M407.483 五、新型說明： 【新型所屬之技術領域】 本創作係有關用於化學機械拋光墊的修整器，尤其是有關具 有含硼單晶鑽石的修整器。 【先前技術】 化學機械拋光(Chemical Mechanical Planarization，CMP) 是將半導體晶圓表面平坦化的技術。在化學機械拋光過程中，拋 光墊的功能是將拋光液穩定而均勻地輸送至晶圓與拋光墊之間， 在化學蝕刻與機械磨削兩者相互作用下，將晶片上凸出的沈積層 移除。 為了達到晶圓加工量產的需求及維持品質的穩定性，必須利 用鑽石修整器（Diamond dresser)在化學機械拋光的過程中適時 地對拋光墊進行修整’除了移除表面之拋光副產物，恢復拋光墊 的粗糙面，改善其容納漿料的能力，並恢復拋光墊表面的孔洞及 其把持、運送拋光液之能力，如此可以節省拋光墊成本，並可達 到晶圓量產時品質穩定的需求。 傳統的鑽石修整器是將平均粒徑的鑽石磨粒固定結合在金屬 盤上。台灣公開專利201038362揭示一種組合式修整器，包括： 一大基板、複數彈性單元及複數研磨單元；複數研磨單元分別包 括複數磨粒；複數磨粒分別具有一切削端；複數研磨單元分別結 合大基板；複數彈性單元分別置於複數研磨單元與大基板之間， 以藉由複數彈性單元分別彈性調整複數磨粒的切削端突出大基板 M407483 的高度，然後賴數研料元分·定結合獻基板；較容易使 大面積組合式修整器的多數磨粒的切削端在同一高度。台灣專利 1306048揭示-種種化學機械研磨修整器，包括··—基板；複數個 超級磨粒固設於基板上’該超級磨粒成型為一高度以控制化學機 械研磨修整器的效果，其中位於修整器中央的超級磨粒係成型為 具有尖端的高度並朝向欲修整之拋光墊，其餘超級絲係成型為 _具有平面或梭線的高度並朝向欲修整之拋光塾；其中超級磨粒可 由以下所列之材料選擇組成：鑽石、聚晶鑽石（pCD)、立方氮化棚 _)、及多晶立方氮化着⑽）；該超級磨粒電鑛於該基板上。 -般的單晶鑽石是絕緣體，平整_定結合於金屬盤上，無 法利用放電加工出所需的形貌及高度，所以必須利用鑽石顆粒自 然形成__修整抛光墊，製造較為且因觸石無法再 被加工’所以一般的鑽石修整器無法回收加工修整後再利用。 % S蝴鑽石不僅具有優異的抗氧化性、化學惰性及機械強度， 並且具有半導禮甚至半金屬的導電特性，是未來具有發展潛力的 材料。-般含爛鑽石的製造方法主要是使用含蝴化合物與石墨混 合作為碳源，使用靜態高溫高壓合成。 2003年〈世界發明〉第八期報導，法國研究人員開發出—種“含棚 錯石”，將氫元素加人含#_P型鑽石半導體中使轉化成n 型鑽時半導體，它不僅比錄鑽石更堅硬，而越導電、耐高溫， 有望在未來用於多種工業生產。 這種含硼鑽石喃材料可觀於^謂歧高溫作業的微 M407.483 電子製造領域。 【新型内容】 為了利用上述能導電的“含硼鑽石”進一步改進習知的鑽石 修整器，而提出本創作。 本創作的主要目的，在提供一種具有含硼單晶鑽石的修整 器，係使多顆含硼單晶鑽石磨粒固定結合於一基板(例如金屬盤) • 上，由於含硼單晶鑽石磨粗具有導電的特性，因此可利用放電加 工等作業使多顆含硼單晶鑽石磨粒獲得加工所需的切削平整度， 及獲得加工所需的切削刃角’以方便製造鑽石修整器。 本創作的另一目的，在提供一種具有含硼單晶鑽石的修整 器，利用含硼單晶鑽石磨粒具有導電的特性，當切削刀角磨鈍或 切削面的平整度變差時，可進一步以放電加工作業，使多顆含硼 單晶鑽石磨粒再次獲得平整度較佳的切削面及獲得加工所需的切 削刀角’因此本創作的修整器是一種可以重複回收加工修整後再 使用的修整器。 本創作的又-目的，在提供一種具有含硼單晶鑽石的修整 器，可以錢較厚的銲料使多顆含解晶鑽石磨粒銲接於金屬盤 上更牢固’再_放電加讀業❹顆含解晶鑽石絲獲得加 工所需_肖醜度，及麟加獨需的 =:磨:與高溫的銲料的接觸梅^ ==石磨粒更穩固的結合金屬盤，較不會脫離金屬盤，且 較具有抗腐蝕性，較為耐用。 5 M407483 本創作的其他目的、功效，請參閱圖式及實施例，詳細說明 如下。 【實施方式】 如圖1、2所示，本創作一種具有含硼單晶鑽石的修整器丨包括， 多顆含蝴單晶鑽石磨粒1〇，被以硬銲、燒結、電鍵等作業固定結 合於一金屬盤20上。由於含硼單晶鑽石磨粒10可以導電，因此 可以先將多顆含硼單晶鑽石磨粒1〇固定結合於金屬盤2〇後，再 利用電極30放電加工作業，對金屬盤2〇上的多顆含硼單晶鑽石 磨粒10進行加工，可加工出高度一致由多顆含蝴單晶鑽石磨粒1〇 構成的磨粒，也可以對多顆含硼單晶鑽石磨粒1〇加工出所需要的 切削刃角（形貌），如圖1中的弧線4〇表示電極3〇的移動方向， 對多顆含硼單晶鑽石磨粒10進行加工作業。 如圆3所示M407.483 V. New description: [New technical field] This creation is about trimmers for chemical mechanical polishing pads, especially for trimmers with boron-containing single crystal diamonds. [Prior Art] Chemical Mechanical Planarization (CMP) is a technique for flattening the surface of a semiconductor wafer. In the chemical mechanical polishing process, the function of the polishing pad is to stably and uniformly transfer the polishing liquid between the wafer and the polishing pad, and to deposit a deposition layer on the wafer under the interaction of chemical etching and mechanical grinding. Remove. In order to meet the needs of mass production of wafer processing and maintain the stability of quality, it is necessary to use a diamond dresser to properly trim the polishing pad during chemical mechanical polishing. In addition to removing the polishing by-products of the surface, the recovery is resumed. The rough surface of the polishing pad improves its ability to hold the slurry and restores the pores on the surface of the polishing pad and its ability to hold and transport the polishing liquid. This saves the cost of the polishing pad and meets the requirements for stable quality during wafer mass production. . A conventional diamond dresser is a fixed combination of diamond particles of average particle size on a metal disk. Taiwan Patent Publication No. 201038362 discloses a combined dresser comprising: a large substrate, a plurality of elastic units and a plurality of grinding units; the plurality of grinding units respectively comprise a plurality of abrasive grains; the plurality of abrasive grains respectively have a cutting end; and the plurality of grinding units respectively are combined with the large substrate The plurality of elastic units are respectively disposed between the plurality of polishing units and the large substrate to elastically adjust the cutting ends of the plurality of abrasive grains to protrude the height of the large substrate M407483 by the plurality of elastic units, and then the plurality of polishing elements are combined with the substrate It is easier to make the cutting ends of the majority of the abrasive grains of the large-area combined dresser at the same height. Taiwan Patent No. 1,306,048 discloses various chemical mechanical polishing dressers, including a substrate; a plurality of superabrasive grains are fixed on a substrate. The superabrasive particles are formed into a height to control the effect of the chemical mechanical polishing dresser, wherein the trimming is performed. The superabrasive system in the center of the device is formed to have a tip height and facing the polishing pad to be trimmed, and the remaining super wire is formed into a height having a plane or a bobbin and facing the polishing crucible to be trimmed; wherein the superabrasive grains can be as follows The materials of the column are selected to be composed of: diamond, polycrystalline diamond (pCD), cubic nitriding shed _), and polycrystalline cubic nitriding (10); the superabrasive is electroscoped on the substrate. The single crystal diamond is an insulator, and it is flat on the metal plate. It cannot be processed by electric discharge to produce the required shape and height. Therefore, it is necessary to use the diamond particles to form a natural __trimming polishing pad, which is more suitable for the touch stone. Can't be processed any more' so the general diamond dresser can't be recycled and reused. % S butterfly diamond not only has excellent oxidation resistance, chemical inertness and mechanical strength, but also has semi-conductive and even semi-metallic conductive properties, and is a material with potential for development in the future. The manufacturing method of the general-containing rotten diamond is mainly to use a compound containing a butterfly compound and graphite as a carbon source, and to use a static high-temperature high-pressure synthesis. In the eighth issue of the "World Inventions" in 2003, French researchers developed a kind of "contained shed stone", which added the hydrogen element to the #_P type diamond semiconductor to convert it into an n-type semiconductor. Diamonds are harder, and the more conductive and high-temperature resistant, it is expected to be used in a variety of industrial production in the future. This boron-containing diamond urethane material is useful in the field of micro-M407.483 electronic manufacturing. [New content] In order to further improve the conventional diamond dresser by using the above-mentioned conductive "boron-containing diamond", the present invention is proposed. The main purpose of the present invention is to provide a dresser having a boron-containing single crystal diamond, which is to fix a plurality of boron-containing single crystal diamond abrasive grains on a substrate (for example, a metal disk). The thick conductive property, so that a plurality of boron-containing single crystal diamond abrasive grains can be obtained by machining such as electric discharge machining, and the cutting edge angle required for processing can be obtained to facilitate the manufacture of the diamond dresser. Another object of the present invention is to provide a dresser having a boron-containing single crystal diamond, which utilizes a boron-containing single crystal diamond abrasive grain to have electrical conductivity characteristics, and when the cutter blade is blunt or the flatness of the cutting surface is deteriorated, Further, in the electric discharge machining operation, a plurality of boron-containing single crystal diamond abrasive grains are again obtained to obtain a flat surface having a better flatness and a cutter angle required for processing. Therefore, the trimmer of the present invention is a reprocessable processing and trimming process. The trimmer used. The purpose of this creation is to provide a dresser with a boron-containing single crystal diamond, which can make a plurality of crystal-containing diamond abrasive grains welded to the metal disk more firmly by the thicker solder. A crystal containing diamond is obtained for processing. Shaw ugly, and Lin Jia only need =: Grind: Contact with high temperature solder. ^ == Stone abrasive grain is more stable combined with metal disc, less detached from metal The disc is more resistant to corrosion and more durable. 5 M407483 For other purposes and functions of this creation, please refer to the drawings and examples. The details are as follows. [Embodiment] As shown in Figs. 1 and 2, a dresser having a boron-containing single crystal diamond includes a plurality of single crystal diamond-containing abrasive grains, which are fixed by brazing, sintering, electric bonding, and the like. It is bonded to a metal disk 20. Since the boron-containing single crystal diamond abrasive grain 10 can be electrically conductive, a plurality of boron-containing single crystal diamond abrasive grains can be fixedly bonded to the metal disk 2〇, and then the electrode 30 is used for electric discharge machining, and the metal disk 2 is placed on the metal disk 2 The plurality of boron-containing single crystal diamond abrasive grains 10 are processed to process abrasive grains which are highly uniform and composed of a plurality of single crystal diamond-containing abrasive grains, and may also be used for a plurality of boron-containing single crystal diamond abrasive grains. The required cutting edge angle (topography) is processed, and the arc 4 如图 in FIG. 1 indicates the moving direction of the electrode 3〇, and a plurality of boron-containing single crystal diamond abrasive grains 10 are processed. As shown by circle 3
田…+剔邗的含硼單晶鑽石磨粒10具有導電 性，在利用電鍵製程製作修整器時，電鑛金屬層5〇，例如錄合金 構成的電齡屬層會包覆整顆含硼單晶鑽石磨粒1()，使含蝴單曰 鐵石磨粒10固定結合於金屬盤上；再利用放電加工作業Γ 放電輪磨)將含解晶鑽石磨仙形成切削刃角η，如圖4、所示疋 出補誇崎辦雜絲10可以和電錢金 磨粒 -般的硬赌料都是使用齡金作為銲接娜，_般 金銲料厚度約在15 mil〜4 ’ /、令 1 mU=25 um(微米）。 6 M407.483 當使用厚度較厚的銲料時，雖然可以將鑽石固定較牢固，但也容 易使鮮料包覆鑽石磨粒，使磨粒失去切削的能力；當使用較薄的 銲料時，會發生因為銲料厚度不均勻或是職不相而致使銲接 後的磨粒脫落的缺失。 如圖5所示，如果使用本創作的含蝴單晶鑽石磨粒1〇，則可 以使用較厚的鋒料60使含硼單晶鑽石磨粒丨〇銲接固定於金屬盤 纛20上。一般銲料會因毛細現象爬上鑽石磨粒表面，造成鑽石磨 粒失去切削能力，但本創作的含硼單晶鑽石磨粒1〇具有導電性， 因此"I使用電極30放電加工的方式修整含硼單晶鑽石磨粒及 移除部分銲料60，即移除如圖6所示雜3G含蓋的部分，使含棚 單晶鑽石磨粒10形成切削刃角u’而成為一具有含删單晶錯石的 修整器1，如圖7所示。且由於含辦晶鑽石磨粒1Q與高溫的銲 料60的接觸部分會形成堅硬_化物，使含爛單晶錯石磨粒1〇 籲更穩固的結合金屬盤2〇 ’較不會脫離金屬盤2〇，且較具有抗腐蚀 性。 如圖1所示’本創作具有含硼單晶鑽石的修整器丨，可以利用 上述電鍍、硬銲加工作業，使多顆含爛單晶鑽石磨粒1〇固定結合 於金屬盤20上，再利用放電加工作業使多顆含爛單晶鑽石磨粒1〇 獲得加工所需的切削面12，例如平整度較佳的切削面12，也可以 任意控制多顆含财⑽石練1G的表轉貌，麟加工所需的 切削刃肖11，以方便製造鑽石修整器。且當切削刀A u磨鈍或切 削面12的平整度變差時，可進一步以線切割放電⑽)M)加工、形 M407483 雕放電⑽Μ)加工及放電輪磨(EDG)加工等放電加工作業，使多顆 含硼單晶鑽石磨粒10再次獲得平整度較佳的切削面12及獲得加 工所需的切削刃角11，因此本創作的鑽石修整器是一種可以重複 回收加工修整後再使用的修整器，為目前一般的鑽石修整器無法 回收修整者所可以比擬。由於該多顆含硼單晶鑽石磨粒1〇具有導 電性，更耐高溫及更具有耐化學腐蝕特性，使本創作具有含硼單 晶鑽石的修整器1更容易製作及更為耐用。本創作具有含硼單晶 鑽石的修整器1中多顆含硼單晶鑽石磨粒1〇之間的平整度在1〇咖 以内；多顆含硼單晶鑽石磨粒10是以陣列式排列；含硼單晶鑽石 磨粒10的馳大小最佳為〇·丨mm(毫米）至1麵，但不限於此。 本創作具有含财晶鑽;5的修整H丨+的金屬盤2Q也可以如塑膠 材料或喊材料等非金屬材料製成的基板取代，但使多顆含蝴單 a曰鑽石磨粒10先m定結合_金屬層，再使金屬制定結合該基板。 以上所記载，僅為利用本創作技術内容之實施例，任何熟系 本項技藝者獅摘作所為之修飾、變化，㈣本創作主張之專 利範圍，而顿於實_賴示者。 、 8 M407.483 【圖式簡單說明】 圖1為本創作具有含解晶鑽石的修整器加工時的剖面示意圖。 圖2為本創作具有含硼單晶鑽^的修整器加坤的上視示意圖。 圖3為本創射顆含尋晶鑽石磨粒紐結合於金屬盤的示意圖。 圖4為本創作乡齡卿晶彻絲紐結合於金屬盤修整後的 示意圖。 圖5為本創作多顆含解晶鑽石磨粒硬銲、结合於金屬盤的示意圖。 圖6為本創作具有含辦晶鑽石的修整器硬銲後加工時的示意圖。 圖7為本創作具有含硼單晶鑽石的修整器硬録且加錢的示意圖。 【主要元件符號說明】 12切削面 30電極 50電鍍金屬層 1具有含硼單晶鑽石的修整器 10含硼單晶鑽石磨粒 11切削刀角 20金屬盤 40狐線 60銲料 (1)、（2)分別為製造本創作的方法的流程編號The field...+ 邗 邗 含 单晶 单晶 单晶 单晶 单晶 单晶 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含 含Single crystal diamond abrasive grain 1 (), the butterfly containing single stellite abrasive grain 10 is fixedly bonded to the metal disk; and then using the electric discharge machining operation Γ discharge wheel grinding) to form the cutting edge angle η with the crystallized diamond grinding, as shown in the figure 4, shown that the 夸 补 夸 办 办 办 办 办 10 可以 可以 可以 可以 可以 可以 可以 可以 可以 10 10 10 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸 夸1 mU = 25 um (microns). 6 M407.483 When thicker solder is used, although the diamond can be fixed firmly, it is easy to make the fresh material coated with diamond abrasive grains, so that the abrasive grains lose the ability to cut; when using thinner solder, The occurrence of loss of abrasive grains after welding occurs due to uneven thickness of the solder or unevenness of the job. As shown in Fig. 5, if the present invention contains a single crystal diamond-containing abrasive grain, a thicker powder 60 can be used to weld the boron-containing single crystal diamond abrasive grain to the metal disk 20. Generally, the solder will climb on the surface of the diamond abrasive particles due to capillary phenomenon, causing the diamond abrasive grains to lose the cutting ability. However, the boron-containing single crystal diamond abrasive particles of the present invention have electrical conductivity, so the "I is trimmed by the electrode 30 electric discharge machining method. The boron-containing single crystal diamond abrasive grain and the part of the solder 60 are removed, that is, the portion of the miscellaneous 3G cover as shown in FIG. 6 is removed, so that the single crystal diamond abrasive grain 10 is formed into a cutting edge angle u' The trimmer 1 of the single crystal is shown in FIG. Moreover, since the contact portion of the diamond-containing abrasive grain 1Q and the high-temperature solder 60 forms a hard _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 2〇, and is more resistant to corrosion. As shown in Fig. 1, the present invention has a dresser 含 with a boron-containing single crystal diamond, which can be used for the above-mentioned electroplating and brazing processing operations, so that a plurality of ruthless single crystal diamond abrasive grains are fixedly bonded to the metal disk 20, and then By using an electric discharge machining operation, a plurality of rotten single crystal diamond abrasive grains are obtained, and a cutting surface 12 required for processing, for example, a cutting surface 12 having a good flatness, can be arbitrarily controlled, and a plurality of coins containing the rich (10) stone training 1G can be arbitrarily controlled. Appearance, the cutting edge required for the processing of the lion 11, to facilitate the manufacture of diamond dressers. When the cutter A u is blunt or the flatness of the cutting surface 12 is deteriorated, the electric discharge machining operation such as the wire cutting discharge (10)) M) machining, the M407483 engraving discharge (10) Μ processing, and the discharge wheel grinding (EDG) processing can be further performed. Therefore, the plurality of boron-containing single crystal diamond abrasive grains 10 obtain the cutting surface 12 with better flatness and the cutting edge angle 11 required for processing. Therefore, the diamond dresser of the present invention can be repeatedly used for processing and trimming. The dresser is comparable to the current general diamond dresser that cannot be recycled. Since the plurality of boron-containing single crystal diamond abrasive grains are electrically conductive, more resistant to high temperatures and more resistant to chemicals, the trimmer 1 having a boron-containing single crystal diamond is easier to manufacture and more durable. The flatness of a plurality of boron-containing single crystal diamond abrasive grains 1 in a dresser 1 having a boron-containing single crystal diamond is within 1 〇 coffee; and the plurality of boron-containing single crystal diamond abrasive grains 10 are arranged in an array The boron-containing single crystal diamond abrasive grain 10 preferably has a size of 〇·丨mm (mm) to one side, but is not limited thereto. The creation has a crystal diamond; the metal plate 2Q of the trimming H丨+ of 5 can also be replaced by a substrate made of a non-metallic material such as a plastic material or a shouting material, but the plurality of diamond-containing a-grain abrasive grains 10 are first The m is combined with the metal layer, and the metal is then bonded to the substrate. As described above, it is only the embodiment that utilizes the content of the creative technology, and any of the skilled lions of this artist is modified and changed, and (4) the patent range of the creative claim, and is based on the actual _ _. , 8 M407.483 [Simple description of the diagram] Figure 1 is a schematic cross-sectional view of the trimmer with a crystallized diamond. FIG. 2 is a schematic top view of a dresser with a boron-containing single crystal drill. Fig. 3 is a schematic view showing the bonding of a granule containing a phosgene diamond to a metal disk. Fig. 4 is a schematic view of the creation of the mother-age Qingjing Chensi New Zealand after the metal plate is trimmed. Figure 5 is a schematic view of a plurality of crystal-containing diamond abrasive grains brazed and bonded to a metal disk. Fig. 6 is a schematic view showing the process of post-brazing processing of a dresser having a crystal diamond. Fig. 7 is a schematic view showing the hard-working and adding money of a dresser having a boron-containing single crystal diamond. [Main component symbol description] 12 cutting surface 30 electrode 50 plating metal layer 1 trimmer with boron single crystal diamond 10 boron containing single crystal diamond abrasive grain 11 cutting blade angle 20 metal disk 40 fox line 60 solder (1), ( 2) The process number of the method for manufacturing this creation separately