TW200726583A - Eletro deposited thin grinding stone blade - Google Patents

Eletro deposited thin grinding stone blade

Info

Publication number
TW200726583A
TW200726583A TW095139492A TW95139492A TW200726583A TW 200726583 A TW200726583 A TW 200726583A TW 095139492 A TW095139492 A TW 095139492A TW 95139492 A TW95139492 A TW 95139492A TW 200726583 A TW200726583 A TW 200726583A
Authority
TW
Taiwan
Prior art keywords
abrasive grain
grinding stone
deposited thin
blade
thin grinding
Prior art date
Application number
TW095139492A
Other languages
Chinese (zh)
Other versions
TWI314497B (en
Inventor
Yoshitaka Ikeda
Takayuki Hanami
Hidekaku Sato
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of TW200726583A publication Critical patent/TW200726583A/en
Application granted granted Critical
Publication of TWI314497B publication Critical patent/TWI314497B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/14—Zonally-graded wheels; Composite wheels comprising different abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12—Cut-off wheels

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

This invention provides an electro deposited thin grinding stone blade for use in cutting an electronic material part such as AFN, IrDA and LED work. The electro deposited thin grinding stone blade of this invention is not only capable of suppressing the occurrence of burrs but is also capable of performing a high precision and highly linear cutting. The blade exhibit excellent resistance to wear and peeling, as well as extended durability. It is capable of maintaining a high quality stably. The electro deposited thin grinding stone blade of this invention has a thin abrasive grain layer (1) constituted by dispersing abrasive grains (3) in a metal plating phase (2), the thin abrasive grain layer (1) having first to fifth abrasive grain layers (1A to 1E) sequentially overlaid in the direction of its layer thickness, wherein the content of the abrasive grain (3) in the first, third, and fifth abrasive grain layers (1A), (1C), and (1E) is higher than the content of the abrasive grain (3) in the second and fourth abrasive grain layers (1B), (1D).
TW095139492A 2005-11-02 2006-10-26 Eletro deposited thin grinding stone blade TWI314497B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005319286A JP4779580B2 (en) 2005-11-02 2005-11-02 Electroformed thin blade whetstone

Publications (2)

Publication Number Publication Date
TW200726583A true TW200726583A (en) 2007-07-16
TWI314497B TWI314497B (en) 2009-09-11

Family

ID=38070170

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095139492A TWI314497B (en) 2005-11-02 2006-10-26 Eletro deposited thin grinding stone blade

Country Status (4)

Country Link
JP (1) JP4779580B2 (en)
KR (1) KR20070047705A (en)
CN (2) CN1958239A (en)
TW (1) TWI314497B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5651045B2 (en) * 2011-02-28 2015-01-07 株式会社東京精密 Cutting blade
JP6194600B2 (en) * 2013-02-15 2017-09-13 山形県 Composite plating film and thin grindstone using the same
JP6233928B2 (en) * 2014-02-28 2017-11-22 国立大学法人 岡山大学 Grinding grain adhesion device
JP6211472B2 (en) * 2014-06-26 2017-10-11 株式会社ノリタケカンパニーリミテド Segment chip
JP2016168660A (en) * 2015-03-13 2016-09-23 株式会社ディスコ Grinding wheel
JP6668178B2 (en) * 2015-06-23 2020-03-18 株式会社ノリタケカンパニーリミテド Segment chip
JP6872342B2 (en) * 2016-10-18 2021-05-19 株式会社ディスコ Cutting blade
JP2019102757A (en) * 2017-12-07 2019-06-24 株式会社ディスコ Method for cutting qfn package substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5783372A (en) * 1980-10-31 1982-05-25 Yasuo Arakawa Metal bond grinder element composed of main and auxiliary grinding layers
JPH081651B2 (en) * 1986-12-10 1996-01-10 富士通株式会社 Data registration device
JPH0730279Y2 (en) * 1987-03-17 1995-07-12 三菱マテリアル株式会社 Electroformed thin blade grindstone
JP2001212769A (en) * 2000-01-31 2001-08-07 Allied Material Corp Super-abrasive grain wheel
JP3823830B2 (en) * 2002-01-10 2006-09-20 三菱マテリアル株式会社 Electroformed thin blade whetstone

Also Published As

Publication number Publication date
CN104029136A (en) 2014-09-10
TWI314497B (en) 2009-09-11
CN104029136B (en) 2017-05-31
CN1958239A (en) 2007-05-09
KR20070047705A (en) 2007-05-07
JP4779580B2 (en) 2011-09-28
JP2007125636A (en) 2007-05-24

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees