JP2007019976A - 縦結合多重モードｓａｗフィルタ、モジュール装置 - Google Patents
縦結合多重モードｓａｗフィルタ、モジュール装置 Download PDFInfo
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- JP2007019976A JP2007019976A JP2005200476A JP2005200476A JP2007019976A JP 2007019976 A JP2007019976 A JP 2007019976A JP 2005200476 A JP2005200476 A JP 2005200476A JP 2005200476 A JP2005200476 A JP 2005200476A JP 2007019976 A JP2007019976 A JP 2007019976A
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- saw
- longitudinally coupled
- quartz substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010453 quartz Substances 0.000 claims abstract description 71
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 71
- 239000000758 substrate Substances 0.000 claims abstract description 64
- 239000013078 crystal Substances 0.000 claims abstract description 37
- 239000000956 alloy Substances 0.000 claims abstract description 11
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 11
- 238000010897 surface acoustic wave method Methods 0.000 claims description 154
- 230000001902 propagating effect Effects 0.000 claims description 10
- 239000010408 film Substances 0.000 description 56
- 230000014509 gene expression Effects 0.000 description 8
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007772 electrode material Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
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- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005200476A JP2007019976A (ja) | 2005-07-08 | 2005-07-08 | 縦結合多重モードｓａｗフィルタ、モジュール装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005200476A JP2007019976A (ja) | 2005-07-08 | 2005-07-08 | 縦結合多重モードｓａｗフィルタ、モジュール装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007019976A true JP2007019976A (ja) | 2007-01-25 |
| JP2007019976A5 JP2007019976A5 (https=) | 2008-05-08 |
Family
ID=37756714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005200476A Withdrawn JP2007019976A (ja) | 2005-07-08 | 2005-07-08 | 縦結合多重モードｓａｗフィルタ、モジュール装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2007019976A (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007049288A (ja) * | 2005-08-08 | 2007-02-22 | Seiko Epson Corp | 複数段接続縦結合多重モード弾性表面波フィルタ |
| JP2009258694A (ja) * | 2008-03-18 | 2009-11-05 | Nec Lcd Technologies Ltd | 液晶表示装置 |
| JP5153889B2 (ja) * | 2008-11-28 | 2013-02-27 | 京セラ株式会社 | 弾性表面波フィルタおよびデュプレクサ |
| CN118249775A (zh) * | 2024-05-24 | 2024-06-25 | 中国科学技术大学 | 一种声波谐振器 |
-
2005
- 2005-07-08 JP JP2005200476A patent/JP2007019976A/ja not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007049288A (ja) * | 2005-08-08 | 2007-02-22 | Seiko Epson Corp | 複数段接続縦結合多重モード弾性表面波フィルタ |
| JP2009258694A (ja) * | 2008-03-18 | 2009-11-05 | Nec Lcd Technologies Ltd | 液晶表示装置 |
| JP5153889B2 (ja) * | 2008-11-28 | 2013-02-27 | 京セラ株式会社 | 弾性表面波フィルタおよびデュプレクサ |
| US8791773B2 (en) | 2008-11-28 | 2014-07-29 | Kyocera Corporation | Surface acoustic wave filter and duplexer |
| CN118249775A (zh) * | 2024-05-24 | 2024-06-25 | 中国科学技术大学 | 一种声波谐振器 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080321 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080321 |
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| A131 | Notification of reasons for refusal |
Effective date: 20090210 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
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| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20090325 |