JP2007042668A - Ｌｅｄ発光装置 - Google Patents

Ｌｅｄ発光装置 Download PDF

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Publication number
JP2007042668A
JP2007042668A JP2005221817A JP2005221817A JP2007042668A JP 2007042668 A JP2007042668 A JP 2007042668A JP 2005221817 A JP2005221817 A JP 2005221817A JP 2005221817 A JP2005221817 A JP 2005221817A JP 2007042668 A JP2007042668 A JP 2007042668A
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JP
Japan
Prior art keywords
light
led chip
led
emitting device
phosphor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005221817A
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English (en)
Japanese (ja)
Other versions
JP2007042668A5 (enExample
Inventor
Yukimura Minami
侑村 南
Yoshimasa Tatewaki
慶真 帯刀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2005221817A priority Critical patent/JP2007042668A/ja
Publication of JP2007042668A publication Critical patent/JP2007042668A/ja
Publication of JP2007042668A5 publication Critical patent/JP2007042668A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2005221817A 2005-07-29 2005-07-29 Ｌｅｄ発光装置 Withdrawn JP2007042668A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005221817A JP2007042668A (ja) 2005-07-29 2005-07-29 Ｌｅｄ発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005221817A JP2007042668A (ja) 2005-07-29 2005-07-29 Ｌｅｄ発光装置

Publications (2)

Publication Number Publication Date
JP2007042668A true JP2007042668A (ja) 2007-02-15
JP2007042668A5 JP2007042668A5 (enExample) 2007-11-15

Family

ID=37800407

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005221817A Withdrawn JP2007042668A (ja) 2005-07-29 2005-07-29 Ｌｅｄ発光装置

Country Status (1)

Country Link
JP (1) JP2007042668A (enExample)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009075530A3 (en) * 2007-12-13 2009-09-17 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof
KR100954453B1 (ko) * 2008-07-04 2010-04-27 (주) 아모엘이디 엘이디 패키지
JP2010118620A (ja) * 2008-11-14 2010-05-27 Showa Denko Kk 発光装置
JP2010177329A (ja) * 2009-01-28 2010-08-12 Sharp Corp 樹脂複合リードフレームとその製造方法、及びその実装体
KR100996919B1 (ko) 2008-07-08 2010-11-26 (주) 아모엘이디 반도체 패키지
KR100996918B1 (ko) 2008-05-16 2010-11-26 (주) 아모엘이디 전자부품 패키지
JP2010278168A (ja) * 2009-05-28 2010-12-09 Mitsubishi Plastics Inc カバーレイフィルム、発光素子搭載用基板及び光源装置
JP2012048862A (ja) * 2010-08-24 2012-03-08 Stanley Electric Co Ltd 車両用灯具
JP2012048861A (ja) * 2010-08-24 2012-03-08 Stanley Electric Co Ltd 車両用灯具
KR20120036982A (ko) * 2009-06-17 2012-04-18 오스람 옵토 세미컨덕터스 게엠베하 광전자 반도체 소자
CN102484924A (zh) * 2009-07-10 2012-05-30 克里公司 包括含荧光粉基质材料的漫射体颗粒的发光结构
JP2013033976A (ja) * 2012-09-14 2013-02-14 Stanley Electric Co Ltd 半導体発光装置、および車両用前照灯
JP2013512556A (ja) * 2009-11-25 2013-04-11 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング オプトエレクトロニクス部品のハウジングおよびハウジング製造方法
EP2679890A1 (en) * 2012-06-29 2014-01-01 Toshiba Lighting & Technology Corporation Lighting apparatus
WO2015060289A1 (ja) * 2013-10-24 2015-04-30 東レ株式会社 蛍光体組成物、蛍光体シート、蛍光体シート積層体ならびにそれらを用いたｌｅｄチップ、ｌｅｄパッケージおよびその製造方法
US9537065B2 (en) 2011-08-12 2017-01-03 Sharp Kabushiki Kaisha Light-emitting device with reflective resin
US9660147B2 (en) 2011-03-18 2017-05-23 Koninklijke Philips N.V. Method for providing a reflective coating to a substrate for a light emitting device
JP2018530161A (ja) * 2015-10-01 2018-10-11 エルジー イノテック カンパニー リミテッド 発光素子、発光素子の製造方法及び発光モジュール

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001307506A (ja) * 2000-04-17 2001-11-02 Hitachi Ltd 白色発光装置および照明器具
JP2003282956A (ja) * 2003-04-21 2003-10-03 Nichia Chem Ind Ltd 半導体発光装置
JP2004055632A (ja) * 2002-07-17 2004-02-19 Toshiba Corp 半導体発光装置
JP2005136378A (ja) * 2003-10-08 2005-05-26 Nichia Chem Ind Ltd パッケージ成形体及び半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001307506A (ja) * 2000-04-17 2001-11-02 Hitachi Ltd 白色発光装置および照明器具
JP2004055632A (ja) * 2002-07-17 2004-02-19 Toshiba Corp 半導体発光装置
JP2003282956A (ja) * 2003-04-21 2003-10-03 Nichia Chem Ind Ltd 半導体発光装置
JP2005136378A (ja) * 2003-10-08 2005-05-26 Nichia Chem Ind Ltd パッケージ成形体及び半導体装置

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009075530A3 (en) * 2007-12-13 2009-09-17 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof
KR100996918B1 (ko) 2008-05-16 2010-11-26 (주) 아모엘이디 전자부품 패키지
KR100954453B1 (ko) * 2008-07-04 2010-04-27 (주) 아모엘이디 엘이디 패키지
KR100996919B1 (ko) 2008-07-08 2010-11-26 (주) 아모엘이디 반도체 패키지
JP2010118620A (ja) * 2008-11-14 2010-05-27 Showa Denko Kk 発光装置
JP2010177329A (ja) * 2009-01-28 2010-08-12 Sharp Corp 樹脂複合リードフレームとその製造方法、及びその実装体
JP2010278168A (ja) * 2009-05-28 2010-12-09 Mitsubishi Plastics Inc カバーレイフィルム、発光素子搭載用基板及び光源装置
KR101673457B1 (ko) * 2009-06-17 2016-11-07 오스람 옵토 세미컨덕터스 게엠베하 광전자 반도체 소자
JP2012530365A (ja) * 2009-06-17 2012-11-29 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング オプトエレクトロニクス半導体部品
KR20120036982A (ko) * 2009-06-17 2012-04-18 오스람 옵토 세미컨덕터스 게엠베하 광전자 반도체 소자
CN102484924A (zh) * 2009-07-10 2012-05-30 克里公司 包括含荧光粉基质材料的漫射体颗粒的发光结构
JP2013512556A (ja) * 2009-11-25 2013-04-11 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング オプトエレクトロニクス部品のハウジングおよびハウジング製造方法
US9006773B2 (en) 2009-11-25 2015-04-14 Osram Opto Semiconductors Gmbh Housing for an optoelectronic component and method for producing a housing
JP2012048861A (ja) * 2010-08-24 2012-03-08 Stanley Electric Co Ltd 車両用灯具
JP2012048862A (ja) * 2010-08-24 2012-03-08 Stanley Electric Co Ltd 車両用灯具
US9660147B2 (en) 2011-03-18 2017-05-23 Koninklijke Philips N.V. Method for providing a reflective coating to a substrate for a light emitting device
US10043959B2 (en) 2011-03-18 2018-08-07 Koninklijke Philips N.V. Substrate with reflective coating including silicate or alkylsilicate network
US9537065B2 (en) 2011-08-12 2017-01-03 Sharp Kabushiki Kaisha Light-emitting device with reflective resin
EP2679890A1 (en) * 2012-06-29 2014-01-01 Toshiba Lighting & Technology Corporation Lighting apparatus
JP2013033976A (ja) * 2012-09-14 2013-02-14 Stanley Electric Co Ltd 半導体発光装置、および車両用前照灯
WO2015060289A1 (ja) * 2013-10-24 2015-04-30 東レ株式会社 蛍光体組成物、蛍光体シート、蛍光体シート積層体ならびにそれらを用いたｌｅｄチップ、ｌｅｄパッケージおよびその製造方法
JPWO2015060289A1 (ja) * 2013-10-24 2017-03-09 東レ株式会社 蛍光体組成物、蛍光体シート、蛍光体シート積層体ならびにそれらを用いたｌｅｄチップ、ｌｅｄパッケージおよびその製造方法
JP2018530161A (ja) * 2015-10-01 2018-10-11 エルジー イノテック カンパニー リミテッド 発光素子、発光素子の製造方法及び発光モジュール

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