JP2007035907A5 - - Google Patents

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Publication number
JP2007035907A5
JP2007035907A5 JP2005216859A JP2005216859A JP2007035907A5 JP 2007035907 A5 JP2007035907 A5 JP 2007035907A5 JP 2005216859 A JP2005216859 A JP 2005216859A JP 2005216859 A JP2005216859 A JP 2005216859A JP 2007035907 A5 JP2007035907 A5 JP 2007035907A5
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JP
Japan
Prior art keywords
thermoelectric module
module according
support substrate
heat exchanger
thermoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005216859A
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English (en)
Japanese (ja)
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JP2007035907A (ja
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Publication date
Application filed filed Critical
Priority to JP2005216859A priority Critical patent/JP2007035907A/ja
Priority claimed from JP2005216859A external-priority patent/JP2007035907A/ja
Publication of JP2007035907A publication Critical patent/JP2007035907A/ja
Publication of JP2007035907A5 publication Critical patent/JP2007035907A5/ja
Pending legal-status Critical Current

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JP2005216859A 2005-07-27 2005-07-27 熱電モジュール Pending JP2007035907A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005216859A JP2007035907A (ja) 2005-07-27 2005-07-27 熱電モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005216859A JP2007035907A (ja) 2005-07-27 2005-07-27 熱電モジュール

Publications (2)

Publication Number Publication Date
JP2007035907A JP2007035907A (ja) 2007-02-08
JP2007035907A5 true JP2007035907A5 (enExample) 2008-05-08

Family

ID=37794799

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005216859A Pending JP2007035907A (ja) 2005-07-27 2005-07-27 熱電モジュール

Country Status (1)

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JP (1) JP2007035907A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4404127B2 (ja) 2007-09-28 2010-01-27 ヤマハ株式会社 熱電モジュール用基板およびこの基板を用いた熱電モジュール
JP2009295878A (ja) * 2008-06-06 2009-12-17 Yamaha Corp 熱交換装置
SG174559A1 (en) * 2009-04-02 2011-10-28 Basf Se Thermoelectric module with insulated substrate
JP5940939B2 (ja) * 2012-08-31 2016-06-29 京セラ株式会社 熱電モジュール
JP5931790B2 (ja) 2013-03-29 2016-06-08 富士フイルム株式会社 熱電発電モジュール
CN105474417B (zh) * 2013-09-04 2018-11-23 富士胶片株式会社 热电转换装置
JP6517914B2 (ja) * 2015-02-25 2019-05-22 京セラ株式会社 熱電モジュール
CN105811808B (zh) * 2016-04-25 2018-07-06 王旭成 一种时域温差供电系统
KR102359057B1 (ko) * 2017-07-31 2022-02-07 엘지이노텍 주식회사 열전 소자

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04259265A (ja) * 1991-02-14 1992-09-14 Matsushita Electric Ind Co Ltd 熱電装置
JPH06151979A (ja) * 1992-11-10 1994-05-31 Matsushita Electric Ind Co Ltd 熱電装置
JPH09139525A (ja) * 1995-11-15 1997-05-27 Hitachi Chem Co Ltd ペルチェ冷却ユニット構造
JPH09196505A (ja) * 1996-01-22 1997-07-31 Zexel Corp 熱電装置
JPH11294891A (ja) * 1998-04-14 1999-10-29 Daikin Ind Ltd 冷熱源モジュール及びそれを利用した冷熱源ユニット
JP2002280621A (ja) * 2001-01-15 2002-09-27 Furukawa Electric Co Ltd:The レーザーモジュール、ペルチェモジュールおよびペルチェモジュール一体型ヒートスプレッダー
JP2003110154A (ja) * 2001-09-28 2003-04-11 Hitachi Ltd ペルチェモジュール付き電子装置、光モジュール及びそれらの製造方法
JP3740116B2 (ja) * 2002-11-11 2006-02-01 三菱電機株式会社 モールド樹脂封止型パワー半導体装置及びその製造方法
JP2006066822A (ja) * 2004-08-30 2006-03-09 Denso Corp 熱電変換装置

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