JP2007012654A - Method of manufacturing laminated ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated ceramic electronic component capable of preventing the occurrence of a short-circuiting fail without increasing the size of the laminated ceramic electronic component. <P>SOLUTION: The method of manufacturing the laminated ceramic electronic component has a conductor pattern formation process. In the conductor pattern formation process: a vertical line 25b is formed in the cut-off region of a second green sheet 32 sandwiched between first and second conductor patterns 21, 22 that should be insulated mutually; a third conductor patten 23, which connects the vertical line 25b to the first conductor pattern 21 mutually, is formed on the surface of the second green sheet 32; and a fourth conductor pattern 24, where the vertical line 25b should be connected to the second conductor pattern 22 mutually, is formed on the surface of a third green sheet 33. In a cut-off process thereafter, third and fourth conductor patterns 23, 24 are cut, or the vertical line 25b is removed completely, thus insulating the first and second patterns 21, 22 each other. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a multilayer ceramic electronic component for constituting various electronic circuits equipped in a small electronic device such as a mobile phone.

  In recent years, in small electronic devices such as mobile phones, the demand for downsizing has become more and more severe. In such a situation, a plurality of circuit elements constituting the device are integrated into a single-chip multilayer ceramic electronic component. Thus, the multilayer ceramic electronic component is mounted on a main board.

The conventional multilayer ceramic electronic component (5) shown in FIG. 4 has a multilayer structure of three ceramic layers (51), (52) and (53). The multilayer ceramic electronic component (5) is composed of three green sheets (41), (42) to be three ceramic layers (51), (52), (53) as shown in FIGS. (43) shows a conductor pattern forming step in which the same conductor pattern is arranged in a matrix, and three green sheets (41), (42), and (43) obtained through the conductor pattern forming step. 5 (d), the laminate (4) shown in FIG. 5 (e) is manufactured, and then the laminate (4) is fired, and the fired laminate (4). Is manufactured through a cutting process of cutting along a predetermined cutting line.
5A to 5C show the conductive pattern forming process for the first green sheet (41) which is the uppermost first ceramic layer (51).

As shown in FIG. 5 (a), first, a first green sheet (41) is prepared. Next, as shown in FIG. 5 (b), a through hole (49) is formed at a predetermined position of the first green sheet (41). After opening (49), as shown in FIG. 5 (c), the through holes (49) to (49) are filled with a conductor material to form vertical lines (58) to (58), and the first A conductor material is printed on the surface of the green sheet (41) to form predetermined conductor patterns (57) to (57).
Similarly, predetermined conductor patterns and vertical lines are formed on the second and third green sheets (42) and (43), which are the second and third ceramic layers (52) and (53), respectively.

In the next firing step, the first to third green sheets (41), (42), and (43) obtained through the conductor pattern forming step are sequentially stacked as shown in FIG. After the laminate (4) shown in FIG. 4 is produced, the laminate (4) is integrated by thermocompression bonding and firing.
Finally, in the cutting step, the multilayer body (4) obtained through the firing step is cut along a predetermined cutting line indicated by a broken line in FIG. A part (5) will be produced.

  However, in the firing step shown in FIG. 5 (e), the first conductor pattern (55) formed on the surface of the second green sheet (42) and the second conductor formed on the surface of the third green sheet (43). The conductor pattern (56) is connected by a fine short-circuit line (45) as shown in the figure, and a short-circuit failure may occur.

The inventor analyzed the conditions for the occurrence of the short-circuit failure described above. As shown in FIG. 4, the two conductor patterns (55) and (56) are electrically insulated from each other, and the two conductor patterns (55) ( 56) is overlapped in the vertical direction and has a region where they overlap each other, it is found that a short-circuit failure occurs, and the cause of the short-circuit failure is between the two conductor patterns (55) (56) generated in the firing process. It was presumed to be due to the potential difference.
That is, in the firing step shown in FIG. 5 (e), polarization occurs in the second green sheet (42), which is a dielectric, due to the pyroelectric effect accompanying the temperature rise and the piezoelectric effect due to the pressure bonding. The first and second conductor patterns (55) and (56) facing each other across the two green sheets (42) are charged, and a potential difference is generated between the two conductor patterns (55) and (56). It is estimated that a fine short circuit line (45) is formed due to the potential difference and a short circuit failure occurs.

By the way, a migration phenomenon is known in which a conductor material moves between wirings formed at minute intervals under high temperature and high humidity conditions, and the wirings are short-circuited. Various conductor materials have been proposed (see Patent Document 1).
JP-A-6-20517 [H01B 1/16]

However, even when a conductive material that hardly causes the migration phenomenon is used, the occurrence of the short-circuit failure described above cannot be sufficiently prevented.
Therefore, in the manufacture of conventional multilayer ceramic electronic components, two conductor patterns facing each other across the ceramic layer are arranged so as not to overlap in the stacking direction of the ceramic layer, or the thickness of the ceramic layer is a certain thickness or more. The occurrence of a short circuit failure was prevented by taking measures on the design such as forming on the surface.
However, due to such design measures, there is a problem that the degree of integration decreases and the multilayer ceramic electronic component becomes large.
Accordingly, an object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component capable of preventing the occurrence of a short circuit failure without increasing the size of the multilayer ceramic electronic component.

The multilayer ceramic electronic component of the present invention has a multilayer structure of a plurality of ceramic layers, and at least one pair of ceramic layers in contact with each other has at least one pair of ceramic layers having a first conductor pattern. A second conductor pattern formed on the surface of one ceramic layer and electrically insulated from the first conductor pattern is formed on the surface of the other ceramic layer.
The method for manufacturing a multilayer ceramic electronic component according to the present invention includes a conductor pattern forming step in which the same conductor pattern is arranged in a matrix on the surface of a plurality of green sheets serving as the plurality of ceramic layers, and the conductor After a plurality of green sheets obtained through the pattern forming step are laminated to produce a laminate, a firing step for firing the laminate, and a laminate obtained through the firing step with a predetermined cutting line And a cutting step of cutting each conductor pattern along the line.

In the conductor pattern forming step, a plurality of the same conductor patterns including the first conductor pattern are formed side by side in the one direction on the surface of the first green sheet serving as the one ceramic layer, and adjacent to each other. A vertical line is formed in each cut region between two identical conductor patterns, and a third conductor pattern that electrically connects the vertical line and the first conductor pattern is formed.
In addition, a plurality of identical conductor patterns including the second conductor pattern are arranged in at least one direction on the surface of the second green sheet serving as the other ceramic layer, and the vertical conductor in the state of the multilayer body is formed. A fourth conductor pattern extending from the second conductor pattern to a position where it overlaps the line is formed.
In the cutting step, the laminate is cut along the predetermined cutting line to remove at least a part of the connection line including the third conductor pattern, the fourth conductor pattern, and the vertical line. The first conductor pattern and the second conductor pattern are electrically insulated from each other.

  Specifically, the vertical line is formed by opening a vertical through hole in the cut region of the first green sheet and filling the through hole with a conductive material in the conductor pattern forming step.

According to the method for manufacturing a multilayer ceramic electronic component of the present invention, the vertical line formed in the cut region of the first green sheet in the conductor pattern forming step and the The fourth conductor pattern formed on the surface of the two green sheets is in contact with each other, whereby the first conductor pattern and the second conductor pattern are connected to the vertical line, the third conductor pattern, and the fourth conductor pattern. They are electrically connected to each other through a connection line made of a conductive pattern.
As a result, polarization occurs in the first green sheet temporarily sandwiched between the first conductor pattern and the second conductor pattern during firing of the laminate, and the first conductor pattern and the second conductor pattern Are temporarily charged to different potentials, the charge moves between the first conductor pattern and the second conductor pattern, and the first conductor pattern and the second conductor pattern have the same potential. To be kept. Therefore, there is no potential difference between the first conductor pattern and the second conductor pattern. Thereby, the occurrence of short circuit failure can be prevented.

  Furthermore, the third conductor pattern, the fourth conductor pattern, and a part of the vertical line are removed by cutting the laminated body along a predetermined cutting line in the next cutting step. As a result, the first conductor pattern and the second conductor pattern are electrically insulated from each other. As a result, a desired multilayer ceramic electronic component is completed.

  According to the method for manufacturing a multilayer ceramic electronic component of the present invention, it is possible to prevent the occurrence of a short circuit failure without taking a conventional design measure. In addition, since it is possible to form the second conductor pattern in a region where a short-circuit failure has conventionally occurred, that is, a region where at least part of the first conductor pattern overlaps, As a result, the degree of integration of the multilayer ceramic electronic component is improved, and the multilayer ceramic electronic component can be miniaturized.

  According to the method for manufacturing a multilayer ceramic electronic component of the present invention, it is possible to prevent occurrence of a short circuit failure without increasing the size of the multilayer ceramic electronic component.

Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.
As shown in FIG. 1, the multilayer ceramic electronic component (1) according to the present invention has a multilayer structure of three ceramic layers (11), (12) and (13).
Each ceramic (11) (12) (13) layer has a predetermined conductor pattern (15) to (15) formed on its surface, and a plurality of conductor patterns (15) to (15) between each layer. Vertical lines (16) to (16) for electrically connecting to each other are formed.

A first conductor pattern (21) is formed on the surface of the second ceramic layer (12) sandwiched between the uppermost first ceramic layer (11) and the lowermost third ceramic layer (13). The first conductor pattern (21) is electrically connected to the conductor pattern (15) formed on the surface of the first ceramic layer (11) via the vertical line (16).
On the surface of the third ceramic layer (13), a second conductor pattern (22) that is electrically insulated from the first conductor pattern (21) extends vertically with respect to the first conductor pattern (21). Overlapping and overlapping regions are formed. The second conductor pattern (22) is electrically connected to the conductor pattern (15) formed on the back surface of the third ceramic layer (13) via the vertical line (16).
The ceramic layers (11), (12), and (13) have a flat plate shape of 5 mm square, for example, and the thickness of each ceramic layer (11), (12), and (13) is, for example, 50 μm. Moreover, the thickness of each conductor pattern is formed to 10-20 micrometers, for example.

  The multilayer ceramic electronic component (1) is composed of three green sheets (31), (32) to be three ceramic layers (11), (12), (13) as shown in FIGS. (33) shows a conductor pattern forming step in which the same conductor pattern is arranged in a matrix, and three green sheets (31), (32) and (33) obtained through the conductor pattern forming step. 2 (d), the laminate (3) shown in FIG. 2 (e) is manufactured, and then the laminate (3) is fired, and the fired laminate (3). Is cut through a predetermined cutting line.

  As shown in FIG. 3, each green sheet (31) (32) (33) has three rectangular conductor pattern formation regions (35) (35) (35) arranged along the longitudinal direction. The same conductor pattern is formed, and a cutting region (36) to be cut in the cutting step is provided between two adjacent conductor pattern forming regions (35) and (35).

2 (a) to 2 (c) show the conductor pattern forming step for the second green sheet (32) to be the second ceramic layer (12).
As shown in FIG. 2 (a), first, a second green sheet (32) is prepared, and then, as shown in FIG. 2 (b), three conductor pattern formation regions (35) of the second green sheet (32) are prepared. ) And through holes (39a) are respectively opened at predetermined positions within the two cutting regions (36).
Thereafter, as shown in FIG. 2 (c), the through holes (39a) and (39b) are filled with a conductor material to form vertical lines (16) and (25b), and the conductors are formed on the surface of the second green sheet (32). The material is printed to form a predetermined conductor pattern including the first conductor pattern (21) in each conductor pattern formation region (35), and in the first conductor pattern (21) and the cutting region (36). A third conductor pattern (23) is formed to electrically connect the formed vertical line (25b) to each other.

Similarly, as shown in FIG. 2 (d), a vertical line (25c) is formed at a predetermined position in each cutting region (36) on the third green sheet (33) to be the third ceramic layer (13). In addition, a predetermined conductor pattern including the second conductor pattern (22) is formed in each conductor pattern forming region (35), and the vertical line (25c) and the second conductor pattern (22) are electrically connected to each other. A fourth conductor pattern (24) to be connected is formed.
Further, the first green sheet (31) to be the first ceramic layer (11) is formed with a vertical line (25a) at a predetermined position in each cutting region (36), and in each conductor pattern forming region (35). Are formed with predetermined conductor patterns (15) to (15), and the fifth conductor for electrically connecting the vertical line (25a) to the adjacent conductor pattern (15) and the vertical line (25a). A pattern (26) is formed.
In this way, the first to third green sheets (31), (32) and (33) in which the predetermined conductor pattern and the vertical line are formed are produced.
The line widths of the third to fifth conductor patterns (24) to (26) are 80 μm, and the diameters of the vertical lines (25a) to (25c) are 130 μm.

  In the next firing step, the first to third green sheets (31), (32), (33) obtained through the conductor pattern forming step are sequentially stacked as shown in FIG. A laminate (3) shown in e) is produced. At this time, the end surfaces of the three vertical lines (25a), (25b), and (25c) formed in the cut regions (36) of the green sheets (31), (32), and (33) are in contact with each other and penetrated vertically. The first conductor pattern (21) and the second conductor pattern (22), which are formed with the line (25) and face each other with the second green sheet (32) interposed therebetween, are a through vertical line (25) and a third conductor. They are electrically connected to each other through the pattern (23) and the fourth conductor pattern (24).

  Next, the laminate (3) is integrated by thermocompression bonding and baking. In the firing process, the second green sheet (32) is polarized, and the first conductor pattern (21) and the second conductor pattern (22) facing each other across the second green sheet (32) temporarily. The first conductor pattern (21) and the second conductor pattern (22) are electrically connected to each other even if they are charged to different potentials. The electric charge moves between the conductor patterns (22), and both the conductor patterns (21) and (22) are kept at the same potential. Therefore, there is no potential difference between the first conductor pattern (21) and the second conductor pattern (22). Thereby, the occurrence of short circuit failure can be prevented.

Finally, in the cutting step, the fired laminate (3) is cut along a predetermined cutting line indicated by a broken line in FIG. 2 (e) using a dicing blade having a thickness of 500 μm. As a result, the through vertical line (25) having a diameter of 130 μm is completely removed. As a result, the first conductor pattern (21) and the second conductor pattern (22) are electrically insulated from each other, The target multilayer ceramic electronic component (1) is completed.
As shown in FIG. 1, a part of the third to fifth conductor patterns (23), (24), and (26) remain in the multilayer ceramic electronic component (1). Since the fifth conductor patterns (23), (24), and (26) are extremely thin conductor patterns having a line width of 80 μm, the performance of the multilayer ceramic electronic component (1) is not adversely affected.

  According to the method of manufacturing the multilayer ceramic electronic component (1) of the present invention, it is possible to prevent the occurrence of a short circuit failure without taking a conventional design measure. In addition, since the second conductor pattern (22) can be formed in a region where a short-circuit failure has conventionally occurred, that is, a region where the first conductor pattern (21) overlaps, The degree of integration of the ceramic electronic components is improved, and this makes it possible to reduce the size of the multilayer ceramic electronic component.

In addition, each part structure of this invention is not restricted to the said embodiment, A various deformation | transformation is possible within the technical scope as described in a claim. For example, in this embodiment, the number of ceramic layers constituting the multilayer ceramic electronic component (1) is three, but any number of layers may be used as long as it is two or more.
In this embodiment, the through vertical line (25) penetrating all the green sheets constituting the plurality of ceramic layers of the multilayer ceramic electronic component (1) is formed in the cutting region (36). A vertical line (25b) is formed only in the cut region (36) of the second green sheet (32) sandwiched between the first conductor pattern (21) and the second conductor pattern (22), which is likely to generate In addition, the vertical lines (25a) and (25c) and the fifth conductor pattern (26) formed in the cut regions of the first and third green sheets (31) and (33) can be omitted.
Furthermore, although the method of printing a conductor material was used as a method of forming a predetermined conductor pattern on the surface of each green sheet, the present invention is not limited to this, and various methods such as a sputtering method, a vapor deposition method, and a plating method are employed. It is also possible.

It is sectional drawing which shows the laminated ceramic electronic component which concerns on this invention. It is a series of sectional views showing the manufacturing process of the multilayer ceramic electronic component. It is a disassembled perspective view of the laminated body produced at the manufacturing process of this laminated ceramic electronic component. It is sectional drawing which shows the conventional multilayer ceramic electronic component. It is a series of sectional views showing a manufacturing process of a conventional multilayer ceramic electronic component.

Explanation of symbols

(1) Multilayer ceramic electronic parts
(11) First ceramic layer
(12) Second ceramic layer
(13) Third ceramic layer
(15) Conductor pattern
(16) Vertical track
(21) First conductor pattern
(22) Second conductor pattern
(23) Third conductor pattern
(24) Fourth conductor pattern
(25a), (25b), (25c) Vertical line
(25) Through vertical line
(3) Laminate
(31) First green sheet
(32) Second green sheet
(33) Third green sheet
(35) Conductor pattern formation area
(36) Cutting area

Claims (3)

A first conductor pattern is formed on the surface of one ceramic layer in at least a pair of ceramic layers that have a laminated structure of a plurality of ceramic layers, and the surface of the other ceramic layer includes the first conductor pattern. In the manufacturing method of the multilayer ceramic electronic component in which the second conductor pattern electrically insulated from the first conductor pattern is formed,
A conductor pattern forming step of forming a plurality of identical conductor patterns in at least one direction on the surface of a plurality of green sheets to be a plurality of ceramic layers, and a plurality of green sheets obtained through the conductor pattern forming step After the laminate is manufactured to produce a laminate, a firing step of firing the laminate, and a cutting step of cutting the laminate obtained through the firing step for each conductor pattern along a predetermined cutting line Have
In the conductor pattern forming step, a plurality of the same conductor patterns including the first conductor pattern are formed side by side in the one direction on the surface of the first green sheet serving as the one ceramic layer, and adjacent to each other. Forming a vertical line in each cut region between two identical conductor patterns, and forming a third conductor pattern for electrically connecting the vertical line and the first conductor pattern, the other ceramic layer A plurality of the same conductor patterns including the second conductor pattern are formed side by side in the one direction on the surface of the second green sheet to be overlapped with the vertical line in the state of the laminate. Forming a fourth conductor pattern extending from the second conductor pattern to a position,
In the cutting step, by cutting the laminated body along the predetermined cutting line, to remove at least a part of the connection line consisting of the third conductor pattern, the fourth conductor pattern and the vertical line, A method for manufacturing a multilayer ceramic electronic component, wherein the first conductor pattern and the second conductor pattern are electrically insulated from each other.   The said conductor pattern formation process WHEREIN: The said 2nd conductor pattern is formed in the area | region which is a surface of the said 2nd green sheet and at least one part overlaps with the said 1st conductor pattern. The manufacturing method of the multilayer ceramic electronic component of description.   The vertical line is formed by opening a vertical through hole in the cut region of the first green sheet and then filling the through hole with a conductive material in the conductor pattern forming step. The manufacturing method of the multilayer ceramic electronic component of Claim 2.

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