JP2007088464A5 - - Google Patents

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Publication number
JP2007088464A5
JP2007088464A5 JP2006252243A JP2006252243A JP2007088464A5 JP 2007088464 A5 JP2007088464 A5 JP 2007088464A5 JP 2006252243 A JP2006252243 A JP 2006252243A JP 2006252243 A JP2006252243 A JP 2006252243A JP 2007088464 A5 JP2007088464 A5 JP 2007088464A5
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JP
Japan
Prior art keywords
polishing pad
permeable substrate
microspheres
polymer composition
polymer matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006252243A
Other languages
English (en)
Japanese (ja)
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JP2007088464A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JP2007088464A publication Critical patent/JP2007088464A/ja
Publication of JP2007088464A5 publication Critical patent/JP2007088464A5/ja
Pending legal-status Critical Current

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JP2006252243A 2005-09-19 2006-09-19 改善された付着性を有する水性研磨パッド及びその製造方法 Pending JP2007088464A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71848905P 2005-09-19 2005-09-19

Publications (2)

Publication Number Publication Date
JP2007088464A JP2007088464A (ja) 2007-04-05
JP2007088464A5 true JP2007088464A5 (https=) 2009-09-17

Family

ID=37776011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006252243A Pending JP2007088464A (ja) 2005-09-19 2006-09-19 改善された付着性を有する水性研磨パッド及びその製造方法

Country Status (7)

Country Link
US (2) US20070066195A1 (https=)
JP (1) JP2007088464A (https=)
KR (1) KR20070032609A (https=)
CN (1) CN1935461A (https=)
DE (1) DE102006042674A1 (https=)
FR (1) FR2890882A1 (https=)
TW (1) TW200720017A (https=)

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US7655117B2 (en) 2005-04-06 2010-02-02 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration
US7744732B2 (en) * 2005-04-06 2010-06-29 Leviton Manufacturing Company, Inc. Continuous plating system and method with mask registration
WO2007119875A1 (ja) 2006-04-19 2007-10-25 Toyo Tire & Rubber Co., Ltd. 研磨パッドの製造方法
US7311590B1 (en) * 2007-01-31 2007-12-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to retain slurry on the pad texture
JP4943233B2 (ja) * 2007-05-31 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US8182655B2 (en) * 2007-09-05 2012-05-22 Leviton Manufacturing Co., Inc. Plating systems and methods
TW200927896A (en) * 2007-12-28 2009-07-01 Iv Technologies Co Ltd Polishing pad and polishing method
TWI360459B (en) * 2008-04-11 2012-03-21 Bestac Advanced Material Co Ltd A polishing pad having groove structure for avoidi
WO2009134775A1 (en) * 2008-04-29 2009-11-05 Semiquest, Inc. Polishing pad composition and method of manufacture and use
US8303375B2 (en) 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
KR20100096459A (ko) * 2009-02-24 2010-09-02 삼성전자주식회사 화학적 기계적 연마장치
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US10722997B2 (en) * 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
SG11201406287QA (en) 2012-04-02 2014-11-27 Thomas West Inc Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods
US9073172B2 (en) * 2012-05-11 2015-07-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Alkaline-earth metal oxide-polymeric polishing pad
US8888877B2 (en) * 2012-05-11 2014-11-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Forming alkaline-earth metal oxide polishing pad
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
TWI518176B (zh) * 2015-01-12 2016-01-21 三芳化學工業股份有限公司 拋光墊及其製造方法
CN107717762A (zh) * 2017-10-26 2018-02-23 东莞金太阳研磨股份有限公司 一种磨具用的聚酯薄膜基材的处理工艺
PL3814053T3 (pl) * 2018-06-29 2026-02-23 Saint-Gobain Abrasives, Inc. Artykuły ścierne i sposoby ich tworzenia
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
US11667061B2 (en) * 2020-04-18 2023-06-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming leveraged poromeric polishing pad
CN112318363B (zh) * 2020-11-06 2022-03-11 万华化学集团电子材料有限公司 一种化学机械抛光垫的抛光层及其制备方法
CN113442056B (zh) * 2021-07-15 2022-12-02 湖北鼎汇微电子材料有限公司 一种抛光垫及其制备方法、半导体器件的制造方法

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US20030104770A1 (en) * 2001-04-30 2003-06-05 Arch Specialty Chemicals, Inc. Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers
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US20080063856A1 (en) 2006-09-11 2008-03-13 Duong Chau H Water-based polishing pads having improved contact area

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