JP2007016260A - 銅合金圧延箔 - Google Patents
銅合金圧延箔 Download PDFInfo
- Publication number
- JP2007016260A JP2007016260A JP2005196997A JP2005196997A JP2007016260A JP 2007016260 A JP2007016260 A JP 2007016260A JP 2005196997 A JP2005196997 A JP 2005196997A JP 2005196997 A JP2005196997 A JP 2005196997A JP 2007016260 A JP2007016260 A JP 2007016260A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper alloy
- foil
- cold rolling
- alloy rolled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 25
- 239000011888 foil Substances 0.000 title claims abstract description 23
- 238000005097 cold rolling Methods 0.000 claims abstract description 20
- 239000010949 copper Substances 0.000 claims abstract description 19
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 7
- 229910052718 tin Inorganic materials 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 35
- 238000005452 bending Methods 0.000 abstract description 25
- 239000011889 copper foil Substances 0.000 abstract description 20
- 239000013078 crystal Substances 0.000 abstract description 18
- 229910052802 copper Inorganic materials 0.000 abstract description 15
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052760 oxygen Inorganic materials 0.000 abstract description 2
- 239000001301 oxygen Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 6
- 238000000137 annealing Methods 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- SWXQKHHHCFXQJF-UHFFFAOYSA-N azane;hydrogen peroxide Chemical compound [NH4+].[O-]O SWXQKHHHCFXQJF-UHFFFAOYSA-N 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Landscapes
- Conductive Materials (AREA)
Abstract
【解決手段】 0.05〜0.2重量%のSn、0.005〜0.02重量%のP、及び残部のCuからなる銅合金圧延箔であって、最終冷間圧延前の焼鈍された状態での結晶粒径が20μm以下である。この銅合金圧延箔は、0.010〜0.02重量%のPを含有し、最終冷間圧延前の焼鈍された状態での結晶粒径が5μm以下であることが好ましい。
【選択図】 図1
Description
Printed Circuit;以下、FPCとも称する)等の可撓性配線部材用として好適な圧延銅箔に関する。
2 固定板
3 可動板
Claims (2)
- 0.05〜0.2重量%のSn、0.005〜0.02重量%のP、及び残部のCuからなり、最終冷間圧延前の焼鈍された状態での結晶粒径が20μm以下であることを特徴とする銅合金圧延箔。
- 0.010〜0.02重量%のPを含有し、最終冷間圧延前の焼鈍された状態での結晶粒径が5μm以下であることを特徴とする、請求項1に記載の銅合金圧延箔。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005196997A JP4749780B2 (ja) | 2005-07-06 | 2005-07-06 | 銅合金圧延箔 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005196997A JP4749780B2 (ja) | 2005-07-06 | 2005-07-06 | 銅合金圧延箔 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007016260A true JP2007016260A (ja) | 2007-01-25 |
JP4749780B2 JP4749780B2 (ja) | 2011-08-17 |
Family
ID=37753677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005196997A Active JP4749780B2 (ja) | 2005-07-06 | 2005-07-06 | 銅合金圧延箔 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4749780B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009099443A (ja) * | 2007-10-18 | 2009-05-07 | Fukuda Metal Foil & Powder Co Ltd | 導電材ペースト用銅合金粉 |
JP2011108442A (ja) * | 2009-11-16 | 2011-06-02 | Jx Nippon Mining & Metals Corp | 圧延銅箔、並びにこれを用いた負極集電体、負極板及び二次電池 |
JP2012062499A (ja) * | 2010-09-14 | 2012-03-29 | Mitsubishi Materials Corp | 電子部品用銅又は銅合金圧延箔及びその製造方法 |
JP2015000990A (ja) * | 2013-06-13 | 2015-01-05 | Jx日鉱日石金属株式会社 | 導電性及び曲げたわみ係数に優れる銅合金板 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62116742A (ja) * | 1985-11-14 | 1987-05-28 | Furukawa Electric Co Ltd:The | 高可撓性導電用銅合金 |
JPS63215044A (ja) * | 1987-03-04 | 1988-09-07 | Nippon Mining Co Ltd | テ−プキヤリヤ用銅合金箔 |
JPS6412538A (en) * | 1987-07-07 | 1989-01-17 | Nippon Mining Co | Film carrier and manufacture thereof |
JPS6412539A (en) * | 1987-07-07 | 1989-01-17 | Nippon Mining Co | Manufacture of film carrier |
JPS6456842A (en) * | 1987-08-27 | 1989-03-03 | Nippon Mining Co | Copper alloy foil for flexible circuit board |
JP2005068484A (ja) * | 2003-08-22 | 2005-03-17 | Nikko Metal Manufacturing Co Ltd | 高屈曲性圧延銅箔 |
-
2005
- 2005-07-06 JP JP2005196997A patent/JP4749780B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62116742A (ja) * | 1985-11-14 | 1987-05-28 | Furukawa Electric Co Ltd:The | 高可撓性導電用銅合金 |
JPS63215044A (ja) * | 1987-03-04 | 1988-09-07 | Nippon Mining Co Ltd | テ−プキヤリヤ用銅合金箔 |
JPS6412538A (en) * | 1987-07-07 | 1989-01-17 | Nippon Mining Co | Film carrier and manufacture thereof |
JPS6412539A (en) * | 1987-07-07 | 1989-01-17 | Nippon Mining Co | Manufacture of film carrier |
JPS6456842A (en) * | 1987-08-27 | 1989-03-03 | Nippon Mining Co | Copper alloy foil for flexible circuit board |
JP2005068484A (ja) * | 2003-08-22 | 2005-03-17 | Nikko Metal Manufacturing Co Ltd | 高屈曲性圧延銅箔 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009099443A (ja) * | 2007-10-18 | 2009-05-07 | Fukuda Metal Foil & Powder Co Ltd | 導電材ペースト用銅合金粉 |
JP2011108442A (ja) * | 2009-11-16 | 2011-06-02 | Jx Nippon Mining & Metals Corp | 圧延銅箔、並びにこれを用いた負極集電体、負極板及び二次電池 |
JP2012062499A (ja) * | 2010-09-14 | 2012-03-29 | Mitsubishi Materials Corp | 電子部品用銅又は銅合金圧延箔及びその製造方法 |
JP2015000990A (ja) * | 2013-06-13 | 2015-01-05 | Jx日鉱日石金属株式会社 | 導電性及び曲げたわみ係数に優れる銅合金板 |
Also Published As
Publication number | Publication date |
---|---|
JP4749780B2 (ja) | 2011-08-17 |
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