DE102006042674A1 - Polierkissen auf Wasserbasis mit verbesserten Hafteigenschaften und Herstellungsverfahren - Google Patents

Polierkissen auf Wasserbasis mit verbesserten Hafteigenschaften und Herstellungsverfahren Download PDF

Info

Publication number
DE102006042674A1
DE102006042674A1 DE102006042674A DE102006042674A DE102006042674A1 DE 102006042674 A1 DE102006042674 A1 DE 102006042674A1 DE 102006042674 A DE102006042674 A DE 102006042674A DE 102006042674 A DE102006042674 A DE 102006042674A DE 102006042674 A1 DE102006042674 A1 DE 102006042674A1
Authority
DE
Germany
Prior art keywords
polishing pad
polymeric matrix
water
polishing
microspheres
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102006042674A
Other languages
German (de)
English (en)
Inventor
Chau H. Newark Duong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of DE102006042674A1 publication Critical patent/DE102006042674A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE102006042674A 2005-09-19 2006-09-12 Polierkissen auf Wasserbasis mit verbesserten Hafteigenschaften und Herstellungsverfahren Withdrawn DE102006042674A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US71848905P 2005-09-19 2005-09-19
US60/718,489 2005-09-19

Publications (1)

Publication Number Publication Date
DE102006042674A1 true DE102006042674A1 (de) 2007-03-22

Family

ID=37776011

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102006042674A Withdrawn DE102006042674A1 (de) 2005-09-19 2006-09-12 Polierkissen auf Wasserbasis mit verbesserten Hafteigenschaften und Herstellungsverfahren

Country Status (7)

Country Link
US (2) US20070066195A1 (https=)
JP (1) JP2007088464A (https=)
KR (1) KR20070032609A (https=)
CN (1) CN1935461A (https=)
DE (1) DE102006042674A1 (https=)
FR (1) FR2890882A1 (https=)
TW (1) TW200720017A (https=)

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* Cited by examiner, † Cited by third party
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US7655117B2 (en) 2005-04-06 2010-02-02 Leviton Manufacturing Co., Inc. Continuous plating system and method with mask registration
US7744732B2 (en) * 2005-04-06 2010-06-29 Leviton Manufacturing Company, Inc. Continuous plating system and method with mask registration
WO2007119875A1 (ja) 2006-04-19 2007-10-25 Toyo Tire & Rubber Co., Ltd. 研磨パッドの製造方法
US7311590B1 (en) * 2007-01-31 2007-12-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to retain slurry on the pad texture
JP4943233B2 (ja) * 2007-05-31 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
US7635290B2 (en) * 2007-08-15 2009-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Interpenetrating network for chemical mechanical polishing
US8182655B2 (en) * 2007-09-05 2012-05-22 Leviton Manufacturing Co., Inc. Plating systems and methods
TW200927896A (en) * 2007-12-28 2009-07-01 Iv Technologies Co Ltd Polishing pad and polishing method
TWI360459B (en) * 2008-04-11 2012-03-21 Bestac Advanced Material Co Ltd A polishing pad having groove structure for avoidi
WO2009134775A1 (en) * 2008-04-29 2009-11-05 Semiquest, Inc. Polishing pad composition and method of manufacture and use
US8303375B2 (en) 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
KR20100096459A (ko) * 2009-02-24 2010-09-02 삼성전자주식회사 화학적 기계적 연마장치
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US10722997B2 (en) * 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
SG11201406287QA (en) 2012-04-02 2014-11-27 Thomas West Inc Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods
US9073172B2 (en) * 2012-05-11 2015-07-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Alkaline-earth metal oxide-polymeric polishing pad
US8888877B2 (en) * 2012-05-11 2014-11-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Forming alkaline-earth metal oxide polishing pad
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
US9522454B2 (en) * 2012-12-17 2016-12-20 Seagate Technology Llc Method of patterning a lapping plate, and patterned lapping plates
TWI518176B (zh) * 2015-01-12 2016-01-21 三芳化學工業股份有限公司 拋光墊及其製造方法
CN107717762A (zh) * 2017-10-26 2018-02-23 东莞金太阳研磨股份有限公司 一种磨具用的聚酯薄膜基材的处理工艺
PL3814053T3 (pl) * 2018-06-29 2026-02-23 Saint-Gobain Abrasives, Inc. Artykuły ścierne i sposoby ich tworzenia
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
US11667061B2 (en) * 2020-04-18 2023-06-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming leveraged poromeric polishing pad
CN112318363B (zh) * 2020-11-06 2022-03-11 万华化学集团电子材料有限公司 一种化学机械抛光垫的抛光层及其制备方法
CN113442056B (zh) * 2021-07-15 2022-12-02 湖北鼎汇微电子材料有限公司 一种抛光垫及其制备方法、半导体器件的制造方法

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JPH0726080B2 (ja) * 1987-11-30 1995-03-22 サンスター技研株式会社 高防錆性付与構造用接着剤
DE4127605A1 (de) * 1991-08-21 1993-02-25 Hoechst Ag Haertbare ueberzugsmassen
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MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5643669A (en) * 1996-02-08 1997-07-01 Minnesota Mining And Manufacturing Company Curable water-based coating compositions and cured products thereof
US5692950A (en) * 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
WO1999065677A1 (en) * 1998-06-17 1999-12-23 Milliken & Company Polyurethane/polyacrylate dispersion coating for airbag fabrics
US6354915B1 (en) * 1999-01-21 2002-03-12 Rodel Holdings Inc. Polishing pads and methods relating thereto
JP4450337B2 (ja) * 1999-02-22 2010-04-14 大日本印刷株式会社 化粧シート
EP1268134A1 (en) * 1999-12-14 2003-01-02 Rodel Holdings, Inc. Method of manufacturing a polymer or polymer composite polishing pad
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US20020098784A1 (en) * 2001-01-19 2002-07-25 Saket Chadda Abrasive free polishing in copper damascene applications
US20030104770A1 (en) * 2001-04-30 2003-06-05 Arch Specialty Chemicals, Inc. Chemical mechanical polishing slurry composition for polishing conductive and non-conductive layers on semiconductor wafers
US6811470B2 (en) * 2001-07-16 2004-11-02 Applied Materials Inc. Methods and compositions for chemical mechanical polishing shallow trench isolation substrates
US6805722B2 (en) * 2002-10-01 2004-10-19 3M Innovative Properties Company Apparatus and method for forming a spiral wound abrasive article, and the resulting article
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US6918821B2 (en) * 2003-11-12 2005-07-19 Dow Global Technologies, Inc. Materials and methods for low pressure chemical-mechanical planarization
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KR20060099398A (ko) 2005-03-08 2006-09-19 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 수계 연마 패드 및 제조 방법
US20080063856A1 (en) 2006-09-11 2008-03-13 Duong Chau H Water-based polishing pads having improved contact area

Also Published As

Publication number Publication date
US20070066195A1 (en) 2007-03-22
CN1935461A (zh) 2007-03-28
US8272922B2 (en) 2012-09-25
FR2890882A1 (fr) 2007-03-23
JP2007088464A (ja) 2007-04-05
KR20070032609A (ko) 2007-03-22
US20080188163A1 (en) 2008-08-07
TW200720017A (en) 2007-06-01

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8139 Disposal/non-payment of the annual fee