JP6194600B2 - Composite plating film and thin grindstone using the same - Google Patents
Composite plating film and thin grindstone using the same Download PDFInfo
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- JP6194600B2 JP6194600B2 JP2013042293A JP2013042293A JP6194600B2 JP 6194600 B2 JP6194600 B2 JP 6194600B2 JP 2013042293 A JP2013042293 A JP 2013042293A JP 2013042293 A JP2013042293 A JP 2013042293A JP 6194600 B2 JP6194600 B2 JP 6194600B2
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- 238000007747 plating Methods 0.000 title claims description 164
- 239000002131 composite material Substances 0.000 title claims description 118
- 239000006061 abrasive grain Substances 0.000 claims description 56
- 239000000463 material Substances 0.000 claims description 31
- 229910021392 nanocarbon Inorganic materials 0.000 claims description 28
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 26
- 239000011159 matrix material Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 10
- 229910003460 diamond Inorganic materials 0.000 claims description 9
- 239000010432 diamond Substances 0.000 claims description 9
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- 239000002048 multi walled nanotube Substances 0.000 claims description 5
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 229910003472 fullerene Inorganic materials 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 239000002109 single walled nanotube Substances 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 48
- 239000002041 carbon nanotube Substances 0.000 description 21
- 229910021393 carbon nanotube Inorganic materials 0.000 description 21
- 229910052759 nickel Inorganic materials 0.000 description 17
- 239000010419 fine particle Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000000737 periodic effect Effects 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 206010019332 Heat exhaustion Diseases 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000879 optical micrograph Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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Description
本発明は、石英ガラスやシリコンウェハなどの硬脆材料の微細溝加工、切断加工に用いられる薄型砥石に関するもので、より詳細には、カーフロス（切断代）低減のための薄型化、高能率加工のための機械的強度向上などの要求に応えるために、高い剛性、低い摩擦係数、熱排出性、低い研削抵抗、切りくずの排出特性を付与した複合めっき被膜及びその複合めっき被膜からなる薄型砥石に関する。 The present invention relates to a thin grindstone used for fine grooving and cutting of hard and brittle materials such as quartz glass and silicon wafers, and more specifically, thinning and high-efficiency machining for reducing kerfloss (cutting allowance). In order to meet demands for improving mechanical strength, etc., a composite plating film with high rigidity, low coefficient of friction, heat exhaustion, low grinding resistance, and chip discharge characteristics, and a thin grindstone made of the composite plating film About.
ニッケルや銅などの母層に機能性の粒子を複合させる複合めっき被膜は、めっき被膜の摺動性、伝導性、機械的強度などの機能性を向上させることを目的として広く用いられている。 A composite plating film in which functional particles are combined with a mother layer such as nickel or copper is widely used for the purpose of improving functionality such as slidability, conductivity, and mechanical strength of the plating film.
複合めっき被膜を用いた応用製品の一つに薄型砥石がある。薄型砥石は、ダイヤモンド砥粒や立方晶窒化ホウ素砥粒などの超砥粒を分散させたニッケルを主成分とする複合めっき被膜が切れ刃となる。前記複合めっき被膜のみから形成された薄型円板形状の自立膜のものを電鋳砥石といい、薄型の円板形状の台がねの上に前記複合めっき被膜を形成したものを電着砥石という。 One of the applied products using composite plating film is a thin grinding wheel. The thin grindstone has a cutting edge of a composite plating film mainly composed of nickel in which superabrasive grains such as diamond abrasive grains and cubic boron nitride abrasive grains are dispersed. A thin disc-shaped self-supporting film formed only from the composite plating film is referred to as an electroforming grindstone, and an electrodeposition grindstone is obtained by forming the composite plating film on a thin disc-shaped platform plate. .
薄型砥石は、石英ガラスやシリコンウェハなどの硬脆材料の微細溝加工、切断加工に用いられる工具である。薄型砥石は、カーフロス低減のための薄型化、高能率加工のための機械的強度向上などの要求に応えるために、高い剛性、低い摩擦係数、熱排出性、低い研削抵抗、切りくずの排出特性を付与することが求められている。 A thin grindstone is a tool used for fine grooving and cutting of hard and brittle materials such as quartz glass and silicon wafers. Thin grinding stones have high rigidity, low friction coefficient, heat exhaustion, low grinding resistance, and chip discharge characteristics in order to meet demands such as thinning to reduce kerf loss and improving mechanical strength for high-efficiency machining. Is required.
特許文献１や特許文献２によれば、薄型砥石の外周部に周期的なスリットを設けることで、切削時に生じる切りくずを排出しやすくして目詰まりを抑制し、研削抵抗を低減する効果が示されている。しかしながら、スリットを設けることで、刃先の剛性が低下してしまうという課題がある。 According to Patent Document 1 and Patent Document 2, by providing periodic slits on the outer peripheral portion of the thin grindstone, it is easy to discharge chips generated during cutting, thereby suppressing clogging and reducing grinding resistance. It is shown. However, there is a problem that the rigidity of the cutting edge is reduced by providing the slit.
特許文献３によれば、三層構造の電鋳砥石が提案されており、被加工物へのダメージが小さい銅電鋳層と剛性のあるニッケル電鋳層を組み合わせた電鋳ブレードが提案されている。この構造であれば、高い剛性とチッピングの小さい加工という利点を享受できるが、低い摩擦係数、低い研削抵抗、切りくずの排出特性などを同時に得ることができないという課題がある。 According to Patent Document 3, an electroformed grinding wheel having a three-layer structure is proposed, and an electroformed blade combining a copper electroformed layer with a small damage to a workpiece and a rigid nickel electroformed layer is proposed. Yes. With this structure, it is possible to enjoy the advantages of high rigidity and small chipping, but there is a problem that a low friction coefficient, low grinding resistance, chip discharge characteristics, etc. cannot be obtained at the same time.
本発明は、機能性を付与した複合めっき被膜及びそれを用いた高性能な薄型砥石に関するもので、より詳細には、ナノカーボン材料を複合化することにより、高い剛性、低い摩擦係数、熱排出性をめっき被膜に付与し、さらに超砥粒を周方向に周期的に配置することにより低い研削抵抗、切りくずの排出特性を付与した複合めっき被膜及び薄型砥石を提供することを目的とする。 TECHNICAL FIELD The present invention relates to a composite plating film provided with functionality and a high-performance thin grindstone using the same, and more specifically, by combining a nanocarbon material, high rigidity, low friction coefficient, heat exhaustion. It is an object to provide a composite plating film and a thin grindstone that impart low grinding resistance and chip discharge characteristics by periodically imparting properties to the plating film and periodically arranging superabrasive grains in the circumferential direction.
上記目的を達成するため、請求項１記載の薄型電鋳砥石は、ナノカーボン材料および超砥粒が分散してなる２層以上の複数層で形成された複合めっき被膜であり、複合めっき被膜を形成する基板面の任意の点を通る法線を中心軸とし、その中心軸から放射状に砥粒列が配置され、その中心軸を中心とした周方向に周期的に砥粒列が配置された複合めっき層を少なくとも１層有し、超砥粒が均一に分散してなる複合めっき層を少なくとも１層有することを特徴とする複合めっき被膜のみからなり、薄型円板形状の自立膜であることを特徴とする。In order to achieve the above object, the thin electroformed grinding wheel according to claim 1 is a composite plating film formed of a plurality of layers of two or more layers in which a nanocarbon material and superabrasive grains are dispersed. A normal line passing through an arbitrary point on the substrate surface to be formed is a central axis, and abrasive grain rows are arranged radially from the central axis, and abrasive grain rows are periodically arranged in the circumferential direction around the central axis. the composite plated layer at least 1 Soyu it superabrasive is only a composite plating film and having at least one layer of composite plating layer formed by uniformly dispersing a self-supporting film of a thin disk-shaped It is characterized by.
請求項２記載の薄型電鋳砥石は、前記複合めっき被膜を形成する基板面の任意の点を通る法線を中心軸とし、その中心軸から放射状に砥粒列が配置され、その中心軸を中心とした周方向に周期的に砥粒列が配置された複合めっき層において、めっき母相にナノカーボン材料を分散した複合めっき領域があり、めっき母相のみの弾性率に比べて１２０％ないし１５０％の値を有する複合めっき領域であることを特徴とする。 The thin electroformed grindstone according to claim 2 has a normal axis passing through an arbitrary point on the substrate surface on which the composite plating film is formed as a central axis, and a row of abrasive grains is arranged radially from the central axis, and the central axis is In the composite plating layer in which the rows of abrasive grains are periodically arranged in the center circumferential direction, there is a composite plating region in which the nanocarbon material is dispersed in the plating matrix phase, which is 120% or less than the elastic modulus of the plating matrix phase alone. It is a composite plating region having a value of 150%.
請求項３記載の薄型電鋳砥石は、前記複合めっき被膜を形成する基板面の任意の点を通る法線を中心軸とし、その中心軸から放射状に砥粒列が配置され、その中心軸を中心とした周方向に周期的に砥粒列が配置された複合めっき層において、めっき母相にナノカーボン材料を分散した複合めっき領域があり、めっき母相のみの場合に比べて、鋼材との摺動による摩耗量が６％ないし３０％の値である複合めっき領域であり、この複合めっき領域を有する層が最表面に存在することを特徴とする。 The thin electroformed grindstone according to claim 3 has a normal axis passing through an arbitrary point of the substrate surface on which the composite plating film is formed as a central axis, and a row of abrasive grains is radially arranged from the central axis, and the central axis is In the composite plating layer in which the rows of abrasive grains are periodically arranged in the circumferential direction around the center, there is a composite plating region in which the nanocarbon material is dispersed in the plating matrix phase, compared with the case of only the plating matrix phase. It is a composite plating region where the amount of wear due to sliding is a value of 6% to 30%, and a layer having this composite plating region is present on the outermost surface.
請求項４記載の薄型電鋳砥石は、前記複合めっき被膜を形成する基板面の任意の点を通る法線を中心軸とし、その中心軸から放射状に砥粒列が配置され、その中心軸を中心とした周方向に周期的に砥粒列が配置された複合めっき層において、めっき母相にナノカーボン材料を分散した複合めっき領域があり、めっき母相のみの摩擦係数に比べて１０％ないし９０％の値を有する複合めっき領域であり、この複合めっき領域を有する層が最表面に存在することを特徴とする。 The thin electroformed grindstone according to claim 4 has a normal axis passing through an arbitrary point of the substrate surface on which the composite plating film is formed as a central axis, and a row of abrasive grains is radially arranged from the central axis, and the central axis is In the composite plating layer in which the rows of abrasive grains are periodically arranged in the center circumferential direction, there is a composite plating region in which the nanocarbon material is dispersed in the plating matrix, and the friction coefficient of the plating matrix alone is 10% or less. This is a composite plating region having a value of 90%, and a layer having this composite plating region is present on the outermost surface.
請求項５記載の薄型電鋳砥石は、前記超砥粒が、ダイヤモンドまたは立方晶窒化ホウ素のいずれかの超砥粒であることを特徴とする。 The thin electroformed grindstone according to claim 5 is characterized in that the superabrasive grains are superabrasive grains of either diamond or cubic boron nitride.
請求項６記載の薄型電鋳砥石は、前記ナノカーボン材料が、単層カーボンナノチューブ、多層カーボンナノチューブ、グラフェン、フラーレンのいずれかのナノカーボン材料であることを特徴とする。 The thin electroformed grindstone according to claim 6 is characterized in that the nanocarbon material is any one of single-walled carbon nanotubes, multi-walled carbon nanotubes, graphene, and fullerene.
請求項１記載の発明によれば、高弾性率で、摩擦係数が低く、熱伝導性に優れるナノカーボン材料が複合めっき被膜に含まれることでナノカーボンが有する機能を前記めっき被膜に付与することができる効果がある。さらに、加工に寄与する超砥粒が、複合めっき被膜を形成する基板面の任意の点を通る法線を中心軸とし、前記中心軸から放射状に砥粒列が形成されてなり、前記中心軸を中心とした周方向に周期的に前記砥粒列が配置されることで、砥粒列が存在し切れ刃となる領域が周方向に周期的に存在するとともに、砥粒列が存在しない領域は切りくずの排出することに寄与する効果がある。結果として、複合めっき被膜は、高い剛性、低い摩擦係数、熱排出性、低い研削抵抗、切りくずの排出特性を得る効果がある。 According to the first aspect of the invention, the nano-carbon material having a high elastic modulus, a low friction coefficient, and excellent thermal conductivity is included in the composite plating film, thereby imparting the function of the nano-carbon to the plating film. There is an effect that can. Further, the superabrasive grains that contribute to the processing have a normal axis passing through an arbitrary point of the substrate surface on which the composite plating film is formed as a central axis, and a row of abrasive grains is formed radially from the central axis, and the central axis The abrasive grain rows are periodically arranged in the circumferential direction around the center, so that the abrasive grain rows are periodically present in the circumferential direction and the abrasive grain rows are not present. Has the effect of contributing to chip discharge. As a result, the composite plating film has an effect of obtaining high rigidity, a low coefficient of friction, heat exhaustability, low grinding resistance, and chip discharge characteristics.
さらに、前記複合めっき被膜が複数層で形成されることで、層ごとに（厚み方向に）機能を分担させることができ、たとえば、切りくずの排出性を重視した複合めっき被膜と高い剛性を重視した複合めっき被膜の構造を実現することができる。それらの機能を有する薄型砥石を提供することができる。
加えて、薄型円板形状の自立膜であることにより、カーフロス低減のための薄型化、高 能率加工のための機械的強度向上などの要求に応えることができる電鋳砥石となる。 Furthermore, since the composite plating film is formed of a plurality of layers, the function can be shared for each layer (in the thickness direction), for example, a composite plating film that emphasizes chip discharge and high rigidity. Thus, the structure of the composite plating film can be realized. A thin grindstone having these functions can be provided.
In addition, the thin disc-shaped self-supporting film provides an electroforming grindstone that can meet the demands for thinning for reducing kerf loss and improving mechanical strength for high- efficiency machining.
請求項２記載の発明によれば、前記複合めっき被膜において、少なくとも前記砥粒列が形成されていない領域のめっき被膜がナノカーボン材料によって補強された複合めっき領域であり、ナノカーボン材料の複合化によって弾性率が、ナノカーボン材料によって補強されていないめっき被膜に比べて１２０％ないし１５０％の値を有する複合めっき領域であることにより、高い剛性を有する複合めっき被膜なり、それを用いた薄型砥石は砥粒列による切れ味の良さとともに高い剛性を同時に有するものとなる。According to the invention of claim 2 , in the composite plating film, at least the plating film in the region where the abrasive grain row is not formed is a composite plating region reinforced by the nanocarbon material, and the nanocarbon material is combined. The composite plating region having a modulus of elasticity of 120% to 150% as compared with the plating coating not reinforced by the nanocarbon material, thereby forming a composite plating film having high rigidity, and a thin grindstone using the same Has high rigidity at the same time as good sharpness due to the abrasive grain rows.
請求項３記載の発明によれば、前記複合めっき被膜において、少なくとも前記砥粒列が形成されていない領域のめっき被膜がナノカーボン材料によって補強された複合めっき領域であり、ナノカーボン材料によって鋼材に対しての摩耗量が、ナノカーボン材料によって補強されていないめっき被膜に比べて６％ないし３０％である複合めっき領域であり、耐摩耗性が高い前記複合めっき領域を含む複合めっき層が少なくとも最表面に存在することにより、耐摩耗性を有する複合めっき被膜なり、それを用いた薄型砥石は砥粒列による切れ味の良さとともに耐摩耗性を同時に有するものとなる。According to the invention of claim 3 , in the composite plating film, at least the plating film in a region where the abrasive grain row is not formed is a composite plating region reinforced by the nanocarbon material, and the steel material is formed by the nanocarbon material. The amount of wear on the composite plating region is 6% to 30% as compared with the plating film not reinforced by the nanocarbon material, and at least the composite plating layer including the composite plating region having high wear resistance is at least the most. By being present on the surface, a composite plating film having wear resistance is obtained, and a thin grindstone using the same has wear resistance as well as sharpness due to the abrasive grain rows.
請求項４記載の発明によれば、前記複合めっき被膜において、少なくとも前記砥粒列が形成されていない領域のめっき被膜がナノカーボン材料によって補強された複合めっき領域であり、ナノカーボン材料によって摩擦係数が、ナノカーボン材料によって補強されていないめっき被膜に比べて１０％ないし９０％の値である複合めっき領域であり、低摩擦係数である前記複合めっき領域を含む複合めっき層が少なくとも最表面に存在することにより、低い摩擦係数を有する複合めっき被膜なり、それを用いた薄型砥石は砥粒列による切れ味の良さとともに切りくずの潤滑性を同時に有するものとなる。According to the invention of claim 4 , in the composite plating film, at least the plating film in the region where the abrasive grain row is not formed is a composite plating region reinforced by the nanocarbon material, and the friction coefficient by the nanocarbon material. Is a composite plating region having a value of 10% to 90% as compared with the plating film not reinforced with the nanocarbon material, and a composite plating layer including the composite plating region having a low coefficient of friction exists at least on the outermost surface. By doing so, a composite plating film having a low friction coefficient is obtained, and a thin grindstone using the composite plating film simultaneously has good sharpness due to the abrasive grain array and chip lubricity.
請求項５記載の発明によれば、前記超砥粒が、ダイヤモンドまたは立方晶窒化ホウ素のいずれかの超砥粒であることにより、請求項１ないし請求項５に記載の複合めっき被膜を、石英ガラスやシリコンウェハなどの硬脆材料の微細溝加工、切断加工に用いる薄型砥石として用いることができる。According to a fifth aspect of the present invention, the superabrasive grain is a superabrasive grain of either diamond or cubic boron nitride, whereby the composite plating film according to any one of the first to fifth aspects is made of quartz. It can be used as a thin grindstone used for fine grooving and cutting of hard and brittle materials such as glass and silicon wafers.
請求項６記載の発明によれば、前記ナノカーボン材料が、単層カーボンナノチューブ、多層カーボンナノチューブ、グラフェン、フラーレンのいずれかのナノカーボン材料であることにより、高い剛性、低い摩擦係数、熱排出性をめっき被膜に付与することができる。According to the invention of claim 6 , the nanocarbon material is any one of single-walled carbon nanotubes, multi-walled carbon nanotubes, graphene, and fullerene, so that it has high rigidity, low friction coefficient, and heat exhaustibility. Can be imparted to the plating film.
以下、図を参照して本発明を説明する。この図および説明は単なる一例に過ぎず、本発明の全般的な概念を制限するものではない。
以下、本発明の好ましい実施例を、添付した図面を参照して詳細に説明する。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
本発明の実施形態の一例である複合めっき被膜（薄型砥石）の概略図である図１において、微粒子列を含む複合めっき被膜１の領域は、めっき母相はニッケルや銅などを主成分とするものであり、面直方向に一様であり、面内周方向に周期的である。微粒子を、ダイヤモンドや立方晶窒化ホウ素などの砥粒とし、図１のように、複合めっき被膜を薄型円板状の自立膜とすれば、薄型電鋳砥石となり、円板形状の台がねの上に前記複合めっき被膜を形成すれば、薄型電着砥石となる。被加工物の切りくずの排出性や求める加工特性に応じて、砥粒列の幅、周期、本数は変化させることができる。前記砥粒列を含む複合めっき被膜１には、微粒子とは別にナノカーボン材料を含んでいても良い。 In FIG. 1, which is a schematic view of a composite plating film (thin grinding wheel) that is an example of an embodiment of the present invention, the region of the composite plating film 1 including a fine particle array is mainly composed of nickel, copper, or the like. It is uniform in the direction perpendicular to the surface, and is periodic in the inner circumferential direction. If the fine particles are abrasive grains such as diamond or cubic boron nitride, and the composite plating film is a thin disc-like self-supporting film as shown in FIG. If the said composite plating film is formed on it, it will become a thin electrodeposition grindstone. The width, period, and number of abrasive grains can be changed according to the chip dischargeability of the workpiece and the required processing characteristics. The composite plating film 1 including the abrasive grain row may contain a nanocarbon material in addition to the fine particles.
図１において、砥粒列を含まない複合めっき被膜２は、単層カーボンナノチューブ、多層カーボンナノチューブ、グラフェン、フラーレンなどのナノカーボン材料によって機能性を付与される。特に複合めっき被膜に、高い剛性、低い摩擦係数、熱排出性などが改善あるいは付与されることにより、この複合めっき被膜を薄型砥石に用いたときに、被加工物との摩擦係数が低減され、この砥粒を含まない複合めっき被膜２の領域上を切りくずが速やかに排出される効果や、砥石を薄型化したときにも剛性が保たれる効果、加工熱の排出効果などが期待できる。また、ナノカーボン材料の複合化により、めっき母相の結晶粒は微細化し、配向性はランダム配向となることも複合めっき被膜の特性を改善する一因である。 In FIG. 1, the composite plating film 2 that does not include an abrasive grain array is provided with functionality by a nanocarbon material such as a single-walled carbon nanotube, a multi-walled carbon nanotube, graphene, or fullerene. In particular, by improving or imparting high rigidity, low coefficient of friction, heat exhaustability, etc. to the composite plating film, when this composite plating film is used for a thin grindstone, the friction coefficient with the workpiece is reduced, The effect that chips are quickly discharged on the region of the composite plating film 2 that does not contain abrasive grains, the effect that rigidity is maintained even when the grinding wheel is thinned, and the effect of discharging processing heat can be expected. In addition, due to the composite of the nanocarbon material, the crystal grains of the plating matrix become finer and the orientation becomes a random orientation.
図２において示される実施形態の一例は、図１で示した実施形態の複合めっき被膜を最表面に配置し、微粒子（砥粒）を均一に含む複合めっき被膜３の層を挟み込んだ構成である本発明の複合めっき被膜（薄型砥石）である。このように特性および形態の異なる複合めっき積層し、加工に寄与する層、剛性を与える層、切りくずを排出させる層、摩擦抵抗を低減させる層に役割を分担させた複合めっき被膜および薄型砥石を形成することができる。図２では、砥粒を均一に含む中央の複合めっき被膜の層で加工能率を維持し、側面の周期的に砥粒列が存在する複合めっき被膜で切りくずの排出性、さらには加工抵抗の低減を実現する構成となっている。 An example of the embodiment shown in FIG. 2 is a configuration in which the composite plating film of the embodiment shown in FIG. 1 is disposed on the outermost surface, and a layer of the composite plating film 3 containing fine particles (abrasive grains) is sandwiched between them. It is the composite plating film (thin whetstone) of this invention. In this way, composite plating layers with different characteristics and shapes are laminated, and the composite plating film and thin grindstone that share roles are divided into layers that contribute to processing, layers that give rigidity, layers that discharge chips, and layers that reduce frictional resistance. Can be formed. In FIG. 2, the processing efficiency is maintained by the central composite plating film layer containing the abrasive grains uniformly, and the chip discharge performance and the processing resistance of the composite plating film in which the abrasive grain rows are periodically present on the side surfaces are maintained. It has a configuration that achieves reduction.
図３（ａ）は、図１に概略図を示した面直方向に一様であり、面内周方向に周期的な砥粒列を有する本発明の実施形態の一例である薄型電鋳砥石の光学顕微鏡写真である。図３（ｂ）、図３（ｃ）は、それぞれ前記薄型電鋳砥石の砥粒列を含む複合めっき被膜１と砥粒列を含まない複合めっき被膜２の拡大光学顕微鏡写真である。この薄型電鋳砥石は、節線を３本有する共振周波数３４ｋＨｚの屈曲振動モード超音波振動板上に形成したものである。ダイヤモンド砥粒は定在波の節部に配列し、めっき被膜に取り込まれ、節線の方向を砥粒列の配列方向１ａとした砥粒列となる。ここで、ダイヤモンド砥粒は、平均粒径１５μｍのニッケル被覆ダイヤモンド砥粒（Ｅｌｅｍｅｎｔ Ｓｉｘ製）である。複合めっき被膜は、振動板上の内径４０ｍｍから外径５０ｍｍで囲まれた面を成膜領域として、前記ダイヤモンド砥粒を含むスルファミン酸ニッケルめっき浴（Ｎｉ（ＮＨ２ＳＯ３）２・４Ｈ２Ｏ：５００ｇ／Ｌ，ＮｉＣｌ２・６Ｈ２Ｏ：４ｇ／Ｌ，Ｈ３ＢＯ３：３３ｇ／Ｌ）を用いて形成した。FIG. 3A is a thin electroformed grindstone that is an example of an embodiment of the present invention that is uniform in the direction perpendicular to the plane shown in FIG. It is an optical microscope photograph of. FIG. 3B and FIG. 3C are magnified optical micrographs of the composite plating film 1 including the abrasive grain rows of the thin electroformed grindstone and the composite plating film 2 not including the abrasive grain rows, respectively. This thin electroformed grindstone is formed on a bending vibration mode ultrasonic vibration plate having three resonances and a resonance frequency of 34 kHz. The diamond abrasive grains are arranged at the nodes of the standing wave and taken into the plating film to form an abrasive grain array in which the direction of the nodal line is the array direction 1a of the abrasive grain array. Here, the diamond abrasive grains are nickel-coated diamond abrasive grains (manufactured by Element Six) having an average particle diameter of 15 μm. The composite plating film is a nickel sulfamate plating bath (Ni (NH 2 SO 3 ) 2 .4H 2 O containing the diamond abrasive grains with a surface surrounded by an inner diameter of 40 mm to an outer diameter of 50 mm on the diaphragm as a film formation region. : 500 g / L, NiCl 2 · 6H 2 O: 4 g / L, H 3 BO 3 : 33 g / L).
図４は、ニッケルを母相とする砥粒列を含まない複合めっき被膜２であり、カーボンナノチューブ（Ｎａｎｏｃｙｌ製ＭＷＣＮＴ：平均直径９．５ｎｍ、平均長さ１．５μｍ）を含んだ複合めっき被膜２の弾性率を示したグラフである。カーボンナノチューブ複合ニッケルめっき被膜の成膜は、１ｇ／Ｌのカーボンナノチューブを分散させたスルファミン酸ニッケル浴を用い、浴温度４５℃で、常にホーン方式の超音波攪拌（２４ｋＨｚ、１５０Ｗ）を行いながら、ＤＣめっき（めっき中に電流密度を変化させないめっき方法）およびＰＲめっき（周期的に電流密度を変化させるめっき方法）により超硬基板上に形成した。ここでは、ＤＣめっきで形成したカーボンナノチューブ複合ニッケルめっき被膜を「低濃度ＣＮＴ−Ｎｉ」、ＰＲめっきでカーボンナノチューブ複合ニッケルめっき被膜を「高濃度ＣＮＴ−Ｎｉ」とする。各めっき条件は次のとおりである。ＤＣめっきの電流密度は、−５Ａ／ｄｍ２とした。ＰＲめっきの電解条件は、周波数２５０ｍＨｚで正電解時間と逆電解時間の比を９：１とし、正電流密度を−１Ａ／ｄｍ２、逆電流密度を６Ａ／ｄｍ２とした。ダイナミック超微小硬度計（島津製作所製ＤＵＨ−２００）により、荷重９８ｍＮ、対稜角１１５°三角錐圧子、負荷・除荷速度２．６５ｍＮ／ｓｅｃ、保持時間５ｓｅｃの条件で、めっき被膜表面から荷重−変位曲線を測定し、除荷率３０％までの除荷曲線の傾きから弾性率を求めた。めっき被膜の炭素含有量は、ＸＰＳによって分析した。FIG. 4 shows a composite plating film 2 that does not include an abrasive grain array having nickel as a matrix, and includes carbon nanotubes (MWCNT manufactured by Nanocyl: average diameter 9.5 nm, average length 1.5 μm). It is the graph which showed the elasticity modulus of. The carbon nanotube composite nickel plating film was formed using a nickel sulfamate bath in which 1 g / L of carbon nanotubes were dispersed, at a bath temperature of 45 ° C., while constantly performing horn-type ultrasonic stirring (24 kHz, 150 W), It was formed on a carbide substrate by DC plating (a plating method that does not change the current density during plating) and PR plating (a plating method that periodically changes the current density). Here, the carbon nanotube composite nickel plating film formed by DC plating is “low concentration CNT-Ni”, and the carbon nanotube composite nickel plating film is PR coating by “high concentration CNT-Ni”. Each plating condition is as follows. The current density of DC plating was −5 A / dm 2 . Electrolysis conditions of PR plating, the ratio of positive electrolysis time and reverse electrolysis time, frequency 250 MHz 9: 1 and then, the positive current density -1A / dm @ 2, and the reverse current density was 6A / dm 2. Loaded from the surface of the plating film using a dynamic ultra-hardness meter (DUH-200, manufactured by Shimadzu Corporation) under the conditions of load 98mN, counter-ridge angle 115 ° triangular pyramid indenter, load / unloading speed 2.65mN / sec, and holding time 5sec. -The displacement curve was measured, and the elastic modulus was determined from the slope of the unloading curve up to 30%. The carbon content of the plating film was analyzed by XPS.
図４より、純ニッケルめっき被膜（Ｎｉ）の弾性率が最も低く、約１５０ＧＰａであった。低濃度ＣＮＴ−Ｎｉめっき被膜（カーボンナノチューブ数ｖｏｌ％）の弾性率は約２００ＧＰａであり、カーボンナノチューブの複合化とニッケル母相の配向性の変化により弾性率が１２０％程度向上していることが確認できる。高濃度ＣＮＴ−Ｎｉめっき被膜（カーボンナノチューブ２０ｖｏｌ％以上）の弾性率は、約２２０ＧＰａであり、カーボンナノチューブの高濃度化により複合めっき被膜の弾性率が１５０％程度向上したことが確認できる。図４の点線は、Ｈａｉｐｉｎ−Ｔｓａｉの式を用いてニッケルとカーボンナノチューブの弾性率を１９３．３ＧＰａ、１２００ＧＰａとして計算した複合めっき被膜の弾性率である。低濃度ＣＮＴ−Ｎｉめっき被膜の測定結果と計算結果は良く一致している。一方、高濃度ＣＮＴ−Ｎｉめっき被膜の実測値は、計算値に比べて低い値を示した。これは、カーボンナノチューブとニッケルの界面などでの滑りの影響などが考えられる。 From FIG. 4, the elastic modulus of the pure nickel plating film (Ni) was the lowest, about 150 GPa. The elastic modulus of the low-concentration CNT-Ni plating film (carbon nanotube number vol%) is about 200 GPa, and the elastic modulus is improved by about 120% due to the composite of carbon nanotubes and the change in orientation of the nickel matrix. I can confirm. The elastic modulus of the high concentration CNT-Ni plating film (carbon nanotubes 20 vol% or more) is about 220 GPa, and it can be confirmed that the elastic modulus of the composite plating film is improved by about 150% by increasing the concentration of carbon nanotubes. The dotted line in FIG. 4 is the elastic modulus of the composite plating film calculated using the Haipin-Tsai equation with the elastic modulus of nickel and carbon nanotubes being 193.3 GPa and 1200 GPa. The measurement result and the calculation result of the low concentration CNT-Ni plating film are in good agreement. On the other hand, the actual measurement value of the high-concentration CNT-Ni plating film was lower than the calculated value. This may be due to the effect of slipping at the interface between the carbon nanotube and nickel.
純Ｎｉめっき被膜、低濃度ＣＮＴ−Ｎｉめっき被膜および高濃度ＣＮＴ−Ｎｉめっき被膜について、協和界面科学製Ｔｒｉｂｏｓｔｅｒ ＴＳ ５０１、φ３ｍｍＳＵＪ２鋼球を用いて、荷重２００ｇ、速度５ｍｍ／ｓｅｃ、１００回の往復褶動試験を行い、摩耗深さから耐摩耗性を評価した結果を図５に示す。通常ニッケルめっき被膜に比べて、低濃度カーボンナノチューブ複合ニッケルめっき被膜で摩耗量が約３０％に減少し、高濃度カーボンナノチューブ複合めっき被膜で６％に減少することが分かった。ゆえに、カーボンナノチューブを多量に含有することにより、耐摩耗性が向上するといえる。 About pure Ni plating film, low concentration CNT-Ni plating film and high concentration CNT-Ni plating film, using a Kyowa Interface Science Triboster TS 501, φ3mm SUJ2 steel ball, load 200g, speed 5mm / sec, 100 reciprocating rods FIG. 5 shows the results of performing a dynamic test and evaluating the wear resistance from the wear depth. It was found that the wear amount was reduced to about 30% with the low-concentration carbon nanotube composite nickel plating coating and about 6% with the high-concentration carbon nanotube composite plating coating compared to the normal nickel plating coating. Therefore, it can be said that wear resistance is improved by containing a large amount of carbon nanotubes.
同様に、純Ｎｉめっき被膜、低濃度ＣＮＴ−Ｎｉめっき被膜および高濃度ＣＮＴ−Ｎｉめっき被膜について、協和界面科学製Ｔｒｉｂｏｓｔｅｒ ＴＳ ５０１、φ３ｍｍＳＵＪ２鋼球を用いて、荷重２００ｇ、速度５ｍｍ／ｓｅｃ、４０回の往復摺動試験を行って求めた動的摩擦係数の測定結果を図６に示す。通常ニッケルめっき被膜に比べて、低濃度カーボンナノチューブ複合ニッケルめっき被膜で摩擦係数が約９０％に減少し、高濃度カーボンナノチューブ複合めっき被膜で１０％に減少することが分かった。ゆえに、カーボンナノチューブを多量に含有することにより、摩擦係数が低減するといえる。 Similarly, a pure Ni plating film, a low concentration CNT-Ni plating film, and a high concentration CNT-Ni plating film using a Kyowa Interface Science Triboster TS 501, φ3 mm SUJ2 steel ball, load 200 g, speed 5 mm / sec, 40 times. The measurement result of the dynamic friction coefficient obtained by performing the reciprocating sliding test is shown in FIG. It was found that the coefficient of friction was reduced to about 90% with the low-concentration carbon nanotube composite nickel plating film and 10% with the high-concentration carbon nanotube composite plating film as compared with the normal nickel plating film. Therefore, it can be said that the friction coefficient is reduced by containing a large amount of carbon nanotubes.
以上のように、微粒子列（砥粒列）を周期的に有する複合めっき領域（層）とナノカーボン材料を複合することで高い剛性、高い耐摩耗性、低い摩擦係数を付与し、構成することにより、切りくずの排出性に優れ、加工抵抗の低い、さらに薄型化や高剛性に対応したこれまでにない高性能な薄型砥石を提供することができる。 As described above, a composite plating region (layer) having a fine particle row (abrasive grain row) and a nanocarbon material are combined to provide high rigidity, high wear resistance, and a low coefficient of friction. As a result, it is possible to provide an unprecedented high-performance thin grindstone that has excellent chip discharge performance, low processing resistance, and is compatible with thinning and high rigidity.
１ 微粒子列（砥粒列）を含む複合めっき被膜
１ａ 微粒子列（砥粒列）の配列方向
２ 微粒子列（砥粒列）を含まない複合めっき被膜
３ 微粒子を均一に含む複合めっき被膜（層）
４ 薄型砥石外周部
５ 薄型砥石内周部
６ 薄型砥石側面
７ 微粒子列（砥粒列）を周期的に有する複合めっき層DESCRIPTION OF SYMBOLS 1 Composite plating film 1a containing fine particle row (abrasive grain row) Arrangement direction 2 of fine particle row (abrasive grain row) Composite plating film 3 not containing fine particle row (abrasive grain row) Composite plating film (layer) uniformly containing fine particles
4 Thin grinding wheel outer peripheral part 5 Thin grinding wheel inner peripheral part 6 Thin grinding wheel side face 7 Composite plating layer having fine particle rows (abrasive grain rows) periodically
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| JP3962966B2 (en) * | 1998-07-28 | 2007-08-22 | 矢野 和也 | Grinding wheel equipped with superabrasive grinding wheel and method for manufacturing the same |
| JP4513135B2 (en) * | 1999-04-01 | 2010-07-28 | 三菱マテリアル株式会社 | Grinding wheel containing fibrous hollow graphite |
| JP2004050364A (en) * | 2002-07-22 | 2004-02-19 | Nitolex Honsha:Kk | Conductive grinding wheel, manufacturing method therefor and dressing method |
| JP2006055943A (en) * | 2004-08-20 | 2006-03-02 | Allied Material Corp | Cmp pad conditioner |
| JP4779580B2 (en) * | 2005-11-02 | 2011-09-28 | 三菱マテリアル株式会社 | Electroformed thin blade whetstone |
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2013
- 2013-02-15 JP JP2013042293A patent/JP6194600B2/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108857954A (en) * | 2018-07-25 | 2018-11-23 | 佛山陵朝新材料有限公司 | A kind of preparation method of high-intensity high heat-resistance resin wheel |
| CN108857954B (en) * | 2018-07-25 | 2020-06-12 | 河北鑫旭德耐磨材料科技有限公司 | Preparation method of high-strength high-heat-resistance resin grinding wheel |
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| JP2014156004A (en) | 2014-08-28 |
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