JP2007035574A - 導電性微粒子、異方性導電材料、及び、接続構造体 - Google Patents
導電性微粒子、異方性導電材料、及び、接続構造体 Download PDFInfo
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- JP2007035574A JP2007035574A JP2005221026A JP2005221026A JP2007035574A JP 2007035574 A JP2007035574 A JP 2007035574A JP 2005221026 A JP2005221026 A JP 2005221026A JP 2005221026 A JP2005221026 A JP 2005221026A JP 2007035574 A JP2007035574 A JP 2007035574A
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Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2005221026A JP2007035574A (ja) | 2005-07-29 | 2005-07-29 | 導電性微粒子、異方性導電材料、及び、接続構造体 |
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JP2005221026A JP2007035574A (ja) | 2005-07-29 | 2005-07-29 | 導電性微粒子、異方性導電材料、及び、接続構造体 |
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JP2007035574A true JP2007035574A (ja) | 2007-02-08 |
JP2007035574A5 JP2007035574A5 (enrdf_load_stackoverflow) | 2008-05-15 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007058159A1 (ja) * | 2005-11-18 | 2007-05-24 | Hitachi Chemical Company, Ltd. | 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法 |
CN102474024A (zh) * | 2009-07-02 | 2012-05-23 | 日立化成工业株式会社 | 导电粒子 |
WO2013085039A1 (ja) * | 2011-12-08 | 2013-06-13 | 株式会社日本触媒 | 導電性微粒子及びそれを含む異方性導電材料 |
CN103827981A (zh) * | 2011-09-22 | 2014-05-28 | 株式会社日本触媒 | 导电性微粒及含有导电性微粒的各向异性导电材料 |
JP2015046144A (ja) * | 2012-12-31 | 2015-03-12 | 株式会社ドクサンハイメタル | タッチスクリーンパネル用導電粒子、およびこれを含む導電材料 |
WO2020071271A1 (ja) * | 2018-10-03 | 2020-04-09 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体、接続構造体の製造方法 |
JP2020095941A (ja) * | 2018-10-03 | 2020-06-18 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体、接続構造体の製造方法 |
Citations (1)
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---|---|---|---|---|
JP2005044773A (ja) * | 2003-07-07 | 2005-02-17 | Sekisui Chem Co Ltd | 被覆導電性粒子、異方性導電材料及び導電接続構造体 |
-
2005
- 2005-07-29 JP JP2005221026A patent/JP2007035574A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005044773A (ja) * | 2003-07-07 | 2005-02-17 | Sekisui Chem Co Ltd | 被覆導電性粒子、異方性導電材料及び導電接続構造体 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007058159A1 (ja) * | 2005-11-18 | 2007-05-24 | Hitachi Chemical Company, Ltd. | 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法 |
JP4877230B2 (ja) * | 2005-11-18 | 2012-02-15 | 日立化成工業株式会社 | 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法 |
CN102474024A (zh) * | 2009-07-02 | 2012-05-23 | 日立化成工业株式会社 | 导电粒子 |
CN102474024B (zh) * | 2009-07-02 | 2014-09-17 | 日立化成株式会社 | 导电粒子 |
CN103827981A (zh) * | 2011-09-22 | 2014-05-28 | 株式会社日本触媒 | 导电性微粒及含有导电性微粒的各向异性导电材料 |
WO2013085039A1 (ja) * | 2011-12-08 | 2013-06-13 | 株式会社日本触媒 | 導電性微粒子及びそれを含む異方性導電材料 |
CN103946929A (zh) * | 2011-12-08 | 2014-07-23 | 株式会社日本触媒 | 导电性微粒及含有该导电性微粒的各向异性导电材料 |
JPWO2013085039A1 (ja) * | 2011-12-08 | 2015-04-27 | 株式会社日本触媒 | 導電性微粒子及びそれを含む異方性導電材料 |
JP2015046144A (ja) * | 2012-12-31 | 2015-03-12 | 株式会社ドクサンハイメタル | タッチスクリーンパネル用導電粒子、およびこれを含む導電材料 |
WO2020071271A1 (ja) * | 2018-10-03 | 2020-04-09 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体、接続構造体の製造方法 |
JP2020095941A (ja) * | 2018-10-03 | 2020-06-18 | デクセリアルズ株式会社 | 異方性導電フィルム、接続構造体、接続構造体の製造方法 |
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