the other hand, if 2nd, the amount of the abrasive particle 3 of the 4th abrasive grain layer 1B, 1D is less to being lower than 1vol%, also might become dark even then the above-mentioned recess width that is marked by wearing and tearing is narrower, 1st, the 5th abrasive grain layer 1A, 1E peel off easily, otherwise, if many to surpassing 10vol%, then the difference with abrasive particle 3 amounts of the 1st, the 3rd, the 5th abrasive grain layer 1A, 1C, 1E diminishes, it is shallow that recess became, and might hinder the discharge of cutting powder, and the inhibition effect of burr becomes insufficient.In addition, contact in the time of in order to ensure above-mentioned the 1st, the 5th abrasive grain layer 1A, 1E and the 3rd abrasive grain layer 1C, the amount of the abrasive particle 3 of these abrasive grain layers 1A, 1C, 1E is preferably as present embodiment equal, and realize not having the discharge of cutting powder of bias for the recess that makes the 2nd, the 4th abrasive grain layer 1B, 1D becomes the equal degree of depth, the amount of the abrasive particle 3 of these abrasive grain layers 1B, 1D also is preferably as present embodiment and is equal to each other.
In addition, in the present embodiment, the bed thickness that makes these the 1st～the 5th abrasive grain layer 1A～1E is 1/5 of the bed thickness of the integral body of thin sharpening granulosa 1, be the bed thickness that is equal to each other, balance disposes the inhibition that is used for bringing into play burr preferably, prevents the 1st, the 5th abrasive grain layer 1A, the 1E of effect and is used for guaranteeing that smear metal discharges the 2nd, the 4th abrasive grain layer 1B, the 1D of property and the 3rd abrasive grain layer 1C that is used for guaranteeing rectilinear propagation mutually, can bring into play action effect separately reliably.Promptly, if the bed thickness of any among these abrasive grain layers 1A～1E for example becomes blocked up, then at least one among remaining abrasive grain layer 1A～1E became thin, if this at least 1 abrasive grain layer is the 1st, the 5th abrasive grain layer 1A, 1E then might be able to not obtains the inhibition effect of burr, if the 2nd, the 4th abrasive grain layer 1B, 1D then might damage smear metal discharge property, also make the inhibition effect of burr become insufficient, if the 3rd abrasive grain layer 1C then might damage the rectilinear propagation of the electroforming thin blade grinding wheel when cutting off.
In addition, in order to bring into play like this action effect of the 1st～the 5th abrasive grain layer 1A～1E respectively reliably, as long as described above these bed thickness all are located in 1/6～1/4 the scope of thin sharpening granulosa 1 whole bed thickness just passable.For example, also can be among abrasive grain layer 1A～1E 3 layers for thin sharpening granulosa 1 whole bed thickness 1/6, other 2 layers be 1/4.But, symmetry in order to ensure thin sharpening granulosa 1 as described above, the bed thickness of the 1st abrasive grain layer 1A and the 5th abrasive grain layer 1E is equal to each other, and the bed thickness of the 2nd abrasive grain layer 1B and the 4th abrasive grain layer 1D also is equal to each other, the bed thickness of the 1st, the 5th abrasive grain layer 1A, 1E and the 3rd abrasive grain layer 1C also is equal to each other, and the bed thickness that is preferably especially as present embodiment all abrasive grain layer 1A～1E is made as 1/5 of thin sharpening granulosa 1 whole bed thickness with being equal to each other.
In addition, for in 1/6～1/4 the scope that like this bed thickness of the 1st～the 5th abrasive grain layer 1A～1E is controlled at reliably thin sharpening granulosa 1 whole bed thickness, particularly thin sharpening granulosa 1 whole bed thickness 1/5, preferably make be distributed to this abrasive grain layer 1A～1E the coat of metal mutually the particle diameter (average grain diameter) of the abrasive particle 3 in 2 also be thin below 1/5 of sharpening granulosa 1 whole bed thickness.Promptly, if the particle diameter of this abrasive particle 3 is excessive, even then the thickness of the coat of metal of abrasive grain layer 1A～1E phase 2 is thin more than 1/6 of sharpening granulosa 1 bed thickness, abrasive particle 3 also can from this coat of metal mutually 2 outstanding and in wrap in the abrasive grain layer 1A～1E of adjacency, the abrasive grain layer that the result can not control adjacency on these bed thickness directions each other interface (boundary face) and partly in bed thickness, produce size, can not bring into play the action effect of each abrasive grain layer 1A～1E reliably.But, if the particle diameter of this abrasive particle 3 is too small, then grinds resistance and become big, burn etc. might take place on workpiece, so the average grain diameter of this abrasive particle 3 is preferably with respect to thin more than 1/30 of sharpening granulosa 1 whole bed thickness.
[embodiment]
Below, enumerate embodiment more specifically, effect of the present invention is described.In the present embodiment, by electroforming thin blade grinding wheel based on above-mentioned embodiment, carry out the cut-out of the LED workpiece 13 that the basal disc 12 of the glass epoxy resin with metal (Cu) electrode 11 as shown in Figure 3 constitutes, the size of measuring the burr 14 that produce from the electrode 11 of this moment when cut-out initial stage and 50m cut off (wherein, as shown in Figure 3, if the size of the burr 14 that extend to laterally (direction of feed) is X, the size of establishing the burr 14 that downward direction extends is Y.).As embodiment 1, the abrasive particle amount in the 1st of this thin sharpening granulosa～the 5th abrasive grain layer is represented in table 1 with its result.In addition, Reference numeral 15 parts of LED workpiece 13 are that epoxy resin is made.
Wherein, in this embodiment 1, the electroforming thin blade grinding wheel external diameter is that 58mm, internal diameter are that 40mm, thickness (bed thickness of thin sharpening granulosa) are 0.15mm, the bed thickness of the 1st～the 5th abrasive grain layer is respectively 0.03mm, the coat of metal is Ni mutually, abrasive particle is that particle diameter is the diamond abrasive grain of 8/20 μ m, does not disperse filler.In addition, machining condition is, the speed of mainshaft is 18000 (1/min), feed speed is 100 (mm/sec), respectively the cooling water of 1.6 (L/min) is supplied with towards place of incision from the two sides side from the direction of feed side of thin blade grinding wheel and with the cooling water of 1.2 (L/min) on one side, Yi Bian cut off.In addition, the size of the LED workpiece 13 after the cut-out as shown in Figure 3.
On the other hand, as comparative example corresponding to this embodiment 1, disperseing the thin sharpening granulosa of the same appearance and size that same abrasive particle constitutes by possessing in mutually with the same coat of metal of the electroforming thin blade grinding wheel of embodiment 1, should have the 1st～the 3rd abrasive grain layer that stacks gradually along its bed thickness direction by thin sharpening granulosa, make wherein the 1st, the electroforming thin blade grinding wheel (comparative example 1) of 3 layers of structure that the abrasive particle amount in the 3rd abrasive grain layer is Duoed than the abrasive particle amount in the 2nd abrasive grain layer, the electroforming thin blade grinding wheel (comparative example 2) of the monolayer constructions will that is made of the 1st abrasive grain layer is only measured the size of the burr 14 that produce under similarity condition.Its result is represented in table 1 with the abrasive particle amount of the 1st～the 3rd abrasive grain layer.Wherein, in comparative example 1, the bed thickness of the 1st～the 3rd abrasive grain layer be thin sharpening granulosa bed thickness 0.15mm 1/3.
[table 1]
| The abrasive particle amount | The cut-out initial stage | Breaking distance 50m | |||||||
| The 1st abrasive grain layer | The 2nd abrasive grain layer | The 3rd abrasive grain layer | The 4th abrasive grain layer | The 5th abrasive grain layer | X(μm) | Y(μm) | X(μm) | Y(μm) | |
| Embodiment 1 | 25vol％ | 8vol％ | 25vol％ | 8vol％ | 25vol％ | 52 | 65 | 62 | 73 |
| Comparative example 1 | 25vol％ | 8vol％ | 25vol％ | - | - | 60 | 55 | Swing takes place can not be cut off | |
| Comparative example 2 | 25vol％ | - | - | - | - | 124 | 80 | 142 | 118 |
Result according to this table 1, at first, in the comparative example 2 that thin sharpening granulosa is made of the 1st single abrasive grain layer that disperses abrasive particle with certain abrasive particle amount (25vol%), from the cut-out initial stage, big or small X, the Y of the burr 14 of direction were bigger under direction of feed reached, along with breaking distance increases and increases gradually, X, Y become the size that surpasses 100 μ m when 50m cuts off, and can not former state use as product.In addition, in comparative example 1, though X, the Y of the burr 14 at the initial stage of cut-out suppress lessly, along with breaking distance increases based on above-mentioned patent documentation 1, in electroforming thin blade grinding wheel, swing, when 50m cuts off, bloat significantly and cut-out itself can not be carried out from set path.Corresponding to these, according to the electroforming thin blade grinding wheel of relevant embodiments of the invention 1, from the cut-out initial stage, X, Y are less in the size of burr, also are suppressed lessly when 50m cuts off, and also do not swing, and can carry out high-quality cut-out.
Then, in the electroforming thin blade grinding wheel of embodiments of the invention, by making the 2nd, the abrasive particle amount of the 4th abrasive grain layer is that 5vol% is certain, make the 1st, the 3rd, 7 kinds of electroforming thin blade grinding wheels of various variations take place in the abrasive particle amount of the 5th abrasive grain layer, otherwise with make the 1st, the 3rd, the abrasive particle amount of the 5th abrasive grain layer is that 25vol% is certain, make the 2nd, 4 kinds of electroforming thin blade grinding wheels of various variations take place in the abrasive particle amount of the 4th abrasive grain layer, measure under condition similarly to Example 1 the big or small X of the burr 14 will 13 cut-outs of same LED workpiece the time every set breaking distance, Y.With these results respectively as embodiment 11～embodiment 17 and embodiment 21～24 and expression in table 2, table 3.In addition, in table 3, as a comparative example 3, the abrasive particle amount of also having represented to make the 2nd, the 4th abrasive grain layer is 0vol%, does not promptly make result after abrasive particle is distributed to big or small X, the Y that measures burr 14 under the situation in the 2nd, the 4th abrasive grain layer.Wherein, the bed thickness of the appearance and size of each electroforming thin blade grinding wheel, coat of metal phase, abrasive particle, each abrasive grain layer all with
Embodiment 1 is same.
[table 2]
| Abrasive particle amount (vol%) | Breaking distance 1m | Breaking distance 10m | Breaking distance 20m | Breaking distance 50m | |||||||||
| The 1st abrasive grain layer | The 2nd abrasive grain layer | The 3rd abrasive grain layer | The 4th abrasive grain layer | The 5th abrasive grain layer | X(μm) | Y(μm) | X(μm) | Y(μm) | X(μm) | Y(μm) | X(μm) | Y(μm) | |
| | 45 | 5 | 45 | 5 | 45 | 91 | 98 | 95 | 101 | 96 | 104 | 98 | 108 |
| | 40 | 5 | 40 | 5 | 40 | 66 | 69 | 67 | 71 | 69 | 73 | 72 | 75 |
| | 35 | 5 | 35 | 5 | 35 | 58 | 63 | 58 | 67 | 61 | 69 | 62 | 74 |
| | 25 | 5 | 25 | 5 | 25 | 42 | 51 | 48 | 56 | 51 | 59 | 54 | 62 |
| | 20 | 5 | 20 | 5 | 20 | 38 | 41 | 43 | 45 | 48 | 52 | 52 | 58 |
| Embodiment 16 | 15 | 5 | 15 | 5 | 15 | 35 | 39 | 39 | 43 | 44 | 50 | 53 | 60 |
| Embodiment 17 | 10 | 5 | 10 | 5 | 10 | 44 | 49 | 68 | 72 | 81 | 93 | 101 | 103 |
[table 3]
| Abrasive particle amount (vol%) | Breaking distance 1m | Breaking distance 10m | Breaking distance 20m | Breaking distance 50m | |||||||||
| The 1st abrasive grain layer | The 2nd abrasive grain layer | The 3rd abrasive grain layer | The 4th abrasive grain layer | The 5th abrasive grain layer | X(μm) | Y(μm) | X(μm) | Y(μm) | X(μm) | Y(μm) | X(μm) | Y(μm) | |
| Comparative example 3 | 25 | 0 | 25 | 0 | 25 | 55 | 61 | 62 | 73 | 84 | 79 | 89 | 87 |
| Embodiment 21 | 25 | 1 | 25 | 1 | 25 | 53 | 59 | 57 | 64 | 68 | 72 | 79 | 83 |
| Embodiment 22 | 25 | 5 | 25 | 5 | 25 | 42 | 51 | 48 | 56 | 51 | 59 | 54 | 62 |
| Embodiment 23 | 25 | 10 | 25 | 10 | 25 | 58 | 65 | 67 | 71 | 70 | 74 | 75 | 78 |
| Embodiment 24 | 25 | 15 | 25 | 15 | 25 | 83 | 91 | 95 | 93 | 97 | 99 | 103 | 108 |
Wherein, at first according to the result of table 2, more at the abrasive particle amount that makes the 1st, the 3rd, the 5th abrasive grain layer, among the embodiment 11 of 45vol%, from the moment of the breaking distance 1m that cuts off the initial stage, the X of burr 14, Y are greatly to approaching 100 μ m, though along with the breaking distance increase can not enlarge markedly, its trend is when proceeding to the 50m cut-out, particularly Y become greater to and surpasses 100 μ m.In addition, abrasive particle amount at the 1st, the 3rd, the 5th abrasive grain layer is less, be among the embodiment 17 of 10vol%, though it is less in the generation of cutting off initial stage burr 14, but along with breaking distance increases, the increase quantitative change of burr 14 is big, the burr 14 that generation X, Y sharply increase produce the roughly equal big or small burr 14 with embodiment 11 when 50m cuts off.
Corresponding to these, as can be known: at the abrasive particle amount that makes the 1st, the 3rd, the 5th abrasive grain layer is among the embodiment 12～16 of 15～40vol%, the burr 14 of comparing the cut-out initial stage with embodiment 11 are less, on the other hand, compare with embodiment 17, along with breaking distance increases, on X, Y, all suppress lessly the increase of burr 14, when cutting off, also suppresses 50m for being lower than the size of 80 μ m.Particularly, be among the embodiment 13～15 of 20～35vol% wherein at the abrasive particle amount that makes the 1st, the 3rd, the 5th abrasive grain layer, the size of the burr 14 at cut-out initial stage and the increase when cutting off to 50m are all littler, promptly can stably keep higher burr and suppress effect.
On the other hand, result according to table 3, at the abrasive particle amount of the 2nd, the 4th abrasive grain layer all be 0vol%, promptly the 2nd, the 4th abrasive grain layer all is not contain in the comparative example 3 of simple Ni coating phase of abrasive particle, though it is less to cut off initial stage burr 14, but the wearing and tearing of these the 2nd, the 4th abrasive grain layers are remarkable, peel off in the 1st, the 5th abrasive grain layer before 50m cuts off and can not cut off.In addition, otherwise be 15vol% at the abrasive particle amount of the 2nd, the 4th abrasive grain layer, among the embodiment 24 than other embodiment more than 21～23, compare, begin to have the bigger trend of burr 14 from the cut-out initial stage with embodiment 21～23 and comparative example 2.
Corresponding to these, at the abrasive particle amount that makes the 2nd, the 4th abrasive grain layer is among the embodiment 21～23 of 1～10vol%, on X, Y, all suppress lessly the burr 14 at the initial stage of cut-out, and the increase of the burr 14 in the time of will arriving the 50m cut-out also suppresses lessly, be that this trend comparison is remarkable among the embodiment 22 of 5vol% particularly at the abrasive particle amount that makes the 2nd, the 4th abrasive grain layer.In addition, in following table 4,5, expression is made as the abrasive particle amount of the 1st, the 3rd, the 5th abrasive grain layer respectively 35vol%, 20vol%, the abrasive particle amount of the 2nd, the 4th abrasive grain layer is made as the result of embodiment 31～33 and the embodiment 41～43 of 1～10vol%, can confirm the trend same with the embodiment 21～23 of table 3.
[table 4]
| Abrasive particle amount (vol%) | Breaking distance 1m | Breaking distance 10m | Breaking distance 20m | Breaking distance 50m | |||||||||
| The 1st abrasive grain layer | The 2nd abrasive grain layer | The 3rd abrasive grain layer | The 4th abrasive grain layer | The 5th abrasive grain layer | X(μm) | Y(μm) | X(μm) | Y(μm) | X(μm) | Y(μm) | X(μm) | Y(μm) | |
| Embodiment 31 | 35 | 1 | 35 | 1 | 35 | 64 | 69 | 66 | 73 | 71 | 76 | 74 | 82 |
| Embodiment 32 | 35 | 5 | 35 | 5 | 35 | 68 | 73 | 68 | 77 | 71 | 79 | 72 | 84 |
| Embodiment 33 | 35 | 10 | 35 | 10 | 35 | 72 | 75 | 73 | 78 | 75 | 81 | 77 | 82 |
[table 5]
| Abrasive particle amount (vol%) | Breaking distance 1m | Breaking distance 10m | Breaking distance 20m | Breaking distance 50m | |||||||||
| The 1st abrasive grain layer | The 2nd abrasive grain layer | The 3rd abrasive grain layer | The 4th abrasive grain layer | The 5th abrasive grain layer | X(μm) | Y(μm) | X(μm) | Y(μm) | X(μm) | Y(μm) | X(μm) | Y(μm) | |
| Embodiment 41 | 20 | 1 | 20 | 1 | 20 | 47 | 49 | 50 | 54 | 54 | 58 | 61 | 66 |
| Embodiment 42 | 20 | 5 | 20 | 5 | 20 | 48 | 51 | 53 | 55 | 58 | 62 | 62 | 68 |
| Embodiment 43 | 20 | 10 | 20 | 10 | 20 | 53 | 55 | 56 | 57 | 60 | 63 | 64 | 71 |
Then, table 6 expression is made as the abrasive particle amount of the 1st, the 3rd, the 5th abrasive grain layer 25vol%, the abrasive particle amount of the 2nd, the 4th abrasive grain layer is made as 5vol%, makes the cut-out result of embodiment 51～55 of bed thickness variation of bed thickness and the 2nd, the 4th abrasive grain layer of these the 1st, the 3rd, the 5th abrasive grain layers, other conditions etc. similarly to Example 1, the bed thickness of promptly thin sharpening granulosa integral body is that 0.15mm is the same.
[table 6]
| Bed thickness (mm) | Breaking distance 1m | Breaking distance 10m | Breaking distance 20m | Breaking distance 50m | |||||||||
| The 1st abrasive grain layer | The 2nd abrasive grain layer | The 3rd abrasive grain layer | The 4th abrasive grain layer | The 5th abrasive grain layer | X(μm) | Y(μm) | X(μm) | Y(μm) | X(μm) | Y(μm) | X(μm) | Y(μm) | |
| Embodiment 51 | 0.02 | 0.045 | 0.02 | 0.045 | 0.02 | 68 | 84 | 73 | 82 | 79 | 85 | 84 | 89 |
| Embodiment 52 | 0.025 | 0.0375 | 0.025 | 0.0375 | 0.025 | 57 | 72 | 66 | 74 | 71 | 78 | 79 | 81 |
| Embodiment 53 | 0.03 | 0.03 | 0.03 | 0.03 | 0.03 | 52 | 61 | 58 | 66 | 61 | 69 | 64 | 72 |
| Embodiment 54 | 0.033 | 0.0255 | 0.033 | 0.0255 | 0.033 | 55 | 58 | 57 | 59 | 63 | 67 | 71 | 74 |
| Embodiment 55 | 0.04 | 0.015 | 0.04 | 0.015 | 0.04 | 81 | 62 | 88 | 68 | 88 | 75 | 92 | 80 |
Result according to this table 6, at the bed thickness that makes the 1st, the 3rd, the 5th abrasive grain layer is 0.02mm and thinner and to make the bed thickness of the 2nd, the 4th abrasive grain layer be 0.045mm and than 1/4 (0.0375mm) of the bed thickness of thin sharpening granulosa among the thick embodiment 51 than 1/6 (0.025mm) of the bed thickness of thin sharpening granulosa, it is just bigger particularly to descend the big or small Y of the burr 14 of direction to begin from the cut-out initial stage, and this trend lasts till when 50m cuts off always.On the other hand, otherwise at the bed thickness that makes the 1st, the 3rd, the 5th abrasive grain layer is 0.04mm and 1/4 thick and to make the bed thickness of the 2nd, the 4th abrasive grain layer be 0.015mm and in than 1/6 of the bed thickness of thin sharpening granulosa thin embodiment 55 than the bed thickness of thin sharpening granulosa is all bigger when particularly the big or small X of the burr 14 of direction of feed and increase thereof were cut off from the cut-out initial stage to 50m.
Corresponding to these, at the bed thickness of the 1st～the 5th abrasive grain layer all among the embodiment 52～54 in 1/6～1/4 the scope at the whole bed thickness of thin sharpening granulosa, the burr 14 at cut-out initial stage and increase thereof are all less on X, Y, particularly the bed thickness at the 1st～the 5th abrasive grain layer equates, is among the embodiment 53 of 1/5 (0.03mm) of bed thickness of thin sharpening granulosa, and this trend is the most significant.
At last, it is that the abrasive particle amount of 25vol%, the 2nd, the 4th abrasive grain layer is 5vol%, makes the cut-out result of embodiment 61～65 of the various variations of particle diameter of this abrasive particle that table 7 expression still makes the abrasive particle amount of the 1st, the 3rd, the 5th abrasive grain layer, and other conditions etc. similarly to Example 1.
[table 7]
| The abrasive particle diameter | Breaking distance 1m | Breaking distance 10m | Breaking distance 20m | Breaking distance 50m | |||||
| X(μm) | Y(μm) | X(μm) | Y(μm) | X(μm) | Y(μm) | X(μm) | Y(μm) | ||
| Embodiment 61 | 5/10μm | 41 | 45 | 52 | 56 | 58 | 59 | 69 | 75 |
| Embodiment 62 | 6/12μm | 48 | 53 | 54 | 61 | 63 | 65 | 72 | 73 |
| Embodiment 63 | 8/20μm | 52 | 61 | 58 | 66 | 61 | 69 | 64 | 72 |
| Embodiment 64 | 20/30μm | 62 | 54 | 66 | 58 | 67 | 60 | 71 | 68 |
| Embodiment 65 | 30/40μm | 78 | 83 | 82 | 84 | 92 | 88 | 93 | 95 |
Result according to this table 7, at first in the embodiment 65 of abrasive particle diameter for the 30/40 μ m of 1/5 (0.03mm) that surpass the whole bed thickness of thin sharpening granulosa, from the cut-out initial stage, burr 14 are all bigger on X, Y, though increase is so not big, this trend lasts till when 50m cuts off always.To this, in the embodiment 1/5 below 61～64 that makes the abrasive particle diameter for the whole bed thickness of thin sharpening granulosa, it is less to begin burr 14 from the cut-out initial stage, and it is also less to be accompanied by the increase of breaking distance increase, also suppresses for enough little when 50m cuts off.Wherein, be lower than among the embodiment 61 of 1/30 (0.005mm) that approach the whole bed thickness of sharpening granulosa,, on the basal disc that constitutes by glass epoxy resin 12 of LED workpiece 13, produce burn, be unsuitable for former state as goods though burr 14 are own less at the abrasive particle diameter.
Claims (4)
1. electroforming thin blade grinding wheel, it is characterized in that, possess at the coat of metal and disperse abrasive particle in mutually and the thin sharpening granulosa that forms, should have the 1st～the 5th abrasive grain layer that stacks gradually by thin sharpening granulosa on the bed thickness direction of this thin sharpening granulosa, wherein the amount of the above-mentioned abrasive particle of the 1st, the 3rd, the 5th abrasive grain layer is more than the amount of the above-mentioned abrasive particle of the 2nd, the 4th abrasive grain layer.
2. electroforming thin blade grinding wheel as claimed in claim 1, it is characterized in that, the amount of the above-mentioned abrasive particle of above-mentioned the 1st, the 3rd, the 5th abrasive grain layer is in the scope of 15～40vol%, and the amount of the above-mentioned abrasive particle of above-mentioned the 2nd, the 4th abrasive grain layer is in the scope of 1～10vol%.
3. electroforming thin blade grinding wheel as claimed in claim 1 or 2 is characterized in that, the bed thickness of above-mentioned the 1st～the 5th abrasive grain layer is all in 1/6～1/4 scope of the whole bed thickness of above-mentioned thin sharpening granulosa.
4. as each described electroforming thin blade grinding wheel in the claim 1～3, it is characterized in that the particle diameter of above-mentioned abrasive particle is whole below 1/5 of bed thickness of above-mentioned thin sharpening granulosa.
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| CN201410070821.2A CN104029136B (en) | 2005-11-02 | 2006-11-02 | Electroforming thin blade grinding wheel |
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| JP2005319286 | 2005-11-02 | ||
| JP2005319286A JP4779580B2 (en) | 2005-11-02 | 2005-11-02 | Electroformed thin blade whetstone |
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| CN201410070821.2A Expired - Fee Related CN104029136B (en) | 2005-11-02 | 2006-11-02 | Electroforming thin blade grinding wheel |
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| JP (1) | JP4779580B2 (en) |
| KR (1) | KR20070047705A (en) |
| CN (2) | CN1958239A (en) |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103517785A (en) * | 2011-02-28 | 2014-01-15 | 株式会社东京精密 | Cutting blade |
| CN107953224A (en) * | 2016-10-18 | 2018-04-24 | 株式会社迪思科 | Cutting tool |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6194600B2 (en) * | 2013-02-15 | 2017-09-13 | 山形県 | Composite plating film and thin grindstone using the same |
| JP6233928B2 (en) * | 2014-02-28 | 2017-11-22 | 国立大学法人 岡山大学 | Grinding grain adhesion device |
| JP6211472B2 (en) * | 2014-06-26 | 2017-10-11 | 株式会社ノリタケカンパニーリミテド | Segment chip |
| JP2016168660A (en) * | 2015-03-13 | 2016-09-23 | 株式会社ディスコ | Grinding wheel |
| JP6668178B2 (en) * | 2015-06-23 | 2020-03-18 | 株式会社ノリタケカンパニーリミテド | Segment chip |
| JP2019102757A (en) * | 2017-12-07 | 2019-06-24 | 株式会社ディスコ | Method for cutting qfn package substrate |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5783372A (en) * | 1980-10-31 | 1982-05-25 | Yasuo Arakawa | Metal bond grinder element composed of main and auxiliary grinding layers |
| JPH081651B2 (en) * | 1986-12-10 | 1996-01-10 | 富士通株式会社 | Data registration device |
| JPH0730279Y2 (en) * | 1987-03-17 | 1995-07-12 | 三菱マテリアル株式会社 | Electroformed thin blade grindstone |
| JP2001212769A (en) * | 2000-01-31 | 2001-08-07 | Allied Material Corp | Super-abrasive grain wheel |
| JP3823830B2 (en) * | 2002-01-10 | 2006-09-20 | 三菱マテリアル株式会社 | Electroformed thin blade whetstone |
-
2005
- 2005-11-02 JP JP2005319286A patent/JP4779580B2/en active Active
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2006
- 2006-10-26 TW TW095139492A patent/TWI314497B/en not_active IP Right Cessation
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103517785A (en) * | 2011-02-28 | 2014-01-15 | 株式会社东京精密 | Cutting blade |
| CN103517785B (en) * | 2011-02-28 | 2016-06-29 | 株式会社东京精密 | Cutting grinding wheel |
| CN107953224A (en) * | 2016-10-18 | 2018-04-24 | 株式会社迪思科 | Cutting tool |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104029136A (en) | 2014-09-10 |
| TWI314497B (en) | 2009-09-11 |
| CN104029136B (en) | 2017-05-31 |
| KR20070047705A (en) | 2007-05-07 |
| TW200726583A (en) | 2007-07-16 |
| JP4779580B2 (en) | 2011-09-28 |
| JP2007125636A (en) | 2007-05-24 |
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