JP2007088481A - 窒化物半導体素子 - Google Patents
窒化物半導体素子 Download PDFInfo
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- JP2007088481A JP2007088481A JP2006256603A JP2006256603A JP2007088481A JP 2007088481 A JP2007088481 A JP 2007088481A JP 2006256603 A JP2006256603 A JP 2006256603A JP 2006256603 A JP2006256603 A JP 2006256603A JP 2007088481 A JP2007088481 A JP 2007088481A
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- 150000004767 nitrides Chemical class 0.000 title claims abstract description 74
- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 229910052738 indium Inorganic materials 0.000 claims abstract description 22
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 22
- 230000004888 barrier function Effects 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 238000003892 spreading Methods 0.000 claims description 29
- 230000007480 spreading Effects 0.000 claims description 29
- 239000006185 dispersion Substances 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 164
- 230000000694 effects Effects 0.000 description 13
- 239000000758 substrate Substances 0.000 description 9
- 229910002704 AlGaN Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001194 electroluminescence spectrum Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/173—The laser chip comprising special buffer layers, e.g. dislocation prevention or reduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2009—Confining in the direction perpendicular to the layer structure by using electron barrier layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34333—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer based on Ga(In)N or Ga(In)P, e.g. blue laser
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Abstract
【解決手段】p型及びn型窒化物半導体層27、24と、上記p型及びn型窒化物半導体層の間に形成され、少なくとも一つの量子障壁層26bと量子井戸層26aとから成る活性層26を有する窒化物半導体素子20において、上記p型窒化物半導体層27bと上記活性層26の間に、少なくとも上記活性層の量子井戸層26aに含有されたインジウムの組成より多いインジウムを含んだ電流分散層25を配置する。
【選択図】 図2a
Description
上記した実施例と同一な条件で窒化物発光素子を作製し、本発明による電子遮断層を形成する代りに、従来結晶性向上のために採用される超格子構造を形成した。即ち、量子井戸層と同一なインジウム含量を有するIn0.18Ga0.82Nである第1層とGaNである第2層を4回交互に繰り返し形成し、この際に第1層及び第2層の厚さは前述した実施例と同じく各々30〜40Å、130〜140Åの厚さに形成した。
11、21 基板
12、22 バッファ層
14、24 n型窒化物半導体層(n型GaN層)
15 InGaN電流分散層
16、26 活性層
16a、26a 量子井戸層
16b、26b 量子障壁層
17、27 p型窒化物半導体層
17a、27a p型AlGaN層
17b、27b p型GaN層
25 InGaN/GaN電流分散層
25a InGaN層(第1層)
25b GaN層 (第2層)
Claims (8)
- 第1導電型及び第2導電型窒化物層と、前記第1導電型及び第2導電型窒化物層との間に形成され、少なくとも一つの量子障壁層と量子井戸層とから成る活性層を有する窒化物半導体素子であって、
前記第1導電型窒化物層と前記活性層の間に配置され、少なくとも前記活性層の量子井戸層に含有されたインジウムの組成より多いインジウムを含んだ電流分散層を含む、窒化物半導体素子。 - 前記活性層は、Inx1Ga1-x1N(0≦x1<1)である量子障壁層と、Inx2Ga1-x2N(x1<x2<1)である量子井戸層とから成り、前記電流分散層はInyGa1-yN(x2<y≦1)層を含むことを特徴とする、請求項1に記載の窒化物半導体素子。
- 前記電流分散層のIn含量は、前記量子井戸層のインジウム含有量より少なくとも5mol%程度多いことを特徴とする、請求項1または請求項2に記載の窒化物半導体素子。
- 前記電流分散層は、交互に積層された互いに異なる組成を有する少なくとも一対の第1層及び第2層を含み、前記第1層はInyGa1-yN層であり、前記第2層はGaN層であることを特徴とする、請求項2に記載の窒化物半導体素子。
- 前記電流分散層は、前記第1層及び第2層が交互に2乃至12週期に繰り返し形成されたことを特徴とする、請求項4に記載の窒化物半導体素子。
- 前記第1層の厚さは、10〜100Åであることを特徴とする、請求項4または請求項5に記載の窒化物半導体素子。
- 前記第2層の厚さは、100〜250Åであることを特徴とする、請求項4または請求項5に記載の窒化物半導体素子。
- 前記第1導電型窒化物層はn型窒化物層であり、前記第2導電型窒化物層はp型窒化物層であることを特徴とする、請求項1〜7のいずれか一項に記載の窒化物半導体素子。
Applications Claiming Priority (1)
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KR1020050088772A KR100691283B1 (ko) | 2005-09-23 | 2005-09-23 | 질화물 반도체 소자 |
Publications (2)
Publication Number | Publication Date |
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JP2007088481A true JP2007088481A (ja) | 2007-04-05 |
JP4503570B2 JP4503570B2 (ja) | 2010-07-14 |
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US (1) | US7718992B2 (ja) |
JP (1) | JP4503570B2 (ja) |
KR (1) | KR100691283B1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014146684A (ja) * | 2013-01-29 | 2014-08-14 | Stanley Electric Co Ltd | 半導体発光素子及びその製造方法 |
JP2014183285A (ja) * | 2013-03-21 | 2014-09-29 | Stanley Electric Co Ltd | 発光素子 |
WO2020036080A1 (ja) * | 2018-08-16 | 2020-02-20 | ソニー株式会社 | 発光デバイス |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009082404A1 (en) * | 2006-12-24 | 2009-07-02 | Lehigh University | Staggered composition quantum well method and device |
KR101459751B1 (ko) | 2007-06-21 | 2014-11-12 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
DE112011101530B4 (de) * | 2010-04-30 | 2021-03-25 | Trustees Of Boston University | Verfahren zur Herstellung einer optischen Vorrichtung |
WO2013191649A1 (en) * | 2012-06-20 | 2013-12-27 | Nanyang Technological University | A light-emitting device |
KR102007273B1 (ko) * | 2013-01-04 | 2019-08-05 | 엘지이노텍 주식회사 | 발광 소자 |
CN103236477B (zh) * | 2013-04-19 | 2015-08-12 | 安徽三安光电有限公司 | 一种led外延结构及其制备方法 |
DE102016117477A1 (de) * | 2016-09-16 | 2018-03-22 | Osram Opto Semiconductors Gmbh | Halbleiterschichtenfolge |
CN114975708A (zh) * | 2022-08-02 | 2022-08-30 | 江西兆驰半导体有限公司 | 一种正装红黄光led芯片及其制备方法 |
Citations (2)
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- 2005-09-23 KR KR1020050088772A patent/KR100691283B1/ko active IP Right Grant
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- 2006-09-22 JP JP2006256603A patent/JP4503570B2/ja active Active
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WO2020036080A1 (ja) * | 2018-08-16 | 2020-02-20 | ソニー株式会社 | 発光デバイス |
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US7718992B2 (en) | 2010-05-18 |
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US20070069234A1 (en) | 2007-03-29 |
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