JP5567900B2 - Electrodeposition whetstone and method for manufacturing the same - Google Patents

Description

  The present invention relates to an electrodeposition grindstone used for various applications and a method for producing the same. More specifically, the present invention relates to an electrodeposited grindstone whose abrasive density is controlled within a suitable range and less clogging during grinding, and a method for producing the same.

  Electrodeposited whetstones are those in which superabrasive grains such as diamond and CBN are fixed to the surface of the conductive grindstone base metal by a metal plating layer. The strength of the binder layer is higher than that of high-performance grinding and high-efficiency grinding is possible. For example, conditioning of polishing pads for CMP (Chemical Mechanical Polishing), plastic, glass, metal, ceramics, etc. Used for grinding. However, in an electrodeposition grindstone, it is very difficult to control the abrasive density due to the property that in the production process, the abrasive grains are first spread on a base metal and then fixed by plating.

  If the abrasive grain density of the grindstone is too low, the workpiece will be processed intermittently with a small number of abrasive grains, and the load on the workpiece will increase, causing chipping defects, especially in ceramic processing. . In addition, the wear of the abrasive grains easily proceeds, and the life of the grindstone is shortened. On the other hand, if the abrasive grain density is too high, the volume of the chip pocket into which chips and the like enter becomes small, so that the grindstone is likely to be clogged, and the processing efficiency is lowered due to an increase in grinding resistance. Thus, since the abrasive density is an important factor that greatly affects the grinding characteristics of the grindstone, the control of the electrodeposition grindstone has heretofore been a problem.

  As a method for solving the above-mentioned problem, for example, Patent Document 1 discloses that superabrasive grains having the same grain size are dispersed in a multilayered manner to make the abrasive grain distribution uniform. Since the positioning is performed by masking, there is a problem in that the number of processes is excessive and the cost is increased. Further, in Patent Document 2, a groove in which abrasive grains are contained in a grindstone base metal is cut at an equal pitch, and an abrasive grain layer having a two-layer structure composed of abrasive grains having equal grain diameters is formed to control the abrasive grain spacing. Although a method has been disclosed, for example, a grindstone having a specific shape such as a thin grinding wheel has a problem that it is not suitable because it requires a large number of steps to perform uneven processing on its end face. Further, Patent Document 3 discloses a method for positioning the abrasive grains one by one using a point adhesive and controlling the abrasive density, but this method also has a very large number of steps. Therefore, the cost is inevitable.

JP-A-6-254768 JP-A-7-314334 JP 2000-153463 A

  The present invention has been made in view of the above-described problems of the prior art, and the problem is that an electrodeposition grindstone having an optimum abrasive density according to the workpiece and processing conditions, and It is in providing the manufacturing method.

  The inventor of the present invention has intensively studied in view of the above problems, and as a result of using two types of abrasive grains having different average particle diameters, the average grains are formed on the abrasive grain layer formed by spreading abrasive grains having a large average particle diameter. It has been found that by depositing abrasive grains having a small diameter and forming a two-layered abrasive grain layer, an electrodeposition grindstone whose grain density is controlled within a desired range can be easily produced. That is, according to the present invention, the following electrodeposition grindstone and the manufacturing method thereof are provided.

[1] An electrodeposited grindstone having a grindstone base metal and an abrasive layer formed on an abrasive layer forming surface of the grindstone base metal, wherein the abrasive layer is formed on the abrasive layer forming surface. The first abrasive grains arranged in layers are fixed to the abrasive grain formation surface by a first plating layer having a thickness of 5 to 75% of the average grain diameter of the first abrasive grains. And a second abrasive having an average particle size smaller than that of the first abrasive grains, which is disposed in a single layer in the gap formed by the first abrasive grains exposed from the first plating layer. An electrodeposited grindstone having a second abrasive layer in which the grains are fixed to the first abrasive layer by a second plating layer having a thickness that completely covers the first abrasive.

[2] A method for producing an electrodeposited whetstone in which an abrasive layer is formed on an abrasive layer forming surface of a grindstone base metal, wherein the first abrasive grains are arranged in a single layer on the abrasive layer forming surface, Forming a first plating layer having a thickness of 5 to 75% of an average particle diameter of the first abrasive grains, thereby fixing the first abrasive grains and forming a first abrasive grain layer; In one step, in the gap formed by the first abrasive grains exposed from the first plating layer, the second abrasive grains having an average particle size smaller than the first abrasive grains are arranged in a single layer, Forming a second plating layer having a thickness that completely covers the first abrasive grains, thereby fixing the second abrasive grains and forming a second abrasive grain layer. Manufacturing method of a grinding stone.

[3] The electrodeposition grindstone according to [2], wherein the density of the second abrasive grains in the abrasive grain layer is controlled by a difference in average particle diameter between the first abrasive grains and the second abrasive grains. Manufacturing method.

[4] The above [2] or [3], wherein the protruding height of the second abrasive grain in the abrasive layer is controlled by the thickness of the first plating layer to which the first abrasive grain is fixed. Method for producing an electrodeposited grinding wheel.

[5] The above-mentioned [2] or [3], wherein the holding power of the second abrasive grains in the abrasive grain layer is controlled by the thickness of the first plating layer that fixes the first abrasive grains. A method for producing an electrodeposited whetstone.

  In the electrodeposition grindstone of the present invention, the abrasive density is controlled in an appropriate range in accordance with the workpiece and processing conditions, so that it is possible to prevent a reduction in grinding ability due to clogging of chips and the like. Moreover, since the abrasive grain layer has a two-layer structure, the abrasive grain holding power is high, and the life of the grindstone can be improved by preventing degranulation. Furthermore, according to the method for producing an electrodeposition grindstone of the present invention, it is possible to produce the electrodeposition grindstone at a low cost with a short delivery time.

It is typical sectional drawing which shows one Embodiment of the electrodeposition grindstone of this invention. It is typical sectional drawing which shows another embodiment of the electrodeposition grindstone of this invention. It is typical sectional drawing which shows one Embodiment of the conventional electrodeposition grindstone. It is typical sectional drawing which shows another embodiment of the conventional electrodeposition grindstone. It is typical sectional drawing which shows another embodiment of the conventional electrodeposition grindstone. It is typical sectional drawing which shows another embodiment of the conventional electrodeposition grindstone. It is typical sectional drawing which shows one Embodiment of the manufacturing process of the electrodeposition grindstone of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the following embodiments, and changes, modifications, and improvements can be added without departing from the scope of the invention.

  FIG.1 and FIG.2 is typical sectional drawing which shows each embodiment of the electrodeposition grindstone of this invention, and FIG. 3A-D is typical sectional drawing which shows each embodiment of the conventional electrodeposition grindstone. Among the embodiments of the conventional electrodeposition grindstone, the electrodeposition grindstones 10b, 10c, and 10d shown in FIGS. 3B to 3D are those in which the abrasive density is particularly controlled. For example, the electrodeposition grindstone 10b shown in FIG. 3B. Requires a process such as masking for positioning the abrasive grains 4 on the abrasive layer forming surface 3, and the electrodeposition grindstone 10c shown in FIG. 3C requires a processing process to the grindstone base metal 2 as a pre-stage of the electrodeposition process. The electrodeposition grindstone 10 d shown in FIG. 3D requires individual positioning of the abrasive grains 4 by application of the adhesive 7. That is, both require a large number of steps and cost. On the other hand, the electrodeposition grindstones 1a and 1b of the present invention shown in FIGS. 1 and 2 have a two-layered abrasive grain layer 6 using two kinds of abrasive grains 4a and 4b having different grain sizes. Since the manufacturing technique similar to that of the conventional electrodeposition grindstone 10a including the single-layer abrasive grain layer 6 shown in 3A is used, the time and cost required for the manufacturing can be suppressed.

  Specifically, the electrodeposition grindstones 1a and 1b of the present invention are the first abrasive grains in which the first abrasive grains 4a are fixed to the abrasive grain formation surface 3 of the grindstone base metal 2 by the first plating layer 5a. A grain layer 6a is formed, and a second abrasive grain layer 6b in which the second abrasive grain 4b is fixed by the second plating layer 5b is further formed thereon. Here, the first abrasive grain 4a refers to an abrasive grain having a larger average grain diameter among two kinds of abrasive grains having different average grain diameters, and the second abrasive grain 4b has a different average grain diameter. Among the two types of abrasive grains, it refers to the abrasive grain having the smaller average particle diameter. Moreover, the 1st abrasive grain layer 6a points out the part which match | combined the 1st abrasive grain 4a and the 1st plating layer 5a, and the 2nd abrasive grain layer 6b is the 2nd abrasive grain 4b and the 2nd abrasive grain. The part which match | combined the 2nd plating layer 5b is pointed out. Furthermore, the abrasive grain layer 6 refers to a portion where the first abrasive grain layer 6a and the second abrasive grain layer 6b are combined.

  The grindstone base 2 is a base material for the electrodeposition grindstones 1a and 1b, and the material is not particularly limited as long as it has conductivity, but it is commonly used in conventional electrodeposition grindstones and can be plated. For example, metals and alloys such as stainless steel, tungsten, titanium, and molybdenum are preferably used. Moreover, there is no restriction | limiting in particular also about the shape of the grindstone base metal 2, and it can select suitably according to the use of the electrodeposition grindstone 1a, 1b which is a final product.

  The first abrasive grain 4 a is fixed to the abrasive grain layer forming surface 3 by the first plating layer 5 a while being arranged in a single layer so as to cover the abrasive grain layer forming face 3 of the grindstone base 2. Here, the first plating layer 5a has a thickness of 5 to 75% of the average particle diameter of the first abrasive grains 4a so that the first abrasive grains 4a are appropriately exposed from the first plating layer 5a. It is preferable. That is, the first plating layer 5a may have a minimum thickness that allows the first abrasive grains 4a to be fixed to the abrasive layer forming surface 3 of the grindstone base metal 2. When it exceeds 75% of the average grain size of the first abrasive grains 4a, the first abrasive grains 4a are hardly exposed from the first plating layer 5a, and a gap for arranging the second abrasive grains 4b is secured. This is not preferable because it cannot be performed.

  While the second abrasive grains 4b are arranged in a single layer so as to fit in the gap formed between the first abrasive grains 4a exposed from the first plating layer 5a, Are fixed to the abrasive layer 6a. By arranging in this way, the probability that the second abrasive grains 4b are dispersedly arranged at the intermediate positions of the adjacent first abrasive grains 4a is increased, and an orderly two-layer structure and uniform abrasive grain distribution are obtained. It can be set as the abrasive grain layer 6 which has. Further, since the second abrasive grain 4b is supported by the first abrasive grain 4a directly or indirectly via the second plating layer 5b, the abrasive grain holding power during grinding is high, that is, the second abrasive grain 4b. It can be set as the electrodeposition grindstone in which the abrasive grain 4b is hard to fall off. Here, the second plating layer 5b preferably has such a thickness that the first abrasive grains 4a exposed from the first plating layer 5a are completely hidden. If the first abrasive grains 4a are also exposed from the second plating layer 5b, the electrodeposition grindstone as the final product may not have a desired grindstone density and grinding ability, which is not preferable.

  In the electrodeposition grindstone 1b of FIG. 2, the average particle diameter of the first abrasive grains 4a is larger than that of the electrodeposition grindstone 1a of FIG. That is, in the electrodeposition grindstone 1b of FIG. 2, the number of the first abrasive grains 4a per unit area is smaller than that of the electrodeposition grindstone 1a of FIG. First abrasive grains exposed from 5a The number of second abrasive grains 4b per unit area arranged in the gap formed in FIG. 4a is also reduced. As a result, in the electrodeposition grindstone 1b of FIG. 2, the abrasive grain density is lower than that of the electrodeposition grindstone 1a of FIG. Here, the abrasive density refers to the number of abrasive grains per unit area on the surface of the abrasive layer of the electrodeposited grindstone. In FIGS. 1 and 2, the abrasive grain interval is indicated by an arrow as an index indicating the abrasive density. Illustrated. Hereinafter, in the present specification, when explaining the density of the abrasive grains, the “abrasive density” and the “abrasive interval” will be used together. In addition, a large abrasive grain interval means that the abrasive grain density is low, and a small abrasive grain interval means that the abrasive grain density is high.

  FIG. 4 is a schematic cross-sectional view showing an embodiment of the process for producing an electrodeposition grindstone of the present invention. In the method for producing an electrodeposition grindstone of the present invention, first, the first abrasive grains 4a are arranged in a single layer on the abrasive grain layer forming surface 3 of the grindstone base metal 2, and the average grain diameter of the first abrasive grains 4a is arranged. By forming the first plating layer 5a having a thickness of 5 to 75%, a first step of fixing the first abrasive grain 4a and forming the first abrasive grain layer 6a is performed. Next, in the gap formed by the first abrasive grains 4a exposed from the first plating layer 5a, the second abrasive grains 4b having an average particle size smaller than the first abrasive grains 4a are arranged in a single layer, By forming the second plating layer 5b having a thickness that completely covers one abrasive grain 4a, the second process is performed in which the second abrasive grain 4b is fixed and the second abrasive grain layer 6b is formed.

  In the first step, the first abrasive grains 4a are preferably arranged in a single layer so as to be spread on the abrasive grain formation surface 3 of the grindstone base 2. At this time, unlike the conventional electrodeposition grindstones 10b, 10c, and 10d shown in FIGS. What is necessary is just to disperse | distribute and arrange in 3 without deviation. In the second step, it is preferable to arrange the second abrasive grains 4b in a single layer so as to fit in the gap formed between the first abrasive grains 4a exposed from the first plating layer 5a. By arranging in this way, the dispersion density of the second abrasive grains 4b is inevitably determined from the geometric arrangement of the first abrasive grains 4a arranged in the first abrasive grain layer 6a. Control of the abrasive density becomes easy.

  In the electrodeposition grindstone manufacturing method of the present invention, as described above, the density of the second abrasive grains 4b, which is the abrasive density of the electrodeposited grindstone as the final product, is set to the first abrasive grains 4a and the second abrasive grains. It is preferable to control by the difference in the average particle diameter of the grains 4b. Since the interval between the first abrasive grains 4a becomes larger when the average grain diameter of the first abrasive grains 4a is set larger than the average grain diameter of the second abrasive grains 4b, a gap is formed. The interval between them also increases, and the dispersion density of the second abrasive grains 4b disposed there necessarily becomes low. In addition, when the average grain size of the first abrasive grains 4a is set smaller than the average grain diameter of the second abrasive grains 4b, the interval between the first abrasive grains 4a is reduced. The interval between the gaps is also reduced, and the dispersion density of the second abrasive grains 4b disposed therein is inevitably increased.

  More specifically, for example, when the count (granularity) of the second abrasive grain 4b is # 100, and the count of the first abrasive grain 4a is # 80, the abrasive grain spacing of the second abrasive grain 4b is When the number of the first abrasive grains 4a is set to # 60 from 0.15 mm to 0.25 mm, the distance between the abrasive grains of the second abrasive grains 4b is 0.2 mm to 0.3 mm, and the count of the first abrasive grains 4a Is # 40, the abrasive grain spacing of the second abrasive grain 4b is 0.3 mm to 0.5 mm. As described above, according to the method for producing an electrodeposited grindstone of the present invention, an electrodeposited grindstone having a desired abrasive density can be produced easily and quickly according to the characteristics of the workpiece and the machining conditions during grinding. Is possible. In addition, the count of each said abrasive grain is based on JISB413.

  Moreover, in the manufacturing method of the electrodeposition grindstone of this invention, the protrusion height of the 2nd abrasive grain 4b in the abrasive grain layer 6 is set by the thickness of the 1st plating layer 5a which fixes the 1st abrasive grain 4a. It is preferable to control. Specifically, when the thickness of the first plating layer 5a is set to about 50% of the average particle diameter of the first abrasive grains 4a, the first abrasive grains 4a exposed from the first plating layer 5a. In the gap formed, the second abrasive grains 4b arranged are directly supported by the first abrasive grains 4a forming the gap. In this case, the protruding height of the second abrasive grains 4b is the lowest. Become. On the other hand, when the thickness of the first plating layer 5a exceeds about 50% of the average particle diameter of the first abrasive grains 4a, the formation of the first abrasive grains 4a exposed from the first plating layer 5a is formed. In the gap, the first plating layer 5a directly supports the bottom of the second abrasive grain 4b that is arranged, and the protruding height of the second abrasive grain 4b is raised. Thus, according to the method for producing an electrodeposition grindstone of the present invention, it is possible to easily and quickly produce an electrodeposition grindstone having a desired protruding height according to the processing conditions during grinding.

  On the other hand, in the method for producing an electrodeposition grindstone of the present invention, the holding power of the second abrasive grains 4b in the abrasive grain layer 6 is controlled by the thickness of the first plating layer 5a to which the first abrasive grains 4a are fixed. It is also preferable to do. Specifically, when the thickness of the first plating layer 5a is set to about 50% of the average particle diameter of the first abrasive grains 4a, the first abrasive grains 4a exposed from the first plating layer 5a. The second abrasive grains 4b that are arranged in the gap formed by are directly supported by the first abrasive grains 4a that form the gap. In this case, the second abrasive grains 4b are surely placed at a predetermined position. Since it is positioned, a stable fixed state can be obtained. Accordingly, even during grinding, the second abrasive grains 4b are unlikely to detach from the second abrasive grain layer 6b, and the second abrasive grains 4b form the second plating layer on the first abrasive grains 4a forming the gap. It is possible to obtain an electrodeposition grindstone with higher abrasive grain retention than when indirectly supported via 5b. At this time, if the second abrasive grains 4b are fixed in contact with at least two of the first abrasive grains 4a forming the gap, a sufficient holding force can be obtained. .

  The electrodeposition grindstone of the present invention can be suitably used as an electrodeposition tool for grinding various materials, and according to the method for producing an electrodeposition grindstone of the present invention, a high grain density is controlled. The electrodeposition grindstone with high performance and long life can be easily manufactured, and the industrial applicability is great.

1a, 1b, 10a, 10b, 10c, 10d: Electrodeposition grindstone, 2: Whetstone base metal, 3: Abrasive layer forming surface, 4: Abrasive grain, 4a: First abrasive grain, 4b: Second abrasive grain 5: Plating layer, 5a: First plating layer, 5b: Second plating layer, 6: Abrasive layer, 6a: First abrasive layer, 6b: Second abrasive layer, 7: Adhesive .

Claims (5)

An electrodeposition grindstone having a grindstone base and an abrasive layer formed on the abrasive layer forming surface of the grindstone base,
The abrasive layer is a first plating in which the first abrasive grains arranged in a single layer on the abrasive layer forming surface have a thickness of 5 to 75% of the average grain diameter of the first abrasive grains. A first abrasive layer fixed to the abrasive layer forming surface by a layer;
The second abrasive grains, which are arranged in a single layer in the gap formed by the first abrasive grains exposed from the first plating layer, have a smaller average particle diameter than the first abrasive grains, An electrodeposition grindstone having a second abrasive grain layer fixed to the first abrasive grain layer by a second plating layer having a thickness that completely covers the abrasive grains. A method for producing an electrodeposition grindstone in which an abrasive layer is formed on an abrasive layer forming surface of a grindstone base metal,
By arranging the first abrasive grains in a single layer on the abrasive layer forming surface and forming a first plating layer having a thickness of 5 to 75% of the average grain diameter of the first abrasive grains, A first step of fixing the first abrasive grains to form a first abrasive grain layer;
In the gap formed by the first abrasive grains exposed from the first plating layer, second abrasive grains having an average particle size smaller than the first abrasive grains are arranged in a single layer, and the first Production of an electrodeposition grindstone having a second step of fixing the second abrasive grains and forming a second abrasive grain layer by forming a second plating layer having a thickness that completely covers the abrasive grains Method.   The method for producing an electrodeposited grindstone according to claim 2, wherein the density of the second abrasive grains in the abrasive grain layer is controlled by a difference in average particle diameter between the first abrasive grains and the second abrasive grains.   The electrodeposition grindstone manufacturing method according to claim 2 or 3, wherein the protrusion height of the second abrasive grain in the abrasive grain layer is controlled by the thickness of the first plating layer that fixes the first abrasive grain. Method.   The method for producing an electrodeposited grindstone according to claim 2 or 3, wherein the holding power of the second abrasive grain in the abrasive grain layer is controlled by the thickness of the first plating layer that fixes the first abrasive grain. .