JP2007052931A - Cathode panel for cold-cathode field electron emission display device, as well as, cold cathode field electron emission display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cathode panel for a cold-cathode field emission display device in which an electrostatic capacitance between a cathode electrode and a gate electrode can be made low without resulting in a high voltage of an operating voltage in an electron emission region, and the cold-cathode field emission display device in which the cathode panel is incorporated. <P>SOLUTION: This is the cathode panel for the cold-cathode field emission display device composed of the electron emission region EA installed at a duplicated region SA in which the cathode electrode 111 and the gate electrode 113 are duplicated. At the electron emission region EA, (a) a plurality of first opening parts 114A formed at the gate electrode 113, (b) a second opening part 114B formed at an insulating layer and communicated with the first opening part 114A, and (c) an electron emission part 115 positioned at the bottom part of the second opening part 114B are installed, and the thickness of the insulating layer in the electron emission region portion of the duplicated region SA is thinner than that of the insulating layer at portions other than the electron emission region of the duplicated region SA. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a cathode panel for a cold cathode field emission display and a cold cathode field emission display.

  As an image display device that can replace the mainstream cathode ray tube (CRT), various types of flat display devices have been studied. Examples of such a flat display device include a liquid crystal display device (LCD), an electroluminescence display device (ELD), and a plasma display device (PDP). In addition, development of a flat display device incorporating a cathode panel equipped with an electron-emitting device is also in progress. Here, as the electron-emitting device, a cold cathode field electron-emitting device, a metal / insulating film / metal-type device (also called MIM device), and a surface conduction electron-emitting device are known. A flat display device incorporating a cathode panel provided with the electron-emitting device is attracting attention from the viewpoint of high-resolution, high-luminance color display and low power consumption.

  A cold cathode field emission display device (hereinafter sometimes abbreviated as a display device), which is a flat display device incorporating a cold cathode field emission device, generally corresponds to each pixel arranged in a two-dimensional matrix. The cathode panel having the electron emission region and the anode panel having a phosphor region that emits light when excited by collision with electrons emitted from the electron emission region are arranged to face each other through a vacuum layer. The electron emission region is usually provided with one or a plurality of cold cathode field emission devices (hereinafter sometimes abbreviated as field emission devices). Examples of field emission devices include Spindt type, flat type, edge type, and planar type.

  As an example, FIG. 24 shows a conceptual partial end view of a display device having a Spindt-type field emission device, and a schematic view of a part of the cathode panel CP and the anode panel AP when the cathode panel CP and the anode panel AP are disassembled. A simple exploded perspective view is shown in FIG. The Spindt-type field emission device constituting this display device was formed on the cathode 10 formed on the support 10, the insulating layer 12 formed on the support 10 and the cathode 11, and the insulating layer 12. A gate electrode 13 and an opening 14 formed in the gate electrode 13 and the insulating layer 12 (a first opening 14A formed in the gate electrode 13 and a second opening 14B formed in the insulating layer 12); It is composed of a conical electron emission portion 15 formed on the cathode electrode 11 located at the bottom of the opening 14.

  Alternatively, FIG. 26 shows a conceptual partial end view of a display device having a Spindt type field emission device provided with a resistor layer. The Spindt-type field emission device constituting this display device is formed on the cathode electrode 11 formed on the support 10, the resistor layer 18 formed on the support 10 and the cathode electrode 11, and the resistor layer 18. The insulating layer 12, the gate electrode 13 formed on the insulating layer 12, the opening 14 formed in the gate electrode 13 and the insulating layer 12 (the first opening 14A formed in the gate electrode 13, and The second opening portion 14B) formed in the insulating layer 12 and the conical electron emission portion 15 formed on the resistor layer 18 located at the bottom of the opening portion 14 are configured. The resistor layer 18 can adjust the current emission characteristics of the electron emission portion 15 and can prevent an excessive current from flowing to the display device due to discharge or the like.

  In these display devices, the cathode electrode 11 has a strip shape extending in the first direction (Y direction in FIGS. 24 to 26), and the gate electrode 13 has a second direction (FIGS. 24 to 26) different from the first direction. In the X direction). In general, the cathode electrode 11 and the gate electrode 13 are each formed in a strip shape in a direction in which the projected images of both the electrodes 11 and 13 are orthogonal to each other. In the overlapping region SA where the strip-shaped cathode electrode 11 and the strip-shaped gate electrode 13 overlap, the region where the Spindt-type field emission device is arranged is the electron emission region EA. The relationship between the overlapping area SA and the electron emission area EA will be described later. The electron emission areas EA are usually arranged in a two-dimensional matrix within the effective area of the cathode panel CP (area corresponding to the display area of the display device).

  On the other hand, the anode panel AP has a phosphor layer 22 (specifically, a red light-emitting phosphor layer 22R, a green light-emitting phosphor layer 22G, and a blue light-emitting phosphor layer 22B) having a predetermined pattern on the substrate 20. The phosphor layer 22 is formed and covered with the anode electrode 24. Between these phosphor layers 22, a light absorption layer (black matrix) 23 made of a light absorption material such as carbon is embedded to prevent display image color turbidity and optical crosstalk. Yes. In the figure, reference numeral 21 represents a partition, reference numeral 40 represents a plate-like spacer, reference numeral 25 represents a spacer holding part, reference numeral 26 represents a frame, reference numeral 16 represents a converging electrode, and so on. Reference numeral 17 represents an interlayer insulating layer. In FIG. 25, illustration of the partition walls, the spacers, the spacer holding portion, the interlayer insulating layer, and the focusing electrode is omitted.

  The anode electrode 24 has a function of preventing charging of the phosphor layer 22 in addition to a function as a reflection film that reflects light emitted from the phosphor layer 22. The barrier rib 21 has a function of reducing the occurrence of so-called optical crosstalk (color turbidity) due to collision of backscattered electrons with another phosphor layer 22.

  One subpixel is constituted by an electron emission area EA on the cathode panel CP side and a phosphor layer 22 on the anode panel AP side facing a group of these field emission elements. In a color display device, one pixel (one pixel) is composed of a set of sub-pixels that emit red light, green light, and blue light. In the display area of the display device, such pixels are formed on the order of several hundred thousand to several million, for example, so as to correspond to the effective area of the cathode panel CP.

Then, the anode panel AP and the cathode panel CP are arranged so that the electron emission area EA and the phosphor layer 22 face each other, joined at the peripheral portion via the frame body 26, and then exhausted and sealed. Thus, a display device can be manufactured. A space surrounded by the anode panel AP, the cathode panel CP, and the frame body 26 is in a high vacuum (for example, 1 × 10 ⁻³ Pa or less).

  In such a display device, since the space surrounded by the anode panel AP, the cathode panel CP, and the frame body 26 is in a high vacuum, the spacer 40 is disposed between the anode panel AP and the cathode panel CP. Otherwise, the display device will be damaged by atmospheric pressure. In order to prevent the spacer 40 from affecting the display image, the spacer is provided at a position overlapping the light absorption layer 23. The spacer 40 includes a spacer base 40A and an antistatic film 40B provided on the side surface of the spacer base 40A. The antistatic film 40B is provided when necessary.

  A relatively negative voltage is applied to the cathode electrode 11 from the cathode electrode control circuit 31, a relatively positive voltage is applied to the gate electrode 13 from the gate electrode control circuit 32, and a focusing electrode control circuit ( A relatively negative voltage (for example, 0 volts) is applied from an anode electrode control circuit 33, and a higher positive voltage than that of the gate electrode 13 is applied to the anode electrode 24. When performing display in such a display device, for example, a scanning signal is input to the cathode electrode 11 from the cathode electrode control circuit 31, and a video signal is input to the gate electrode 13 from the gate electrode control circuit 32. Alternatively, a video signal is input from the cathode electrode control circuit 31 to the cathode electrode 11, and a scanning signal is input from the gate electrode control circuit 32 to the gate electrode 13. Electrons are emitted from the electron emitter 15 based on the quantum tunnel effect due to an electric field generated when a voltage is applied between the cathode electrode 11 and the gate electrode 13, and the electrons are attracted to the anode electrode 24. It passes and collides with the phosphor layer 22. As a result, the phosphor layer 22 is excited to emit light, and a desired image can be obtained. That is, the operation of the cold cathode field emission display is basically controlled by the voltage applied to the gate electrode 13 and the voltage applied to the cathode electrode 11.

In this display device, for example, as disclosed in Japanese Patent Application Laid-Open No. 2003-168356, a capacitance exists between the cathode electrode 11 and the gate electrode 13. This capacitance will be described with reference to FIG. 27A is a diagram schematically showing the positional relationship between the cathode electrode 11 and the gate electrode 13 on the support 10, and FIG. 27B is a diagram showing the cathode electrode 11 and the gate electrode 13. It is the figure which showed typically the structure of this overlap area | region SA. As shown in FIG. 27A, each cathode electrode 11 intersects a large number of gate electrodes 13. In the overlapping area SA between the cathode electrode 11 and the gate electrode 13, an electron emission area EA is arranged as shown in FIG. In FIG. 27B, the overlapping region SA is a hatched region, and the electron emission region EA is a region surrounded by an alternate long and short dash line. As is apparent from FIG. 27B, the electron emission area EA is in a relationship included in the overlapping area SA. More specifically, the part other than the electron emission area EA in the overlapping area SA (that is, the remaining part excluding the electron emission area EA from the overlapping area SA, and is abbreviated as “non-emission area part” as will be described later). Is a region that does not contribute to electron emission. If the area of the overlapping region SA is S _SA , the distance between the cathode electrode 11 and the gate electrode 13 is the distance D, and the capacitance existing in the overlapping region SA is C _SA , the capacitance C _SA becomes the area S _SA . Proportional and inversely proportional to distance D. At this time, if the total number of gate electrodes 13 intersecting with one cathode electrode 11 is M (pieces), the capacitance C per one cathode electrode 11 is equal to one cathode electrode 11. the sum of the capacitance C _SA by overlap area SA that is present, that is, the M × C _SA. In other words, the capacitance C per one cathode electrode 11 is proportional to the area M × S _SA and inversely proportional to the distance D.

JP 2003-168356 A

  The operation of the display device is basically controlled by the voltage applied to the gate electrode 13 and the voltage applied to the cathode electrode 11. For example, an image is displayed by inputting a scanning signal to the gate electrode 13, inputting a video signal to the cathode electrode 11, and switching these signals at high speed to perform line sequential scanning. With the increase in the screen size and the definition of the display device, the display device is required to cope with increasing the scanning speed and lowering the operating voltage of the electron emission area EA. As disclosed in Japanese Patent Application Laid-Open No. 2003-168356, the capacitance between the cathode electrode 11 and the gate electrode 13 causes a delay in signal transmission, which is a limitation in increasing the scanning speed. It has become. This is because as the electrostatic capacitance C per one cathode electrode 11 increases, the signal transmission is delayed. As described above, the capacitance C can be reduced by increasing the distance D between the cathode electrode 11 and the gate electrode 13. However, when the distance D between the cathode electrode 11 and the gate electrode 13 is increased, the electric field generated by the cathode electrode 11 and the gate electrode 13 is weakened, and the operating characteristics of the electron emission region EA are changed. That is, in order to operate the display device, a larger potential difference must be given between the gate electrode 13 and the cathode electrode 11. Thus, the reduction in the capacitance by simply increasing the distance D between the cathode electrode 11 and the gate electrode 13 leads to an increase in the operating voltage in the electron emission region EA.

  Accordingly, an object of the present invention is to provide cold cathode field electrons that can achieve a reduction in capacitance between the cathode electrode and the gate electrode without causing an increase in operating voltage in the electron emission region EA. It is an object of the present invention to provide a cathode panel for an emission display device and a cold cathode field emission display device incorporating the cathode panel.

In order to achieve the above object, a cathode panel for a cold cathode field emission display device of the present invention comprises:
(A) a support,
(B) a plurality of cathode electrodes formed on the support and extending in the first direction;
(C) an insulating layer formed on the support and the cathode electrode;
(D) a plurality of gate electrodes formed on the insulating layer and extending in a second direction different from the first direction; and
(E) an electron emission region provided in an overlapping region where the cathode electrode and the gate electrode overlap,
Consists of.

In order to achieve the above object, a cold cathode field emission display device according to the present invention comprises a cathode panel for a cold cathode field emission display device, and a cold cathode field electron emission comprising a phosphor layer and an anode electrode. A cold cathode field emission display device in which an anode panel for a display device is joined at a peripheral portion thereof, and the cathode panel for a cold cathode field emission display device is similarly
(A) a support,
(B) a plurality of cathode electrodes formed on the support and extending in the first direction;
(C) an insulating layer formed on the support and the cathode electrode;
(D) a plurality of gate electrodes formed on the insulating layer and extending in a second direction different from the first direction; and
(E) an electron emission region provided in an overlapping region where the cathode electrode and the gate electrode overlap,
Consists of.

  Hereinafter, the cathode panel for a cold cathode field emission display device of the present invention or the cold cathode field emission display device of the present invention may be simply referred to as the present invention. The cathode panel for the cold cathode field emission display device of the present invention or the cathode panel for the cold cathode field emission display device constituting the cold cathode field emission display device of the present invention is simply referred to as the cathode panel of the present invention. Sometimes called. Furthermore, the cold cathode field emission display device of the present invention may be simply referred to as the display device of the present invention.

And in the electron emission region of the cathode panel of the present invention,
(A) a first opening formed in the gate electrode;
(B) a second opening formed in the insulating layer and communicating with the first opening; and
(C) an electron emission portion located at the bottom of the second opening,
Is provided. The thickness of the insulating layer in the electron emission region portion of the overlapping region (hereinafter sometimes referred to as “emission region portion”) is the portion other than the electron emission region of the overlapping region (hereinafter referred to as “non-emitting region portion”). It may be abbreviated as “the emission region portion”).

  In the cathode panel of the present invention, in the “non-emitting region portion”, the insulating layer has a laminated structure of the first insulating layer and the second insulating layer, and in the “emitting region portion”, the insulating layer is the first layer. It can be configured by one insulating layer. In the “emission region portion”, since the insulating layer is formed of the first insulating layer, the distance between the cathode electrode and the gate electrode is defined by the thickness of the first insulating layer. On the other hand, in the “non-emitting region portion”, the insulating layer has a laminated structure of a first insulating layer and a second insulating layer. Therefore, in the “non-emission region portion”, the distance between the cathode electrode and the gate electrode is relatively wider than that in the “emission region portion”. As a result, since the capacitance decreases as a whole in the overlapping region, a reduction in the capacitance between the cathode electrode and the gate electrode is achieved. In addition, the distance between the cathode electrode and the gate electrode in the electron emission region is defined only by the thickness of the first insulating layer. Therefore, the second insulating layer does not directly affect the operating characteristics of the field emission region.

  In the “non-emitting region portion”, the insulating layer has a laminated structure of a first insulating layer and a second insulating layer. In the “emitting region portion”, the insulating layer is composed of the first insulating layer. In the “non-emission region portion”, the second insulating layer may have a structure formed on the cathode electrode (hereinafter sometimes referred to as “first structure”), or “ In the “non-emission region portion”, the first insulating layer may be formed on the cathode electrode (hereinafter also referred to as “second structure”). In the “first structure” and the “second structure”, the first insulating layer or the second insulating layer may be formed directly on the cathode electrode, or the cathode electrode may be interposed via another layer. The structure formed above can also be used. The laminated structure of the first insulating layer and the second insulating layer may also be a structure of direct lamination or a structure of lamination via other layers. Examples of the other layer include an adhesion improving layer and a resistor layer described below. In particular, the current emission characteristics of the electron emission portion can be adjusted by providing a resistor layer on the cathode electrode in the overlapping region (more specifically, at least on the cathode electrode corresponding to the “emission region portion”). In addition, it is possible to prevent an excessive current from flowing to the display device due to discharge or the like.

As a material constituting the resistor layer, a carbon-based material such as silicon carbide (SiC) or SiCN, a semiconductor material such as SiN or amorphous silicon, or a refractory metal oxide such as ruthenium oxide (RuO ₂ ), tantalum oxide, or tantalum nitride. It can be illustrated. As a method for forming the resistor layer, for example, various physical vapor deposition methods (PVD method) such as an evaporation method such as an electron beam evaporation method and a hot filament evaporation method, a sputtering method, an ion plating method, and a laser ablation method; Examples include chemical vapor deposition (CVD); screen printing; metal mask printing; lift-off; sol-gel. The electrical resistance value per one electron emitting portion may be approximately 1 × 10 ⁶ to 1 × 10 ¹¹ Ω, preferably several tens of gigaΩ.

In the "first structure"
A resistor layer is formed in the overlapping region,
The resistor layer is
In the “emission region portion”, between the cathode electrode and the first insulating layer,
In the “non-emission region portion”, between the cathode electrode and the second insulating layer,
(Hereinafter sometimes referred to as “the structure of the first A”), or, alternatively,
In the “emission region portion”, between the cathode electrode and the first insulating layer,
In the “non-emission region portion”, between the second insulating layer and the first insulating layer,
(Hereinafter, sometimes referred to as “first B structure”).

In the "second structure"
A resistor layer is formed in the overlapping region,
The resistor layer may have a structure located between the cathode electrode and the first insulating layer (hereinafter sometimes referred to as “second A structure”).

  In the above-described “first structure”, “first A structure”, “first B structure”, “second structure”, and “second A structure”, there is an overlap in the cathode panel region. In the region other than the region SA, the first insulating layer, the second insulating layer, and the resistor layer can take various laminated forms. These aspects are listed in the following [Table 1] to [Table 5]. In these tables, the description of the interlayer insulating layer and the gate electrode is omitted.

  As for the “first structure”, as shown in the following [Table 1], “the embodiment of 1-A” to “the embodiment of 1-E” can be exemplified.

[Table 1]

  As for “Structure of 1A”, “Mode of 1A-A” to “Mode of 1A-Eb” can be exemplified as shown in [Table 2] below.

[Table 2]

  As for “Structure of 1B”, “Mode of 1B-A” to “Mode of 1B-Eb” can be exemplified as shown in [Table 3] below. The “1B structure” is a portion other than the overlapping region of the cathode electrode even if the resistor layer is formed on the entire surface as in the “1B-A mode” shown in [Table 3]. However, there is no direct contact with the resistor layer. The “first B structure” has an advantage that electrical interference between adjacent cathode electrodes generated via the resistor layer can be reduced without patterning the resistor layer.

[Table 3]

  With respect to the “second structure”, embodiments of “2-A” to “2-E” can be exemplified as shown in [Table 4] below.

[Table 4]

  With respect to the “second A structure”, embodiments of “2A-A” to “2A-Eb” can be exemplified as shown in [Table 5] below.

[Table 5]

  In the present invention, the field emission device includes a cathode electrode formed on a support, an “insulating layer” formed on the support and the cathode electrode, a gate electrode formed on the “insulating layer”, and a gate electrode. And an opening formed in the “insulating layer” and an electron emission portion formed on the cathode electrode located at the bottom of the opening. In the present invention, the type of the field emission device is not particularly limited, and a Spindt-type field emission device (a field emission device in which a conical electron emission portion is provided on the cathode electrode positioned at the bottom of the opening), A flat field emission device (a field emission device in which a substantially planar electron emission portion is provided on a cathode electrode positioned at the bottom of an opening) can be given. The “insulating layer” described above may be composed of a first insulating layer and / or a second insulating layer.

  In the cathode panel of the present invention, it is simplified that the projected image of the cathode electrode and the projected image of the gate electrode are orthogonal, that is, the first direction and the second direction are orthogonal. From the viewpoint of, it is preferable. An electron emission region is arranged in an overlapping region where the cathode electrode and the gate electrode overlap, and the electron emission region is arranged in a two-dimensional matrix, and each electron emission region includes one or a plurality of field emission elements. Is provided.

  In the display device of the present invention, as a result of applying a strong electric field generated by the voltage applied to the cathode electrode and the gate electrode to the electron emission portion, electrons are emitted from the electron emission portion by the quantum tunnel effect. The electrons are attracted to the anode panel by the anode electrode provided on the anode panel, and collide with the phosphor layer. As a result of the collision of electrons with the phosphor layer, the phosphor layer emits light and can be recognized as an image.

In the display device of the present invention, the cathode electrode is connected to the cathode electrode control circuit, the gate electrode is connected to the gate electrode control circuit, and the anode electrode is connected to the anode electrode control circuit. Note that these control circuits can be constituted by known circuits. During actual operation, the output voltage V _A of the anode electrode control circuit is normally constant, and can be, for example, 5 kilovolts to 15 kilovolts. Alternatively, when the distance between the anode panel and the cathode panel is d ₀ (where 0.5 mm ≦ d ₀ ≦ 10 mm), the value of V _A / d ₀ (unit: kilovolt / mm) is 0. It is desirable to satisfy 5 or more and 20 or less, preferably 1 or more and 10 or less, and more preferably 4 or more and 8 or less. In actual operation of the display device, a voltage modulation method can be adopted as a gradation control method for the voltage V _C applied to the cathode electrode and the voltage V _G applied to the gate electrode.

A field emission device can be generally manufactured by the following method. In the process described later, the “insulating layer” may be composed of a first insulating layer and / or a second insulating layer.
(1) forming a cathode electrode on a support;
(2) forming an “insulating layer” on the support and the cathode electrode;
(3) forming a gate electrode on the “insulating layer”;
(4) a step of forming an opening in a portion of the gate electrode and the “insulating layer” where the electron emission region is to be formed, and exposing the cathode electrode to the bottom of the opening;
(5) A step of forming an electron emission portion on the cathode electrode located at the bottom of the opening.

Alternatively, the field emission device can be manufactured by the following method. In the process described later, the “insulating layer” may be composed of a first insulating layer and / or a second insulating layer.
(1) forming a cathode electrode on a support;
(2) forming an electron emission portion on the cathode electrode;
(3) forming an “insulating layer” on the support and the electron emission portion, or on the support, the cathode electrode and the electron emission portion;
(4) forming a gate electrode on the “insulating layer”;
(5) A step of forming an opening in a portion of the gate electrode and “insulating layer” where an electron emission region is to be formed, and exposing the electron emission portion at the bottom of the opening.

  The field emission device may be provided with a focusing electrode. That is, for example, a field emission element in which an interlayer insulating layer is further provided on the gate electrode and the insulating layer, and a focusing electrode is provided on the interlayer insulating layer, or a focusing electrode is provided above the gate electrode. It can also be a field emission device. Here, the focusing electrode is an electrode for converging the trajectory of emitted electrons that are emitted from the opening and directed toward the anode electrode, thereby improving the luminance and preventing optical crosstalk between adjacent pixels. It is. In a so-called high voltage type cold cathode field emission display, the potential difference between the anode electrode and the cathode electrode is on the order of several kilovolts or more and the distance between the anode electrode and the cathode electrode is relatively long. The electrode is particularly effective. A relative negative voltage (for example, 0 volts) is applied to the focusing electrode from the focusing electrode control circuit. The focusing electrode does not necessarily have to be individually formed so as to surround each overlapping region where the cathode electrode and the gate electrode overlap. For example, the overlapping region may extend along a predetermined arrangement direction, or the entire overlapping region may be surrounded by one focusing electrode (that is, the focusing electrode may be used as a cold cathode field emission display device). A single sheet-like structure covering the entire effective area, which is a central display area that performs a practical function, may be used), and thereby a common convergence effect can be exerted on a plurality of overlapping areas.

  In the Spindt-type field emission device, as the material constituting the electron emission portion, molybdenum, molybdenum alloy, tungsten, tungsten alloy, titanium, titanium alloy, niobium, niobium alloy, tantalum, tantalum alloy, chromium, chromium alloy, and And at least one material selected from the group consisting of silicon (polysilicon and amorphous silicon) containing impurities. The electron emission portion of the Spindt-type field emission device can be formed by, for example, a sputtering method or a CVD method in addition to the vacuum evaporation method.

In the flat field emission device, it is preferable that the material constituting the electron emission portion is composed of a material having a work function Φ smaller than that of the material constituting the cathode electrode. What is necessary is just to determine based on the work function of the material which comprises a cathode electrode, the electric potential difference between a gate electrode and a cathode electrode, the magnitude | size of the emission electron current density requested | required, etc. Alternatively, the material constituting the electron emission portion may be appropriately selected from materials in which the secondary electron gain δ of the material is larger than the secondary electron gain δ of the conductive material constituting the cathode electrode. In the flat type field emission device, carbon, more specifically, amorphous diamond or graphite, a carbon nanotube structure (carbon nanotube and / or graphite nanofiber), as a particularly preferable constituent material of the electron emission portion, Examples thereof include ZnO whiskers, MgO whiskers, SnO ₂ whiskers, MnO whiskers, Y ₂ O ₃ whiskers, NiO whiskers, ITO whiskers, In ₂ O ₃ whiskers, and Al ₂ O ₃ whiskers. In addition, the material which comprises an electron emission part does not necessarily need to be provided with electroconductivity.

The constituent materials of the cathode electrode, gate electrode, and focusing electrode are aluminum (Al), tungsten (W), niobium (Nb), tantalum (Ta), molybdenum (Mo), chromium (Cr), copper (Cu), gold ( Metals such as Au), silver (Ag), titanium (Ti), nickel (Ni), cobalt (Co), zirconium (Zr), iron (Fe), platinum (Pt), zinc (Zn); these metal elements Alloys (eg, MoW) or compounds (eg, nitrides such as TiN, silicides such as WSi ₂ , MoSi ₂ , TiSi ₂ , TaSi ₂ ); semiconductors such as silicon (Si); carbon thin films such as diamond; ITO ( Examples thereof include conductive metal oxides such as indium oxide-tin oxide, indium oxide, and zinc oxide. In addition, as a method for forming these electrodes, for example, a vapor deposition method such as an electron beam vapor deposition method or a hot filament vapor deposition method, a sputtering method, a combination of a CVD method, an ion plating method and an etching method; a screen printing method; Plating method and electroless plating method); lift-off method; laser ablation method; sol-gel method and the like. According to the screen printing method or the plating method, for example, a strip-like cathode electrode or gate electrode can be formed directly.

As a constituent material of the insulating layer (first insulating layer, second insulating layer) and interlayer insulating layer, SiO ₂ , BPSG, PSG, BSG, AsSG, PbSG, SiON, SOG (spin on glass), low melting glass, glass paste, etc. An insulating resin such as SiO ₂ material; SiN material; polyimide can be used alone or in appropriate combination. The first insulating layer and the second insulating layer may be composed of the same material or may be composed of different materials. Various processes known in the art such as CVD, coating, sputtering, and screen printing can be used to form the insulating layer (first insulating layer, second insulating layer) and interlayer insulating layer.

  Planar shape (support surface) of the first opening (opening formed in the gate electrode) or the second opening (opening formed in the insulating layer (first insulating layer in the case of a two-layer structure)) Can be any shape such as a circle, an ellipse, a rectangle, a polygon, a rounded rectangle, and a rounded polygon. The formation of the first opening can be performed by, for example, anisotropic etching, isotropic etching, a combination of anisotropic etching and isotropic etching, or, depending on the method of forming the gate electrode, The first opening can also be formed directly. The second opening can also be formed by, for example, anisotropic etching, isotropic etching, or a combination of anisotropic etching and isotropic etching.

As a support constituting the cathode panel or as a substrate constituting the anode panel, a glass substrate, a glass substrate with an insulating film formed on the surface, a quartz substrate, a quartz substrate with an insulating film formed on the surface, and a surface Examples of the semiconductor substrate include an insulating film. From the viewpoint of reducing manufacturing costs, it is preferable to use a glass substrate or a glass substrate having an insulating film formed on the surface. As a glass substrate, high strain point glass, soda glass (Na ₂ O · CaO · SiO ₂ ), borosilicate glass (Na ₂ O · B ₂ O ₃ · SiO ₂ ), forsterite (2MgO · SiO ₂ ), lead glass (Na ₂ O · PbO · SiO ₂ ) and alkali-free glass can be exemplified.

  In a display device, examples of configurations of an anode electrode and a phosphor layer include (1) a configuration in which an anode electrode is formed on a substrate and a phosphor layer is formed on the anode electrode, and (2) a phosphor on the substrate. The structure which forms a layer and forms an anode electrode on a fluorescent substance layer can be mentioned. In the configuration (1), a so-called metal back film that is electrically connected to the anode electrode may be formed on the phosphor layer. In the configuration (2), a metal back film may be formed on the anode electrode.

The anode electrode may be composed of one anode electrode as a whole, or may be composed of a plurality of anode electrode units. In the latter case, it is preferable that the anode electrode unit and the anode electrode unit are electrically connected by a resistor film. The material constituting the resistor film is a carbon-based material such as carbon, silicon carbide (SiC) or SiCN; a SiN-based material; a refractory metal such as ruthenium oxide (RuO ₂ ), tantalum oxide, tantalum nitride, chromium oxide or titanium oxide. Examples thereof include oxides; semiconductor materials such as amorphous silicon; ITO. It is also possible to realize a stable desired sheet resistance value by combining a plurality of films such as laminating a carbon thin film having a low resistance value on the SiC resistance film. Examples of the sheet resistance value of the resistor film include 1 × 10 ⁻¹ Ω / □ to 1 × 10 ¹⁰ Ω / □, preferably 1 × 10 ³ Ω / □ to 1 × 10 ⁸ Ω / □. The number (Q) of anode electrode units may be two or more. For example, when the total number of rows of phosphor layers arranged in a straight line is q, Q = q or q = k · Q (K is an integer of 2 or more, preferably 10 ≦ k ≦ 100, more preferably 20 ≦ k ≦ 50), or a number obtained by adding 1 to the number of spacers arranged at a constant interval. It can also be a number that matches the number of pixels or sub-pixels, or an integer fraction of the number of pixels or sub-pixels. The size of each anode electrode unit may be the same regardless of the position of the anode electrode unit, or may vary depending on the position of the anode electrode unit.

The anode electrode (including the anode electrode unit) may be formed using a conductive material layer. As a method for forming the conductive material layer, for example, various PVD methods such as an evaporation method such as an electron beam evaporation method and a hot filament evaporation method, a sputtering method, an ion plating method, and a laser ablation method; various CVD methods; a screen printing method; a metal Examples include mask printing method; lift-off method; sol-gel method. That is, it is possible to form an anode electrode by forming a conductive material layer made of a conductive material and patterning the conductive material layer based on a lithography technique and an etching technique. Alternatively, the anode electrode can be obtained by forming a conductive material based on a PVD method or a screen printing method through a mask or screen having an anode electrode pattern. The resistor film can also be formed by the same method. That is, a resistor film may be formed from a resistor material, and the resistor film may be patterned based on lithography technology and etching technology, or the resistor material may be provided via a mask or screen having a resistor film pattern. A resistor film can be obtained by formation based on the PVD method or the screen printing method. 3 × 10 ⁻⁸ m (30 nm) to 5 as the average thickness of the anode electrode on the substrate (or above the substrate) (when the partition is provided as described later, the average thickness of the anode electrode on the top surface of the partition) Examples include x10 ⁻⁷ m (0.5 μm), preferably 5 × 10 ⁻⁸ m (50 nm) to 3 × 10 ⁻⁷ m (0.3 μm).

As the constituent material of the anode electrode, molybdenum (Mo), aluminum (Al), chromium (Cr), tungsten (W), niobium (Nb), tantalum (Ta), gold (Au), silver (Ag), titanium (Ti) ), Cobalt (Co), zirconium (Zr), iron (Fe), platinum (Pt), zinc (Zn), etc .; alloys or compounds containing these metal elements (for example, nitrides such as TiN, WSi ₂ Silicide such as MoSi ₂ , TiSi ₂ , TaSi ₂ ); Semiconductor such as silicon (Si); Carbon thin film such as diamond; Conductive metal oxide such as ITO (indium oxide-tin oxide), indium oxide, zinc oxide can do. When the resistor film is formed, the anode electrode is preferably made of a conductive material that does not change the resistance value of the resistor film. For example, when the resistor film is made of silicon carbide (SiC), the anode electrode is It is preferable to comprise from molybdenum (Mo).

  The phosphor layer may be composed of single-color phosphor particles or may be composed of three primary color phosphor particles. The phosphor layer is arranged in a dot pattern. Specifically, when the display device performs color display, examples of the arrangement and arrangement of the phosphor layers include a delta arrangement, a stripe arrangement, a diagonal arrangement, and a rectangle arrangement. That is, one line of the phosphor layers arranged in a straight line is occupied by a line occupied by the red light emitting phosphor layer, a line occupied by the green light emitting phosphor layer, and a blue light emitting phosphor layer. It may be comprised from the row | line | column, and it may be comprised from the row | line | column in which the red light emission fluorescent substance layer, the green light emission fluorescent substance layer, and the blue light emission fluorescent substance layer were arrange | positioned in order. Here, the phosphor layer is defined as a phosphor region that generates one bright spot on the anode panel. Further, one pixel (one pixel) is composed of a set of one red light emitting phosphor layer, one green light emitting phosphor layer, and one blue light emitting phosphor layer, and one subpixel is one phosphor. It is composed of layers (one red-emitting phosphor layer, one green-emitting phosphor layer, or one blue-emitting phosphor layer). A gap between adjacent phosphor layers may be filled with a light absorption layer (black matrix) for the purpose of improving contrast.

  The phosphor layer uses a luminescent crystal particle composition prepared from luminescent crystal particles (for example, phosphor particles having a particle size of about 2 to 10 nm), for example, a red photosensitive luminescent crystal particle composition. (Red phosphor slurry) is applied to the entire surface, exposed and developed to form a red light emitting phosphor layer, and then a green photosensitive luminescent crystal particle composition (green phosphor slurry) is applied to the entire surface. Then, it is exposed to light and developed to form a green light emitting phosphor layer. Further, a blue photosensitive luminescent crystal particle composition (blue phosphor slurry) is applied to the entire surface, exposed to light and developed to emit blue light. It can be formed by a method of forming a phosphor layer. Alternatively, after sequentially applying the red light emitting phosphor slurry, the green light emitting phosphor slurry, and the blue light emitting phosphor slurry, each phosphor slurry may be sequentially exposed and developed to form each phosphor layer. Each phosphor layer may be formed by a screen printing method, an inkjet method, a float coating method, a sedimentation coating method, a phosphor film transfer method, or the like. The average thickness of the phosphor layer on the substrate is not limited, but is preferably 3 μm to 20 μm, preferably 5 μm to 10 μm. The phosphor material constituting the luminescent crystal particles can be appropriately selected from conventionally known phosphor materials. In the case of color display, a phosphor material whose color purity is close to the three primary colors specified by NTSC, white balance is achieved when the three primary colors are mixed, the afterglow time is short, and the afterglow time of the three primary colors is almost equal. It is preferable to combine them.

  The light absorption layer that absorbs light from the phosphor layer is preferably formed between adjacent phosphor layers or between the partition wall and the substrate from the viewpoint of improving the contrast of the display image. Here, the light absorption layer functions as a so-called black matrix. As the material constituting the light absorption layer, it is preferable to select a material that absorbs 90% or more of light from the phosphor layer. Such materials include carbon, metal thin films (eg, chromium, nickel, aluminum, molybdenum, etc., or alloys thereof), metal oxides (eg, chromium oxide), metal nitrides (eg, chromium nitride), heat resistance Materials such as photosensitive organic resins, glass pastes, glass pastes containing conductive particles such as black pigments and silver, and specifically, photosensitive polyimide resins, chromium oxides, and chromium oxide / chromium laminated films Can be illustrated. In the chromium oxide / chromium laminated film, the chromium film is in contact with the substrate. For example, the light absorption layer is a combination of a vacuum vapor deposition method, a sputtering method and an etching method, a vacuum vapor deposition method, a sputtering method, a combination of a spin coating method and a lift-off method, a screen printing method, a lithography technique, etc. It can be formed by a method appropriately selected depending on the method.

  In order to reduce the occurrence of so-called optical crosstalk (color turbidity) when electrons rebounding from the phosphor layer or secondary electrons emitted from the phosphor layer enter the other phosphor layer, Alternatively, when electrons recoiled from the phosphor layer or secondary electrons emitted from the phosphor layer enter the other phosphor layer through the barrier ribs, these electrons enter the other phosphor layer. In order to prevent collision, it is preferable to provide a partition wall.

  Examples of the partition wall forming method include a screen printing method, a dry film method, a photosensitive method, a casting method, and a sandblast forming method. Here, in the screen printing method, an opening is formed in a portion of the screen corresponding to a portion where a partition is to be formed, and the partition forming material on the screen is passed through the opening using a squeegee, and the partition is formed on the substrate. In this method, after the formation material layer is formed, the partition wall formation material layer is fired. The dry film method is a method of laminating a photosensitive film on a substrate, removing the photosensitive film at the part where the partition wall is to be formed by exposure and development, embedding the partition wall forming material in the opening generated by the removal, and baking. . The photosensitive film is burned and removed by baking, and the partition wall-forming material embedded in the openings remains to form partition walls. The photosensitive method is a method in which a barrier rib-forming material layer having photosensitivity is formed on a substrate, the barrier rib-forming material layer is patterned by exposure and development, and then fired (cured). The casting method (embossing molding method) refers to a method for forming a partition wall forming material layer by extruding a partition wall forming material layer made of a paste-like organic material or inorganic material onto a substrate from a mold (cast). In this method, the partition wall forming material layer is fired. The sand blast forming method is, for example, forming a partition wall forming material layer on a substrate using a screen printing or metal mask printing method, a roll coater, a doctor blade, a nozzle discharge type coater, etc. In this method, the part of the partition wall forming material layer to be covered is covered with a mask layer, and then the exposed part of the partition wall forming material layer is removed by sandblasting. After the partition wall is formed, the partition wall may be polished to flatten the top surface of the partition wall.

  As a planar shape of the part surrounding the phosphor layer in the partition wall (corresponding to the inner contour line of the projected image of the partition wall side surface and a kind of opening region), a rectangular shape, a circular shape, an elliptical shape, an oval shape, a triangular shape, Examples include pentagonal or more polygonal shapes, rounded triangular shapes, rounded rectangular shapes, rounded polygons, and the like. By arranging these planar shapes (planar shapes of the opening regions) in a two-dimensional matrix, a grid-like partition is formed. This two-dimensional matrix-like arrangement may be arranged, for example, like a cross or like a zigzag.

Examples of the partition wall forming material include photosensitive polyimide resin, lead glass colored with a metal oxide such as cobalt oxide, SiO ₂ , and a low melting point glass paste. A protective layer (for example, made of SiO ₂ , SiON, or AlN) is provided on the surface (top surface and side surface) of the partition wall to prevent an electron beam from colliding with the partition wall and releasing gas from the partition wall. It may be formed.

The cathode panel and the anode panel are joined at the peripheral edge. The joining may be performed using an adhesive layer, or a frame made of an insulating rigid material such as glass or ceramics and an adhesive layer are used in combination. May be. When using a frame and an adhesive layer together, the opposing distance between the cathode panel and the anode panel is set longer than when only the adhesive layer is used by appropriately selecting the height of the frame. Is possible. As a constituent material of the adhesive layer, frit glass is generally used, but a so-called low melting point metal material having a melting point of about 120 to 400 ° C. may be used. Such low melting point metal materials include In (indium: melting point 157 ° C.); indium-gold based low melting point alloy; Sn ₈₀ Ag ₂₀ (melting point 220 to 370 ° C.), Sn ₉₅ Cu ₅ (melting point 227 to 370 ° C.) C) tin (Sn) type high temperature solder such as Pb _97.5 Ag _2.5 (melting point 304 ° C.), Pb _94.5 Ag _5.5 (melting point 304 to 365 ° C.), Pb _97.5 Ag _1.5 Sn _1.0 (melting point 309 ° C.), etc. Lead (Pb) high temperature solder; zinc (Zn) high temperature solder such as Zn ₉₅ Al ₅ (melting point 380 ° C.); Sn ₅ Pb ₉₅ (melting point 300 to 314 ° C.), Sn ₂ Pb ₉₈ (melting point 316 to 322) Tin-lead standard solder such as ° C); brazing material such as Au ₈₈ Ga ₁₂ (melting point 381 ° C) (the above subscripts all represent atomic%).

  When joining the three of the cathode panel, the anode panel and the frame, the three may be joined at the same time, or in the first stage, either the cathode panel or the anode panel and the frame are joined, In the second stage, the other of the cathode panel or the anode panel and the frame may be joined. When the three-party simultaneous bonding or the second-stage bonding is performed in a high vacuum atmosphere, the space surrounded by the cathode panel, the anode panel, the frame, and the adhesive layer becomes a vacuum simultaneously with the bonding. Alternatively, the space surrounded by the cathode panel, the anode panel, the frame body, and the adhesive layer can be exhausted and vacuumed after the completion of the joining of the three parties. When exhausting after joining, the pressure of the atmosphere at the time of joining may be normal pressure / depressurized, and the gas constituting the atmosphere may be air, or nitrogen gas or group 0 of the periodic table An inert gas containing a gas belonging to (for example, Ar gas) may be used.

  When exhaust is performed, exhaust can be performed through a tip tube connected in advance to the cathode panel and / or the anode panel. The tip tube is typically a glass tube, or a metal or alloy having a low thermal expansion coefficient [for example, an iron (Fe) alloy containing 42 wt% nickel (Ni), 42 wt% nickel (Ni), An iron (Fe) alloy containing 6% by weight of chromium (Cr)], and an ineffective area of the cathode panel and / or the anode panel (an effective area that is a display area in the center portion that performs a practical function as a display device) Is bonded to the periphery of the through-hole provided in the frame-like area) using frit glass or the above-mentioned low-melting-point metal material, and after the space reaches a predetermined degree of vacuum, it is sealed by thermal fusion. Or alternatively sealed by crimping. Note that it is preferable that the entire display device is once heated and then cooled before being sealed because residual gas can be released into the space and the residual gas can be removed out of the space by exhaust.

  The spacer base material can be made of ceramics or glass, for example. When the spacer substrate is made of ceramics, the ceramics include mullite, alumina, barium titanate, lead zirconate titanate, zirconia, cordiolite, borosilicate barium, iron silicate, glass ceramic materials, titanium oxide and Examples include chromium oxide, iron oxide, vanadium oxide, nickel oxide added, and the like. In this case, the spacer can be manufactured by forming a so-called green sheet, firing the green sheet, and cutting the green sheet fired product. Moreover, soda-lime glass can be mentioned as glass which comprises a spacer base material. The spacer may be fixed by being sandwiched between the partition walls, for example. Alternatively, for example, a spacer holding part may be formed on the anode panel and fixed by the spacer holding part.

An antistatic film may be provided on the surface of the spacer base material. The material constituting the antistatic film preferably has a secondary electron emission coefficient close to 1, and as the material constituting the antistatic film, a semimetal such as graphite, an oxide, a boride, a carbide, a sulfide, and A nitride or the like can be used. For example, compounds containing a metalloid element ₂ such as a semi-metal and MoSe such as _{graphite, Cr 2 O 3, Nd 2} O 3, La x Ba 2-x CuO 4, La x Ba 2-x CuO 4, La x Y List oxides such as _1-x CrO ₃ , borides such as AlB ₂ and TiB ₂ , carbides such as SiC, sulfides such as MoS ₂ and WS ₂ , and nitrides such as BN, TiN, and AlN. In addition, for example, materials described in JP-T-2004-500688 can be used. The antistatic film may be composed of a single type of material, may be composed of a plurality of types of materials, may be a single layer structure, or may be a multilayer structure. May be. The antistatic film can be formed based on a known method such as a sputtering method, a vacuum deposition method, a CVD method, or the like.

  In the cathode panel of the present invention or the cathode panel used in the display device of the present invention, the thickness of the insulating layer in the “emission region portion” is smaller than the thickness of the insulating layer in the “non-emission region portion”. As a result, since the capacitance decreases as a whole in the overlap region, the capacitance between the cathode electrode and the gate electrode can be reduced. When the insulating layer has a laminated structure of the first insulating layer and the second insulating layer, the distance between the cathode electrode and the gate electrode in the electron emission region is defined only by the thickness of the first insulating layer. Therefore, the second insulating layer does not directly affect the operating characteristics of the field emission region. As a result, the capacitance between the cathode electrode and the gate electrode can be reduced without increasing the operating voltage in the electron emission region.

  Hereinafter, the present invention will be described based on examples with reference to the drawings.

  Example 1 relates to the cathode panel of the present invention and the display device of the present invention. A conceptual partial end view of the display device of Example 1 is shown in FIG. The display device according to the first embodiment is a display device in which a cathode panel CP and an anode panel AP for a cold cathode field emission display device including a phosphor layer and an anode electrode are joined together at their peripheral portions. . Specifically, the cathode panel CP provided with the electron emission region EA and the anode panel AP face each other with a plate-like spacer 40 interposed therebetween, and the peripheral edge portion of the cathode panel CP and the peripheral edge portion of the anode panel AP are For example, the space between the cathode panel CP and the anode panel AP is held in vacuum by being joined via the frame body 26. The same applies to other embodiments described later. The cathode panel CP of Example 1 includes the “first structure” shown in Table 1. More specifically, the cathode panel CP of Example 1 corresponds to “an embodiment of 1-A” shown in Table 1.

  The cathode panel CP of Example 1 is formed on (A) the support body 110 and (B) the support body 110 and extends in the first direction (Y direction in FIG. 1), and a plurality of cathode electrodes 111 and (C) support. An insulating layer formed on the body 110 and the cathode electrode 111; (D) a plurality of gate electrodes 113 formed on the insulating layer and extending in a second direction (X direction in FIG. 1) different from the first direction; And (E) an electron emission area EA provided in the overlapping area SA where the cathode electrode 111 and the gate electrode 113 overlap. The same applies to other embodiments described later. Here, in the portion other than the electron emission region of the overlapping region SA, the insulating layer has a stacked structure of the first insulating layer 112 and the second insulating layer 119. In the electron emitting region portion of the overlapping region SA, the insulating layer is And the first insulating layer 112. The second insulating layer 119 is formed on the cathode electrode in a portion other than the electron emission region of the overlapping region SA. A converging electrode 116 is provided on the first insulating layer 112 via an interlayer insulating layer 117.

  In the electron emission region EA, (a) a first opening 114A formed in the gate electrode 113, (b) an insulating layer (more specifically, the first insulating layer 112) is formed, and the first opening 114A is formed. A second opening 114B in communication with the second opening 114B, and (c) an electron emission portion 115 located at the bottom of the second opening 114B, and an electron emission region portion of the overlapping region SA (ie, an “emission region portion”). The thickness of the insulating layer in () is smaller than the thickness of the insulating layer in the portion other than the electron emission region of the overlap region SA (that is, the “non-emission region portion”). Specifically, in the “non-emitting region portion”, the insulating layer has a stacked structure of the first insulating layer 112 and the second insulating layer 119, and in the “emitting region portion”, the insulating layer is the first insulating layer. Consists of. The same applies to other embodiments described later. In Example 1, the second insulating layer 119 is formed on the cathode electrode 111 in the “non-emitting region portion”. In addition, the lamination | stacking aspect in area | regions other than the overlap area | region SA is as the column of the "1-A aspect" of Table 1.

  Since the configurations, operations, and functions of the anode panel AP, the spacer 40, and the frame 26 are the same as those described in the conventional example, the description thereof is omitted here. Further, the support 110 and the cathode electrode 111 have the same configuration as the support 10 and the cathode electrode 11 in the conventional example. Furthermore, the gate electrode 113, the opening 114, the electron emission portion 115, the focusing electrode 116, and The interlayer insulating layer 117 has the same configuration as the gate electrode 13, the opening 14, the electron emission portion 15, the convergence electrode 16, and the interlayer insulating layer 17 in the conventional example. Therefore, detailed description thereof will be omitted.

  2A is a partial end view similar to FIG. 2 along the cross section when the cathode panel CP of Example 1 is cut along the YZ plane, and FIG. It is a partial end elevation similar to that along the cross section when cut by the XZ plane. On the other hand, for comparison, FIG. 3A shows a cross section of the cathode panel CP of Conventional Example 1 shown in FIG. 24 when the cathode panel CP is cut along the YZ plane as in FIG. FIG. 3B is a partial end view similar to that taken along the cross section when cut by the XZ plane. In these drawings, for convenience, the width of the cathode electrode in the Z direction is enlarged. The same applies to other drawings to be described later.

  As is clear from comparison between FIG. 2 and FIG. 3, in the cathode panel of Example 1, in the “non-emission region portion”, the distance between the gate electrode 113 and the cathode electrode 111 is the same as that of the cathode panel of Conventional Example 1. Wide compared to. Therefore, the capacitance of the “non-emitting region portion” is smaller than that of the conventional example 1. On the other hand, if the thickness of the first insulating layer 112 in FIG. 2 is the same as that of the insulating layer 12 in FIG. 3, the distance between the gate electrode and the cathode electrode of the “emission region portion” in the cathode panel of Example 1 is This is the same as Conventional Example 1. Therefore, the operating characteristics of the electron emission region in the cathode panel of Example 1 are kept the same as those of Conventional Example 1.

  Hereinafter, with reference to (A) to (C) of FIG. 4, (A) to (B) of FIG. 5, and (A) to (B) of FIG. 6, a method for manufacturing the cathode panel of Example 1, and A method for manufacturing the display device will be described. These drawings are partial end views similar to those along the cross section when the cathode panel CP is cut along the XZ plane, as in FIG. 2B. The same applies to the drawings relating to other embodiments described later.

[Step-100]
First, a plurality of cathode electrodes 111 extending in the first direction (Y direction) are formed on the support 110 constituting the cathode panel CP (see FIG. 4A). In Example 1, a thin film made of molybdenum / tungsten alloy was formed on the support 110 by a sputtering method, and then patterned by a known lithography technique or the like to form the cathode electrode 111. However, the present invention is not limited to this. Absent.

[Step-110]
Next, a second insulating layer 119 is formed on the support 110 and the cathode electrode 111. The second insulating layer 119 is provided with a predetermined opening 119A (see FIG. 4B). The opening 119A is provided at a position corresponding to the electron emission area EA of the cathode panel CP. In Example 1, after the SiO ₂ layer was formed on the entire surface by the sputtering method, the SiO ₂ layer was patterned by a known lithography technique or the like to form the second insulating layer 119 provided with the opening 119A. However, it is not limited to this.

  Note that the first insulating layer 112 and the gate electrode 113 formed in a process described later are basically formed following the surface shape of the second insulating layer 119. Therefore, it is preferable that the end surface 119B in the opening 119A of the second insulating layer 119 shown in FIG. 4B has a slope shape that covers the XY plane to some extent. This is because the sharper end surface 119B is, the easier the gate electrode 113 formed following the surface shape of the second insulating layer 119 is disconnected. The same applies to other embodiments described later.

In order to make the end surface 119B into a slope shape, the following technique can be used. When the opening 119A is formed by an etching technique, a thin film made of a material having an etching rate faster than the layer to be etched is formed on the layer to be etched (that is, the SiO ₂ layer), and a predetermined thickness is formed on the thin film. A mask having an opening is formed. Next, when an etching process is performed, a thin film made of a material having a high etching rate is etched relatively quickly, so that the end surface portion of the etching target layer has a slope shape. The inclination of the slope shape can be adjusted by the conditions of the thin film formed on the layer to be etched (etching rate, thin film thickness, etc.). The same applies to other embodiments described later.

[Step-120]
Thereafter, the first insulating layer 112 is formed on the support 110 and the cathode electrode 111 (more specifically, on the second insulating layer 119 and the cathode electrode 111 exposed to the opening 119A) (see FIG. 4). (See (C)). In Example 1, the first insulating layer 112 is provided by forming the SiO ₂ layer on the entire surface by sputtering, but the present invention is not limited to this. In the case where the electron emission portion is used as the electron emission portion of the Spindt field emission device, the thickness of the first insulating layer 112 needs to be set so that a desired shape of the Spindt field emission device can be obtained. . That is, the Spindt-type field emission device manufacturing method is basically a method in which a conical electron emission portion is formed by vertical vapor deposition of a metal material, and vapor deposition particles are incident on the opening 114 vertically. The amount of vapor deposition particles reaching the bottom of the second opening 114B is gradually reduced by utilizing the shielding effect of the overhanging deposit formed in the vicinity of the first opening 114A, thereby forming a conical deposit. The electron emission portion is formed in a self-aligning manner. Therefore, the shape of the Spindt field emission device is controlled by the thickness of the first insulating layer 112 and the hole diameter of the first opening 114A described later. The same applies to other embodiments described later.

[Step-130]
Next, a plurality of gate electrodes 113 formed on the first insulating layer 112 and extending in a second direction (X direction) different from the first direction are formed (see FIG. 5A). In Example 1, a thin film made of chromium was formed on the first insulating layer 112 by sputtering, and then patterned by a known lithography technique or the like to form the gate electrode 113. However, the present invention is not limited to this. . The same applies to other embodiments described later.

[Step-140]
Thereafter, an interlayer insulating layer 117 is formed on the gate electrode 113, and then a focusing electrode 116 is formed thereon. The interlayer insulating layer 117 and the focusing electrode 116 are provided with openings so that at least a portion of the gate electrode 113 where the electron emission region EA is to be formed is exposed (see FIG. 5B). The same applies to other embodiments described later.

[Step-150]
Next, a first opening 114A formed in the gate electrode 113 and a second opening 114B formed in the first insulating layer 112 and communicating with the first opening 114A are provided (see FIG. 6A). . In the first embodiment, a resist layer (not shown) is formed by lithography, and then a hole 114A is formed in the gate electrode 113 by a well-known etching method, and an opening 114B is formed in the first insulating layer 112. Thereafter, the resist layer is removed by an ashing technique, but is not limited thereto. The cathode electrode 111 is exposed at the bottom of the opening 114B.

[Step-160]
After that, an electron emission portion 115 located at the bottom of the second opening 114B is provided (see FIG. 6B). In Example 1, although the electron emission part 115 was used as the electron emission part of a Spindt-type field emission device, it is not limited to this. First, a release layer (not shown) is formed by obliquely depositing aluminum, and then, for example, molybdenum (Mo) is vertically deposited on the entire surface. Although the vapor deposition particles are perpendicularly incident on the opening 114, the vaporized particles reach the bottom of the second opening 114B by utilizing the shielding effect by the overhanging deposit formed in the vicinity of the first opening 114A. The amount of vapor deposition particles is gradually decreased, and the electron emission portion 115 which is a conical deposit is formed in a self-aligning manner. Thereafter, the release layer and the like are removed by an electrochemical process and a wet process. The same applies to other embodiments described later.

  The cathode panel of Example 1 can be manufactured by the above [Step-100] to [Step-160].

[Step-170]
Next, the display device shown in FIG. 1 is assembled. Specifically, the anode panel AP and the cathode panel CP are arranged so that the phosphor layer 22 and the electron emission region EA face each other with the spacer 40 interposed therebetween. The anode panel AP and the cathode panel CP (more specifically, the support body 10 and the substrate 20) are joined together at the peripheral edge via, for example, the frame body 26. At the time of joining, frit glass is applied to the joining part between the frame body 26 and the anode panel AP and the joining part between the frame body 26 and the cathode panel CP, and the frit glass is dried by pre-baking, and then the anode panel AP. The cathode panel CP and the frame are bonded together, and the main baking is performed at about 450 ° C. for 10 to 30 minutes. Thereafter, the space surrounded by the anode panel AP, the cathode panel CP, the frame body 26 and the adhesive layer is exhausted through a through hole (not shown) and a tip tube (not shown), and the pressure in the space is 10 ^−4. When the pressure reaches about Pa, the tip tube is sealed by heat melting or pressure welding. In this way, the space surrounded by the anode panel AP, the cathode panel CP, and the frame 26 can be evacuated. Thereafter, wiring with necessary external circuits is performed, and the display device of Example 1 can be completed.

  The second embodiment is a modification of the first embodiment. Example 2 is mainly different from Example 1 in that a resistor layer is provided. More specifically, a resistor layer is formed in an overlapping region where the cathode electrode and the gate electrode overlap each other, and this resistor layer forms a first insulating layer from the cathode electrode in the electron emission region portion of the overlapping region. In the portion other than the electron emission region in the overlapping region between the layers, the layer is located between the cathode electrode and the second insulating layer. By providing the resistor layer, the current emission characteristics of the electron emission portion can be adjusted, and an excessive current can be prevented from flowing to the display device due to discharge or the like.

  A conceptual partial end view of the display device of Example 2 is shown in FIG. The cathode panel CP of Example 2 includes the “first-A structure” shown in Table 2. More specifically, the cathode panel CP of Example 1 corresponds to the “1A-A mode” shown in Table 1. Since the configuration, operation, and operation of the anode panel AP, the spacer 40, and the frame 26 in the display device of Example 2 are the same as those described in the conventional example, the description thereof is omitted here. Further, the support 210 and the cathode electrode 211 have the same configuration as the support 10 and the cathode electrode 11 in the conventional example, and further, the gate electrode 213, the opening 214, the electron emission portion 215, the focusing electrode 216, and The interlayer insulating layer 217 has the same configuration as the gate electrode 13, the opening 14, the electron emitting portion 15, the convergence electrode 16, and the interlayer insulating layer 17 in the conventional example. Therefore, detailed description thereof will be omitted. In addition, the lamination | stacking aspect in area | regions other than the overlap area | region SA is as the column of the "1A-A aspect" of Table 2.

  FIG. 8A is a partial end view similar to FIG. 7 along the cross-section when the cathode panel CP of Example 2 is cut along the YZ plane, and FIG. It is a partial end elevation similar to that along the cross section when cut by the XZ plane. On the other hand, for comparison, FIG. 9A shows a cross section of the cathode panel CP of the conventional example 2 shown in FIG. 26 when the cathode panel CP is cut along the YZ plane as in FIG. FIG. 9B is a partial end view similar to that taken along the cross section when cut by the XZ plane. In these drawings, for the sake of convenience, the widths in the Z direction of the cathode electrode and the resistor layer are shown expanded. The same applies to other drawings to be described later.

  As is clear from comparison between FIG. 8 and FIG. 9, in the cathode panel of Example 2, in the “non-emission region portion”, the distance between the gate electrode 213 and the cathode electrode 211 is the same as that of the cathode panel of Conventional Example 2. Wide compared to. Therefore, the electrostatic capacity of the “non-emitting region portion” is smaller than that of the conventional example 2. On the other hand, if the thickness of the first insulating layer 212 in FIG. 8 is the same as that of the insulating layer 12 in FIG. 9, the distance between the gate electrode and the cathode electrode of the “emission region portion” in the cathode panel of Example 2 is This is the same as Conventional Example 2. Therefore, the operating characteristics of the electron emission region in the cathode panel of Example 2 are kept the same as those of Conventional Example 2.

  Hereinafter, with reference to FIGS. 10A to 10C and FIGS. 11A to 11B, a cathode panel manufacturing method and a display device manufacturing method of Example 2 will be described.

[Step-200]
First, in the same manner as in [Step-100] of Example 1, a plurality of cathode electrodes 211 extending in the first direction (Y direction) are formed on the support 210. Next, the resistor layer 218 is formed on the entire surface of the support 210 and the cathode electrode 211. In Example 2, the resistor layer 218 made of SiC was formed by sputtering, but the present invention is not limited to this. Thereafter, a second insulating layer 219 is formed on the resistor layer 218 in the same manner as in [Step-110] in Example 1. Note that the second insulating layer 219 is provided with a predetermined opening 219A (see FIG. 10A). Similar to the opening 119A of the first embodiment, the opening 219A is provided at a position corresponding to the electron emission region EA of the cathode panel CP.

[Step-210]
Thereafter, in the same manner as in [Step-120] in Example 1, on the support 210 and the cathode electrode 211 (more specifically, on the second insulating layer 219 and the resistor layer 218 exposed to the opening 219A). ), The first insulating layer 212 is formed (see FIG. 10B).

[Step-220]
Next, in the same manner as in [Step-130] in Example 1, a plurality of gate electrodes 213 formed on the first insulating layer 212 and extending in the second direction (X direction) different from the first direction are formed. To do. Thereafter, in the same manner as in [Step-140] in Example 1, an interlayer insulating layer 217 is formed on the gate electrode 213, and then a focusing electrode 216 is formed thereon. An opening is provided in the interlayer insulating layer 217 and the focusing electrode 216 so that the gate electrode 213 corresponding to the electron emission region is exposed (see FIG. 10C).

[Step-230]
Next, in the same manner as in [Step-150] of Example 1, the second opening 214A formed in the gate electrode 213 and the second opening formed in the first insulating layer 212 and communicated with the first opening 214A. An opening 214B is provided (see FIG. 11A). The resistor layer 218 is exposed at the bottom of the opening 214B.

[Step-240]
Thereafter, in the same manner as in [Step-160] in Example 1, an electron emission portion 215 located at the bottom of the second opening 214B is provided (see FIG. 11B). In the second embodiment, the electron emission portion 215 is the electron emission portion of the Spindt-type field emission device, but is not limited thereto.

  Through the above [Step-200] to [Step-240], the cathode panel of Example 2 can be manufactured. Next, the display device of Example 2 can be completed in the same manner as [Step-170] of Example 1.

  The third embodiment is a modification of the first embodiment. Example 2 is mainly different from Example 1 in that a resistor layer is provided. Further, Example 3 is mainly different from Example 2 in the position of the resistor layer. More specifically, a resistor layer is formed in an overlapping region where the cathode electrode and the gate electrode overlap each other, and this resistor layer forms a first insulating layer from the cathode electrode in the electron emission region portion of the overlapping region. In the part other than the electron emission region of the overlapping region between the layers, the layer is located between the second insulating layer and the first insulating layer. In this configuration, as described later, even if the resistor layer is formed on the entire surface, portions other than the overlapping region of the cathode electrode are not electrically connected to the resistor layer.

  A conceptual partial end view of the display device of Example 3 is shown in FIG. The cathode panel CP of Example 3 includes the “1B structure” shown in Table 3. More specifically, the cathode panel CP of Example 3 corresponds to the “mode of 1B-A” shown in Table 3. Since the configuration, operation, and action of the anode panel AP, the spacer 40, and the frame 26 in the display device of Example 3 are the same as those described in the conventional example, the description thereof is omitted here. Further, the support 310 and the cathode electrode 311 have the same configuration as the support 10 and the cathode electrode 11 in the conventional example, and further, the gate electrode 313, the opening 314, the electron emission portion 315, the focusing electrode 316, and The interlayer insulating layer 317 has the same configuration as the gate electrode 13, the opening 14, the electron emission portion 15, the convergence electrode 16, and the interlayer insulating layer 17 in the conventional example. Therefore, detailed description thereof will be omitted. In addition, the lamination | stacking aspect in area | regions other than the overlap area | region SA is as the column of the "1B-A aspect" of Table 3.

  FIG. 13A is a partial end view similar to FIG. 12 along the cross section when the cathode panel CP of Example 3 is cut along the YZ plane, and FIG. It is a partial end elevation similar to that along the cross section when cut by the XZ plane.

  As shown in FIG. 8, in the cathode panel of Example 2, the resistor layer 218 is formed so as to cover all of the cathode electrode 211 and the support 210. Therefore, since the gaps between the adjacent cathodes are all filled with the resistor layers, electrical interference between the adjacent cathode electrodes generated via the resistor layers is likely to occur. In order to improve this, it is necessary to pattern the resistor layer. As shown in FIG. 13, also in the cathode panel of Example 3, the resistor layer 318 is formed so as to cover all of the cathode electrode 311 and the second insulating layer 319. However, as is apparent from FIG. 13, the resistor layer 318 and the cathode electrode 311 are in contact with each other only in the overlapping region SA. That is, portions other than the overlapping region of the cathode electrode 311 are not in direct contact with the resistor layer 318. Thereby, in the cathode panel of Example 3, the electrical interference between the adjacent cathode electrodes generated via the resistor layer can be reduced without patterning the resistor layer.

  Hereinafter, with reference to FIGS. 14A to 14C and FIGS. 15A to 15B, a cathode panel manufacturing method and a display device manufacturing method of Example 3 will be described.

[Step-300]
First, a plurality of cathode electrodes 311 extending in the first direction (Y direction) are formed on the support 310 in the same manner as in [Step-100] to [Step-110] of Example 1, and then the support is performed. A second insulating layer 319 is formed on the body 310 and the cathode electrode 311. This stage is the same as FIG. 4B of the first embodiment. That is, the second insulating layer 319 is formed with the same opening as the opening 119A shown in FIG. Next, a resistor layer 318 is formed on the entire surface of the cathode electrode 311 (more specifically, the cathode electrode 311 exposed in the opening of the second insulating layer 319) and the second insulating layer 319 (FIG. 14 ( A)). In Example 3, the resistor layer 318 made of SiC was formed by the sputtering method, but the present invention is not limited to this.

[Step-310]
Thereafter, the first insulating layer 312 is formed over the resistor layer 318 in the same manner as in [Step-120] in Example 1 (see FIG. 14B). The first insulating layer 312 is located on the support 310 and the cathode electrode 311 with the resistor layer 318 interposed therebetween. Through the above [Step-300] to [Step-310], the resistor layer 318 is formed between the cathode electrode 311 and the first insulating layer 312 in the “emission region portion” and in the “non-emission region portion”. , Located between the second insulating layer 319 and the first insulating layer 312.

[Step-320]
Next, in the same manner as in [Step-130] in Example 1, a plurality of gate electrodes 313 formed on the first insulating layer 312 and extending in the second direction (X direction) different from the first direction are formed. To do. Thereafter, in the same manner as in [Step-140] in Example 1, an interlayer insulating layer 317 is formed on the gate electrode 313, and then a focusing electrode 316 is formed thereon. An opening is provided in the interlayer insulating layer 317 and the focusing electrode 316 so that the gate electrode 313 corresponding to the electron emission region is exposed (see FIG. 14C).

[Step-330]
Next, in the same manner as in [Step-150] of the first embodiment, the first opening 314A formed in the gate electrode 313 and the second opening formed in the first insulating layer 312 and communicated with the first opening 314A. An opening 314B is provided (see FIG. 15A). The resistor layer 318 is exposed at the bottom of the opening 314B.

[Step-340]
Thereafter, in the same manner as in [Step-160] in Example 1, an electron emission portion 315 located at the bottom of the second opening 314B is provided (see FIG. 15B). In the third embodiment, the electron emission portion 315 is the electron emission portion of the Spindt-type field emission device, but is not limited thereto.

  The cathode panel of Example 2 can be manufactured by the above [Step-300] to [Step-340]. Next, the display device of Example 3 can be completed in the same manner as [Step-170] of Example 1.

  Example 4 also relates to the cathode panel of the present invention and the display device of the present invention. Example 4 is mainly different from Example 1 in that the order of stacking the first insulating layer and the second insulating layer is different. More specifically, the first insulating layer is formed on the cathode electrode in a portion other than the electron emission region (“non-emission region portion”) of the overlapping region. A conceptual partial end view of the display device of Example 4 is shown in FIG. The cathode panel CP of Example 4 includes the “second structure” shown in Table 4. More specifically, the cathode panel CP of Example 4 corresponds to the “2-A mode” shown in Table 4. Note that a focusing electrode 416 is provided over the second insulating layer 419 with an interlayer insulating layer 417 interposed therebetween.

  Since the configurations, operations, and functions of the anode panel AP, the spacer 40, and the frame 26 are the same as those described in the conventional example, the description thereof is omitted here. The support 410 and the cathode electrode 411 have the same configuration as the support 10 and the cathode electrode 11 in the conventional example, and further, the gate electrode 413, the opening 414, the electron emission portion 415, the focusing electrode 416, and The interlayer insulating layer 417 has the same configuration as the gate electrode 13, the opening 14, the electron emission portion 15, the convergence electrode 16, and the interlayer insulating layer 17 in the conventional example. Therefore, detailed description thereof will be omitted. In addition, the lamination | stacking aspect in area | regions other than the overlap area | region SA is as the column of the "2-A aspect" of Table 4.

  FIG. 17A is a partial end view similar to FIG. 16 along the cross section when the cathode panel CP of Example 4 is cut along the YZ plane, and FIG. It is a partial end elevation similar to that along the cross section when cut by the XZ plane.

  As is clear from comparison between FIG. 17 and FIG. 3 of the conventional example 1, in the cathode panel of the fourth example, in the “non-emission region portion”, the distance between the gate electrode 413 and the cathode electrode 411 is It is wider than the cathode panel. Therefore, the capacitance for the “non-emitting region portion” is smaller than that of the conventional example 4. On the other hand, if the thickness of the first insulating layer 412 in FIG. 17 is the same as that of the insulating layer 12 in FIG. 3, the distance between the gate electrode and the cathode electrode of the “emission region portion” in the cathode panel of Example 4 is This is the same as Conventional Example 1. Therefore, the operating characteristics of the electron emission region in the cathode panel of Example 1 are kept the same as those of Conventional Example 1.

  Hereinafter, with reference to FIGS. 18A to 18C and FIGS. 19A to 19B, a cathode panel manufacturing method and a display device manufacturing method of Example 4 will be described.

[Step-400]
First, a plurality of cathode electrodes 411 extending in the first direction (Y direction) are formed on the support 410 in the same manner as in [Step-100] of the first embodiment. Next, a first insulating layer 412 is formed over the support 410 and the cathode electrode 411 in the same manner as in [Step-120] in Example 1 (see FIG. 18A).

[Step-410]
Thereafter, a second insulating layer 419 is formed on the first insulating layer 412 in the same manner as in [Step-110] in Example 1. Note that the second insulating layer 419 is provided with a predetermined opening 419A (see FIG. 18B). The opening 419A is provided at a position corresponding to the electron emission area EA of the cathode panel CP, similarly to the opening 119A of the first embodiment.

[Step-420]
Next, in the same manner as in [Step-130] of Example 1, the second insulating layer 419 and the first insulating layer 412 (more specifically, the first insulating layer exposed in the opening 419A of the second insulating layer 419). 412) A plurality of gate electrodes 413 are formed which extend on the second direction (X direction) different from the first direction. Thereafter, in the same manner as in [Step-140] in Example 1, an interlayer insulating layer 417 is formed on the gate electrode 413, and then a focusing electrode 416 is formed thereon. An opening is provided in the interlayer insulating layer 417 and the focusing electrode 416 so that the gate electrode 413 corresponding to the electron emission region is exposed (see FIG. 18C).

[Step-430]
Next, in the same manner as in [Step-150] of Example 1, the second opening 414A formed in the gate electrode 413 and the first insulating layer 412 and communicated with the first opening 414A are formed. An opening 414B is provided (see FIG. 19A). The cathode electrode 411 is exposed at the bottom of the opening 414B.

[Step-440]
Thereafter, in the same manner as in [Step-160] in Example 1, an electron emission portion 415 located at the bottom of the second opening 414B is provided (see FIG. 19B). In Example 4, although the electron emission part 415 was used as the electron emission part of the Spindt-type field emission device, it is not limited to this.

  The cathode panel of Example 4 can be manufactured by the above [Step-400] to [Step-440]. Next, the display device of Example 4 can be completed in the same manner as [Step-170] of Example 1.

  The fifth embodiment is a modification of the fourth embodiment. Example 5 is mainly different from Example 4 in that a resistor layer is provided. More specifically, a resistor layer is formed in the overlapping region where the cathode electrode and the gate electrode overlap, and this resistor layer is located between the cathode electrode and the first insulating layer. By providing the resistor layer, the current emission characteristics of the electron emission portion can be adjusted, and an excessive current can be prevented from flowing to the display device due to discharge or the like.

  A conceptual partial end view of the display device of Example 5 is shown in FIG. The cathode panel CP of Example 5 includes the “second A structure” shown in Table 5. More specifically, the cathode panel CP of Example 5 corresponds to “a mode of 2A-A” shown in Table 5. Since the configuration, operation, and action of the anode panel AP, the spacer 40, and the frame 26 in the display device of Example 5 are the same as those described in the conventional example, the description thereof is omitted here. The support 510 and the cathode electrode 511 have the same configuration as the support 10 and the cathode electrode 11 in the conventional example. Furthermore, the gate electrode 513, the opening 514, the electron emission portion 515, the focusing electrode 516, and The interlayer insulating layer 517 has the same configuration as the gate electrode 13, the opening 14, the electron emission portion 15, the convergence electrode 16, and the interlayer insulating layer 17 in the conventional example. Therefore, detailed description thereof will be omitted. In addition, the lamination | stacking aspect in area | regions other than the overlap area | region SA is as the column of the "2A-A aspect" of Table 5.

  FIG. 21A is a partial end view similar to FIG. 21 along the cross section when the cathode panel CP of Example 5 is cut along the YZ plane, and FIG. It is a partial end elevation similar to that along the cross section when cut by the XZ plane.

  As is clear from comparison between FIG. 21 and FIG. 9 of the conventional example 2, the cathode panel of the example 5 has a gap between the gate electrode 513 and the cathode electrode 511 in the “non-emitting region portion”. It is wider than the cathode panel. Therefore, the electrostatic capacity of the “non-emitting region portion” is smaller than that of the conventional example 2. On the other hand, if the thickness of the first insulating layer 512 in FIG. 21 is the same as that of the insulating layer 12 in FIG. 9, the distance between the gate electrode and the cathode electrode of the “emission region portion” in the cathode panel of Example 5 is This is the same as Conventional Example 2. Therefore, the operating characteristics of the electron emission region in the cathode panel of Example 2 are kept the same as those of Conventional Example 2.

  Hereinafter, with reference to FIGS. 22A to 22C and FIGS. 23A to 23B, a cathode panel manufacturing method and a display device manufacturing method of Example 5 will be described.

[Step-500]
First, in the same manner as in [Step-100] of Example 1, a plurality of cathode electrodes 511 extending in the first direction (Y direction) are formed on the support 510. Next, a resistor layer 518 is formed on the entire surface of the support 510 and the cathode electrode 511. In Example 5, the resistor layer 518 made of SiC was formed by the sputtering method, but the present invention is not limited to this. Thereafter, a first insulating layer 512 is formed over the resistor layer 518 in the same manner as in [Step-120] in Example 1 (see FIG. 22A).

[Step-510]
Thereafter, a second insulating layer 519 is formed on the first insulating layer 512 in the same manner as in [Step-110] in Example 1. Note that the second insulating layer 519 is provided with a predetermined opening 519A (see FIG. 22B). Similar to the opening 119A of the first embodiment, the opening 519A is provided at a position corresponding to the electron emission region EA of the cathode panel CP.

[Step-520]
Next, in the same manner as in [Step-130] of Example 1, the second insulating layer 519 and the first insulating layer 512 (more specifically, the first insulating layer exposed in the opening 519A of the second insulating layer 519). 512) A plurality of gate electrodes 513 are formed which extend in a second direction (X direction) different from the first direction. Thereafter, in the same manner as in [Step-140] in Example 1, an interlayer insulating layer 517 is formed on the gate electrode 513, and then a focusing electrode 516 is formed thereon. An opening is provided in the interlayer insulating layer 517 and the focusing electrode 516 so that the gate electrode 513 corresponding to the electron emission region is exposed (see FIG. 22C).

[Step-530]
Next, in the same manner as in [Step-150] in Example 1, the second opening 514A formed in the gate electrode 513 and the second opening formed in the first insulating layer 512 and communicated with the first opening 514A. An opening 514B is provided (see FIG. 23A). The resistor layer 518 is exposed at the bottom of the opening 514B.

[Step-540]
Thereafter, in the same manner as in [Step-160] of Example 1, an electron emission portion 515 located at the bottom of the second opening 514B is provided (see FIG. 23B). In Example 5, although the electron emission part 515 was used as the electron emission part of the Spindt-type field emission device, it is not limited to this.

  The cathode panel of Example 5 can be manufactured by the above [Step-500] to [Step-540]. Next, the display device of Example 5 can be completed in the same manner as [Step-170] of Example 1.

  As mentioned above, although this invention was demonstrated based on the preferable Example, this invention is not limited to these Examples. The configurations and structures of the cathode panel and anode panel, cold cathode field emission display device and cold cathode field emission device described in the embodiments are examples, and can be changed as appropriate. The anode panel, cathode panel, The manufacturing method of the cathode field emission display device and the cold cathode field emission device is also an example, and can be appropriately changed. Furthermore, various materials used in the manufacture of the anode panel and the cathode panel are also examples, and can be changed as appropriate. The display device has been described by taking color display as an example, but it may also be a single color display.

  In the embodiment, the cathode electrode and the gate electrode are described as strips, but the present invention is not limited to this. For example, the cathode electrode or the gate electrode may have a configuration in which a branch electrode is connected to the trunk electrode, and a configuration in which the branch electrode portions face each other to form an overlapping region.

  In the embodiment, the insulating layer has a laminated structure of the first insulating layer and the second insulating layer, but the present invention is not limited to this. For example, the insulating layer is composed of a single layer, and the insulating layer in the portion where the electron emission region is to be provided is processed by an etching method or the like until a predetermined thickness is obtained. It is also possible to adopt a configuration in which the thickness is made thinner than the thickness of the insulating layer in the portion other than the electron emission region in the overlapping region.

  In the field emission device, a mode in which one electron emission portion corresponds to one opening has been described. However, depending on the structure of the field emission device, a mode in which a plurality of electron emission portions correspond to one opening. Alternatively, one electron emission portion may correspond to a plurality of openings. In addition, although the mode in which a plurality of openings are disposed exclusively in the gate electrode of each electron emission region has been described, a mode in which one opening is provided in the gate electrode of each electron emission region may be employed.

FIG. 1 is a conceptual partial end view of the display device according to the first embodiment. 2A is a partial end view similar to FIG. 2 along the cross section when the cathode panel CP of Example 1 is cut along the YZ plane, and FIG. It is a partial end elevation similar to that along the cross section when cut by the XZ plane. 3 is a partial end view of the cathode panel CP of the conventional example 1 shown in FIG. 24 along the cross section when the cathode panel CP is cut along the YZ plane as in FIG. 3 (B) is a partial end view similar to that along the cross section when cut by the XZ plane. 4A to 4C are cross-sectional views when the cathode panel CP is cut along the XZ plane for explaining the cathode panel manufacturing method and the display device manufacturing method of the first embodiment. It is a partial end elevation similar to that along. 5 (A) to 5 (B) show a cathode by an XZ plane for explaining the manufacturing method of the cathode panel and the manufacturing method of the display device of Example 1 following FIG. 4 (C). It is a partial end elevation similar to that along the cross section when the panel CP is cut. 6 (A) to 6 (B) show a cathode by an XZ plane for explaining the manufacturing method of the cathode panel and the manufacturing method of the display device of Example 1 following FIG. 5 (B). It is a partial end elevation similar to that along the cross section when the panel CP is cut. FIG. 7 is a conceptual partial end view of the display device according to the second embodiment. FIG. 8A is a partial end view similar to FIG. 7 along the cross-section when the cathode panel CP of Example 2 is cut along the YZ plane, and FIG. It is a partial end elevation similar to that along the cross section when cut by the XZ plane. 9 is a partial end view of the cathode panel CP of the conventional example 2 shown in FIG. 26 along the cross section when the cathode panel CP is cut along the YZ plane as in FIG. 9B is a partial end view similar to that along the cross section when cut by the XZ plane. 10A to 10C are cross-sectional views when the cathode panel CP is cut along the XZ plane for explaining the cathode panel manufacturing method and the display device manufacturing method of the second embodiment. It is a partial end elevation similar to that along. 11 (A) to 11 (B) show the cathode by the XZ plane for explaining the manufacturing method of the cathode panel and the manufacturing method of the display device of Example 2 following FIG. 10 (C). It is a partial end elevation similar to that along the cross section when the panel CP is cut. FIG. 12 is a conceptual partial end view of the display device according to the third embodiment. FIG. 13A is a partial end view similar to FIG. 12 along the cross section when the cathode panel CP of Example 3 is cut along the YZ plane, and FIG. It is a partial end elevation similar to that along the cross section when cut by the XZ plane. 14A to 14C are cross-sectional views when the cathode panel CP is cut along the XZ plane for explaining the method for manufacturing the cathode panel of Example 3 and the method for manufacturing the display device. It is a partial end elevation similar to that along. 15 (A) to 15 (B) show a cathode by an XZ plane for explaining the manufacturing method of the cathode panel and the manufacturing method of the display device of Example 3 following FIG. 14 (C). It is a partial end elevation similar to that along the cross section when the panel CP is cut. FIG. 16 is a conceptual partial end view of the display device according to the fourth embodiment. FIG. 17A is a partial end view similar to FIG. 16 along the cross section when the cathode panel CP of Example 4 is cut along the YZ plane, and FIG. It is a partial end elevation similar to that along the cross section when cut by the XZ plane. 18A to 18C are cross-sectional views when the cathode panel CP is cut along the XZ plane for explaining the cathode panel manufacturing method and the display device manufacturing method of the fourth embodiment. It is a partial end elevation similar to that along. 19 (A) to 19 (B) show the cathode by the XZ plane for explaining the manufacturing method of the cathode panel and the manufacturing method of the display device of Example 4 following FIG. 18 (C). It is a partial end elevation similar to that along the cross section when the panel CP is cut. FIG. 20 is a conceptual partial end view of the display device according to the fifth embodiment. FIG. 21A is a partial end view similar to FIG. 20 along the cross section when the cathode panel CP of Example 5 is cut along the YZ plane, and FIG. It is a partial end elevation similar to that along the cross section when cut by the XZ plane. 22A to 22C are cross-sectional views when the cathode panel CP is cut along the XZ plane for explaining the method of manufacturing the cathode panel of Example 5 and the method of manufacturing the display device. It is a partial end elevation similar to that along. 23 (A) to 23 (B) show cathodes on the XZ plane for explaining the manufacturing method of the cathode panel and the manufacturing method of the display device of Example 5 following FIG. 22 (C). It is a partial end elevation similar to that along the cross section when the panel CP is cut. FIG. 24 is a conceptual partial end view of a display device having a Spindt-type field emission device. FIG. 25 is a schematic exploded perspective view of a part of the cathode panel CP and the anode panel AP when the cathode panel CP and the anode panel AP are disassembled. FIG. 26 is a conceptual partial end view of a display device having a Spindt-type field emission device provided with a resistor layer. FIG. 27A is a diagram schematically showing the positional relationship between the cathode electrode and the gate electrode on the support, and FIG. 27B shows the overlapping region of the cathode electrode and the gate electrode. It is the figure which showed the structure typically.

Explanation of symbols

CP ... cathode panel, AP ... anode panel, 10, 110, 210, 310, 410, 510 ... support, 11, 111, 211, 311, 411, 511 ... cathode electrode, 12. ..Insulating layer, 112, 212, 312, 412, 512 ... first insulating layer, 13, 113, 213, 313, 413, 513 ... gate electrode, 14, 114, 214, 314, 414, 514 ... Opening, 14A, 114A, 214A, 314A, 414A, 514A ... First opening, 14B, 114B, 214B, 314B, 414B, 514B ... Second opening, 15, 115, 215 315, 415, 515... Electron emission portion, 16, 116, 216, 316, 416, 516... Converging electrode, 17, 117, 217, 317 417, 517 ... interlayer insulating layer, 18, 218, 318, 518 ... resistor layer, 119, 219, 319, 419, 519 ... second insulating layer, 119A, 219A, 419A, 519A ... Opening, 119B ... end face, 20 ... substrate, 21 ... partition, 22, 22R, 22G, 22B ... phosphor layer, 23 ... light absorption layer, 24 ... anode electrode 25 ... Spacer holding part, 26 ... Frame, 31 ... Cathode electrode control circuit, 32 ... Gate electrode control circuit, 33 ... Anode electrode control circuit, 40 ... Spacer, 40A ... Spacer base material, 40B ... Antistatic film

Claims (14)

(A) a support,
(B) a plurality of cathode electrodes formed on the support and extending in the first direction;
(C) an insulating layer formed on the support and the cathode electrode;
(D) a plurality of gate electrodes formed on the insulating layer and extending in a second direction different from the first direction; and
(E) an electron emission region provided in an overlapping region where the cathode electrode and the gate electrode overlap,
A cathode panel for a cold cathode field emission display comprising:
In the electron emission region,
(A) a first opening formed in the gate electrode;
(B) a second opening formed in the insulating layer and communicating with the first opening; and
(C) an electron emission portion located at the bottom of the second opening,
Is provided,
The cathode panel for a cold cathode field emission display device, wherein the thickness of the insulating layer in the electron emission region portion of the overlapping region is thinner than the thickness of the insulating layer in the portion other than the electron emission region of the overlapping region. In the portion other than the electron emission region of the overlapping region, the insulating layer has a stacked structure of a first insulating layer and a second insulating layer,
The cathode panel for a cold cathode field emission display according to claim 1, wherein the insulating layer is formed of a first insulating layer in the electron emission region portion of the overlapping region.   The cathode panel for a cold cathode field emission display according to claim 2, wherein the second insulating layer is formed on the cathode electrode in a portion other than the electron emission region of the overlapping region. A resistor layer is formed in the overlapping region,
The resistor layer is
In the electron emission region portion of the overlapping region, between the cathode electrode and the first insulating layer,
In the portion other than the electron emission region of the overlapping region, between the cathode electrode and the second insulating layer,
The cathode panel for a cold cathode field emission display device according to claim 3, wherein A resistor layer is formed in the overlapping region,
The resistor layer is
In the electron emission region portion of the overlapping region, between the cathode electrode and the first insulating layer,
In the portion other than the electron emission region of the overlapping region, between the second insulating layer and the first insulating layer,
The cathode panel for a cold cathode field emission display device according to claim 3, wherein   3. The cathode panel for a cold cathode field emission display according to claim 2, wherein the first insulating layer is formed on the cathode electrode in a portion other than the electron emission region of the overlapping region. A resistor layer is formed in the overlapping region,
The cathode panel for a cold cathode field emission display according to claim 6, wherein the resistor layer is located between the cathode electrode and the first insulating layer. Cold cathode field emission display comprising a cathode panel for a cold cathode field emission display and an anode panel for a cold cathode field emission display having a phosphor layer and an anode electrode joined together at the periphery thereof A device,
The cathode panel for cold cathode field emission display is
(A) a support,
(B) a plurality of cathode electrodes formed on the support and extending in the first direction;
(C) an insulating layer formed on the support and the cathode electrode;
(D) a plurality of gate electrodes formed on the insulating layer and extending in a second direction different from the first direction; and
(E) an electron emission region provided in an overlapping region where the cathode electrode and the gate electrode overlap,
Consisting of
In the electron emission region,
(A) a first opening formed in the gate electrode;
(B) a second opening formed in the insulating layer and communicating with the first opening; and
(C) an electron emission portion located at the bottom of the second opening,
Is provided,
The cold cathode field emission display according to claim 1, wherein the thickness of the insulating layer in the electron emission region is thinner than the thickness of the insulating layer in a portion other than the electron emission region in the overlapping region. In the portion other than the electron emission region of the overlapping region, the insulating layer has a stacked structure of a first insulating layer and a second insulating layer,
9. The cold cathode field emission display according to claim 8, wherein in the electron emission region portion of the overlapping region, the insulating layer is formed of a first insulating layer.   The cold cathode field emission display according to claim 9, wherein the second insulating layer is formed on the cathode electrode in a portion other than the electron emission region of the overlapping region. A resistor layer is formed in the overlapping region,
The resistor layer is
In the electron emission region portion of the overlapping region, between the cathode electrode and the first insulating layer,
In the portion other than the electron emission region of the overlapping region, between the cathode electrode and the second insulating layer,
The cold cathode field emission display according to claim 10, wherein A resistor layer is formed in the overlapping region,
The resistor layer is
In the electron emission region portion of the overlapping region, between the cathode electrode and the first insulating layer,
In the portion other than the electron emission region of the overlapping region, between the second insulating layer and the first insulating layer,
The cold cathode field emission display according to claim 10, wherein   The cold cathode field emission display according to claim 9, wherein the first insulating layer is formed on the cathode electrode in a portion other than the electron emission region of the overlapping region. A resistor layer is formed in the overlapping region,
The cold cathode field emission display according to claim 13, wherein the resistor layer is located between the cathode electrode and the first insulating layer.

Images